CN115280612A - 半导体激光元件 - Google Patents
半导体激光元件 Download PDFInfo
- Publication number
- CN115280612A CN115280612A CN202180020766.4A CN202180020766A CN115280612A CN 115280612 A CN115280612 A CN 115280612A CN 202180020766 A CN202180020766 A CN 202180020766A CN 115280612 A CN115280612 A CN 115280612A
- Authority
- CN
- China
- Prior art keywords
- film
- layer
- semiconductor laser
- semiconductor
- laser element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
- H01S5/18369—Structure of the reflectors, e.g. hybrid mirrors based on dielectric materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0287—Facet reflectivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
- H01S5/18377—Structure of the reflectors, e.g. hybrid mirrors comprising layers of different kind of materials, e.g. combinations of semiconducting with dielectric or metallic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2218—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties
- H01S5/222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties having a refractive index lower than that of the cladding layers or outer guiding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3211—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
- H01S5/3216—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities quantum well or superlattice cladding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
- H01S5/143—Littman-Metcalf configuration, e.g. laser - grating - mirror
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4062—Edge-emitting structures with an external cavity or using internal filters, e.g. Talbot filters
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020046662 | 2020-03-17 | ||
| JP2020-046662 | 2020-03-17 | ||
| PCT/JP2021/007842 WO2021187081A1 (ja) | 2020-03-17 | 2021-03-02 | 半導体レーザ素子 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115280612A true CN115280612A (zh) | 2022-11-01 |
Family
ID=77768133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180020766.4A Pending CN115280612A (zh) | 2020-03-17 | 2021-03-02 | 半导体激光元件 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230072452A1 (https=) |
| JP (1) | JP7696887B2 (https=) |
| CN (1) | CN115280612A (https=) |
| DE (1) | DE112021000475T5 (https=) |
| WO (1) | WO2021187081A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113555768A (zh) * | 2017-06-08 | 2021-10-26 | 欧司朗光电半导体有限公司 | 边缘发射的半导体激光器和这种半导体激光器的运行方法 |
| US20230061476A1 (en) * | 2021-08-30 | 2023-03-02 | Samsung Display Co., Ltd. | Display device, manufacturing method of light emitting element, and manufacturing method of display device including light emitting element manufactured thereby |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023149081A1 (ja) * | 2022-02-01 | 2023-08-10 | パナソニックホールディングス株式会社 | 半導体レーザ素子 |
| JP2023160590A (ja) * | 2022-04-22 | 2023-11-02 | 華信光電科技股▲分▼有限公司 | 端面発光半導体レーザ |
| JPWO2024004677A1 (https=) * | 2022-06-28 | 2024-01-04 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142768A (ja) * | 2001-08-23 | 2003-05-16 | Furukawa Electric Co Ltd:The | 光伝送装置、それに用いられる半導体レーザ装置及びその製造方法 |
| CN1444317A (zh) * | 2002-03-08 | 2003-09-24 | 三菱电机株式会社 | 光半导体器件 |
| CN1819378A (zh) * | 2003-03-27 | 2006-08-16 | 三菱电机株式会社 | 半导体激光器装置 |
| US20100014550A1 (en) * | 2008-07-18 | 2010-01-21 | Yoshiaki Hasegawa | Nitride semiconductor laser device |
| CN101741013A (zh) * | 2008-11-21 | 2010-06-16 | 三洋电机株式会社 | 氮化物类半导体激光元件和光拾取装置 |
| CN102457017A (zh) * | 2010-10-14 | 2012-05-16 | 三洋电机株式会社 | 氮化物类半导体激光元件和光学装置 |
| US20150055670A1 (en) * | 2013-08-23 | 2015-02-26 | Oclaro Japan, Inc. | Multi-beam semiconductor laser device |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004363534A (ja) * | 2002-09-05 | 2004-12-24 | Mitsubishi Electric Corp | 半導体光素子装置およびそれが用いられた半導体レーザモジュール |
| US7852893B2 (en) * | 2007-02-26 | 2010-12-14 | Kabushiki Kaisha Toshiba | Semiconductor laser device |
| JP2008294202A (ja) * | 2007-05-24 | 2008-12-04 | Nec Electronics Corp | ファブリペロー型共振器レーザとその設計方法 |
| JP2009231367A (ja) * | 2008-03-19 | 2009-10-08 | Sharp Corp | 窒化物半導体レーザ素子および外部共振器型半導体レーザ装置 |
| WO2010005027A1 (ja) * | 2008-07-10 | 2010-01-14 | 浜岡東芝エレクトロニクス株式会社 | 半導体レーザ装置 |
| JP2010219436A (ja) * | 2009-03-18 | 2010-09-30 | Sony Corp | 多波長半導体レーザおよび光学記録再生装置 |
| JP2012064637A (ja) * | 2010-09-14 | 2012-03-29 | Sanyo Electric Co Ltd | 半導体レーザ素子、半導体レーザ装置およびこれを用いた光装置 |
| KR20140127034A (ko) * | 2013-04-24 | 2014-11-03 | 주식회사 옵토웰 | 에지 에미팅 레이저 다이오드 및 그의 제조방법 |
| DE102017112610A1 (de) * | 2017-06-08 | 2018-12-13 | Osram Opto Semiconductors Gmbh | Kantenemittierender Halbleiterlaser und Betriebsverfahren für einen solchen Halbleiterlaser |
| JP2019129216A (ja) * | 2018-01-24 | 2019-08-01 | パナソニック株式会社 | 窒化物半導体レーザ素子及び半導体レーザ装置 |
| JP7296934B2 (ja) * | 2018-02-14 | 2023-06-23 | ヌヴォトンテクノロジージャパン株式会社 | 窒化物半導体レーザ素子及び照明光源モジュール |
| WO2020026730A1 (ja) * | 2018-07-30 | 2020-02-06 | パナソニック株式会社 | 半導体発光装置及び外部共振型レーザ装置 |
-
2021
- 2021-03-02 WO PCT/JP2021/007842 patent/WO2021187081A1/ja not_active Ceased
- 2021-03-02 JP JP2022508185A patent/JP7696887B2/ja active Active
- 2021-03-02 CN CN202180020766.4A patent/CN115280612A/zh active Pending
- 2021-03-02 US US17/904,385 patent/US20230072452A1/en active Pending
- 2021-03-02 DE DE112021000475.1T patent/DE112021000475T5/de active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142768A (ja) * | 2001-08-23 | 2003-05-16 | Furukawa Electric Co Ltd:The | 光伝送装置、それに用いられる半導体レーザ装置及びその製造方法 |
| CN1444317A (zh) * | 2002-03-08 | 2003-09-24 | 三菱电机株式会社 | 光半导体器件 |
| CN1819378A (zh) * | 2003-03-27 | 2006-08-16 | 三菱电机株式会社 | 半导体激光器装置 |
| US20100014550A1 (en) * | 2008-07-18 | 2010-01-21 | Yoshiaki Hasegawa | Nitride semiconductor laser device |
| CN101741013A (zh) * | 2008-11-21 | 2010-06-16 | 三洋电机株式会社 | 氮化物类半导体激光元件和光拾取装置 |
| CN102457017A (zh) * | 2010-10-14 | 2012-05-16 | 三洋电机株式会社 | 氮化物类半导体激光元件和光学装置 |
| US20150055670A1 (en) * | 2013-08-23 | 2015-02-26 | Oclaro Japan, Inc. | Multi-beam semiconductor laser device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113555768A (zh) * | 2017-06-08 | 2021-10-26 | 欧司朗光电半导体有限公司 | 边缘发射的半导体激光器和这种半导体激光器的运行方法 |
| CN113555768B (zh) * | 2017-06-08 | 2024-06-07 | 欧司朗光电半导体有限公司 | 边缘发射的半导体激光器和这种半导体激光器的运行方法 |
| US20230061476A1 (en) * | 2021-08-30 | 2023-03-02 | Samsung Display Co., Ltd. | Display device, manufacturing method of light emitting element, and manufacturing method of display device including light emitting element manufactured thereby |
| US12563872B2 (en) * | 2021-08-30 | 2026-02-24 | Samsung Display Co., Ltd. | Display device, manufacturing method of light emitting element, and manufacturing method of display device including light emitting element manufactured thereby |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021187081A1 (ja) | 2021-09-23 |
| JP7696887B2 (ja) | 2025-06-23 |
| DE112021000475T5 (de) | 2022-12-01 |
| JPWO2021187081A1 (https=) | 2021-09-23 |
| US20230072452A1 (en) | 2023-03-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20221101 |