CN115411493A - LTE and millimeter wave coplanar common-caliber antenna applied to mobile terminal - Google Patents

LTE and millimeter wave coplanar common-caliber antenna applied to mobile terminal Download PDF

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Publication number
CN115411493A
CN115411493A CN202211005552.2A CN202211005552A CN115411493A CN 115411493 A CN115411493 A CN 115411493A CN 202211005552 A CN202211005552 A CN 202211005552A CN 115411493 A CN115411493 A CN 115411493A
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China
Prior art keywords
antenna
substrate
millimeter wave
lte
metal
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CN202211005552.2A
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Chinese (zh)
Inventor
杨汶汶
丁鑫浩
陈云
陈建新
孙强
杨永杰
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Nantong University
Nantong Research Institute for Advanced Communication Technologies Co Ltd
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Nantong University
Nantong Research Institute for Advanced Communication Technologies Co Ltd
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Priority to CN202211005552.2A priority Critical patent/CN115411493A/en
Publication of CN115411493A publication Critical patent/CN115411493A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
    • H01Q5/335—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Waveguide Aerials (AREA)

Abstract

The invention belongs to the technical field of microwave communication, and particularly relates to an LTE (Long term evolution) and millimeter wave coplanar common-caliber antenna applied to a mobile terminal. The millimeter wave continuous dielectric resonator array is constructed in the clearance area of the LTE planar inverted F antenna PIFA, and the space utilization rate is high. In the millimeter wave frequency band, in order to realize high radiation efficiency, the millimeter wave antenna adopts a substrate integrated dielectric resonator antenna SIDRA. Two types of metallized vias are used to promote isolation between the antennas. One is used for realizing the isolation between millimeter wave units, and the other is used for realizing the isolation between a millimeter wave antenna array and a microwave antenna, thereby facilitating the independent design and tuning of two frequency band antennas. In a microwave frequency band, the PIFA introduces a matching circuit, and the working bandwidth of the PIFA is widened. More importantly, the LTE antenna and the millimeter wave antenna array are realized by sharing one dielectric substrate, and the high integration level is achieved.

Description

LTE and millimeter wave coplanar common-caliber antenna applied to mobile terminal
Technical Field
The invention belongs to the technical field of microwave communication, and particularly relates to an LTE (Long term evolution) and millimeter wave coplanar common-caliber antenna applied to a mobile terminal.
Background
In order to meet the rapidly increasing mobile data traffic demand of the fifth generation mobile communication technology 5G, millimeter waves are introduced and play an important role due to their rich spectrum resources. Since the advantage of wide coverage of the existing microwave frequency band is still irreplaceable, the millimeter wave and the microwave will work together for a long time in the future. The introduction of millimeter waves will, of course, bring even greater difficulties to the design of antennas for mobile terminals, such as handheld communication devices, vehicles, drones, etc., whose interior space is already very limited. Therefore, an antenna solution that is compact and can support both the microwave and millimeter wave bands is urgently needed at the present stage. The microwave/millimeter wave common-caliber antenna has the advantage of high space utilization rate, and is considered to be an effective solution. The 5G terminal application puts forward three new design requirements on the microwave/millimeter wave common-caliber antenna, firstly, the compact size of the microwave antenna, namely the whole size of the antenna is determined by the size of the microwave antenna, so that the size requirement is as compact as possible to adapt to the terminal application. And secondly, high gain and wide-angle coverage of the millimeter wave antenna are realized, wherein the millimeter wave antenna needs to be realized in an array form in order to overcome higher transmission loss, the gain is usually more than 9dBi, and meanwhile, a phased array is required to be designed for wide-angle beam scanning so as to establish stable connection between a terminal and a base station. Third, wider bandwidths of the microwave and millimeter wave bands, for practical applications, the millimeter wave and millimeter wave antennas should cover some commercial bands, such as the LTE band of microwaves (1.71-2.69 GHz) and the n257 band of millimeter waves (26.5-29.5 GHz).
Currently, in mobile terminal applications, a millimeter wave antenna array is usually designed to be integrated with an LTE antenna or a sub-6GHz antenna. The first type is an integrated design of a millimeter wave antenna array and a microwave metal frame antenna. The second type is the integrated design of millimeter wave array and microwave plane printed antenna. However, none of the above designs can support only edge-fire beam scanning in the millimeter wave band, which is essential for mobile terminal applications. The existing microwave/millimeter wave common-caliber technology applied to mobile terminal equipment has a common defect that effective integration of a frame type/PIFA antenna of microwave and a side-emitting millimeter wave beam scanning array cannot be realized, and the side-emitting millimeter wave beam scanning antenna is indispensable in mobile terminal application, so that the application requirement of the terminal equipment on the side-emitting millimeter wave antenna is difficult to solve in the prior art. Therefore, the design of the microwave/millimeter wave coplanar common-caliber antenna with the millimeter wave side-emitting beam scanning function has good research significance and application value.
Disclosure of Invention
Aiming at the problems in the technology, the invention provides the LTE and millimeter wave coplanar common-caliber antenna applied to the mobile terminal, the invention effectively performs coplanar integration and realizes millimeter wave band side-emission beam scanning, wherein the LTE microwave antenna can cover 1.71-2.69GHz of an LTE frequency band, and the millimeter wave antenna can cover 26.5-29.5GHz of a 5G millimeter wave n257 frequency band.
In order to achieve the purpose, the invention adopts the following technical scheme:
an LTE and millimeter wave coplanar common-caliber antenna applied to a mobile terminal comprises a first substrate, a second substrate and a linear metalized groove for low-frequency radiation, wherein the first substrate, the second substrate and the linear metalized groove are sequentially stacked from bottom to top; the microstrip line structure comprises a plurality of metal microstrip lines arranged in an array along the direction of the x axis; a metal ground is arranged on the upper surface of the first substrate; a plurality of linear gaps are arranged on the surface of the metal ground; the plurality of linear gaps are arranged in an array along the y-axis direction; the plurality of linear gaps are vertically projected on a plane where the plurality of metal microstrip lines are located; the plurality of linear slots are used for feeding the high-frequency antenna; a plurality of dielectric resonator antennas are arranged on the upper surface of the second substrate in an array mode; the linear slot is positioned on the central line projected on the y-axis direction of the lower surface of the dielectric resonator antenna; a plurality of second metalized through holes and a plurality of third metalized through holes are arranged on the surface of the second substrate in a penetrating manner; the second metalized through holes are used for mutual isolation among the dielectric resonator antennas; the third metallized through holes are used for realizing mutual isolation between the millimeter wave antenna and the LTE microwave antenna; a microstrip feeder line for feeding the low-frequency antenna is arranged on the upper surface of the second substrate; an impedance matching circuit, a first metal strip and a second metal strip are arranged on the upper surface of the second substrate; one end of the impedance matching circuit is connected with the linear metallization groove through a first metal belt; the other end of the impedance matching circuit is connected with the microstrip feeder line; the impedance matching circuit is used for widening the bandwidth of the low-frequency antenna; the first substrate and the second metal strip are provided with a first metalized through hole in a penetrating manner; the impedance matching circuit is connected with a metal ground through a first metalized through hole.
As a further preferred technical solution of the present invention, the impedance matching circuit includes a lumped capacitor, a first lumped inductor, and a second lumped inductor; one end of the lumped capacitor is connected with the linear metallization groove through a first metal belt; the other end of the lumped capacitor is connected with one end of the first lumped inductor; the other end of the first lumped inductor is connected with one end of the microstrip feeder line; one end of the second lumped inductor is connected with the linear metallization groove through a first metal belt; the other end of the second lumped inductance is connected to metal ground through a first metalized via.
Further, according to a preferred embodiment of the present invention, the first substrate has a dielectric constant of 3.38, a loss angle of 0.0027, and a thickness of 0.305mm.
Further, according to a preferred embodiment of the present invention, the second substrate has a dielectric constant of 10.2, a loss angle of 0.0023, and a thickness of 1.27mm.
Further, as a preferred technical solution of the present invention, the number of the plurality of dielectric resonator antennas, the number of the plurality of line slots, and the number of the plurality of metal microstrip lines are four.
Further, as a preferred embodiment of the present invention, the first metal strip and the second metal strip are both metal strips printed on the second substrate.
Compared with the prior art, the LTE and millimeter wave coplanar common-caliber antenna applied to the mobile terminal has the following technical effects by adopting the technical scheme:
1. the millimeter wave continuous dielectric resonator array is constructed in the clearance area of the LTE planar inverted-F antenna PIFA, the scheme has extremely high space utilization rate, and the LTE antenna and the millimeter wave antenna array are realized by sharing one dielectric substrate, so that the high integration level is achieved.
2. The millimeter wave frequency band adopts the substrate integrated continuous medium resonator array, and has the advantages of high efficiency and high space utilization rate. Two types of metallized vias are used to promote isolation between the antennas. One is used for realizing the isolation between the millimeter wave units, and the other is used for realizing the isolation between the millimeter wave antenna array and the microwave antenna, thereby being convenient for the independent design and tuning of the two frequency band antennas.
3. In the microwave frequency range, the PIFA introduces a matching circuit, and the working bandwidth of the PIFA is widened.
4. The invention can realize the edge-emitting beam scanning of the millimeter wave frequency band while realizing the dual-band coverage of LTE microwave and millimeter wave, has the excellent characteristics of low profile and smaller plane size, and has high practical value.
Drawings
Fig. 1 is a schematic perspective view of an antenna structure according to an embodiment of the present invention;
fig. 2 is an enlarged schematic diagram of a first region and a second region of an antenna structure according to an embodiment of the invention;
fig. 3 is a schematic diagram of an antenna structure according to an embodiment of the present invention;
fig. 4 is an enlarged schematic diagram of an impedance matching circuit of the antenna structure of the embodiment of the present invention;
fig. 5 is a schematic diagram of a simulation result of reflection coefficient and gain of an LTE frequency band antenna according to an embodiment of the present invention;
FIG. 6 (a) is the simulated directional diagram of the E-plane antenna at 1.9GHz according to the embodiment of the invention;
FIG. 6 (b) is an H-plane antenna simulation pattern at 1.9GHz according to an embodiment of the present invention;
FIG. 6 (c) is an E-plane antenna simulation pattern at 2.4GHz in accordance with an embodiment of the present invention;
FIG. 6 (d) is an H-plane antenna simulation pattern at 2.4GHz in accordance with an embodiment of the present invention;
FIG. 7 is a diagram illustrating simulation results of reflection coefficient and gain of an antenna in 28GHz band according to an embodiment of the present invention;
FIG. 8 is a simulated pattern for antenna beam scanning at 28GHz according to an embodiment of the invention;
FIG. 9 is a diagram of an isolation simulation of an embodiment of the present invention in the millimeter wave and microwave frequency bands of an antenna;
in the figure, 1-metallization groove, 2-second substrate, 3-first substrate, 4-microstrip line structure, 5-metal ground, 6-microstrip feeder line, 7-first metallization through hole, 8-second metallization through hole, 9-third metallization through hole, 10-linear slot, 11-lumped capacitor, 12-first lumped inductor, and 13-second lumped inductor.
Detailed Description
The present invention will be further explained with reference to the drawings so that those skilled in the art can more deeply understand the present invention and can carry out the present invention, but the present invention will be explained below by referring to examples, which are not intended to limit the present invention.
As shown in fig. 1, an LTE and millimeter wave coplanar common-aperture antenna applied to a mobile terminal includes a first substrate 3, a second substrate 2 and a linear metallization slot 1 for low-frequency radiation, which are sequentially stacked from bottom to top, wherein a microstrip line structure 4 for high-frequency antenna feed is arranged on the lower surface of the first substrate 3; the microstrip line structure 4 comprises four metal microstrip lines arranged in an array along the x-axis direction; a metal ground 5 is arranged on the upper surface of the first substrate 3; as shown in the enlarged schematic diagrams of the first area and the second area in fig. 2, four linear slits 10 are disposed on the surface of the metal ground 5; the four straight-line-shaped gaps 10 are arranged in an array along the y-axis direction; as shown in the enlarged schematic diagram of the area three in fig. 3, four line-shaped slots 10 are vertically projected on the plane where the four metal microstrip lines are located; the four straight slots 10 are used for feeding the high-frequency antenna; four dielectric resonator antennas are arranged on the upper surface of the second substrate 2 in an array mode; the linear slot 10 is positioned on the central line of the y-axis direction projected on the lower surface of the dielectric resonator antenna; ten second metalized through holes 8 and eight third metalized through holes 9 are arranged on the surface of the second substrate 2 in a penetrating manner; ten second metallized through holes 8 are used for mutual isolation among the four dielectric resonator antennas; the eight third metallized through holes 9 are used for realizing mutual isolation between the millimeter wave antenna and the LTE microwave antenna; a microstrip feeder 6 for feeding the low-frequency antenna is arranged on the upper surface of the second substrate 2; an impedance matching circuit, a first metal strip and a second metal strip are arranged on the upper surface of the second substrate 2; one end of the impedance matching circuit is connected with the linear metallization groove 1 through a first metal belt; the other end of the impedance matching circuit is connected with the microstrip feeder line 6; the impedance matching circuit is used for widening the bandwidth of the low-frequency antenna; a first metalized through hole 7 is arranged between the first substrate 3 and the second metal strip in a penetrating way; the impedance matching circuit is connected to metal ground 5 through a first metallized via 7. The first metal tape and the second metal tape are both metal tapes printed on the second substrate 2.
As shown in fig. 4, the impedance matching circuit includes a lumped capacitor 11, a first lumped inductor 12 and a second lumped inductor 13; one end of the lumped capacitor 11 is connected with the linear metallization groove 1 through a first metal strip; the other end of the lumped capacitor 11 is connected with one end of the first lumped inductor 12; the other end of the first lumped inductor 12 is connected with one end of the microstrip feeder line 6; one end of the second lumped inductor 13 is connected with the in-line metallization tank 1 through a first metal strip; the other end of the second lumped inductance 13 is connected to the metal ground 5 through the first metallized via 7.
During specific work, four dielectric resonator antenna arrays are constructed on the second substrate 2 in a 28GHz millimeter wave frequency band. The radio frequency excitation signal is fed in by four metal microstrip lines of the microstrip line structure 4 at the bottom layer, and is coupled and fed to the dielectric resonator antenna positioned above the metal ground 5 through the straight-line-shaped slot 10, so that the millimeter-band work is realized. The four-unit dielectric resonator antenna array can realize side-emitting beam scanning. In the LTE microwave frequency band, the second substrate 2 serves as a microwave antenna dielectric substrate, the metallization groove 1 serves as an antenna radiation element, and a radio frequency excitation signal is fed by the upper microstrip feeder 6. The lumped capacitor 11, the first lumped inductor 12 and the second lumped inductor 13 in front of the microstrip feeder 6 jointly form an impedance matching circuit, so that the bandwidth of the low-frequency antenna is widened, and the broadband working effect of the LTE microwave frequency band is realized.
The first substrate 3 had a dielectric constant of 3.38, a loss angle of 0.0027 and a thickness of 0.305mm. The second substrate 2 had a dielectric constant of 10.2, a loss angle of 0.0023 and a thickness of 1.27mm.
The overall section height of the invention is 1.575mm (-0.01 lambda) 0 @2.2 GHz) with a clearance dimension of 7mm (-0.05 lambda) 0 @2.2 GHz). The transmission response and the radiation response of the antenna are shown in fig. 5 and fig. 7, and fig. 5 is a schematic diagram of a simulation result of the reflection coefficient and the gain of the antenna in the LTE frequency band according to the embodiment of the present invention; FIG. 7 is a diagram illustrating simulation results of reflection coefficient and gain of an antenna in 28GHz band according to an embodiment of the present invention; for S11 less than or equal to-6 dB, the bandwidth ranges from 1.69 GHz to 2.76GHz and from 26.4 GHz to 29.8GHz, the LTE frequency band (1.71 GHz to 2.69 GHz) and the 5G millimeter wave frequency band n257 (26.5 GHz to 29.5 GHz) are well covered, and the highest gains in the frequency bands are respectively 4.3dBi and 12.4dBi. FIG. 6 (a) is an E-plane antenna simulation pattern at 1.9GHz in accordance with an embodiment of the present invention; FIG. 6 (b) is the simulated directional diagram of the H-plane antenna at 1.9GHz according to the embodiment of the invention; FIG. 6 (c) is an E-plane antenna simulation pattern at 2.4GHz in accordance with an embodiment of the present invention; fig. 6 (d) is the simulated pattern of the H-plane antenna of the embodiment of the present invention at 2.4GHz, the pattern of the antenna is symmetrical, and the front-to-back ratio is better than 7dB. FIG. 8 is a simulated directional diagram of beam scanning at 28GHz antenna, which satisfies the requirement of beam scanning performanceIn the range of ± 45 °. Fig. 9 is a simulation of the isolation of the antenna between the millimeter wave and microwave frequency bands, with greater than 20dB of isolation between the microwave and millimeter wave antenna ports.
The invention provides an LTE and millimeter wave coplanar common-caliber antenna applied to a mobile terminal, and a millimeter wave continuous dielectric resonator array is constructed in a clearance area of an LTE planar inverted-F antenna PIFA, so that the space utilization rate is higher. In the millimeter wave frequency band, in order to realize high radiation efficiency, the millimeter wave antenna adopts a substrate integrated dielectric resonator antenna SIDRA. Two types of metallized vias are used to promote isolation between the antennas. One is used for realizing the isolation between millimeter wave units, and the other is used for realizing the isolation between a millimeter wave antenna array and a microwave antenna, thereby facilitating the independent design and tuning of two frequency band antennas. In a microwave frequency band, the PIFA introduces a matching circuit, and the working bandwidth of the PIFA is widened. More importantly, the LTE antenna and the millimeter wave antenna array are realized by sharing one medium substrate, and the integration level is very high.
The above-mentioned embodiments, objects, technical solutions and advantages of the present invention are further described in detail, it should be understood that the above-mentioned embodiments are only examples of the present invention, and are not intended to limit the scope of the present invention, and any person skilled in the art should be able to make equivalent changes and modifications without departing from the concept and principle of the present invention.

Claims (6)

1. An LTE and millimeter wave coplanar common-caliber antenna applied to a mobile terminal comprises a first substrate (3), a second substrate (2) and a linear metalized groove (1) for low-frequency radiation, wherein the first substrate (3) and the second substrate are sequentially stacked from bottom to top, and the lower surface of the first substrate (3) is provided with a microstrip line structure (4) for high-frequency antenna feed; the microstrip line structure (4) comprises a plurality of metal microstrip lines arranged in an array along the x-axis direction; a metal ground (5) is arranged on the upper surface of the first substrate (3); a plurality of linear gaps (10) are arranged on the surface of the metal ground (5); the plurality of linear gaps (10) are arranged in an array along the y-axis direction; the plurality of linear gaps (10) are vertically projected on a plane where the plurality of metal microstrip lines are located; the plurality of linear slots (10) are used for feeding the high-frequency antenna; a plurality of dielectric resonator antennas are arranged on the upper surface of the second substrate (2) in an array mode; the straight line-shaped slot (10) is positioned on the central line of the lower surface of the dielectric resonator antenna in the y-axis direction in a projection manner; a plurality of second metalized through holes (8) and a plurality of third metalized through holes (9) are arranged on the surface of the second substrate (2) in a penetrating manner; the second metalized through holes (8) are used for mutual isolation among the dielectric resonator antennas; the third metallized through holes (9) are used for realizing mutual isolation between the millimeter wave antenna and the LTE microwave antenna; a microstrip feed line (6) for feeding the low-frequency antenna is arranged on the upper surface of the second substrate (2); an impedance matching circuit, a first metal strip and a second metal strip are arranged on the upper surface of the second substrate (2); one end of the impedance matching circuit is connected with the linear metallization groove (1) through a first metal belt; the other end of the impedance matching circuit is connected with a microstrip feeder line (6); the impedance matching circuit is used for widening the bandwidth of the low-frequency antenna; a first metalized through hole (7) is arranged between the first substrate (3) and the second metal strip in a penetrating manner; the impedance matching circuit is connected with a metal ground (5) through a first metalized through hole (7).
2. The LTE and millimeter wave coplanar common-aperture antenna applied to a mobile terminal according to claim 1, wherein the impedance matching circuit comprises a lumped capacitor (11), a first lumped inductor (12) and a second lumped inductor (13); one end of the lumped capacitor (11) is connected with the linear metallization groove (1) through a first metal belt; the other end of the lumped capacitor (11) is connected with one end of a first lumped inductor (12); the other end of the first lumped inductor (12) is connected with one end of the microstrip feeder line (6); one end of the second lumped inductor (13) is connected with the linear metallization groove (1) through a first metal belt; the other end of the second lumped inductance (13) is connected to a metal ground (5) through a first metallized via (7).
3. The LTE-MMW coplanar co-aperture antenna applied to a mobile terminal according to claim 1, wherein the first substrate (3) has a dielectric constant of 3.38, a loss angle of 0.0027 and a thickness of 0.305mm.
4. The LTE-MMW coplanar co-aperture antenna applied to the mobile terminal according to claim 1, wherein the second substrate (2) has a dielectric constant of 10.2, a loss angle of 0.0023 and a thickness of 1.27mm.
5. The LTE and millimeter wave coplanar common-aperture antenna applied to a mobile terminal as claimed in claim 1, wherein the number of the dielectric resonator antennas, the number of the linear slots (10), and the number of the metal microstrip lines are four.
6. The LTE and MMW coplanar co-aperture antenna for a mobile terminal according to claim 1, wherein the first metal strip and the second metal strip are metal strips printed on the second substrate (2).
CN202211005552.2A 2022-08-22 2022-08-22 LTE and millimeter wave coplanar common-caliber antenna applied to mobile terminal Pending CN115411493A (en)

Priority Applications (1)

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CN202211005552.2A CN115411493A (en) 2022-08-22 2022-08-22 LTE and millimeter wave coplanar common-caliber antenna applied to mobile terminal

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CN202211005552.2A CN115411493A (en) 2022-08-22 2022-08-22 LTE and millimeter wave coplanar common-caliber antenna applied to mobile terminal

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CN115411493A true CN115411493A (en) 2022-11-29

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