CN115216738A

CN115216738A - Rotatable plating ring plate pot mechanism and evaporator

Info

Publication number: CN115216738A
Application number: CN202210874414.1A
Authority: CN
Inventors: 吴爱明; 许康; 黄鑫; 曹玉飞; 卓昌正
Original assignee: Focus Lightings Technology Suqian Co ltd
Current assignee: Focus Lightings Technology Suqian Co ltd
Priority date: 2022-07-20
Filing date: 2022-07-20
Publication date: 2022-10-21

Abstract

The application discloses rotatable plating pot mechanism and coating by vaporization machine that plates of ring includes: the motor is arranged on the shell of the evaporator, and the plating pot is arranged in the cavity of the evaporator; the plating pot is internally provided with at least one plating ring structure, the plating ring structure comprises a plurality of plating rings for placing wafers, the plating rings are linearly arranged along the horizontal direction, two adjacent plating rings are fixedly connected through a connecting rod, each plating ring is provided with a fixing piece for movably clamping the wafers, the outer part of the plating pot is provided with an umbrella stand fixedly connected with the top of a cavity of the evaporation plating machine, and the plating pot is detachably connected with the umbrella stand; a rotating mechanism is arranged between the motor and the plating pot, one end of the rotating mechanism is connected with an output shaft of the motor, the other end of the rotating mechanism penetrates through the umbrella stand and then is fixedly connected with the plating ring structure, the motor is used for driving the rotating mechanism to drive the plating ring structure to do circumferential rotating motion along the arrangement direction of the plating rings.

Description

Rotatable plating pot mechanism and coating by vaporization machine that plates ring

Technical Field

The embodiment of the application relates to the technical field of semiconductor processing, in particular to a plating pot mechanism capable of rotating to plate a ring and an evaporation machine.

Background

The vapor deposition belongs to physical deposition, and is a process of sublimating a vapor deposition material into a gas molecular vapor deposition material in a certain mode, wherein the gas molecular vapor deposition material moves in a vacuum environment and is attached to the surface of an object to be vapor deposited, so that a film is formed on the surface of the object to be vapor deposited. An organic light-emitting diode (OLED) has the characteristics of self-luminescence, lightness, thinness, easy realization of flexible display and the like, and is a new generation display technology with good development prospect. At present, in the process of manufacturing the OLED panel, the OLED evaporation technology is often adopted to manufacture each functional film layer.

In the prior art, vacuum evaporation devices are generally used for vacuum evaporation, the evaporation devices are evaporation sources, and the evaporation sources are divided into organic evaporation sources and inorganic evaporation sources, so that different designs of evaporation sources for evaporating different materials can be realized. On gaseous molecule coating by vaporization material sublimation to the coating by vaporization pot that comes out from the coating by vaporization source, the coating by vaporization pot of coating by vaporization equipment is used for placing and fixed treating the coating by vaporization thing, treats the coating by vaporization thing such as wafer. The general principle of the OLED evaporation technology is as follows: and (3) storing the OLED organic material and the evaporated substrate in a vacuum environment, heating the organic material to evaporate or sublimate the organic material, and evaporating the organic material to the surface of the evaporated substrate to condense and form a film. At present, a mass production evaporator generally adopts a point source or line source evaporation mode in a vacuum environment, the utilization rate of organic materials is lower than 20 percent, most of the organic materials are formed into films on a defending plate of an evaporator cavity, and the defending plate needs to be replaced and cleaned regularly.

However, at present, each plating ring on the plating pot of the evaporation machine is a fixed position and can only be used for placing a wafer on a single surface, that is, in a common evaporation machine, after the single surface of the wafer is coated, the coating machine is opened to detach the plating pot from the umbrella stand, the wafer is replaced, and then the plating pot and the umbrella stand are installed and the coating is started again, so that the limitation of a material placing area is narrow, the yield is low, and the air suction time, the heating time and the exhaust time are too long.

Disclosure of Invention

The application provides a rotatable pot mechanism and coating machine that plates of ring, in order to solve prior art, the coating machine plates every on the pot and plates the ring for fixed position and can only the single face put the problem of wafer operation, that is to say in current coating machine, need be with wafer single face coating film back, reopen the coating machine and will plate the pot and dismantle from the umbrella stand, change the wafer, will plate the pot and install and restart the coating film with the umbrella stand again, this has just also led to the material and has placed the district limitation narrow, and the output is lower, air-bleed time, heat time, exhaust time overlength.

In a first aspect, the present application provides a plating pot mechanism for a rotatable plating ring, comprising: the motor is arranged on the shell of the evaporator, and the plating pot is arranged in the cavity of the evaporator;

the plating pot is internally provided with at least one plating ring structure, the plating ring structure comprises a plurality of plating rings for placing wafers, the plating rings are linearly arranged along the horizontal direction, two adjacent plating rings are fixedly connected through a connecting rod, each plating ring is provided with a fixing piece for movably clamping the wafers, the outer part of the plating pot is provided with an umbrella stand fixedly connected with the top of a cavity of the evaporation plating machine, and the plating pot is detachably connected with the umbrella stand;

the utility model discloses a plating device, including umbrella stand, motor, plating pot, rotary mechanism, umbrella stand, motor, plating ring structure, the motor with be equipped with rotary mechanism between the plating pot, rotary mechanism one end with the output shaft of motor, rotary mechanism's the other end pass behind the umbrella stand with plate ring structure fixed connection, the motor is used for driving rotary mechanism and drives plate the ring structure and follow plate the ring array orientation and be circumferential direction rotary motion.

Further, the mounting is including setting up plate two at least spring clamps of ring outer circumference side, the spring clamp respectively to plate the direction at ring center and support and press plate the ring.

Further, rotary mechanism includes gear box and rotation control rod, be equipped with action wheel and a plurality of follow driving wheel in the gear box, the action wheel with the output shaft of motor, follow driving wheel is close to plate one side of pot with rotation control rod fixed connection, the action wheel with from the driving wheel meshing, and through pivot fixed mounting in the gear box, rotation control rod level sets up and is connected to plate the one end of loop structure.

Further, the plating ring structure rotates circumferentially along the arrangement direction of the plating rings by a rotation angle of 180 °.

Further, the driving wheel and the driven wheel are gears which are meshed with each other or chain wheels of a chain transmission.

Further, the rotating mechanism comprises a support and a first turning arm, the first turning arm is fixedly connected with one end of the support, a first rotating part is arranged at one end, far away from the support, of the first turning arm, and a second turning arm and a second rotating part which are symmetrically arranged with the first turning arm and the first rotating part are fixed at the other end of the support;

the first rotary part is connected with an output shaft of the motor, one end of the plating ring structure is fixedly connected with the first rotary part, and the other end of the plating ring structure is fixedly connected with the second rotary part.

In a second aspect, the invention further provides an evaporator, which comprises the plating pot mechanism of the rotatable plating ring in the first aspect.

As can be seen from the above, the present application provides a vapor deposition machine including: the plating pot is characterized in that an ion source fixedly connected with the bottom of the cavity of the evaporator is arranged under the plating pot, an electron gun fixedly connected with the bottom of the cavity of the evaporator and a crucible fixedly connected with the bottom of the cavity of the evaporator are respectively arranged on two sides of the ion source, and a prevention plate positioned on the inner wall of the cavity of the evaporator is arranged on one side of the plating pot.

Furthermore, the shape of the anti-adhesion plate is arc-shaped or bent, and the anti-adhesion plate is integrally formed or formed by splicing a plurality of plates.

This application has set up a motor on the coating by vaporization machine shell, and the motor can drive through rotary mechanism and plate the ring structure and rotate, and every when the coating by vaporization machine operation plates the ring like this and just can put two wafers, and after the wafer coating film of one side was accomplished, can overturn the wafer, for the opposite side coating film of wafer, not only promoted work efficiency when the operation, increased the output, still reduced air exhaust, heating, carminative time.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the descriptions provided without creative efforts.

FIG. 1 is a schematic front view of a plating pot mechanism of a rotatable plating ring according to the present application;

FIG. 2 is a schematic structural diagram of a plating ring mechanism of a plating pot mechanism of a rotatable plating ring according to the present application;

FIG. 3 is a schematic view of a structure of a driving wheel and a driven wheel of a plating pot mechanism of a rotatable plating ring according to the present application;

FIG. 4 is a schematic structural diagram of a plating pot mechanism for a rotatable plating ring according to another embodiment of the present disclosure.

Reference numerals are as follows:

1-motor, 2-plating pot, 21-plating ring structure, 211-plating ring, 212-fixing piece, 3-rotating mechanism, 4-umbrella stand, 5-ion source, 6-electron gun, 7-crucible, 8-anti-sticking board, 9-gear box, 91-driving wheel, 92-driven wheel, 32-first turning arm, 33-bracket, 321-first revolving part, 34-second turning arm and 341-second revolving part.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Among the prior art, every plating ring is for fixed position and can only the single face put the wafer operation on the coating by vaporization machine plating pot, that is to say in general evaporimeter, and the material is placed the district limitation and is narrow, and the output is lower, bleed time, heating time, exhaust time overlength, in order to solve above technical problem, this application provides a rotatable coating by vaporization pot mechanism and coating by vaporization machine that plates the ring.

Referring to fig. 1, it is a schematic structural diagram of a plating pot mechanism of a rotatable plating ring according to the present application;

in a first aspect, the present application provides a plating pot mechanism of a rotatable plating ring, as can be seen from fig. 1, the present application provides a motor 1 disposed on an evaporator shell, wherein the motor 1 is used for driving other devices, and the plating pot 2 is disposed in a cavity of the evaporator;

the plating pot 2 is internally provided with at least one plating ring structure 21, the plating pot 2 can be internally provided with a plurality of plating ring structures 21, the number of the plating ring structures 21 is determined according to the size of the plating pot 2, when the number of the plating ring structures 21 arranged in the plating pot 2 is larger, the relative output is also larger, each plating ring structure 21 comprises a plurality of plating rings 211 for placing a wafer, the plurality of plating rings 211 are linearly arranged along the horizontal direction, two adjacent plating rings 211 are fixedly connected through a connecting rod, when the plating rings are rotated, the connecting rod drives the plurality of plating rings 211 to rotate, each plating ring 211 is provided with a fixing part 212 for movably clamping the wafer, the fixing part 212 is used for fixing the wafer and preventing the wafer from falling off when the wafer is turned over, the outside of the plating pot 2 is provided with an umbrella stand 4 fixedly connected with the top of a cavity of an evaporation machine, and the plating pot 2 is detachably connected with the umbrella stand 4; the umbrella stand 4 is used for fixing the plating pot 2 on the top of the cavity of the evaporator for plating.

The utility model discloses a solar battery plating device, including a motor 1, a plating pot 211, a motor 3, a rotary mechanism 3, the output shaft of motor 1, after motor 1 circular telegram, the output shaft of motor 1 drives rotary mechanism 3 rotates, rotary mechanism 3's the other end pass behind the umbrella stand 4 with plate ring structure 21 fixed connection, rotary mechanism 3 drives plate ring structure 21 rotates, motor 1 is used for driving rotary mechanism 3 and drives plate ring structure 21 follows plate ring 211 array direction is circumferential direction rotary motion, that is to say when plate ring structure 21 is rotatory only can be circumferential direction rotary motion.

In this embodiment, a wafer is fixed on a plating ring 211 through a fixing member 212, when the plating ring 211 starts to rotate, the fixing member 212 can ensure that the wafer does not fall off from the plating ring 211, the plating rings 211 are fixedly connected through a connecting rod to form a plating ring structure 21, the plating ring structure 21 is located on a plating pot 2, the plating pot 2 is mounted on an umbrella stand 4 fixedly connected with the top of a cavity of an evaporation machine, so that the plating pot 2 can be located at the top of the cavity of the evaporation machine, a motor 1 is further arranged on one side of the cavity of the evaporation machine, after one side of the wafer finishes film plating, the motor 1 drives the plating ring structure 21 to do circumferential rotation motion along the arrangement direction of the plating rings 211 through a rotating mechanism 3, the crystal is rotated to the other side to continue film plating, and after both sides of the wafer finish film plating, the plating pot 2 is detached from the umbrella stand 4. Will after the wafer carries out two-sided coating film, avoided with the wafer single face coating film back, need open the coating machine will the pot 2 that plates is dismantled, is changed the wafer will plate pot 2 and umbrella stand 4 and install and restart the coating film again, compare like this, scheme in this application has not only promoted work efficiency, has increased the output when coating film at every turn, has still reduced bleed, heating, carminative time.

as can be seen from fig. 2, the fixing member 212 includes at least two spring clips disposed on the outer circumferential side of the plating ring 211, and the spring clips respectively press the plating ring 211 toward the center of the plating ring 211. In this embodiment, the fixing member 212 is configured as a spring clip so as to fix the wafer on the plating ring 211 more firmly, and since the spring clip needs to press the plating ring 211 toward the center of the plating ring 211, at least two spring clips need to be symmetrically disposed, otherwise the wafer is easy to fall off from the plating ring 211, and the number of the spring clips can be increased appropriately for better fixing the wafer.

Fig. 3 is a schematic structural view of the engagement between the driving wheel and the driven wheel of the plating pot mechanism of the rotatable plating ring according to the present application;

as shown in fig. 3, the rotating mechanism 3 includes a gear box 9 and a rotating operation rod, a driving wheel 91 and a plurality of driven wheels 92 are arranged in the gear box 9, the driving wheel is connected to an output shaft of the motor 1, one side of the driven wheels 92 close to the plating pot 2 is fixedly connected to the rotating operation rod, the driving wheel 91 is engaged with the driven wheels 92 and is fixedly installed in the gear box 9 through a rotating shaft, and the rotating operation rod is horizontally arranged and connected to one end of the plating ring structure 21. In this embodiment, the rotating mechanism 3 includes a gear box 9 and a rotating lever, the gear box 9 further includes the driving wheel 91 and the driven wheel 92, wherein the driving wheel 91 and the driven wheel 92 need to be engaged to enable the driving wheel 91 to drive the driven wheel 92 to rotate, the driving wheel 91 is connected to the output shaft of the motor 1, after the output shaft of the motor 1 starts to rotate, the driving wheel 91 can be driven to rotate, since the driving wheel 91 is engaged with the driven wheel 92, the driven wheel 92 can be driven to rotate when the driving wheel 91 rotates, one side of the driven wheel 92 close to the plating pot 2 is also fixedly connected to the rotating lever, and when the driven wheel 92 rotates, the rotating lever also drives the plating ring structure 21 to start to rotate, wherein the driving wheel 91 and the driven wheel 92 need to be fixedly installed in the gear box 9 through a rotating shaft.

The plating ring structure 21 performs a circumferential rotational motion along the arrangement direction of the plating rings 211 by a rotation angle of 180 °. In this embodiment, after the coating on one surface of the wafer is completed, the rotating mechanism 3 is required to drive the plating ring structure 21 to rotate to coat the other surface of the wafer, so the rotation angle of the wafer must be 180 °, if the rotation angle of the wafer is greater than 180 ° or less than 180 °, the wafer cannot be flipped, or the rotation angle is 180 ° + N360 °, where N may be 0.

The driving pulley 91 and the driven pulley 92 are gears that mesh with each other or sprockets of a chain drive. In this embodiment, since there is only one output shaft on the motor 1, in order to drive the plurality of rotary operating levers by the motor 1, the gear box 9 needs to be additionally arranged in the middle, the driving wheel 91 is driven by the motor 1, and further the driving wheel 91 drives the driven wheel 92, and in order to drive the driven wheel 92 by the driving wheel 91, the driving wheel 91 and the driven wheel 92 need to be meshed with each other or chain-driven sprockets.

Fig. 4 is a schematic structural diagram of a plating pot mechanism of a rotatable plating ring according to another embodiment of the present application.

As can be seen from fig. 4, the rotating mechanism 3 includes a bracket 33 and a first turning arm 32, the first turning arm 32 is fixedly connected to one end of the bracket 33, one end of the first turning arm 32 away from the bracket 33 is provided with a first turning part 321, and the other end of the bracket 33 is fixed with a second turning arm 34 and a second turning part 341 which are symmetrically arranged with the first turning arm 32 and the first turning part 321; the first rotating part 321 is connected to an output shaft of the motor 1, one end of the plating ring structure 21 is fixedly connected to the first rotating part 321, and the other end of the plating ring structure 21 is fixedly connected to the second rotating part 341.

In this embodiment, a support 33 is disposed outside the evaporator, the support 33 is configured to fix the first rotating portion 321 and the second rotating portion 341 through the first rotating arm 32 and the second rotating arm 34, wherein one end of the first rotating portion 321 is connected to an output shaft on the motor 1, the other end of the first rotating portion 321 is fixedly connected to one end of the plating ring structure 21, and the other end of the plating ring structure 21 is fixedly connected to the second rotating portion 341, when the motor 1 starts to operate, the output shaft of the motor 1 starts to rotate, the output shaft drives the first rotating portion 321 to rotate, and since the first rotating portion 321 is fixedly connected to the plating ring structure 21 and the second rotating portion 341, when the first rotating portion 321 rotates, the plating ring structure 21 and the second rotating portion 341 rotate accordingly, it should be noted that the rotation angle of the plating ring structure 21 is 180 °, and if the rotation angle of the plating ring structure 21 is greater than 180 ° or less than 180 °, N + 360 ° may be 0 °.

This application second aspect still provides an evaporation plating machine, including foretell rotatable plating ring plate pot mechanism, plate pot 2 under be equipped with evaporation plating machine cavity bottom fixed connection's ion source 5, the both sides of ion source 5 be equipped with respectively with evaporation plating machine cavity bottom fixed connection electron gun 6 and with evaporation plating machine cavity bottom fixed connection crucible 7, electron gun 6 is used for the emission beam, crucible 7 is used for placing evaporation material, one side of plating pot 2 is equipped with and is located evaporation plating machine cavity inner wall and prevents board 8.

In this embodiment, the principle of electron beam evaporation is applied, which is a Physical Vapor Deposition (PVD) technique that directly heats an evaporation material (usually particles) by an electron beam under vacuum and transfers the evaporation material to a wafer to form a thin film. The electron beam evaporation can plate high-purity and high-precision films. That is to say, in this application, electron gun 6 in the coating machine inner chamber need to shine the light beam to crucible 7, the evaporation material of placing in heating crucible 7, carry the material after the evaporation on the wafer, form a film on the wafer, the coating film is accomplished this moment, because the coating machine of this application includes the coating pot mechanism of foretell rotatable plating ring, so after the coating film of one side of wafer is accomplished, need through motor 1 with the wafer upset 180, continue the coating film, after the coating film is also accomplished to the another side of wafer, can open the coating machine, take out it. The electron beam evaporation coating principle is adopted in the application, because the electron beam evaporation can evaporate high-melting-point materials, the efficiency is higher than that of common resistance heating evaporation. The electron beam evaporation can be widely used for optical coating of high-purity films, conductive glass and the like.

The anti-attachment plate 8 is arc-shaped or bent, and the anti-attachment plate 8 is integrally formed or formed by splicing a plurality of plates. In this embodiment, the reason why the shape of the adhesion preventing plate 8 is formed into a circular arc shape or a bent shape is to make the adhesion preventing plate 8 adhere to the inner cavity of the vapor deposition machine more favorably. Prevent that board 8 integrated into one piece or for the polylith concatenation forms, be in order to let prevent that board 8 and coating by vaporization machine inner chamber do not leave the gap, work as prevent that certain concatenation part is damaged after board 8 splices, so can only change the part that damages, help the enterprise has practiced thrift manufacturing cost.

According to the technical solution, the embodiment of the present application provides a plating pot mechanism of a rotatable plating ring, including: the motor 1 is arranged on the shell of the evaporation machine, wherein the motor 1 is used for driving other equipment, and the plating pot 2 is arranged in the cavity of the evaporation machine; the plating pot 2 is internally provided with at least one plating ring structure 21, the plating pot 2 can be internally provided with a plurality of plating ring structures 21, the number of the plating ring structures 21 is determined according to the size of the plating pot 2, when the number of the plating ring structures 21 arranged in the plating pot 2 is more, the yield is more, the plating ring structures 21 comprise a plurality of plating rings 211 for placing wafers, the plating rings 211 are linearly arranged along the horizontal direction, two adjacent plating rings 211 are fixedly connected through a connecting rod, when the plating rings are rotated, the connecting rod drives the plating rings 211 to rotate, each plating ring 211 is provided with a fixing part 212 for movably clamping the wafers, the fixing part 212 is used for fixing the wafers and preventing the wafers from falling off when being turned over, the plating pot 2 is externally provided with an umbrella stand 4 fixedly connected with the top of a cavity of an evaporation plating machine, and the plating pot 2 is detachably connected with the umbrella stand 4; the umbrella stand 4 is used for fixing the plating pot 2 on the top of the cavity of the evaporator for plating.

The utility model discloses a solar battery plating device, including a motor 1, a plating pot 211, a plating ring structure 21, a motor 3, a rotary mechanism 3, a motor 1 and a plating pot 2, be equipped with rotary mechanism 3 between the motor 1 with plating pot 2, rotary mechanism 3 one end with the output shaft of motor 1 is connected, works as after motor 1 circular telegram, drive rotary mechanism 3 rotates, rotary mechanism 3's the other end passes behind the umbrella stand 4 with plating ring structure 21 fixed connection, rotary mechanism 3 drives plating ring structure 21 rotates, motor 1 is used for driving rotary mechanism 3 and drives plating ring structure 21 follows it is to plate ring 211 array orientation and be circumferential direction rotary motion, works as only can be circumferential direction rotary motion when plating ring structure 21 is rotatory.

This application has set up a motor 1 on the coating by vaporization machine shell, motor 1 can drive through rotary mechanism and plate the ring structure and rotate, and every plate the ring just can put two wafers like this when the coating by vaporization machine operation, and after the wafer coating film of one side was accomplished, can overturn the wafer, for the opposite side coating film of wafer, not only promoted work efficiency when the operation, increased the output, still reduced bleed, heating, carminative time.

Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can make modifications and equivalents to the specific embodiments of the present invention without departing from the spirit and scope of the present invention, which is set forth in the following claims.

Claims

1. A plate pot mechanism of rotatable plating ring, its characterized in that includes: the device comprises a motor (1) arranged on a shell of the evaporator, and a plating pot (2) arranged in a cavity of the evaporator;

at least one plating ring structure (21) is arranged in the plating pot (2), the plating ring structure (21) comprises a plurality of plating rings (211) for placing wafers, the plating rings (211) are linearly arranged along the horizontal direction, two adjacent plating rings (211) are fixedly connected through a connecting rod, a fixing piece (212) for movably clamping the wafers is arranged on each plating ring (211), an umbrella stand (4) fixedly connected with the top of a cavity of an evaporation plating machine is arranged outside the plating pot (2), and the plating pot (2) is detachably connected with the umbrella stand (4);

motor (1) with be equipped with rotary mechanism (3) between plating pot (2), rotary mechanism (3) one end with the output shaft of motor (1), rotary mechanism's (3) other end passes behind umbrella stand (4) with plate ring structure (21) fixed connection, motor (1) are used for driving rotary mechanism (3) and drive plate ring structure (21) and follow plate ring (211) array orientation and be circumferential direction rotary motion.

2. The rotatable plating pot mechanism of claim 1, wherein the fixing member (212) comprises at least two spring clips disposed at the outer circumferential side of the plating ring (211), the spring clips respectively pressing the plating ring (211) toward the center of the plating ring (211).

3. The plating pot mechanism of the rotatable plating ring as claimed in claim 1, wherein the rotating mechanism (3) comprises a gear box (9) and a rotating operating lever, a driving wheel (91) and a plurality of driven wheels (92) are arranged in the gear box (9), the driving wheel (91) is connected with an output shaft of the motor (1), one side of the driven wheel (92) close to the plating pot (2) is fixedly connected with the rotating operating lever, the driving wheel (91) is meshed with the driven wheel (92) and is fixedly installed in the gear box (9) through a rotating shaft, and the rotating operating lever is horizontally arranged and connected to one end of the plating ring structure (21).

4. The plating pot mechanism of the rotatable plating ring as claimed in claim 1, wherein the plating ring structure (21) performs a circumferential rotation movement along the arrangement direction of the plating rings (211) by a rotation angle of 180 °.

5. The plating pot mechanism of the rotatable plating ring as claimed in claim 3, wherein the driving wheel (91) and the driven wheel (92) are mutually meshed gears or chain wheels of a chain drive.

6. The plating pot mechanism of the rotatable plating ring as claimed in claim 1, wherein the rotating mechanism (3) comprises a bracket (33) and a first turning arm (32), the first turning arm (32) is fixedly connected with one end of the bracket (33), one end of the first turning arm (32) far away from the bracket (33) is provided with a first turning part (321), and the other end of the bracket (33) is fixed with a second turning arm (34) and a second turning part (341) which are symmetrically arranged with the first turning arm (32) and the first turning part (321)

The first rotary part (321) is connected with an output shaft of the motor (1), one end of the plating ring structure (21) is fixedly connected with the first rotary part (321), and the other end of the plating ring structure (21) is fixedly connected with the second rotary part (341).

7. An evaporation machine is characterized by comprising the rotatable plating ring plating pot mechanism of any one of claims 1 to 6, wherein an ion source (5) fixedly connected with the bottom of an evaporation machine cavity is arranged right below a plating pot (2), an electron gun (6) fixedly connected with the bottom of the evaporation machine cavity and a crucible (7) fixedly connected with the bottom of the evaporation machine cavity are respectively arranged on two sides of the ion source (5), and a sticking prevention plate (8) positioned on the inner wall of the evaporation machine cavity is arranged on one side of the plating pot (2).

8. The evaporation plating machine according to claim 7, wherein the shape of the anti-adhesion plate (8) is circular arc or bending, and the anti-adhesion plate (8) is integrally formed or formed by splicing a plurality of plates.