CN115335482B - 粘接剂组合物和粘接片材、层叠体及印刷线路板 - Google Patents

粘接剂组合物和粘接片材、层叠体及印刷线路板 Download PDF

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Publication number
CN115335482B
CN115335482B CN202180024655.0A CN202180024655A CN115335482B CN 115335482 B CN115335482 B CN 115335482B CN 202180024655 A CN202180024655 A CN 202180024655A CN 115335482 B CN115335482 B CN 115335482B
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CN
China
Prior art keywords
acid
adhesive composition
polyester resin
amorphous polyester
less
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CN202180024655.0A
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English (en)
Chinese (zh)
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CN115335482A (zh
Inventor
坂本晃一
三浦航
川楠哲生
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Dongyang Textile Mc Co ltd
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Dongyang Textile Mc Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
CN202180024655.0A 2020-04-06 2021-03-26 粘接剂组合物和粘接片材、层叠体及印刷线路板 Active CN115335482B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020068163 2020-04-06
JP2020-068163 2020-04-06
PCT/JP2021/013044 WO2021205917A1 (ja) 2020-04-06 2021-03-26 接着剤組成物ならびに接着シート、積層体およびプリント配線板

Publications (2)

Publication Number Publication Date
CN115335482A CN115335482A (zh) 2022-11-11
CN115335482B true CN115335482B (zh) 2024-06-25

Family

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Family Applications (1)

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CN202180024655.0A Active CN115335482B (zh) 2020-04-06 2021-03-26 粘接剂组合物和粘接片材、层叠体及印刷线路板

Country Status (5)

Country Link
JP (1) JP6981583B1 (https=)
KR (1) KR102937559B1 (https=)
CN (1) CN115335482B (https=)
TW (1) TWI885110B (https=)
WO (1) WO2021205917A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7223300B2 (ja) * 2020-09-18 2023-02-16 三菱ケミカル株式会社 ポリエステル系樹脂、接着剤組成物及び接着剤
JP7156562B1 (ja) 2021-04-16 2022-10-19 三菱ケミカル株式会社 フレキシブルプリント配線板用接着剤組成物
KR102521064B1 (ko) * 2021-12-14 2023-04-13 율촌화학 주식회사 Lcp 필러를 포함하는 폴리올레핀계 저유전 접착제 조성물 및 이를 이용한 저유전 본딩 시트
JPWO2023127890A1 (https=) * 2021-12-28 2023-07-06
JPWO2024202632A1 (https=) * 2023-03-28 2024-10-03

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102627934A (zh) * 2011-02-01 2012-08-08 阿尔卑斯电气株式会社 密封材料
CN108291076A (zh) * 2015-12-24 2018-07-17 株式会社钟化 树脂组合物、使用了其的半固化性热传导膜、电路基板和粘接片

Family Cites Families (15)

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JPH06104813B2 (ja) * 1987-12-16 1994-12-21 信越化学工業株式会社 難燃性カバーレイフイルム
JPH06104813A (ja) 1992-09-18 1994-04-15 Canon Inc 無線電話機
JP4036345B2 (ja) * 1996-04-10 2008-01-23 三井・デュポンフロロケミカル株式会社 金属基材被覆用組成物
JP4172063B2 (ja) * 1997-06-30 2008-10-29 東レ株式会社 溶着用樹脂組成物の製造方法
JP2002249754A (ja) * 2001-02-27 2002-09-06 Dainippon Ink & Chem Inc 接着剤用樹脂組成物及び積層体
JP2004013054A (ja) * 2002-06-11 2004-01-15 Sumitomo Chem Co Ltd 高耐熱ラベル
JP2006307093A (ja) * 2005-05-02 2006-11-09 Sekisui Chem Co Ltd 光反応型接着剤組成物および液晶表示装置の製造方法
WO2014109199A1 (ja) 2013-01-09 2014-07-17 株式会社村田製作所 処理済み液晶ポリマーパウダー、これを含むペーストおよび、それらを用いた液晶ポリマーシート、積層体、ならびに処理済み液晶ポリマーパウダーの製造方法
JPWO2014147903A1 (ja) * 2013-03-22 2017-02-16 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP6164609B2 (ja) * 2013-08-23 2017-07-19 東亞合成株式会社 光硬化性接着剤組成物、偏光板とその製造法、光学部材及び液晶表示装置
JP6645431B2 (ja) * 2014-08-27 2020-02-14 東洋紡株式会社 低誘電接着剤組成物
CN107075335B (zh) 2014-09-24 2020-02-14 东亚合成株式会社 粘接剂组合物和使用了其的带有粘接剂层的层叠体
TW201938741A (zh) * 2018-03-05 2019-10-01 日商拓自達電線股份有限公司 接著劑用組成物
KR102889825B1 (ko) * 2018-05-25 2025-11-21 세키스이가가쿠 고교가부시키가이샤 액정 표시 소자용 시일제, 상하 도통 재료, 및 액정 표시 소자
CN109666434B (zh) * 2018-12-27 2021-09-10 苏州赛伍应用技术股份有限公司 粘合剂及制备方法、包含其的胶膜和制备方法及应用

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102627934A (zh) * 2011-02-01 2012-08-08 阿尔卑斯电气株式会社 密封材料
CN108291076A (zh) * 2015-12-24 2018-07-17 株式会社钟化 树脂组合物、使用了其的半固化性热传导膜、电路基板和粘接片

Also Published As

Publication number Publication date
JPWO2021205917A1 (https=) 2021-10-14
TWI885110B (zh) 2025-06-01
CN115335482A (zh) 2022-11-11
JP6981583B1 (ja) 2021-12-15
KR20220163937A (ko) 2022-12-12
KR102937559B1 (ko) 2026-03-10
TW202144528A (zh) 2021-12-01
WO2021205917A1 (ja) 2021-10-14

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Effective date of registration: 20230525

Address after: South Building, Meitian Twin Towers, No. 13-1, Meitian 1-chome, Kita ku, Osaka City, Osaka Prefecture, Japan

Applicant after: Dongyang Textile MC Co.,Ltd.

Address before: No. 1, No. 13, meitian-1, Shibei District, Osaka, Osaka, Japan

Applicant before: TOYOBO Co.,Ltd.

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