CN115298772A - 导电性复合粒子的制造方法、导电性复合粒子及电路连接用黏合剂膜 - Google Patents

导电性复合粒子的制造方法、导电性复合粒子及电路连接用黏合剂膜 Download PDF

Info

Publication number
CN115298772A
CN115298772A CN202180021507.3A CN202180021507A CN115298772A CN 115298772 A CN115298772 A CN 115298772A CN 202180021507 A CN202180021507 A CN 202180021507A CN 115298772 A CN115298772 A CN 115298772A
Authority
CN
China
Prior art keywords
resin
conductive composite
particles
composite particles
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180021507.3A
Other languages
English (en)
Chinese (zh)
Inventor
竹中启
富樫盛典
佐佐木洋
根岸芳典
松泽光晴
富坂克彦
山崎将平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of CN115298772A publication Critical patent/CN115298772A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/03—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in aqueous media
    • C08J3/07—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in aqueous media from polymer solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/06—Polystyrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
CN202180021507.3A 2020-03-25 2021-03-23 导电性复合粒子的制造方法、导电性复合粒子及电路连接用黏合剂膜 Pending CN115298772A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020053697 2020-03-25
JP2020-053697 2020-03-25
PCT/JP2021/011989 WO2021193630A1 (ja) 2020-03-25 2021-03-23 導電性複合粒子の製造方法、導電性複合粒子、及び回路接続用接着剤フィルム

Publications (1)

Publication Number Publication Date
CN115298772A true CN115298772A (zh) 2022-11-04

Family

ID=77892223

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180021507.3A Pending CN115298772A (zh) 2020-03-25 2021-03-23 导电性复合粒子的制造方法、导电性复合粒子及电路连接用黏合剂膜

Country Status (5)

Country Link
JP (1) JPWO2021193630A1 (ja)
KR (1) KR20220158243A (ja)
CN (1) CN115298772A (ja)
TW (1) TW202200750A (ja)
WO (1) WO2021193630A1 (ja)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010125965A1 (ja) * 2009-04-28 2010-11-04 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法
JP2012216294A (ja) 2011-03-31 2012-11-08 Sekisui Chem Co Ltd 複合粒子、樹脂組成物及び接続構造体

Also Published As

Publication number Publication date
JPWO2021193630A1 (ja) 2021-09-30
WO2021193630A1 (ja) 2021-09-30
KR20220158243A (ko) 2022-11-30
TW202200750A (zh) 2022-01-01

Similar Documents

Publication Publication Date Title
JP4387175B2 (ja) 被覆導電性粒子、異方性導電材料及び導電接続構造体
JP4920698B2 (ja) 異方性導電接続用導電性粒子
TW200826120A (en) Conductive particles and method of preparing the same
TW525193B (en) Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same
JP2007537570A (ja) 絶縁導電性微粒子及びこれを含有する異方導電性接着フィルム
JP4686120B2 (ja) 被覆導電粒子、異方性導電材料及び導電接続構造体
CN103765527B (zh) 导电性粒子、导电材料及连接结构体
JP2008525611A (ja) 機能性有機粒子、およびその製造方法
JP6114671B2 (ja) タッチパネル用導電性粒子、タッチパネル用導電材料及びタッチパネル用接続構造体
JP4852311B2 (ja) 導電性粒子、異方性導電材料及び導電接続構造体
JPWO2014054572A1 (ja) 導電性粒子、導電材料及び接続構造体
JP4313664B2 (ja) 突起導電性粒子、被覆導電性粒子及び異方性導電材料
KR102095291B1 (ko) 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체
JP2001216841A (ja) 導電性微粒子及び導電接続構造体
CN115298772A (zh) 导电性复合粒子的制造方法、导电性复合粒子及电路连接用黏合剂膜
CN107615466A (zh) 连接结构体的制造方法、导电性粒子、导电膜及连接结构体
JP6123283B2 (ja) 導電性粒子、異方性導電材料及び回路部材の接続構造体
CN105070351A (zh) 一种柔韧导电微球及其应用
KR102302526B1 (ko) 반응 장치, 그리고 수지 입자, 도전성 입자, 이방 도전 재료 및 접속 구조체의 제조 방법
JP5581276B2 (ja) 導電性微粒子
JP6182846B2 (ja) 架橋ポリマー粒子、導電性粒子、異方性導電材料及び回路部材の接続構造体
WO2023171631A1 (ja) 導電粒子、回路接続用接着フィルム及びその製造方法、並びに、接続構造体及びその製造方法
KR20190008828A (ko) 도전성 입자, 도전 재료 및 접속 구조체
JP7255102B2 (ja) 樹脂粒子の製造方法、導電性粒子の製造方法、異方導電材料の製造方法、及び接続構造体の製造方法
JP2002093240A (ja) 導電性微粒子及び導電接続構造体

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Tokyo, Japan

Applicant after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: Showa electrical materials Co.,Ltd.

CB02 Change of applicant information