CN115241107A - 一种晶粒转移机构 - Google Patents

一种晶粒转移机构 Download PDF

Info

Publication number
CN115241107A
CN115241107A CN202211133882.XA CN202211133882A CN115241107A CN 115241107 A CN115241107 A CN 115241107A CN 202211133882 A CN202211133882 A CN 202211133882A CN 115241107 A CN115241107 A CN 115241107A
Authority
CN
China
Prior art keywords
probe
transfer
adsorption
carrier plate
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211133882.XA
Other languages
English (en)
Inventor
郑灿升
王勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Yougen Technology Co ltd
Original Assignee
Shenzhen Yougen Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Yougen Technology Co ltd filed Critical Shenzhen Yougen Technology Co ltd
Priority to CN202211133882.XA priority Critical patent/CN115241107A/zh
Publication of CN115241107A publication Critical patent/CN115241107A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Liquid Crystal (AREA)

Abstract

本发明公开了一种晶粒转移机构，包括竖直设置的吸附腔体，吸附腔体的底部为开放面，该开放面处可拆卸地连接有探针帽，吸附腔体与真空发生装置连接；吸附腔体内竖直设有探针，探针在吸附腔体内上下升降运动，并穿过上述载板承载机构及探针帽向下顶刺载板承载机构内蓝膜载板上的晶粒；探针帽的底部围绕探针穿出部位通过真空负压力向上吸附蓝膜载板上的蓝膜。本发明采用锥形下探部与探孔相配合，利用探孔内径大于锥形下探部外径，且小于探针外径设计，并在探针周围布设辅助吸孔，通过探帽接触蓝膜后利用辅助吸孔形成的真空负压向上吸住蓝膜晶，防止下探部位周围蓝膜形变情况，有效保证晶粒位置稳定性避免掉落。

Description

一种晶粒转移机构
技术领域
本发明涉及自动化领域，特别指一种晶粒转移机构。
背景技术
在显示技术领域，目前已经量产的微型显示技术包括基于水晶玻璃的HTPS TFTLCD、基于硅晶圆的DLP等。由于OLED技术有发光效率、操作温度范围以及寿命等限制缺陷，从长远来看，无机的Micro LED将是未来微型显示的技术主流。随着传统平面显示技术与应用逐渐进入成熟期，未来显示应用发展将迈向穿戴或虚拟实境与扩增实境等领域，因对比值、面板精度及省电等因素影响，基于晶圆制程的微型显示技术更加适用于新兴应用。在晶圆上制作Micro LED阵列技术上已成熟，因此采用该技术的微型显示器有望投入量产，但是将此类技术向一般平板显示应用扩展时，晶粒巨量转移效率成为最大的技术瓶颈。如何有效地将LED晶粒转移到玻璃或塑胶基板上成为Micro LED技术大规模发展推广的关键因素。
在进行晶粒转移自动化设备（产线）研发过程中，待转移的晶粒一般放置于中部水平夹持有蓝膜的载板上，晶粒需要转移至水平的玻璃或塑胶载板上。晶粒转移可采用探针为执行部件，通过控制探针高速运动，将蓝膜载板上的晶粒高速顶推至玻璃载板上。在利用探针转移晶粒工艺中需要解决以下技术问题：1、探针下探过程中易出现因过度顶推而导致晶粒、蓝膜或下部玻璃载板的损坏；2、由于待转移晶粒的蓝膜载体本身材质为柔性材质，具备一定的内部弹性，当探针抵推蓝膜上一个晶粒时，晶粒收到的探针作用力将传递给蓝膜，使得蓝膜沿着该晶粒部分从原始的平面状态向下凸起形变，该种情况将导致上述晶粒周围的其他晶粒位置发生偏移，或者因蓝膜形变后无法完全恢复至原有平面状态而出现的周围其他晶粒位置发生偏移或晶粒掉落的情况；3、基于以上情况，在探针下探过程中采用真空负压向上吸附蓝膜，需要解决活动的探针与吸附腔体之间协同问题；4、另外，由于探针高速多批次下探转移晶粒，探针经常需要更换，因此需要解决探针快捷拆装问题。
发明内容
本发明要解决的技术问题是针对上述现有技术的不足，提供一种采用锥形下探部与探孔相配合，利用探孔内径大于锥形下探部外径，且小于探针外径设计，通过探孔实现探针下探极限位置限定，同时通过探针帽形成吸附腔体，并在探针周围布设辅助吸孔，通过探针帽接触蓝膜后利用辅助吸孔形成的真空负压向上吸住蓝膜晶，防止下探部位周围蓝膜形变情况，有效保证晶粒位置稳定性避免掉落的晶粒转移机构。
本发明采用的技术方案如下：一种晶粒转移机构，沿竖直方向设置于载板承载机构上方，并插入载板承载机构内，在载板承载机构内沿竖直方向升降运动，载板承载机构下方对应设有转移平台，载板承载机构用于水平承载待转移晶粒的蓝膜载板，转移平台上装置有空玻璃载板；
晶粒转移机构包括竖直设置的吸附腔体，吸附腔体的底部为开放面，该开放面处可拆卸地连接有探针帽，吸附腔体与真空发生装置连接；
上述吸附腔体内竖直设有探针，探针在吸附腔体内上下升降运动，并穿过上述载板承载机构及探针帽向下顶刺载板承载机构内蓝膜载板上的晶粒，使晶粒转移至转移平台上的玻璃载板上；
上述探针帽的底部围绕探针穿出部位通过真空负压力向上吸附蓝膜载板上的蓝膜。
优选的，包括转移支板、转移升降电机及晶粒转移组件，其中，上述转移支板竖直设置；上述转移升降电机设置在转移支板上，且输出端朝下设置；上述晶粒转移组件沿竖直方向可滑动地连接在转移支板上，并与转移升降电机的输出端连接。
优选的，所述晶粒转移组件包括转移支座、驱动部件、吸附部件、探针及探针帽，其中，上述转移支座沿竖直方向可滑动地设置在转移支板上，并通过丝杆帽及丝杆与转移升降电机的输出端连接，转移升降电机通过驱动丝杆旋转带动丝杆帽升降运动，丝杆帽带动转移支座升降运动；上述驱动部件设置于转移支座上，并输出向下的动力；上述吸附部件设置在驱动部件下方，吸附部件内设有吸附腔体，吸附腔体与外部真空发送装置连接，驱动部件的输出端穿入吸附腔体向下延伸。
优选的，所述探针连接在驱动部件输出端下部，探针下部设有锥形下探部。
优选的，所述探针帽为上部开放的帽体结构，探针帽可拆卸地连接在吸附腔体的下部，封合吸附腔体的底部开放面；上述探针帽的底面为吸附平面，吸附平面的中部设有上下贯通的探孔，探孔内径不大于探针外径，探针的锥形下探部向下穿过探孔将晶粒下顶转移。
优选的，所述探孔的周沿开设有至少两个辅助吸孔，辅助吸孔在探孔周沿部位产生负压吸附平面，以便吸附下探晶粒周围的晶粒载体。
优选的，所述驱动部件包括驱动电机及驱动轴，其中，上述驱动电机竖直设置在转移支座的侧壁上，且输出端朝下设置；上述驱动轴竖直连接于驱动电机的输出端上，并向下延伸。
优选的，所述吸附部件包括连接座及吸附座，其中，上述连接座设置于驱动电机下方，并固定在转移支座的侧壁上，连接座内设有沿竖直方向上下贯通的插孔，插孔内径不小于驱动轴的外径，驱动轴由上而下穿过插孔。
优选的，所述吸附座连接于连接座的底部，吸附座内部设有吸附腔体，吸附腔体的上部与插孔连通，驱动轴由上而下插入吸附腔体内，且通过密封圈密封与吸附座的连接处；上述吸附座的侧壁上开设有气孔，气孔处连接有真空接头，以便与外部真空发生装置连接。
优选的，所述驱动轴的底部设有探针安装座；所述探针安装座的中部设有安装孔，探针安装座的侧壁上开设有分割槽，所述分割槽从探针安装座的外壁延伸至安装孔，将探针安装座沿圆周方向分割为至少两块安装夹块，探针插入安装孔内后，通过从外部套上卡环，卡环向内的压力使按照夹块向内夹紧探针。
本发明的有益效果在于：
本发明针对现有技术存在的缺陷和不足自主研发设计了一种采用锥形下探部与探孔相配合，利用探孔内径大于锥形下探部外径，且小于探针外径设计，通过探孔实现探针下探极限位置限定，同时通过探针帽形成吸附腔体，并在探针周围布设辅助吸孔，通过探针帽接触蓝膜后利用辅助吸孔形成的真空负压向上吸住蓝膜晶，防止下探部位周围蓝膜形变情况，有效保证晶粒位置稳定性避免掉落。
本发明为晶粒转移执行部件，设置于载板承载机构上方包括探针及探针帽，探针帽内部为腔体结构，并插入载板承载机构内，在载板承载机构内沿竖直方向升降运动，载板承载机构下方对应设有转移平台，载板承载机构用于水平承载待转移晶粒的蓝膜载板，转移平台上装置有空玻璃载板；本发明通过转移升降电机利用丝杆及丝杆帽驱动晶粒转移组件升降运动，使晶粒转移组件下降并靠近载板承载机构，晶粒转移组件以竖直设置的转移支座作为承载结构，在转移支板的侧壁上设有驱动电机，利用驱动电机驱动驱动轴升降运动，驱动轴向下穿过连接座插入吸附座内，其中连接座固定在转移支板的侧壁上，吸附座内部为空腔结构，其侧壁上设有气孔，以便连接外部的真空发生装载，吸附座底部为开放面，并可拆卸地连接有探针帽，驱动轴穿过吸附座伸入至探针帽内。
特别地，本发明的吸附座底部设有探针安装座，探针安装座中部设有安装孔，探针安装座的侧壁上开设有分割槽，分割槽从探针安装座的外壁延伸至安装孔，将探针安装座沿圆周方向分割为至少两块安装夹块，探针插入安装孔内后，通过从外部套上卡环，卡环向内的压力使按照夹块向内夹紧探针，从而实现了探针的快速安装。另外，探针帽的底面为平面结构的吸附平面，吸附平面的中部设有上下贯通的探孔；本发明的探针设置于探针帽内部，并通过动力机构驱动而沿竖直方向升降运动。特别地，本发明的探针下部采用锥形结构，锥形下探部的外径小于探孔，以便穿过探孔抵推至下方蓝膜上的晶粒上，同时探孔的内径不大于探针的外径，探针下探过程中利用探孔对探针位置进行限定，避免其过度下探而刺穿蓝膜或损坏晶粒及玻璃载板。同时，在探孔的周围布设有辅助吸孔，利用探针帽内部吸附腔体形成负压空间，通过辅助吸孔向上吸附固定蓝膜从而避免了探针下探过程中探针抵推晶粒而导致蓝膜发生形变，从而影响周围其他晶粒的位置或使其掉落的情况。
附图说明
图1为本发明的立体结构示意图之一。
图2为本发明的立体结构示意图之二。
图3为本发明晶粒转移组件的立体结构示意图之一。
图4为本发明晶粒转移组件的立体结构示意图之二。
图5为本发明晶粒转移组件的立体结构示意图之三。
图6为本发明晶粒转移组件隐藏部件后的立体结构示意图之一。
图7为本发明晶粒转移组件隐藏部件后的立体结构示意图之二。
图8为图7中II处放大结构示意图。
图9为本发明探针及探针帽的立体结构示意图之一。
图10为本发明探针及探针帽的立体结构示意图之二。
图11为图9中III处放大结构示意图。
具体实施方式
下面将结合附图对本发明作进一步描述：
如图1至图11所示，本发明采取的技术方案如下：一种晶粒转移机构，沿竖直方向设置于载板承载机构上方，并插入载板承载机构内，在载板承载机构内沿竖直方向升降运动，载板承载机构下方对应设有转移平台，载板承载机构用于水平承载待转移晶粒的蓝膜载板，转移平台上装置有空玻璃载板；
晶粒转移机构包括竖直设置的吸附腔体，吸附腔体的底部为开放面，该开放面处可拆卸地连接有探针帽638，吸附腔体与真空发生装置连接；
上述吸附腔体内竖直设有探针6311，探针6311在吸附腔体内上下升降运动，并穿过上述载板承载机构及探针帽638向下顶刺载板承载机构内蓝膜载板上的晶粒，使晶粒转移至转移平台上的玻璃载板上；
上述探针帽638的底部围绕探针6311穿出部位通过真空负压力向上吸附蓝膜载板上的蓝膜。
本发明包括转移支板631、转移升降电机632及晶粒转移组件，其中，上述转移支板631竖直设置；上述转移升降电机632设置在转移支板631上，且输出端朝下设置；上述晶粒转移组件沿竖直方向可滑动地连接在转移支板631上，并与转移升降电机632的输出端连接。
晶粒转移组件包括转移支座633、驱动部件、吸附部件、探针6311及探针帽638，其中，上述转移支座633沿竖直方向可滑动地设置在转移支板631上，并通过丝杆帽及丝杆与转移升降电机632的输出端连接，转移升降电机632通过驱动丝杆旋转带动丝杆帽升降运动，丝杆帽带动转移支座633升降运动；上述驱动部件设置于转移支座633上，并输出向下的动力；上述吸附部件设置在驱动部件下方，吸附部件内设有吸附腔体，吸附腔体与外部真空发送装置连接，驱动部件的输出端穿入吸附腔体向下延伸。
探针6311连接在驱动部件输出端下部，探针下部设有锥形下探部6313。
探针帽638为上部开放的帽体结构，探针帽638可拆卸地连接在吸附腔体的下部，封合吸附腔体的底部开放面；上述探针帽638的底面为吸附平面6314，吸附平面6314的中部设有上下贯通的探孔6315，探孔6315内径不大于探针6311外径，探针6311的锥形下探部6313向下穿过探孔6315将晶粒下顶转移。
探孔6315的周沿开设有至少两个辅助吸孔6316，辅助吸孔6316在探孔6315周沿部位产生负压吸附平面，以便吸附下探晶粒周围的晶粒载体。
驱动部件包括驱动电机634及驱动轴635，其中，上述驱动电机634竖直设置在转移支座633的侧壁上，且输出端朝下设置；上述驱动轴635竖直连接于驱动电机634的输出端上，并向下延伸。
吸附部件包括连接座636及吸附座637，其中，上述连接座636设置于驱动电机634下方，并固定在转移支座633的侧壁上，连接座636内设有沿竖直方向上下贯通的插孔，插孔内径不小于驱动轴635的外径，驱动轴635由上而下穿过插孔。
吸附座637连接于连接座636的底部，吸附座637内部设有吸附腔体，吸附腔体的上部与插孔连通，驱动轴635由上而下插入吸附腔体内，且通过密封圈密封与吸附座637的连接处；上述吸附座637的侧壁上开设有气孔639，气孔639处连接有真空接头，以便与外部真空发生装置连接。
驱动轴635的底部设有探针安装座6310；所述探针安装座6310的中部设有安装孔，探针安装座6310的侧壁上开设有分割槽，所述分割槽从探针安装座6310的外壁延伸至安装孔，将探针安装座6310沿圆周方向分割为至少两块安装夹块，探针6311插入安装孔内后，通过从外部套上卡环，卡环向内的压力使按照夹块向内夹紧探针6311。
进一步，本发明设计了一种采用锥形下探部与探孔相配合，利用探孔内径大于锥形下探部外径，且小于探针外径设计，通过探孔实现探针下探极限位置限定，同时通过探针帽形成吸附腔体，并在探针周围布设辅助吸孔，通过探针帽接触蓝膜后利用辅助吸孔形成的真空负压向上吸住蓝膜晶，防止下探部位周围蓝膜形变情况，有效保证晶粒位置稳定性避免掉落。
本发明为晶粒转移执行部件，设置于载板承载机构上方包括探针及探针帽，探针帽内部为腔体结构，并插入载板承载机构内，在载板承载机构内沿竖直方向升降运动，载板承载机构下方对应设有转移平台，载板承载机构用于水平承载待转移晶粒的蓝膜载板，转移平台上装置有空玻璃载板；本发明通过转移升降电机利用丝杆及丝杆帽驱动晶粒转移组件升降运动，使晶粒转移组件下降并靠近载板承载机构，晶粒转移组件以竖直设置的转移支座作为承载结构，在转移支板的侧壁上设有驱动电机，利用驱动电机驱动驱动轴升降运动，驱动轴向下穿过连接座插入吸附座内，其中连接座固定在转移支板的侧壁上，吸附座内部为空腔结构，其侧壁上设有气孔，以便连接外部的真空发生装载，吸附座底部为开放面，并可拆卸地连接有探针帽，驱动轴穿过吸附座伸入至探针帽内。
特别地，本发明的吸附座底部设有探针安装座，探针安装座中部设有安装孔，探针安装座的侧壁上开设有分割槽，分割槽从探针安装座的外壁延伸至安装孔，将探针安装座沿圆周方向分割为至少两块安装夹块，探针插入安装孔内后，通过从外部套上卡环，卡环向内的压力使按照夹块向内夹紧探针，从而实现了探针的快速安装。另外，探针帽的底面为平面结构的吸附平面，吸附平面的中部设有上下贯通的探孔；本发明的探针设置于探针帽内部，并通过动力机构驱动而沿竖直方向升降运动。特别地，本发明的探针下部采用锥形结构，锥形下探部的外径小于探孔，以便穿过探孔抵推至下方蓝膜上的晶粒上，同时探孔的内径不大于探针的外径，探针下探过程中利用探孔对探针位置进行限定，避免其过度下探而刺穿蓝膜或损坏晶粒及玻璃载板。同时，在探孔的周围布设有辅助吸孔，利用探针帽内部吸附腔体形成负压空间，通过辅助吸孔向上吸附固定蓝膜从而避免了探针下探过程中探针抵推晶粒而导致蓝膜发生形变，从而影响周围其他晶粒的位置或使其掉落的情况。
本发明的实施例只是介绍其具体实施方式，不在于限制其保护范围。本行业的技术人员在本实施例的启发下可以作出某些修改，故凡依照本发明专利范围所做的等效变化或修饰，均属于本发明专利权利要求范围内。

Claims (10)

1.一种晶粒转移机构，其特征在于：沿竖直方向设置于载板承载机构上方，并插入载板承载机构内，在载板承载机构内沿竖直方向升降运动，载板承载机构下方对应设有转移平台，载板承载机构用于水平承载待转移晶粒的蓝膜载板，转移平台上装置有空玻璃载板；
晶粒转移机构包括竖直设置的吸附腔体，吸附腔体的底部为开放面，该开放面处可拆卸地连接有探针帽（638），吸附腔体与真空发生装置连接；
上述吸附腔体内竖直设有探针（6311），探针（6311）在吸附腔体内上下升降运动，并穿过上述载板承载机构及探针帽（638）向下顶刺载板承载机构内蓝膜载板上的晶粒，使晶粒转移至转移平台上的玻璃载板上；
上述探针帽（638）的底部围绕探针（6311）穿出部位通过真空负压力向上吸附蓝膜载板上的蓝膜。
2.根据权利要求1所述的一种晶粒转移机构，其特征在于：包括转移支板（631）、转移升降电机（632）及晶粒转移组件，其中，上述转移支板（631）竖直设置；上述转移升降电机（632）设置在转移支板（631）上，且输出端朝下设置；上述晶粒转移组件沿竖直方向可滑动地连接在转移支板（631）上，并与转移升降电机（632）的输出端连接。
3.根据权利要求2所述的一种晶粒转移机构，其特征在于：所述晶粒转移组件包括转移支座（633）、驱动部件、吸附部件、探针（6311）及探针帽（638），其中，上述转移支座（633）沿竖直方向可滑动地设置在转移支板（631）上，并通过丝杆帽及丝杆与转移升降电机（632）的输出端连接，转移升降电机（632）通过驱动丝杆旋转带动丝杆帽升降运动，丝杆帽带动转移支座（633）升降运动；上述驱动部件设置于转移支座（633）上，并输出向下的动力；上述吸附部件设置在驱动部件下方，吸附部件内设有吸附腔体，吸附腔体与外部真空发送装置连接，驱动部件的输出端穿入吸附腔体向下延伸。
4.根据权利要求3所述的一种晶粒转移机构，其特征在于：所述探针（6311）连接在驱动部件输出端下部，探针下部设有锥形下探部（6313）。
5.根据权利要求4所述的一种晶粒转移机构，其特征在于：所述探针帽（638）为上部开放的帽体结构，探针帽（638）可拆卸地连接在吸附腔体的下部，封合吸附腔体的底部开放面；上述探针帽（638）的底面为吸附平面（6314），吸附平面（6314）的中部设有上下贯通的探孔（6315），探孔（6315）内径不大于探针（6311）外径，探针（6311）的锥形下探部（6313）向下穿过探孔（6315）将晶粒下顶转移。
6.根据权利要求5所述的一种晶粒转移机构，其特征在于：所述探孔（6315）的周沿开设有至少两个辅助吸孔（6316），辅助吸孔（6316）在探孔（6315）周沿部位产生负压吸附平面，以便吸附下探晶粒周围的晶粒载体。
7.根据权利要求3所述的一种晶粒转移机构，其特征在于：所述驱动部件包括驱动电机（634）及驱动轴（635），其中，上述驱动电机（634）竖直设置在转移支座（633）的侧壁上，且输出端朝下设置；上述驱动轴（635）竖直连接于驱动电机（634）的输出端上，并向下延伸。
8.根据权利要求7所述的一种晶粒转移机构，其特征在于：所述吸附部件包括连接座（636）及吸附座（637），其中，上述连接座（636）设置于驱动电机（634）下方，并固定在转移支座（633）的侧壁上，连接座（636）内设有沿竖直方向上下贯通的插孔，插孔内径不小于驱动轴（635）的外径，驱动轴（635）由上而下穿过插孔。
9.根据权利要求8所述的一种晶粒转移机构，其特征在于：所述吸附座（637）连接于连接座（636）的底部，吸附座（637）内部设有吸附腔体，吸附腔体的上部与插孔连通，驱动轴（635）由上而下插入吸附腔体内，且通过密封圈密封与吸附座（637）的连接处；上述吸附座（637）的侧壁上开设有气孔（639），气孔（639）处连接有真空接头，以便与外部真空发生装置连接。
10.根据权利要求9所述的一种晶粒转移机构，其特征在于：所述驱动轴（635）的底部设有探针安装座（6310）；所述探针安装座（6310）的中部设有安装孔，探针安装座（6310）的侧壁上开设有分割槽，所述分割槽从探针安装座（6310）的外壁延伸至安装孔，将探针安装座（6310）沿圆周方向分割为至少两块安装夹块，探针（6311）插入安装孔内后，通过从外部套上卡环，卡环向内的压力使按照夹块向内夹紧探针（6311）。
CN202211133882.XA 2022-09-19 2022-09-19 一种晶粒转移机构 Pending CN115241107A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211133882.XA CN115241107A (zh) 2022-09-19 2022-09-19 一种晶粒转移机构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211133882.XA CN115241107A (zh) 2022-09-19 2022-09-19 一种晶粒转移机构

Publications (1)

Publication Number Publication Date
CN115241107A true CN115241107A (zh) 2022-10-25

Family

ID=83681651

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211133882.XA Pending CN115241107A (zh) 2022-09-19 2022-09-19 一种晶粒转移机构

Country Status (1)

Country Link
CN (1) CN115241107A (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111312865A (zh) * 2018-12-12 2020-06-19 东莞市中麒光电技术有限公司 一种全自动智能定位转移、排列led芯片的方法及装置
CN111785823A (zh) * 2020-08-06 2020-10-16 湘能华磊光电股份有限公司 一种先进的led晶粒分选及倒膜装置
CN112885766A (zh) * 2021-03-23 2021-06-01 成都储翰科技股份有限公司 一种蓝膜芯片顶出装置
CN114141930A (zh) * 2021-11-22 2022-03-04 惠州华星光电显示有限公司 发光二极管的转移方法、发光基板以及显示面板
CN114933167A (zh) * 2022-04-27 2022-08-23 泉州兰姆达仪器设备有限公司 一种激光芯片测试分选机的顶针机构及其工作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111312865A (zh) * 2018-12-12 2020-06-19 东莞市中麒光电技术有限公司 一种全自动智能定位转移、排列led芯片的方法及装置
CN111785823A (zh) * 2020-08-06 2020-10-16 湘能华磊光电股份有限公司 一种先进的led晶粒分选及倒膜装置
CN112885766A (zh) * 2021-03-23 2021-06-01 成都储翰科技股份有限公司 一种蓝膜芯片顶出装置
CN114141930A (zh) * 2021-11-22 2022-03-04 惠州华星光电显示有限公司 发光二极管的转移方法、发光基板以及显示面板
CN114933167A (zh) * 2022-04-27 2022-08-23 泉州兰姆达仪器设备有限公司 一种激光芯片测试分选机的顶针机构及其工作方法

Similar Documents

Publication Publication Date Title
KR102459402B1 (ko) 다이 이젝팅 장치
CN115424967A (zh) 一种晶粒转移设备及其晶粒转移工艺
CN206345061U (zh) 曲面贴合模具
CN108133907B (zh) 一种芯片剥离装置
CN111508805B (zh) 半导体设备中的晶片升降结构及半导体设备
CN106856186B (zh) 一种硅片交接精度控制装置、硅片吸附台、硅片传输系统及硅片交接方法
CN115241107A (zh) 一种晶粒转移机构
CN115424966A (zh) 一种顶刺式晶粒转移装置
KR20120134368A (ko) 기판 척킹 디척킹 장치
JP4163242B1 (ja) 基板貼り合せ装置及び基板貼り合せ方法
CN209843684U (zh) 承载装置
JP6634231B2 (ja) 支持チャック及び基板処理装置
CN210516691U (zh) 一种承载装置
CN201171044Y (zh) 吸附底座装置
CN219696423U (zh) 一种针顶晶圆转移装置
CN218602408U (zh) 一种晶粒转移探针机构
CN115440642A (zh) 一种适用于晶粒转移的载板承载装置
JP2007187707A (ja) 液晶表示パネルの製造方法、液晶表示パネルの製造装置、液晶表示パネル、電子機器
CN114920009A (zh) 一种转运设备及太阳能电池生产系统
CN210335563U (zh) 玻璃基板托盘
KR20120087462A (ko) 기판합착장치 및 기판합착방법
CN217750277U (zh) 一种背光模组的组装装置
CN218595465U (zh) 一种自动化晶粒载板取放承载转移装置
CN219017687U (zh) 一种led芯片封装用定位装置
KR101912885B1 (ko) 지지 척 및 기판 처리 장치

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20221025