CN115274640A - Module of LED lamp pearl preparation that contains resistance - Google Patents

Module of LED lamp pearl preparation that contains resistance Download PDF

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Publication number
CN115274640A
CN115274640A CN202110492787.8A CN202110492787A CN115274640A CN 115274640 A CN115274640 A CN 115274640A CN 202110492787 A CN202110492787 A CN 202110492787A CN 115274640 A CN115274640 A CN 115274640A
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CN
China
Prior art keywords
led
module
resistor
chip
electrodes
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Pending
Application number
CN202110492787.8A
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Chinese (zh)
Inventor
王定锋
徐文红
冉崇友
徐磊
宋健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tongling Guozhan Electronic Co ltd
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Tongling Guozhan Electronic Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tongling Guozhan Electronic Co ltd filed Critical Tongling Guozhan Electronic Co ltd
Priority to CN202110492787.8A priority Critical patent/CN115274640A/en
Publication of CN115274640A publication Critical patent/CN115274640A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/20—Resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

The invention relates to a module for manufacturing an LED lamp bead containing a resistor, in particular to a module for manufacturing an LED lamp bead containing a resistor, which is characterized in that at least three electrodes are arranged on a support of the LED lamp bead, at least two welding feet are arranged on the LED lamp bead, a resistor and an LED chip are packaged on the support, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, at least two welding feet, the LED chip and the resistor form conduction connection to manufacture the LED lamp bead with the resistor, and then the LED lamp bead with the resistor is welded on a circuit board to manufacture the module for manufacturing the LED lamp bead containing the resistor.

Description

Module of LED lamp pearl preparation that contains resistance
Technical Field
The invention relates to the field of LEDs, in particular to a module for manufacturing an LED lamp bead with a resistor.
Background
When the LED lamp beads are used for manufacturing LED module products, the LED lamp beads and the resistors are often required to form a series connection relation, the LEDs and the resistors are respectively welded on the circuit board to manufacture the LED module products, the resistors and the LEDs in the prior art are respectively independent devices, and the two independent devices are welded on the circuit board.
The invention discloses a module manufactured by LED lamp beads containing resistors, and the manufactured LED module product does not need an external resistor, and is small in size, light in weight, more attractive, high in manufacturing efficiency and low in cost.
The specific method comprises the following steps:
the utility model provides a module that LED lamp pearl preparation that contains resistance, includes: an LED support; an LED chip; a resistance; packaging glue; a circuit board; the LED module is characterized in that the LED module is formed by welding a plurality of LED lamp beads with resistors on the circuit board, and is characterized in that an LED chip and a resistor are packaged on an LED support by packaging glue, the support is provided with at least three electrodes, the LED support is provided with at least two welding feet, at least two welding feet are conducted with the electrodes, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, at least two welding feet, the LED chip and the resistor are conducted through the electrodes, the chip and the electrodes are connected and conducted by leads, or are conducted by welding tin or are conducted by conductive glue, the circuit board is characterized by being a flexible circuit board or a rigid circuit board, and the LED module manufactured by the LED lamp beads with resistors is a module formed by welding the plurality of LED lamp beads with resistors on the circuit board.
Or a module that contains LED lamp pearl preparation of resistance includes: an LED support; flip-chip LED chips or CSP LEDs; a resistance; a circuit board; characterized by the LED module be a plurality of LED lamp pearls of taking the resistance weld the module that forms on the circuit board, the characteristic of lamp pearl is, a flip-chip LED chip or a CSP LED and a resistance have welded on the LED support, have at least three electrode on the support, have two fillets on the LED support at least, have two fillets and electrode to form and switch on at least, LED flip-chip or CSP LED and resistance have welded on the electrode, LED flip-chip or CSP LED and resistance have connected into series connection structure through the electrode, the LED lamp pearl has two fillets at least, fillet and LED flip-chip or CSP LED have formed the turn-on connection through the electrode, fillet and resistance have also formed the turn-on connection through the electrode, the characteristic of circuit board is: the LED module is characterized in that the LED module is a flexible circuit board or a rigid circuit board, and the LED module made of the LED lamp beads with the resistors is a module formed by welding the LED lamp beads with the resistors on the circuit board.
The electrodes and solder feet are explained and illustrated below:
1. the electrode of the bracket is a metal electrode and is used for fixing and conducting a light source such as a chip and the like and a resistance device, and the electrode is generally arranged in a cup of the bracket or on the plane of the device such as a bracket welding chip and the like.
2. The welding pins are metal pins which are used for being welded and connected with a circuit board or a conductor on the lamp beads and are all exposed at the bottoms of the lamp beads.
Disclosure of Invention
The invention relates to a module for manufacturing an LED lamp bead with a resistor, which is characterized in that at least three electrodes are arranged on a support of the LED lamp bead, at least two welding feet are arranged on the LED lamp bead, a resistor and an LED chip are packaged on the support in the lamp bead, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, at least two welding feet, the LED chip and the resistor form conduction connection to manufacture the LED lamp bead with the resistor, and then the LED lamp bead with the resistor is welded on a circuit board to manufacture the module for manufacturing the LED lamp bead with the resistor.
The invention provides a module for manufacturing an LED lamp bead with a resistor, which comprises: an LED support; an LED chip; a resistance; packaging glue; a circuit board; the LED module is characterized in that the LED module is formed by welding a plurality of LED lamp beads with resistors on the circuit board, and is characterized in that an LED chip and a resistor are packaged on an LED support by packaging glue, the support is provided with at least three electrodes, the LED support is provided with at least two welding feet, at least two welding feet are conducted with the electrodes, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, at least two welding feet, the LED chip and the resistor are conducted through the electrodes, the chip and the electrodes are connected and conducted by leads, or are conducted by welding tin or are conducted by conductive glue, the circuit board is characterized by being a flexible circuit board or a rigid circuit board, and the LED module manufactured by the LED lamp beads with resistors is a module formed by welding the plurality of LED lamp beads with resistors on the circuit board.
According to the invention, the invention also provides a module for manufacturing the LED lamp bead with the resistor, which comprises: an LED support; flip-chip LED chips or CSP LEDs; a resistance; a circuit board; the LED module is characterized in that the LED module is formed by welding a plurality of LED lamp beads with resistors on the circuit board, and the lamp beads are characterized in that: a flip-chip LED chip or a CSP LED and a resistance have welded on the LED support, there are three electrodes at least on the support, there are two fillets at least on the LED support, it has formed and switched on to have two fillets and electrode at least, LED flip-chip or CSP LED and resistance have welded on the electrode, LED flip-chip or CSP LED and resistance have connected into series connection structure through the electrode, LED lamp pearl has two fillets at least, fillet and LED flip-chip or CSP LED have formed the turn-on connection through the electrode, fillet and resistance have also formed the turn-on connection through the electrode, the characteristic of circuit board is: the circuit board is a flexible circuit board or a rigid circuit board, and the LED module manufactured by the LED lamp beads with the resistors is a module formed by welding the LED lamp beads with the resistors on the circuit board.
According to a preferred embodiment of the invention, the module made of the LED lamp beads containing the resistors is characterized in that the LED chip is fixed on the No. 1 electrode and is connected to the No. 1 and No. 2 electrodes through bonding wires, the resistors are fixed on the No. 2 and No. 3 electrodes, and the resistors are in conductive connection with the No. 2 and No. 3 electrodes.
According to a preferred embodiment of the invention, the module for manufacturing the LED lamp bead with the resistor is characterized in that the LED chip is fixed on the No. 1 and No. 2 electrodes and is conducted to the No. 1 and No. 2 electrodes through soldering tin connection, the resistor is fixed on the No. 2 and No. 3 electrodes, and the resistor is in conducting connection with the No. 2 and No. 3 electrodes.
According to a preferred embodiment of the invention, the module made of the LED lamp bead containing the resistor is characterized in that the LED flip chip is a flip chip with core light powder on the surface.
According to a preferred embodiment of the invention, the module made of the LED lamp bead containing the resistor is characterized in that the CSP LED is an LED device with core light powder on the surface.
According to a preferred embodiment of the invention, the module for manufacturing the LED lamp bead with the resistor is characterized in that the LED chip and the resistor are packaged on the LED support by packaging glue, and the packaging glue is packaging glue containing yellow fluorescent powder or packaging glue without the yellow fluorescent powder.
According to a preferred embodiment of the invention, the module for manufacturing the LED lamp bead with the resistor is characterized in that the LED support is formed by embedding metal on resin.
According to a preferred embodiment of the present invention, the module made of the LED lamp bead with the resistor is characterized in that the resistor is connected with the support electrode through solder or through conductive adhesive.
According to a preferred embodiment of the present invention, the module made of the LED lamp bead with the resistor is characterized in that the LED lamp bead with the resistor is an SMD patch lamp bead.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a schematic plan view of a single stent.
Fig. 2 is a perspective view of a single stent.
FIG. 3 is a schematic cross-sectional view of a single stent.
FIG. 4 is a schematic cross-sectional view of a chip and a resistor fabricated on a support.
Fig. 5 is a schematic cross-sectional view of a flip chip and resistor fabricated on a support.
FIG. 6 is a schematic cross-sectional view of an LED white light bead fabricated on a support with a front-mounted chip and a resistor.
FIG. 7 is a schematic cross-sectional view of an LED white light bead fabricated on a support with a flip chip and a resistor.
FIG. 8 is a schematic cross-sectional view of an LED bead fabricated on a support with CSP LEDs and resistors.
Fig. 9 is a schematic plan view of a laminate of two parallel flat conductor flexible wiring boards.
Fig. 10 is a schematic plan view of a module manufactured by using a resistor-containing LED lamp bead.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are only exemplary and descriptive of some preferred embodiments and are not intended to limit the claims of the present invention in any way.
Example one
1, preparation of the scaffold
A copper strip 1.1 with the thickness of 0.2MM is prepared to be punched into a circuit prototype through a special die, then silver is plated, PPA1.2 is injection molded to manufacture a bracket, and each bracket comprises 3 electrodes, namely a No. 1 electrode 1.1a, a No. 2 electrode 1.1b and a No. 3 electrode 1.1c (shown in figures 1, 2 and 3).
2, the chip and the resistor are manufactured on the bracket
The method comprises the following steps: using a positively-mounted chip and resistor
(1) And fixing the blue light chip 3.1a on the No. 1 electrode of the bracket by using die bond adhesive, and baking to solidify the die bond adhesive.
(2) The resistor 4.1 is adhered to the No. 2 and No. 3 electrodes of the bracket by a die bonder through solder paste, and the resistor is welded to the bracket electrodes through reflow soldering.
(3) The LED front chip 3.1a is communicated with the No. 1 and No. 2 electrodes of the bracket through a bonding wire 5.1 by a bonding machine (shown in figure 4).
The second method comprises the following steps: using flip-chip and resistor
(1) And bonding the flip blue LED chip 3.1b on the No. 1 and No. 2 electrodes by using a die bonder and solder paste.
(2) The resistor 4.1 is adhered to the No. 2 and No. 3 electrodes by a die bonder and solder paste.
(3) The LED flip chip 3.1b and the resistor 4.1 are soldered to the LED support electrodes by reflow (fig. 5).
3, preparation of packaging adhesive
And (3) respectively dripping fluorescent powder glue 6.1 into the bracket cup of the semi-finished LED lamp bead manufactured by the two methods, and heating and curing in an oven to manufacture two LED white light lamp beads 9.1 with resistors, wherein the LED white light lamp beads are manufactured by a front chip and a flip chip respectively (shown in figures 6 and 7).
4. Manufacturing method of flexible circuit board
Two copper-clad aluminum wires are pressed into flat wires 7.1, a layer of PI covering film is punched into a plurality of bonding pad windows 7.1a by a mould, the interval between the two wires is controlled by controlling the interval between the conductors on a wire covering machine, the flat wires are clamped between a layer of PI film 8.1 with glue and the punched PI film and are firmly bonded, and the flexible circuit board with two parallel flat wires is manufactured (shown in figure 9).
5. Manufacture of module
And (3) welding the LED lamp beads 9.1 with the resistors on a flexible circuit board with two parallel flat conducting wires by an SMT (surface mount technology) process to prepare a module (shown in figure 10) containing the LED lamp beads with the resistors.
Example two
1, preparation of the scaffold
A copper strip 1.1 with the thickness of 0.2MM is prepared to be punched into a circuit prototype through a special die, then silver is plated, PPA1.2 is injection molded to manufacture a bracket, and each bracket comprises 3 electrodes, namely a No. 1 electrode 1.1a, a No. 2 electrode 1.1b and a No. 3 electrode 1.1c (shown in figures 1, 2 and 3).
2, CSP LED and resistor are manufactured on the bracket
(1) And bonding the CSP LED small device 3.1c with the fluorescent powder on the No. 1 and No. 2 electrodes by using a die bonder and solder paste.
(2) And adhering the resistor 4.1 to the No. 2 and No. 3 electrodes by using a die bonder and solder paste.
(3) And welding the small CSP LED device 3.1c and the resistor 4.1 on the LED support electrode through reflow soldering to form an LED lamp bead 9.1 with a resistor, wherein the resistor of the lamp bead and the CSP LED device are exposed (shown in figure 8).
3. Manufacturing method of flexible circuit board
Two copper-clad aluminum wires are pressed into a flat wire 7.1, a layer of PI covering film is punched into a plurality of pad windows 7.1a by a mould, the interval between the two wires is controlled by controlling the interval control of the conductors on a wire covering machine, the two wires are kept at equal intervals, a layer of PI film 8.1 with glue and the punched PI film are used for clamping the flat wire in the middle and firmly adhering the flat wire, and a flexible circuit board (shown in figure 9) with two parallel flat wires is manufactured.
4. Manufacture of module
And (3) welding the LED lamp beads 9.1 with the resistors on a flexible circuit board with two parallel flat conducting wires by an SMT (surface mount technology) process to prepare a module (shown in figure 10) containing the LED lamp beads with the resistors.
The invention is described in detail with reference to the accompanying drawings by using a specific embodiment of a module for manufacturing a resistor-containing LED lamp bead. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.

Claims (10)

1. The utility model provides a module that LED lamp pearl preparation that contains resistance, includes:
an LED support;
an LED chip;
a resistance;
packaging glue;
a circuit board;
the LED module is characterized in that the LED module is formed by welding a plurality of LED lamp beads with resistors on the circuit board, and is characterized in that an LED chip and a resistor are packaged on an LED support by packaging glue, the support is provided with at least three electrodes, the LED support is provided with at least two welding feet which are communicated with the electrodes, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, the at least two welding feet, the LED chip and the resistor are communicated through the electrodes, the chip and the electrodes are communicated through lead wires or tin solder or are communicated through conductive glue, the circuit board is characterized by being a flexible circuit board or a rigid circuit board, and the LED module manufactured by the LED lamp beads with resistors is a module formed by welding the plurality of LED lamp beads with resistors on the circuit board.
2. The utility model provides a module that LED lamp pearl preparation that contains resistance, includes:
an LED support;
flip-chip LED chips or CSP LEDs;
a resistance;
a circuit board;
the LED module is characterized in that the LED module is formed by welding a plurality of LED lamp beads with resistors on the circuit board, and the lamp beads are characterized in that: a flip-chip LED chip or a CSP LED and a resistance have welded on the LED support, there are three electrodes at least on the support, there are two fillets at least on the LED support, it has formed and switched on to have two fillets and electrode at least, LED flip-chip or CSP LED and resistance have welded on the electrode, LED flip-chip or CSP LED and resistance have connected into series connection structure through the electrode, LED lamp pearl has two fillets at least, fillet and LED flip-chip or CSP LED have formed the turn-on connection through the electrode, fillet and resistance have also formed the turn-on connection through the electrode, the characteristic of circuit board is: the circuit board is a flexible circuit board or a rigid circuit board, and the LED module manufactured by the LED lamp beads with the resistors is a module formed by welding the LED lamp beads with the resistors on the circuit board.
3. The module of claim 1, wherein the LED chip is fixed to electrode No. 1 and connected to electrode No. 1 and electrode No. 2 by bonding wires, the resistor is fixed to electrode No. 2 and electrode No. 3, and the resistor is electrically connected to electrode No. 2 and electrode No. 3.
4. The module of claim 1 for manufacturing an LED lamp bead with a resistor, wherein the LED chip is fixed on the No. 1 and No. 2 electrodes and is connected to the No. 1 and No. 2 electrodes through a solder connection, the resistor is fixed on the No. 2 and No. 3 electrodes, and the resistor is connected to the No. 2 and No. 3 electrodes in a conductive manner.
5. The module of claim 2, wherein the LED flip chip is a flip chip with core powder on the surface.
6. The module of claim 2, wherein the CSP LED is a LED device with core powder on the surface.
7. The module of claim 1, wherein the LED chip and the resistor are packaged on the LED support by a packaging adhesive, and the packaging adhesive is a packaging adhesive containing yellow phosphor or a packaging adhesive without yellow phosphor.
8. The module of claim 1 or 2, wherein the LED support is formed by metal-embedding a resin.
9. The module of claim 1 or 2, wherein the resistor is conductively connected to the electrodes of the support by soldering or by conductive adhesive.
10. The module of claim 1 or 2, wherein the LED lamp bead with the resistor is an SMD (surface mounted device) patch lamp bead.
CN202110492787.8A 2021-04-29 2021-04-29 Module of LED lamp pearl preparation that contains resistance Pending CN115274640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110492787.8A CN115274640A (en) 2021-04-29 2021-04-29 Module of LED lamp pearl preparation that contains resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110492787.8A CN115274640A (en) 2021-04-29 2021-04-29 Module of LED lamp pearl preparation that contains resistance

Publications (1)

Publication Number Publication Date
CN115274640A true CN115274640A (en) 2022-11-01

Family

ID=83744985

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110492787.8A Pending CN115274640A (en) 2021-04-29 2021-04-29 Module of LED lamp pearl preparation that contains resistance

Country Status (1)

Country Link
CN (1) CN115274640A (en)

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