CN115368607A - 一种聚醚砜基复合介电薄膜材料及其制备方法 - Google Patents
一种聚醚砜基复合介电薄膜材料及其制备方法 Download PDFInfo
- Publication number
- CN115368607A CN115368607A CN202211308149.7A CN202211308149A CN115368607A CN 115368607 A CN115368607 A CN 115368607A CN 202211308149 A CN202211308149 A CN 202211308149A CN 115368607 A CN115368607 A CN 115368607A
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- China
- Prior art keywords
- barium titanate
- graded
- polyether sulfone
- polyphenyl ether
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002131 composite material Substances 0.000 title claims abstract description 87
- 239000004695 Polyether sulfone Substances 0.000 title claims abstract description 71
- 229920006393 polyether sulfone Polymers 0.000 title claims abstract description 71
- 239000000463 material Substances 0.000 title claims abstract description 42
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical class [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims abstract description 177
- 229910002113 barium titanate Inorganic materials 0.000 claims abstract description 149
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000002994 raw material Substances 0.000 claims abstract description 4
- MTEZSDOQASFMDI-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-ol Chemical compound CCC(O)[Si](OC)(OC)OC MTEZSDOQASFMDI-UHFFFAOYSA-N 0.000 claims abstract description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 50
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 45
- 239000011521 glass Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 37
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 36
- 238000001035 drying Methods 0.000 claims description 27
- 239000012046 mixed solvent Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 16
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 239000003960 organic solvent Substances 0.000 claims description 13
- 239000002105 nanoparticle Substances 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 10
- 238000010992 reflux Methods 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 7
- 229910021641 deionized water Inorganic materials 0.000 claims description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 6
- RIAHASMJDOMQER-UHFFFAOYSA-N 5-ethyl-2-methyl-1h-imidazole Chemical compound CCC1=CN=C(C)N1 RIAHASMJDOMQER-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000001291 vacuum drying Methods 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 238000007790 scraping Methods 0.000 claims description 2
- 239000000945 filler Substances 0.000 abstract description 18
- 230000015556 catabolic process Effects 0.000 abstract description 13
- 238000004146 energy storage Methods 0.000 abstract description 11
- 230000007547 defect Effects 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 56
- 230000000052 comparative effect Effects 0.000 description 18
- 239000002245 particle Substances 0.000 description 17
- 239000011159 matrix material Substances 0.000 description 10
- -1 poly (arylene ether nitrile Chemical class 0.000 description 8
- 229920001955 polyphenylene ether Polymers 0.000 description 8
- 229920000265 Polyparaphenylene Polymers 0.000 description 6
- 230000010287 polarization Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- AJCDFVKYMIUXCR-UHFFFAOYSA-N oxobarium;oxo(oxoferriooxy)iron Chemical compound [Ba]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O AJCDFVKYMIUXCR-UHFFFAOYSA-N 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910002112 ferroelectric ceramic material Inorganic materials 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
- C08J2381/06—Polysulfones; Polyethersulfones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
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CN202211308149.7A CN115368607B (zh) | 2022-10-25 | 2022-10-25 | 一种聚醚砜基复合介电薄膜材料及其制备方法 |
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CN202211308149.7A CN115368607B (zh) | 2022-10-25 | 2022-10-25 | 一种聚醚砜基复合介电薄膜材料及其制备方法 |
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CN115368607A true CN115368607A (zh) | 2022-11-22 |
CN115368607B CN115368607B (zh) | 2023-02-24 |
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CN202211308149.7A Active CN115368607B (zh) | 2022-10-25 | 2022-10-25 | 一种聚醚砜基复合介电薄膜材料及其制备方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114957993A (zh) * | 2022-06-02 | 2022-08-30 | 宁夏清研高分子新材料有限公司 | 一种高介电聚芳醚砜材料及其制备方法 |
CN115490847A (zh) * | 2022-09-30 | 2022-12-20 | 四川轻化工大学 | 含砜基双羟基聚苯醚、可交联聚苯醚及其制备方法 |
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KR100879034B1 (ko) * | 2007-12-28 | 2009-01-15 | 한국과학기술연구원 | 내장형 커패시터용 유기화 처리된 티탄화바륨/에폭시복합체 및 이를 이용한 유전체 필름 제조방법 |
CN103881303A (zh) * | 2012-12-20 | 2014-06-25 | 三星电机株式会社 | 印刷电路基板用树脂组合物和绝缘膜及预浸料坯和印刷电路基板 |
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US20170335041A1 (en) * | 2015-02-17 | 2017-11-23 | Fujifilm Corporation | Composition for polymerization, method for producing same, composition for a coating containing composition for polymerization, method for producing composition for a coating using composition for polymerization, and method for producing coating |
CN114805892A (zh) * | 2022-05-19 | 2022-07-29 | 乌镇实验室 | 一种双层结构聚醚砜基高温电介质复合薄膜的制备方法 |
CN115124838A (zh) * | 2022-06-15 | 2022-09-30 | 乌镇实验室 | 一种聚砜/改性填料复合介电薄膜材料及其制备方法 |
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2022
- 2022-10-25 CN CN202211308149.7A patent/CN115368607B/zh active Active
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KR100879034B1 (ko) * | 2007-12-28 | 2009-01-15 | 한국과학기술연구원 | 내장형 커패시터용 유기화 처리된 티탄화바륨/에폭시복합체 및 이를 이용한 유전체 필름 제조방법 |
CN103881303A (zh) * | 2012-12-20 | 2014-06-25 | 三星电机株式会社 | 印刷电路基板用树脂组合物和绝缘膜及预浸料坯和印刷电路基板 |
JP2014210904A (ja) * | 2013-04-17 | 2014-11-13 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 低い熱膨張率および誘電損失率を有するプリント基板用絶縁樹脂組成物、これを用いたプリプレグおよびプリント基板 |
CN103881381A (zh) * | 2014-04-03 | 2014-06-25 | 广州市聚赛龙工程塑料有限公司 | 一种高介电常数低介电损耗聚醚砜复合材料及其制备方法 |
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CN115124838A (zh) * | 2022-06-15 | 2022-09-30 | 乌镇实验室 | 一种聚砜/改性填料复合介电薄膜材料及其制备方法 |
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白晓飞等: "嵌入式电容用钛酸钡/聚酰亚胺复合薄膜的制备及性能研究", 《绝缘材料》 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114957993A (zh) * | 2022-06-02 | 2022-08-30 | 宁夏清研高分子新材料有限公司 | 一种高介电聚芳醚砜材料及其制备方法 |
CN115490847A (zh) * | 2022-09-30 | 2022-12-20 | 四川轻化工大学 | 含砜基双羟基聚苯醚、可交联聚苯醚及其制备方法 |
CN115490847B (zh) * | 2022-09-30 | 2024-01-30 | 湖南长炼新材料科技股份公司 | 含砜基双羟基聚苯醚、可交联聚苯醚及其制备方法 |
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