CN115302742A - 磁吸夹层的制造方法及电子设备保护壳的制造方法 - Google Patents

磁吸夹层的制造方法及电子设备保护壳的制造方法 Download PDF

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Publication number
CN115302742A
CN115302742A CN202210939013.XA CN202210939013A CN115302742A CN 115302742 A CN115302742 A CN 115302742A CN 202210939013 A CN202210939013 A CN 202210939013A CN 115302742 A CN115302742 A CN 115302742A
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China
Prior art keywords
interlayer
flexible container
magnetic
manufacturing
assembly obtained
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Inventor
郑阳辉
仇森
郑阳红
郑井艳
刘秋顺
陈少华
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Shenzhen Lingyi Innovation Technology Co ltd
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Shenzhen Lingyi Innovation Technology Co ltd
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Priority to CN202210939013.XA priority Critical patent/CN115302742A/zh
Publication of CN115302742A publication Critical patent/CN115302742A/zh
Priority to US18/365,436 priority patent/US12005656B2/en
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Abstract

本申请实施例公开了一种磁吸夹层的制造方法及电子设备保护壳的制造方法,磁吸夹层包括夹层基材与磁吸件,磁吸夹层开设有贯通的安装孔,磁吸件固定嵌置于安装孔,磁吸夹层的制造方法包括:采用设有增强纤维纱的夹层基材,并且在夹层基材上开设贯通的安装孔;磁吸件嵌入夹层基材上的安装孔得到的组件装夹于整形模具中;再将组件与整形模具一并装入柔性容器,抽气后再对柔性容器密封;接着将柔性容器及其内容物一并装入热压罐以进行热压处理;完成热压处理后最后再对磁吸夹层半成品进行剪裁。本申请的磁吸夹层的制造方法采用具有增强纤维纱的夹层基材并对热压处理前的半成品进行装夹、排气,如此制得的磁吸夹层厚度小,结构牢固而不易变形。

Description

磁吸夹层的制造方法及电子设备保护壳的制造方法
技术领域
本申请涉及层状电子设备保护壳制造方法技术领域,尤其涉及一种磁吸夹层的制造方法及电子设备保护壳的制造方法。
背景技术
为了方便固定,越来越多的电子设备保护壳内嵌了磁吸件。例如为了方便无线充电设备透过手机保护壳对手机进行充电,手机保护壳的薄壁结构内嵌了磁吸件。然而,电子设备保护壳的技术门槛低,竞争日趋激烈,即使内嵌有磁吸件,电子设备保护壳仍需足够轻薄且外观质感高才能建立有效的竞争优势。
为了方便嵌置磁吸件,现有的一种电子设备保护壳的制造方法包括直接将磁吸件放置于夹层基材上,然后在采用热熔胶水固定磁吸件与夹层基材,为了消除磁吸件与夹层基材之间的高度落差,最后再将所得组件的正反面通过包胶层与内层壳和外层壳热压固定。但这种方案由于磁吸件与夹层基材之间存在落差、夹层基材以及包胶层的变形难以控制,因此,不仅使得电子设备保护壳的厚度较大,而且还会导致电子设备保护壳在对应磁吸件的部位出现印痕,如此便降低了外观质感。
为了解决热压工艺变形量大的技术问题,韩国授权专利文献KR102248166B1公开了一种非热压工艺的电子设备保护壳的制造方法,该制造方法涉及在夹层基材上开设“盲孔”,再将磁吸件安装于盲孔,取两盖板并在两盖板的内侧面涂覆粘接剂,再将安装有磁吸件的夹层基材置于两盖板之间,盖板上涂覆的粘接剂可流入盲孔内。由于粘接剂的固化温度相对较低,因此,两个盖板的变形量较小,但是由于磁吸件与盲孔的底壁存在叠加,这种方式制造的产品厚度还是偏厚;并且因为粘接剂流入盲孔的量难以控制,因此,在盖板对应磁吸件的位置还是有可能出现凸印或凹印,从而外观质感仍然不理想。
发明内容
本申请的主要目的是提出一种磁吸夹层的制造方法及电子设备保护壳的制造方法,旨在解决现有的磁吸夹持的制造方法制得的磁吸夹层产品厚度较大,应用于电子设备保护壳时容易出现对应于磁吸件的印痕的技术问题。
为实现上述目的,本申请提出一种磁吸夹层的制造方法,所述磁吸夹层包括夹层基材与磁吸件,所述磁吸夹层开设有贯通的安装孔,所述磁吸件固定嵌置于所述安装孔,所述磁吸夹层的制造方法包括:
S100:在夹层基材上开设贯通的安装孔,所述夹层基材包括热熔基体以及包含在所述热熔基体中的增强纤维纱;
S200:在整形下模的上表面铺贴第一离型膜;
S300:将步骤S100所得的夹层基材铺贴于所述第一离型膜;
S400:将磁吸件嵌入所述夹层基材的所述安装孔中;
S500:将第二离型膜铺贴于步骤S400所得组件的上表面;
S600:将整形上模盖合在所述第二离型膜的上表面;
S700:将步骤S600所得的组件、所述整形上模、第一离型膜、第二离型膜以及整形上模一并装入第一柔性容器;
S800:对所述第一柔性容器内进行抽气处理,并在抽气处理完成后密封所述第一柔性容器;
S900:将所述第一柔性容器以及所述第一柔性容器的内容物一并置入热压罐,并在所述热压罐密封后对所述热压罐进行充气加压处理,对步骤S800所得组件加热预设时长;
S1000:停止加热至步骤S900所得组件降温至预设温度时,取出所述第一离型膜与第二离型膜之间的磁吸夹层半成品;
S1100:对步骤S1000所得所述磁吸夹层半成品进行剪裁以获得预设外形尺寸的磁吸夹层。
优选地,所述增强纤维纱为玻璃纤维纱,所述热熔基体为树脂;所述步骤S900中所述对步骤S800所得组件加热预设时长具体包括:
对步骤S800所得组件从初始温度加热至125摄氏度并保持15分钟,然后再加热至135摄氏度并保持40分钟。
优选地,所述步骤S900中所述对所述热压罐进行充气加压处理具体包括:对所述热压罐进行充气加压处理以至所述热压罐内的压强在[0.4,0.8]MPa范围内。
优选地,所述整形下模和整形上模均为板状;所述第一柔性容器为金属箔袋,且在空置排气状态下,所述第一柔性容器为片状。
优选地,所述第一柔性容器为锡箔袋。
优选地,所述夹层基材包括多个相互叠合的片材,所述片材包括热熔基体以及包含在所述热熔基体中的增强纤维纱;所述安装孔包括环形孔,所述步骤S100具体包括:
步骤S110:将多个片材叠合至形成预设厚度的夹层基材;
步骤S120:冲裁贯穿各个所述片材以形成所述安装孔。
优选地,所述磁吸件包括主吸附件,所述主吸附件包括多个主磁吸件以及将多个主磁吸件连接成环状的环形膜;所述S400具体包括:
将所述主吸附件嵌入所述夹层基材的所述环形孔中。
本申请还提出一种电子设备保护壳的制造方法,所述电子设备保护壳包括内层壳、外层壳以及夹设于所述内层壳与外层壳之间的磁吸夹层,所述电子设备保护壳的制造方法包括:
P100:将磁吸夹层叠设于所述内层壳与外层壳之间,所述磁吸夹层为采用如上任一实施例所述的磁吸夹层的制造方法制造的磁吸夹层;
P200:将步骤P100所得的组件装入第二柔性容器;
P300:对所述第二柔性容器内进行抽气处理,并在抽气处理完成后密封所述第二柔性容器;
P400:将所述第二柔性容器以及所述第二柔性容器的内容物一并置入热压罐,并在所述热压罐密封后对所述热压罐进行充气加压处理,对步骤P300所得组件加热预设时长;
P500:停止加热至步骤P400所得组件降温至预设温度时,取出所述第二柔性容器内的电子设备保护壳。
优选地,所述内层壳与外层壳的初始形状均为平板状;在所述步骤P100与步骤P200之间还包括:
P110:将步骤P100所得的组件置入拉深凹模上;
P120:将拉深芯模置于步骤P100所得的组件上表面的预设位置,所述拉深芯模的大小与所述电子设备保护壳的容腔大小相适配;
P130:将所述拉深芯模压入所述拉深凹模的内腔;
P140:将所述拉深芯模与步骤P130所得组件装夹于束紧件,使步骤P130所得组件相对所述拉深芯模保持预设的变形状态;
所述步骤P200具体包括:
将所述束紧件、拉深芯模与步骤P130所得组件装入第二柔性容器。
优选地,所述束紧件为硅胶袋,所述第二柔性容器为锡箔袋,且在空置排气状态下,所述第二柔性容器为片状。
本申请的磁吸夹层的制造方法采用设有增强纤维纱的夹层基材,并且在夹层基材上开设贯通的安装孔;磁吸件嵌入夹层基材上的安装孔如此得到的组件初始厚度较小。将得到的组件装夹于整形模具中;再将组件与整形模具一并装入柔性容器,抽气后再对柔性容器密封;接着将柔性容器及其内容物一并装入热压罐以进行热压处理,如此夹层基材包含的热熔基体可以充分流动、填充到安装孔与磁吸件之间的间隙中,并且由于大气压会通过整形模具(整形上模和整形下模)传递,以及增强纤维纱对于热熔基体流动变形的限制,所以在保证施加分布力的同时可以保证磁吸夹层半成品在热压过程的平整度,从而在冷却后获得夹层基材与磁吸件一体的且表面光滑的片材本申请的磁吸夹层的制造方法采用具有增强纤维纱的夹层基材并对热压处理前的半成品进行装夹、排气,如此制得的磁吸夹层厚度小,结构牢固而不易变形,应用于电子设备保护壳的制造,可获得更轻薄且无磁吸件印痕、外观质感更高电子设备保护壳。
附图说明
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为根据本申请提出的电子设备保护壳的制造方法制造的电子设备保护壳的爆炸结构示意图;
图2为本申请磁吸夹层的制造方法第一实施例的流程示意图;
图3为本申请磁吸夹层的制造方法第二实施例的流程示意图;
图4为本申请磁吸夹层的制造方法第三实施例的流程示意图;
图5为本申请磁吸夹层的制造方法再一实施例步骤S100的细化流程示意图;
图6为本申请电子设备保护壳的制造方法第一实施例的流程示意图;
图7为本申请电子设备保护壳的制造方法第二实施例的流程示意图。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
为实现上述目的,本申请提出一种磁吸夹层的制造方法,参照图1,在一实施例中,磁吸夹层30包括夹层基材31与磁吸件32,磁吸夹层开设有贯通的安装孔33,磁吸件32固定嵌置于安装孔33。夹层基材31的作用是为了补偿磁吸件32与外层壳及内层壳之间的高度差,磁吸件的厚度与安装孔的深度相匹配。安装孔33为通孔如此可以最大程度地减小磁吸夹层的厚度。磁吸件用于配合与电子设备吸附,磁吸件可以为磁铁也可以为普通的铁质材料。
图2为本申请磁吸夹层的制造方法第一实施例的流程示意图,参照图2,在第一实施例中,磁吸夹层的制造方法包括:
S100:在夹层基材上开设贯通的安装孔,夹层基材包括热熔基体以及包含在热熔基体中的增强纤维纱;
增强纤维纱可以限制热熔基体在加热状态下的流动,从而保证基层基材在加工过程中的厚度尺寸的稳定性。作为示例,热熔基体可以为环氧树脂,增强纤维纱可以为玻璃纤维或芳纶纤维。
S200:在整形下模的上表面铺贴第一离型膜;
S300:将步骤S100所得的夹层基材铺贴于第一离型膜;
通过设置第一离型膜可以方便在后续工序中将夹层基材与整形下模分离。
S400:将磁吸件嵌入夹层基材的安装孔中;
可以理解的是在磁吸件装入安装孔后,磁吸件与安装孔的内壁面之间存在一定的缝隙,但在后续的工序中软化的热熔基体可以填充该缝隙,从而在冷却后实现磁吸件与夹层基材固定连接。
S500:将第二离型膜铺贴于步骤S400所得组件的上表面;
S600:将整形上模盖合在第二离型膜的上表面;
与第一离型膜的设置同理,通过设置第二离型膜,可以方便在后续工序中将夹层基材与整形上模分离。整形上模和整形下模可以对步骤S400所得组件形成上下夹合的作用,从而在热压过程中对组件进行整形,使组件保持平整。可以理解是,整形上模和整形下模分别具有上整形平面和下整形平面,至于整形模具的外形可以不做限定。
S700:将步骤S600所得的组件、整形上模、第一离型膜、第二离型膜以及整形上模一并装入第一柔性容器;
S800:对第一柔性容器内进行抽气处理,并在抽气处理完成后密封第一柔性容器;
通过对第一柔性容器进行抽气,如此第一柔性容器可以通过自身的变形更好地包裹内容物,从而在后续工序加压、加热时,可以排除热熔基体中的气泡,并避免第一柔性容器内的空气混入热熔基体。
S900:将第一柔性容器以及第一柔性容器的内容物一并置入热压罐,并在热压罐密封后对热压罐进行充气加压处理,对步骤S800所得组件加热预设时长;
本步骤中,充气加压处理可以在加热处理之前,但为了提升效率,充气加压处理与加热处理在时间上交叠,即在充气加压处理开始后同时进行加热处理。
S1000:停止加热至步骤S900所得组件降温至预设温度时,取出第一离型膜与第二离型膜之间的磁吸夹层半成品;
在冷却后,打开热压罐,取出装有内容物的第一柔性容器,然后打开第一柔性容器并取出内容物,揭开整形上模,并撕下第一离型膜和第二离型膜即可获得磁吸夹层半成品,此时的磁吸夹层已经硬化,夹层基材与磁吸件为一体且表面光滑的片材。
S1100:对步骤S1000所得磁吸夹层半成品进行剪裁以获得预设外形尺寸的磁吸夹层。
本实施例中,半成品的磁吸夹层的外形尺寸要大于预设的外形尺寸,而且在热压工艺中半成品的磁吸夹层有被挤出的热熔基体余料,通过剪裁可用于电子设备保护壳的制造。
本申请的磁吸夹层的制造方法采用设有增强纤维纱的夹层基材,并且在夹层基材上开设贯通的安装孔;磁吸件嵌入夹层基材上的安装孔如此得到的组件初始厚度较小。将得到的组件装夹于整形模具中;再将组件与整形模具一并装入柔性容器,抽气后再对柔性容器密封;接着将柔性容器及其内容物一并装入热压罐以进行热压处理,如此夹层基材包含的热熔基体可以充分流动、填充到安装孔与磁吸件之间的间隙中,并且由于大气压会通过整形模具(整形上模和整形下模)传递,以及增强纤维纱对于热熔基体流动变形的限制,所以在保证施加分布力的同时可以保证磁吸夹层半成品在热压过程的平整度,从而在冷却后获得夹层基材与磁吸件一体的且表面光滑的片材本申请的磁吸夹层的制造方法采用具有增强纤维纱的夹层基材并对热压处理前的半成品进行装夹、排气,如此制得的磁吸夹层厚度小,结构牢固而不易变形,应用于电子设备保护壳的制造,可获得更轻薄且无磁吸件印痕、外观质感更高电子设备保护壳。
进一步地,增强纤维纱为玻璃纤维纱,热熔基体为树脂;图3为本申请磁吸夹层的制造方法第二实施例的流程示意图,参照图3,在第二实施例中,步骤S900中对步骤S800所得组件加热预设时长具体包括:
对步骤S800所得组件从初始温度加热至125摄氏度并保持15分钟,然后再加热至135摄氏度并保持40分钟。
本实施例中,玻璃纤维纱是常见的材料,易于获取且成本低,应用于夹层基材可以保证足够的强度。树脂,例如环氧树脂是常用的电子材料。相比纯树脂制造的夹层基材,将玻璃纤维纱与树脂混合既可以在加热状态下空置树脂的流动,从而保证夹层基材的厚度稳定性。加热时先以相对较低的温度对组件进行加热,如此可以使组件受热均匀,且热熔的树脂可以缓慢地粘合或填充缝隙,从而避免产生较大的变形。然后再将温度提升至135度,这样可以使树脂充分流平以获得平滑的表面。
进一步地,图4为本申请磁吸夹层的制造方法第三实施例的流程示意图,参照图4,在第三实施例中,步骤S900中对热压罐进行充气加压处理具体包括:对热压罐进行充气加压处理以至热压罐内的压强在[0.4,0.8]MPa范围内。
本实施例中,通过将热压罐内的压强提升至优选的数值范围内,如此,可以使整形模具收到合适大小的分布力,并使热熔基体充分地横向流动。
进一步地,整形下模和整形上模均为板状;第一柔性容器为金属箔袋,且在空置排气状态下,第一柔性容器为片状。
将两块整形模具设置成板状,如此占用的堆叠空间比较少且可以向整形下模和整形上模之间的组件施加均匀的压力。可以理解的是,为了实现大批量的生产,可以在热压罐内设置料架,然后在料架上放置多套整形模具。金属箔袋不仅方便变形,而且耐热、导热;在热压完成后,可以直接剖开第一柔性容器以取出内容物,使用过的金属箔袋还可回收利用。由于在空置排气状态下,第一柔性容器为片状,因此在于板状的整形下模和整形上模配合使,不容易形成褶皱。优选地,第一柔性容器为锡箔袋。
进一步地,参照图1,在示意的实施例中,所述夹层基材包括多个相互叠合的片材,所述片材包括热熔基体以及包含在所述热熔基体中的增强纤维纱;安装孔32包括环形孔321,参照图4,在一实施例中,步骤S100具体包括:
步骤S110:将多个片材叠合至形成预设厚度的夹层基材;
步骤S120:冲裁贯穿各个片材以形成安装孔。
本实施例中,由于安装孔包括环形孔,因此,夹层基材上在环形孔的内侧将形成可分离的“岛”状部位,若先在各个片材上冲裁过过孔,然后再叠合各个片材,则不仅要对齐各个过孔以形成安装孔,而且还需对齐可分离的岛状部位。通过先将多个片材叠合在一起,然后再冲裁安装孔,省去了对齐的工作,从而使制造更简单。
进一步地,参照图1,在示意的实施例中,磁吸件33包括主吸附件332,主吸附件332包括多个主磁吸件以及将多个主磁吸件连接成环状的环形膜;S400具体包括:
将主吸附件嵌入夹层基材的环形孔中。
通过先将多个主磁吸件用环形膜连起来,使得可以准确快速地将主吸附件332装入安装孔。环形的主吸附件332可以围合形成无线充电区域,方便在使用电子设备保护壳的同时对电子设备进行充电。
参照图1,在示意的实施例中,磁吸件33还包括用于帮助定位的辅吸附件332,安装孔32还包括定位磁吸孔322,辅吸附件332安装于定位磁吸孔322;
本申请还提出一种电子设备保护壳的制造方法,参照图1,在示意的实施例中,电子设备保护壳包括内层壳10、外层壳20以及夹设于内层壳与外层壳之间的磁吸夹层30。电子设备可以常见的手机或平板电脑,也可以为其他便携的电子设备。通过设置磁吸夹层30可以方便地将电子设备保护壳连连同置于其中的电子设备一并地安装至支架或充电装置上。内层壳10、外层壳20的材质可以为塑料或金属,本申请在此不做限定。内层壳10、外层壳20可以为最终形态的形状也可以为需要进一步加工的中间形态。内层壳10、外层壳20最终形态的一实施例中,内层壳10、外层壳20均包括底壁及设于底壁外边缘的侧壁,从而形成朝一侧敞口的容腔。
图6为本申请电子设备保护壳的制造方法第一实施例的流程示意图,参照图6,在第一实施例中,电子设备保护壳的制造方法包括:
P100:将磁吸夹层叠设于内层壳与外层壳之间,磁吸夹层为采用如上任一实施例的磁吸夹层的制造方法制造的磁吸夹层。磁吸夹层的制造方法的具体制造流程参照上述实施例,由于本电子设备保护壳的制造方法采用了上述所有实施例的全部技术方案,因此同样具有上述实施例的技术方案所带来的所有有益效果,在此不再一一赘述。
P200:将步骤P100所得的组件装入第二柔性容器;
P300:对第二柔性容器内进行抽气处理,并在抽气处理完成后密封第二柔性容器;
与第一柔性容器同理,在对第二柔性容器进行抽气时,利用第二柔性容器的变形可以包裹组件,从而在后续工序加压、加热时,可以排除热熔基体中的气泡,并避免第二柔性容器内的空气混入热熔基体。
P400:将第二柔性容器以及第二柔性容器的内容物一并置入热压罐,并在热压罐密封后对热压罐进行充气加压处理,对步骤P300所得组件加热预设时长;
本步骤中,充气加压处理可以在加热处理之前,但为了提升效率,充气加压处理与加热处理在时间上交叠,即在充气加压处理开始后同时进行加热处理。通过加压、加热处理,夹层基材的热熔基体再次发生软化并且可分别与内层壳与外层壳充分粘合。在具体的实施例中,内层壳与外层壳的材料与夹层基材的材料相近,例如内层壳与外层壳的材料均为芳纶材质。
P500:停止加热至步骤P400所得组件降温至预设温度时,取出第二柔性容器内的电子设备保护壳。
本步骤中,冷却后内层壳、外层壳以及磁吸夹层充分粘合在一起,形成一体的结构。
本实施例中,由于磁吸夹层的初始形态即为具有平滑表面的片材,因此磁吸夹层可与内层壳、外层壳之间形成较高质量的面接触,然后通过密封于第二柔性容器中并抽气,可以保证在热压工艺过程中既能保证粘合强度,又不至于发生较大的变形。
进一步地,图7为本申请电子设备保护壳的制造方法第二实施例的流程示意图,参照图7,在第二实施例中,内层壳与外层壳的初始形状均为平板状;在步骤P100与步骤P200之间还包括:
P110:将步骤P100所得的组件置入拉深凹模上;
在本步骤中,组件将覆盖拉深凹模的模腔,可以理解的是,为了方便拉深,内层壳与外层壳为可变形的材质制成,例如芳纶材质(凯夫拉材质)。
P120:将拉深芯模置于步骤P100所得的组件上表面的预设位置,拉深芯模的大小与电子设备保护壳的容腔大小相适配;
P130:将拉深芯模压入拉深凹模的内腔;
通过拉深工艺,使得组件形成用以容纳电子设备的容腔。
P140:将拉深芯模与步骤P130所得组件装夹于束紧件,使步骤P130所得组件相对拉深芯模保持预设的变形状态;
本步骤中,拉深芯模保留在组件的容腔,从而可以与束紧件配合制成组件,防止拉深后的组件产生过大的回弹变形。
步骤P200具体包括:
将束紧件、拉深芯模与步骤P130所得组件装入第二柔性容器。
进一步地,束紧件为硅胶袋,第二柔性容器为锡箔袋,且在空置排气状态下,第二柔性容器为片状。
本实施例中,硅胶袋具有一定的耐热性,将硅胶袋用作束紧件简单方便且可适用于后续的热压工艺,可以理解的是,为了方便排气,硅胶袋无需密封。与第一柔性容器采用锡箔袋类似,第二柔性容器同样采用锡箔袋,具有可充分变形、耐热、易拆和回收的效果,并且可以保证压力均匀地作用于包括组件在内的内容物。
最后应说明的是:以上实施例仅用以说明本申请的技术方案,而非对其限制;尽管参照前述实施例对本申请进行了详细的说明,本领域的普通技术人员当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不驱使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (10)

1.一种磁吸夹层的制造方法,所述磁吸夹层包括夹层基材与磁吸件,所述磁吸夹层开设有贯通的安装孔,所述磁吸件固定嵌置于所述安装孔,其特征在于,所述磁吸夹层的制造方法包括:
S100:在夹层基材上开设贯通的安装孔,所述夹层基材包括热熔基体以及包含在所述热熔基体中的增强纤维纱;
S200:在整形下模的上表面铺贴第一离型膜;
S300:将步骤S100所得的夹层基材铺贴于所述第一离型膜;
S400:将磁吸件嵌入所述夹层基材的所述安装孔中;
S500:将第二离型膜铺贴于步骤S400所得组件的上表面;
S600:将整形上模盖合在所述第二离型膜的上表面;
S700:将步骤S600所得的组件、所述整形上模、第一离型膜、第二离型膜以及整形上模一并装入第一柔性容器;
S800:对所述第一柔性容器内进行抽气处理,并在抽气处理完成后密封所述第一柔性容器;
S900:将所述第一柔性容器以及所述第一柔性容器的内容物一并置入热压罐,并在所述热压罐密封后对所述热压罐进行充气加压处理,对步骤S800所得组件加热预设时长;
S1000:停止加热至步骤S900所得组件降温至预设温度时,取出所述第一离型膜与第二离型膜之间的磁吸夹层半成品;
S1100:对步骤S1000所得所述磁吸夹层半成品进行剪裁以获得预设外形尺寸的磁吸夹层。
2.如权利要求1所述的磁吸夹层的制造方法,其特征在于,所述增强纤维纱为玻璃纤维纱,所述热熔基体为树脂;所述步骤S900中所述对步骤S800所得组件加热预设时长具体包括:
对步骤S800所得组件从初始温度加热至125摄氏度并保持15分钟,然后再加热至135摄氏度并保持40分钟。
3.如权利要求1或2所述的磁吸夹层的制造方法,其特征在于,所述步骤S900中所述对所述热压罐进行充气加压处理具体包括:对所述热压罐进行充气加压处理以至所述热压罐内的压强在[0.4,0.8]MPa范围内。
4.如权利要求3所述的磁吸夹层的制造方法,其特征在于,所述整形下模和整形上模均为板状;所述第一柔性容器为金属箔袋,且在空置排气状态下,所述第一柔性容器为片状。
5.如权利要求4所述的磁吸夹层的制造方法,其特征在于,所述第一柔性容器为锡箔袋。
6.如权利要求1所述的磁吸夹层的制造方法,其特征在于,所述夹层基材包括多个相互叠合的片材,所述片材包括热熔基体以及包含在所述热熔基体中的增强纤维纱;所述安装孔包括环形孔,所述步骤S100具体包括:
步骤S110:将多个片材叠合至形成预设厚度的夹层基材;
步骤S120:冲裁贯穿各个所述片材以形成所述安装孔。
7.如权利要求6所述的磁吸夹层的制造方法,其特征在于,所述磁吸件包括主吸附件,所述主吸附件包括多个主磁吸件以及将多个主磁吸件连接成环状的环形膜;所述S400具体包括:
将所述主吸附件嵌入所述夹层基材的所述环形孔中。
8.一种电子设备保护壳的制造方法,所述电子设备保护壳包括内层壳、外层壳以及夹设于所述内层壳与外层壳之间的磁吸夹层,其特征在于,所述电子设备保护壳的制造方法包括:
P100:将磁吸夹层叠设于所述内层壳与外层壳之间,所述磁吸夹层为采用如权利要求1-7任一项所述的磁吸夹层的制造方法制造的磁吸夹层;
P200:将步骤P100所得的组件装入第二柔性容器;
P300:对所述第二柔性容器内进行抽气处理,并在抽气处理完成后密封所述第二柔性容器;
P400:将所述第二柔性容器以及所述第二柔性容器的内容物一并置入热压罐,并在所述热压罐密封后对所述热压罐进行充气加压处理,对步骤P300所得组件加热预设时长;
P500:停止加热至步骤P400所得组件降温至预设温度时,取出所述第二柔性容器内的电子设备保护壳。
9.如权利要求8所述的电子设备保护壳的制造方法,其特征在于,所述内层壳与外层壳的初始形状均为平板状;在所述步骤P100与步骤P200之间还包括:
P110:将步骤P100所得的组件置入拉深凹模上;
P120:将拉深芯模置于步骤P100所得的组件上表面的预设位置,所述拉深芯模的大小与所述电子设备保护壳的容腔大小相适配;
P130:将所述拉深芯模压入所述拉深凹模的内腔;
P140:将所述拉深芯模与步骤P130所得组件装夹于束紧件,使步骤P130所得组件相对所述拉深芯模保持预设的变形状态;
所述步骤P200具体包括:
将所述束紧件、拉深芯模与步骤P130所得组件装入第二柔性容器。
10.如权利要求9所述的电子设备保护壳的制造方法,其特征在于,所述束紧件为硅胶袋,所述第二柔性容器为锡箔袋,且在空置排气状态下,所述第二柔性容器为片状。
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