CN115196111B - Multi-pad electronic component testing braid equipment - Google Patents

Multi-pad electronic component testing braid equipment Download PDF

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Publication number
CN115196111B
CN115196111B CN202210886183.6A CN202210886183A CN115196111B CN 115196111 B CN115196111 B CN 115196111B CN 202210886183 A CN202210886183 A CN 202210886183A CN 115196111 B CN115196111 B CN 115196111B
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CN
China
Prior art keywords
electronic components
assembly
testing
test
electronic component
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CN202210886183.6A
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Chinese (zh)
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CN115196111A (en
Inventor
白志坚
薛克瑞
庄裕刚
张小东
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Shenzhen Good Machine Automation Equipment Co ltd
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Shenzhen Good Machine Automation Equipment Co ltd
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Priority to CN202210886183.6A priority Critical patent/CN115196111B/en
Publication of CN115196111A publication Critical patent/CN115196111A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B57/00Automatic control, checking, warning, or safety devices
    • B65B57/10Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged
    • B65B57/14Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged and operating to control, or stop, the feed of articles or material to be packaged
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04Attaching a series of articles, e.g. small electrical components, to a continuous web
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B35/00Supplying, feeding, arranging or orientating articles to be packaged
    • B65B35/10Feeding, e.g. conveying, single articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B35/00Supplying, feeding, arranging or orientating articles to be packaged
    • B65B35/10Feeding, e.g. conveying, single articles
    • B65B35/20Feeding, e.g. conveying, single articles by reciprocating or oscillatory pushers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Abstract

The application belongs to the field of semiconductor component production equipment, and discloses multi-pad electronic component test braid equipment, which comprises a frame, a feeding mechanism and a test mechanism, wherein the frame is provided with a bedplate; the feeding mechanism is arranged on the frame, the testing mechanism is arranged on the bedplate, the testing mechanism comprises a chuck assembly and a photoelectric parameter testing assembly, the photoelectric parameter testing assembly comprises testing needles, connecting rods, a testing base and second driving pieces, the second driving pieces and the testing base are arranged on the bedplate, the testing needles are fixedly connected with the connecting rods, the connecting rods are hinged with the testing base, the second driving pieces drive the connecting rods to drive the testing needles to contact with electronic component bonding pads on the chuck assembly, and the testing needles are arranged in a plurality of and are in one-to-one correspondence with the electronic component bonding pads. The application improves the accuracy of photoelectric parameter test of the multi-pad electronic components, and does not need to replace test mechanisms for electronic components with different pads and different sizes, thereby reducing the input cost.

Description

Multi-pad electronic component testing braid equipment
Technical Field
The application belongs to the field of semiconductor production equipment, and relates to multi-pad electronic component testing braid equipment.
Background
In the production process of the electronic components, the operations such as testing the electronic components and braiding packaging are required, and the electrode direction and the photoelectric parameter test are required to be carried out when the existing patch type electronic components are braided, wherein the photoelectric parameter test is used for testing whether the electrical performance of the patch type electronic components is good, and the electrode direction is used for testing whether the positive and negative directions of all patch type electronic components placed in the carrier band are consistent. The parameters of each electronic component, such as electrical and optical parameters, may be different, so it is particularly important to test the yield and the luminescence performance of the electronic component.
In the related art, the detection of the electronic components and the braid are manufactured by using different equipment. When the photoelectric parameter is tested, the electronic component is pressed on a test bench of the testing mechanism to form benign ohmic contact, and the existing testing mechanism is communicated with a bonding pad of the electronic component in a clamping mode for electrifying, so that the electric signal test is performed.
Aiming at the related technical means, the testing means is suitable for carrying out photoelectric parameter testing on electronic components with two or a few bonding pads, the photoelectric parameter testing on the electronic components with multiple bonding pads is inaccurate, and different testing mechanisms are needed for the electronic components with different bonding pads and different packaging sizes, so that the equipment investment cost is higher.
Disclosure of Invention
In order to improve the defect that inaccurate photoelectric parameter test exists in the multi-pad electronic component, the application provides multi-pad electronic component test taping equipment.
The application provides a multi-pad electronic component test braid device, which adopts the following technical scheme:
a multi-pad electronic component test taping apparatus includes,
the rack is provided with a bedplate;
the feeding mechanism is arranged on the frame and used for conveying electronic components;
the testing mechanism is used for carrying out photoelectric testing on electronic components, the testing mechanism is installed in the platen, the testing mechanism comprises a chuck assembly used for bearing the circulation of the electronic components at different stations and a photoelectric parameter testing assembly used for carrying out electric parameter testing on the electronic components, the photoelectric parameter testing assembly comprises a testing needle, a connecting rod, a testing base and a second driving piece, wherein the testing needle, the connecting rod, the testing base and the second driving piece are used for being electrically connected with an electronic component bonding pad, the second driving piece is installed in the platen, the testing needle is fixedly connected with the connecting rod, the connecting rod is hinged with the testing base, the second driving piece drives the testing needle to be in contact with the electronic component bonding pad on the chuck assembly, the testing needle is provided with a plurality of electronic component bonding pads, and the testing needle is in one-to-one correspondence with the electronic component bonding pad.
By adopting the technical scheme, when the electronic components on the chuck assembly pass through the photoelectric parameter testing assembly, the second driving piece drives the connecting rod to rotate relative to the testing base, and the connecting rod drives the plurality of testing needles to approach towards the direction of the chuck assembly, so that the plurality of testing needles are contacted with the bonding pads of the electronic components, and the other ends of the testing needles are connected with external wires so as to realize photoelectric parameter testing of the electronic components with the plurality of bonding pads. For electronic components with different bonding pads and different packaging sizes, only the number and positions of the test pins are correspondingly adjusted, and different test mechanisms do not need to be replaced, so that the input cost of equipment is reduced.
Optionally, the optoelectronic parameter testing assembly further comprises a guide block for guiding the test needle, the guide block is provided with a guide groove, two opposite side walls of the guide groove are obliquely arranged, and extension lines of the two side walls converge towards the direction of the chuck assembly.
Through adopting above-mentioned technical scheme, the connecting rod is at the in-process that drives the test needle towards chuck subassembly motion, and the test needle passes the guide way, leads the tip of test needle via the opposite both sides wall of guide way for a plurality of test needles all can contact with the many pads of electronic components and carry out electric parameter detection, have improved the photoelectricity parameter test degree of accuracy of test needle.
Optionally, the chuck assembly includes a rotating chuck, a first motor for driving the rotating chuck to rotate, and a fixing seat, wherein the fixing seat is installed on the platen, an output end of the first motor is fixedly connected with the rotating chuck, and the other end of the first motor is installed on the fixing seat; the rotating chuck is provided with a plurality of holding tanks for holding electronic components.
Through adopting above-mentioned technical scheme, first motor drive rotates chuck and rotates, drives the electronic components that holds in the silo and circulate for a plurality of holding the silo homoenergetic of rotating chuck pass through photoelectricity parameter test assembly one by one, thereby carry out electric parameter detection to the electronic components that holds in the silo, the electronic components after the completion test rotates the area through rotating chuck and leaves, adjacent holding the silo on the rotating chuck continues to drive electronic components and gets into the test station and carry out photoelectric detection, the efficiency that electronic components detected has been improved, space utilization has been improved to the use of rotating chuck simultaneously.
Optionally, the feed mechanism includes the vibration dish, the vibration dish is provided with the material loading track, the one end of material loading track with Rong Liaocao dock so that electronic components gets into the holding groove.
Through adopting above-mentioned technical scheme, the vibration dish is automatic and orderly directional arrangement orderly with unordered electronic components through the vibration, and then carries to material loading track department, and material loading track and holding silo butt joint make electronic components follow material loading track department motion to hold in the silo to realize automatic feeding, improve the efficiency of material loading.
Optionally, the feeding mechanism further comprises a feeding separation assembly for separating electronic components entering the containing groove, the feeding separation assembly comprises a separation mounting seat arranged on the platen, a separation substrate for bearing the electronic components, a separation thimble for separating the electronic components and a first driving piece for driving the separation thimble to lift, the separation substrate is provided with a separation through hole, and the separation thimble is arranged between two adjacent electronic components in a penetrating way.
By adopting the technical scheme, the first driving piece drives the separation thimble to ascend, so that the separation through holes penetrate through to separate two adjacent electronic components, limit the electronic components far away from the containing groove, and meanwhile, the electronic components in the containing groove rotate to the next processing station along with the rotation chuck, thereby reducing the disturbance of feeding of the electronic components caused by adhesion between the adjacent electronic components; when the first driving piece drives the separation thimble to descend, thereby the electronic components on the material loading track gets into the appearance silo, has improved the degree of accuracy and the material loading efficiency of material loading.
Optionally, the material loading separation subassembly still includes the air cock, the air cock install in separation base plate below, separation base plate is provided with and is used for dodging the separation of rotating chuck and dodges the groove and be used for the gas passage's gas circuit through-hole, air cock one end with the gas circuit through-hole intercommunication, the other end of air cock is used for being connected with outside air inlet pump.
Through adopting above-mentioned technical scheme, the air inlet pump blows air through the air cock and advances the air inlet channel, and the cell wall motion in groove is dodged towards the separation to gaseous drive electronic components, and the separation is dodged the groove and is carried out the fine setting with gaseous cooperation to the position that is located the electronic components that holds the silo, improves the goodness of fit in electronic components and holds the silo position, reduces when follow-up rotation chuck flows electronic components, and the electronic components breaks away from the possibility in the container silo.
Optionally, still include the feed mechanism that classifies according to the quantity of different electronic components, feed mechanism includes the inlet pipe, is used for holding a plurality of collection barrels of different grade type electronic components and is used for loading into a plurality of with different electronic components the unipolar of collection barrel charge assembly, collection barrel with the unipolar charge assembly all install in the frame, the rotation chuck is provided with the feed station, the inlet pipe install in the feed station.
Through adopting above-mentioned technical scheme, when the electronic components in the appearance silo flows to the branch material station through rotating the chuck, the electronic components of the biggest type of quantity continues to flow to next station along with rotating the chuck, and remaining different grade type electronic components get into through the inlet pipe, pack into the collection bucket respectively with different grade type electronic components through the unipolar subassembly of feeding in, realize once to the classification of electronic components, reduced the electronic components and easily produced the damage to electronic components in the transportation process between different equipment, reduced the time that the circulation classification of electronic components between different equipment consumes simultaneously.
Optionally, unipolar charging assembly includes charge mounting bracket, dress stub bar, drive wheel, drive belt and drive wheel pivoted second motor, the drive wheel install in the output of second motor and with charge mounting bracket rotates to be connected, the drive belt install in the drive wheel periphery, dress stub bar with drive belt fixed connection, a plurality of aggregate barrel sets up side by side and is located the below of dress stub bar, the one end of dress stub bar with the inlet pipe intercommunication, the other end is counterpointed with the opening of aggregate barrel.
Through adopting above-mentioned technical scheme, electronic components gets into the loading head through the inlet pipe, and the second motor drive wheel rotates, and the drive wheel rotates and drives the drive belt motion to make the loading head move in the length direction of drive belt and shift into different material collection bucket with different grade type electronic components, accomplish the classification to different grade type electronic components.
Optionally, still include transport mechanism, transport mechanism is including transporting the mounting panel, transporting the carousel, transporting the suction nozzle, the rotatory third driving piece of carousel and control are transported in the drive transport the fourth driving piece of suction nozzle motion stroke, transport the mounting panel with frame fixed connection, the third driving piece with the fourth driving piece all install in the frame, transport the suction nozzle install in transport the carousel.
Through adopting above-mentioned technical scheme, fourth driving piece drive is transported the suction nozzle and is moved towards rotating chuck for transport the suction nozzle and hold the electronic components contact in the silo, absorb electronic components, thereby third driving piece drive is transported the carousel and is rotated and will transport the electronic components on the suction nozzle and shift, accomplish the transportation of electronic components.
Optionally, the electronic component feeding device comprises a braiding mechanism, a feeding mechanism and a braiding mechanism, wherein the braiding mechanism comprises a carrier tape track, a braiding assembly for braiding an electronic component feeding tape, a tape placing assembly for conveying a material tape and a braiding driving piece for driving the material tape on the carrier tape track to move, the carrier tape track is arranged on the frame, and the braiding assembly is positioned above the carrier tape track and is arranged corresponding to the carrier tape track; the carrier band track is provided with a feeding end for bearing the electronic components on the transfer suction nozzle and a discharging end for outputting finished electronic components braids, and the feeding end is rotationally connected with the transfer turntable.
Through adopting above-mentioned technical scheme, the electronic components on the transportation suction nozzle moves to the orbital feed end of carrier tape, and the electronic components is arranged in the material area on the carrier tape track, and the braid driving piece drive is put the area subassembly and is rotated, and the braid subassembly drives the material area motion on the carrier tape track for the electronic components on the transportation suction nozzle moves to the braid subassembly below through the feed end, and the braid subassembly carries out the braid operation to the material area that has the electronic components, and the electronic components that the braid was accomplished is followed the discharge end and is gone out, accomplishes the categorised braid of different grade type electronic components.
In summary, the present application includes at least one of the following beneficial technical effects:
1. when the electronic components on the chuck assembly pass through the photoelectric parameter testing assembly, the second driving piece drives the connecting rod to rotate relative to the testing base, and the connecting rod drives the plurality of testing needles to approach towards the direction of the chuck assembly, so that the plurality of testing needles are contacted with the bonding pads of the electronic components, and the other ends of the testing needles are connected with external wires so as to realize photoelectric parameter testing of the electronic components with the plurality of bonding pads; for electronic components with different bonding pads and different packaging sizes, only the number and positions of the test pins are correspondingly adjusted, and different test mechanisms do not need to be replaced, so that the input cost of equipment is reduced.
2. The first driving piece drives the separation thimble to ascend, so that two adjacent electronic components are separated by the penetrating separation through hole, the electronic components far away from the containing groove are limited, and meanwhile, the electronic components in the containing groove flow to the next processing station along with the rotating chuck, so that the disorder of feeding of the electronic components caused by adhesion between the adjacent electronic components is reduced; when the first driving piece drives the separation thimble to descend, thereby the electronic components on the material loading track gets into the appearance silo, has improved the degree of accuracy and the material loading efficiency of material loading.
3. When the electronic components in the material containing groove flow to the material distributing station through the rotating chuck, the electronic components with the highest quantity continue to flow to the next station along with the rotating chuck, the rest electronic components with different types enter through the material inlet pipe, and the electronic components with different types are respectively loaded into the material collecting barrel through the single-shaft material loading assembly, so that the electronic components are classified at one time, the damage to the electronic components in the transferring process of the electronic components among different equipment is reduced, the time consumed by the circulation classification of the electronic components among different equipment is reduced,
drawings
Fig. 1 is a schematic diagram of the overall structure of a multi-pad electronic component test braid apparatus of the present application.
Fig. 2 is a schematic structural view showing a feeding mechanism according to an embodiment of the present application.
FIG. 3 is a schematic diagram showing the structure of a testing mechanism according to an embodiment of the present application.
FIG. 4 is a schematic view showing the structure of a feed separation assembly according to an embodiment of the present application.
FIG. 5 is a schematic diagram showing the structure of an optoelectronic parameter testing assembly according to an embodiment of the present application.
FIG. 6 is a schematic view showing the overall structure of a single shaft loading assembly according to an embodiment of the present application.
FIG. 7 is a schematic view showing the overall structure of the transfer mechanism according to the embodiment of the present application.
FIG. 8 is a schematic view showing the overall structure of the braiding mechanism according to the embodiment of the present application.
Reference numerals illustrate:
1. a frame; 11. a carrier substrate; 12. a platen; 2. a feeding mechanism; 21. a vibration plate; 211. a feeding rail; 22. a feeding separation assembly; 221. separating the mounting seat; 222. separating the substrate; 2221. separating the through holes; 2222. separating and avoiding grooves; 2223. the air passage through hole; 223. separating the thimble; 224. a first driving member; 225. an air tap; 3. a testing mechanism; 31. a chuck assembly; 311. rotating the chuck; 3111. rong Liaocao; 3112. a material distributing station; 313. a fixing seat; 32. a pole measurement assembly; 33. a reversing assembly; 34. a photoelectric parameter testing component; 341. a test needle; 342. a connecting rod; 343. a test base; 344. a second driving member; 345. a guide block; 3451. a guide groove; 4. a material distributing mechanism; 41. a feed pipe; 42. a collecting barrel; 43. a single shaft charging assembly; 431. a charge mounting rack; 432. a loading head; 433. a driving wheel; 434. a transmission belt; 435. a second motor; 5. a transfer mechanism; 51. a transfer mounting plate; 52. a transfer turntable; 53. a transfer suction nozzle; 54. a third driving member; 55. a fourth driving member; 56. an image correction component; 57. a recovery cylinder; 6. a braiding mechanism; 61. a carrier tape track; 611. a feed end; 612. a discharge end; 613. a material conveying groove; 62. a braid assembly; 63. a tape placement assembly; 631. a material strip coil; 632. a roll of film; 633. and (5) winding the coil.
Detailed Description
The application is described in further detail below with reference to fig. 1-8.
The embodiment of the application discloses a multi-pad electronic component test braid device.
Referring to fig. 1, a multi-pad electronic component test braid apparatus includes a frame 1, a feeding mechanism 2, a testing mechanism 3, a distributing mechanism 4, a transferring mechanism 5, and a braid mechanism 6. The feeding mechanism 2 is used for carrying electronic components, the testing mechanism 3 is used for carrying out photoelectric parameter detection to the electronic components that feeding mechanism 2 carried, the feed divider 4 is used for classifying according to photoelectric parameter to the electronic components, the transport mechanism 5 is used for transporting the electronic components on the testing mechanism 3, the braid mechanism 6 is used for carrying out the braid to the electronic components that transport mechanism 5 transported, feeding mechanism 2, testing mechanism 3, feed divider 4, transport mechanism 5 and braid mechanism 6 all install in frame 1. The electronic components transport to the testing mechanism 3 through feed mechanism 2, carry out photoelectric parameter detection through the testing mechanism 3, and feed divider 4 classifies according to the quantity of the photoelectric parameter of electronic components, and the electronic components of quantity most type is transported to braider 6 through transport mechanism 5 and is braided, and the categorised collection of remaining different types of electronic components is carried out through feed divider 4.
The frame 1 is provided with a bearing substrate 11 for dividing the frame 1 into an upper space and a lower space, and the feeding mechanism 2 is arranged on the upper end face of the bearing substrate 11. In order to facilitate the transportation of electronic components, the rack 1 is provided with a platen 12, and the platen 12 is fixedly mounted on the upper end surface of the carrier substrate 11 and is arranged corresponding to the height of the feeding mechanism 2. The testing mechanism 3, the distributing mechanism 4, the transferring mechanism 5 and the braiding mechanism 6 are all arranged on the bedplate 12.
Referring to fig. 1 and 2, the feeding mechanism 2 includes a vibration plate 21, the vibration plate 21 is fixedly connected with the bearing substrate 11, the vibration plate 21 is provided with a feeding track 211 for bearing electronic components, and the vibration plate 21 automatically and orderly orients and arranges unordered electronic components by vibration, so as to accurately convey the unordered electronic components to the feeding track 211.
Referring to fig. 1 and 3, the testing mechanism 3 includes a chuck assembly 31 for carrying electronic components to be transferred between different stations, a pole testing assembly 32 for determining the direction of the electronic components, a reversing assembly 33 for adjusting the direction of the electronic components, and a photoelectric parameter testing assembly 34 for testing the electrical parameters of the electronic components. The pole testing component 32, the reversing component 33 and the photoelectric parameter testing component 34 are distributed in the circumferential direction of the chuck component 31. The electronic components flow from the feeding track 211 to the polar measurement assembly 32 sequentially through the chuck assembly 31 for direction detection, and the electronic components which are not in line with the direction are subjected to direction adjustment through the reversing assembly 33, so that the directions of the electronic components positioned on the chuck assembly 31 are consistent, and then the photoelectric parameter test assembly 34 is used for carrying out the electric parameter test.
The chuck assembly 31 comprises a rotating chuck 311, a first motor for driving the rotating chuck 311 to rotate, and a fixing base 313, wherein the fixing base 313 is installed on the platen 12, the output end of the first motor is fixedly connected with the rotating chuck 311, and the other end of the first motor is installed on the fixing base 313. The rotating chuck 311 is generally disc-shaped, the rotating chuck 311 and the vibrating disc 21 are respectively positioned at two ends of the feeding track 211, and the central axis of the feeding track 211 coincides with the diameter of the rotating chuck 311. The rotating chuck 311 is provided with a plurality of holding groove 3111 that hold electronic components, and the material loading track 211 is docked with Rong Liaocao 3111 and makes electronic components follow material loading track 211 department motion to hold in the groove 3111 and realize automatic feeding, and first motor drive rotates chuck 311, drives and holds the electronic components in the groove 3111 and circulate for a plurality of holding groove 3111 of rotating chuck 311 all hold electronic components, and the electronic components in Rong Liaocao 3111 all can pass through next subassembly one by one.
Referring to fig. 3 and 4, in order to improve the accuracy of the feeding, the feeding mechanism 2 further includes a feeding separation assembly 22 for separating adjacent electronic components, where the feeding separation assembly 22 includes a separation mounting base 221 mounted on the platen 12, a separation substrate 222 for carrying the electronic components, a separation thimble 223 for separating the electronic components, and a first driving element 224 for driving the separation thimble 223 to lift, the separation substrate 222 is provided with a separation through hole 2221, and the separation thimble 223 is disposed between two adjacent electronic components through the separation through hole 2221. The first driving piece 224 drives the separation thimble 223 to ascend, so that two adjacent electronic components are separated by penetrating the separation through hole 2221, the electronic components far away from the material containing groove 3111 are limited, and meanwhile, the electronic components in the material containing groove 3111 flow to the next processing station along with the rotation chuck 311, so that the disorder of feeding of the electronic components caused by adhesion between the adjacent electronic components is reduced; when the first driving piece 224 drives the separation thimble 223 to descend, electronic components on the feeding track 211 enter the containing groove 3111, and feeding accuracy and feeding efficiency are improved.
Referring to fig. 4, further, the feeding separation assembly 22 further includes an air tap 225, the air tap 225 is installed below the separation substrate 222, the separation substrate 222 is provided with a separation avoidance groove 2222 for avoiding the rotation chuck 311 and an air passage through hole 2223 for passing air, one end of the air tap 225 is communicated with the air passage through hole 2223, and the other end of the air tap 225 is connected with an external air intake pump. The air inlet pump blows air into the air channel through the air tap 225, the gas drives the electronic components to move towards the groove wall of the separation avoidance groove 2222, the separation avoidance groove 2222 is matched with the gas to finely adjust the position of the electronic components in the containing groove 3111, the matching degree of the electronic components and the position of the containing groove 3111 is improved, and the possibility that the electronic components are separated from the containing groove 3111 when the electronic components are circulated by the follow-up rotating chuck 311 is reduced.
Referring to fig. 5, the optoelectronic parameter testing assembly 34 includes a testing pin 341 for electrically connecting with the electronic component pads, a connecting rod 342, a testing base 343, and a second driving member 344, the second driving member 344 and the testing base 343 are mounted on the platen 12, the testing pin 341 is fixedly connected with the connecting rod 342, the connecting rod 342 is hinged with the testing base 343, the second driving member 344 drives the connecting rod 342 to drive the testing pin 341 to contact with the electronic component pads on the chuck assembly 31, the testing pins 341 are provided in plurality, and the testing pins 341 are disposed in one-to-one correspondence with the electronic component pads. In this embodiment, the second driving member is preferably a cylinder.
When the electronic components on the chuck assembly 31 pass through the photoelectric parameter testing assembly 34, the second driving piece 344 drives the connecting rod 342 to rotate relative to the testing base 343, the connecting rod 342 drives the plurality of testing needles 341 to approach towards the direction of the chuck assembly 31, so that the plurality of testing needles 341 are contacted with bonding pads of the electronic components, the other ends of the testing needles 341 are connected with external wires, thereby realizing photoelectric parameter testing of the electronic components with the plurality of bonding pads, the tested electronic components are carried away by the rotation of the rotating chuck 311, and the adjacent material containing grooves 3111 on the rotating chuck 311 continuously drive the electronic components to enter the photoelectric parameter testing assembly 34 for electric parameter detection. For electronic components with different bonding pads and different packaging sizes, only the number and positions of the test pins 341 are correspondingly adjusted, and different test mechanisms 3 are not required to be replaced, so that the input cost of equipment is reduced.
Further, the optoelectronic parameter testing assembly 34 further includes a guiding block 345 for guiding the testing needle 341, the guiding block 345 is provided with a guiding groove 3451, two opposite sidewalls of the guiding groove 3451 are obliquely arranged, and extension lines of the two sidewalls converge toward the chuck assembly 31. In the process of driving the test needles 341 to move towards the chuck assembly 31, the connecting rods 342 penetrate through the guide grooves 3451, and the ends of the test needles 341 are guided through the two opposite side walls of the guide grooves 3451, so that the plurality of test needles 341 can be contacted with multiple bonding pads of electronic components and perform electrical parameter detection, and the photoelectric parameter testing accuracy of the test needles 341 is improved.
Referring to fig. 1 and 6, the sorting mechanism 4 sorts the electronic components with the largest number according to the number of different types of electronic components, and then flows to the taping mechanism 6 for taping through the transfer mechanism 5. The material distributing mechanism 4 comprises a material feeding pipe 41, a plurality of material collecting barrels 42 for containing different types of electronic components and a single-shaft material charging assembly 43 for charging the different types of electronic components into the plurality of material collecting barrels 42, wherein the material collecting barrels 42 and the single-shaft material charging assembly 43 are both arranged on the frame 1, a material distributing station 3112 is arranged on a rotating chuck 311, and the material feeding pipe 41 is arranged on the material distributing station 3112. When the electronic components in Rong Liaocao 3111 flow to the material distributing station 3112 through the rotating chuck 311, the electronic components of the type with the largest quantity continue to flow to the next station along with the rotating chuck 311, the rest electronic components of different types enter through the material feeding pipe 41, and the electronic components of different types are respectively loaded into the material collecting barrel 42 through the single-shaft material loading assembly 43, so that the classification of the electronic components is realized.
Referring to fig. 6, the single-shaft charging assembly 43 includes a charging frame 431, a charging head 432, a driving wheel 433, a driving belt 434, and a second motor 435 for driving the driving wheel 433 to rotate, the driving wheel 433 is mounted at an output end of the second motor 435 and is rotatably connected with the charging frame 431, the driving belt 434 is mounted at an outer periphery of the driving wheel 433, the charging head 432 is fixedly connected with the driving belt 434, a plurality of collecting barrels 42 are arranged side by side and below the charging head 432, one end of the charging head 432 is communicated with the feeding pipe 41, and the other end is aligned with an opening of the collecting barrel 42. The electronic components get into loading head 432 through inlet pipe 41, and the rotation of second motor 435 drive wheel 433, and the rotation of drive wheel 433 drives the motion of drive belt 434 to make loading head 432 follow the length direction motion of drive belt 434 and shift into different material collection bucket 42 with different type electronic components, accomplish the classification to different type electronic components.
In order to transport the electronic components to the feeding pipe 41, the material distributing mechanism 4 is further provided with a blowing component, the blowing component blows the electronic components down to the feeding pipe 41, and the blowing component is located below the rotating chuck 311 and is arranged at the material distributing station 3112, so that the speed of the electronic components entering the feeding pipe 41 is increased, and the material distributing efficiency is improved.
Referring to fig. 7, the transfer mechanism 5 is located around the rotating chuck 311, where the transfer mechanism 5 includes a transfer mounting plate 51, a transfer turntable 52, a transfer nozzle 53, a third driving member 54 for driving the transfer turntable 52 to rotate, and a fourth driving member 55 for controlling a movement stroke of the transfer nozzle 53, the transfer mounting plate 51 is fixedly connected with the carrier substrate 11, the third driving member 54 and the fourth driving member 55 are both mounted on the transfer mounting plate 51, and the transfer nozzle 53 is mounted on the transfer turntable 52. In this embodiment, the transfer nozzles 53 are disposed in a plurality and circumferentially distributed around the transfer turntable 52, and the center of the receiving slot 3111 is located on the central axis of the transfer nozzles 53. The fourth driving member 55 drives the transfer suction nozzle 53 to move towards the rotating chuck 311, so that the transfer suction nozzle 53 contacts with the electronic components in the containing groove 3111 to suck the electronic components, and the third driving member 54 drives the transfer turntable 52 to rotate so as to transfer the electronic components on the transfer suction nozzle 53, thereby completing the transfer of the electronic components.
In order to ensure the yield of the electronic components, the transfer mechanism 5 is further provided with an image correction assembly 56 for detecting whether the electronic components are defective or not and a recovery cylinder 57 for collecting unqualified electronic components, the recovery cylinder 57 being located below the image correction assembly 56 and mounted on the transfer mounting plate 51. The transfer suction nozzle 53 sucks electronic components in Rong Liaocao 3111, the electronic components are transferred to the image correction assembly 56 through the transfer turntable 52 for image detection, the electronic components which are qualified in detection are transferred to the taping mechanism 6 for taping, and the electronic components which are unqualified in detection enter the recovery cylinder 57 for recovery.
Referring to fig. 8, the taping mechanism 6 includes a carrier tape rail 61, a taping assembly 62, a taping assembly 63, and a taping drive member, the taping assembly 63 is used for conveying a carrier tape, the carrier tape rail 61 is used for mounting a carrier tape, the taping drive member is used for driving a tape on the carrier tape rail 61 to move, and the taping assembly 62 is used for taping electronic components. The carrier rail 61 is mounted on the upper surface of the carrier substrate 11, the braid assembly 62 is mounted on the side wall of the carrier rail 61 and above the carrier rail 61, the tape placement assembly 63 is located on the side of the carrier rail 61, and the braid driving member is mounted on the carrier rail 61.
The carrier tape rail 61 has a feed end 611 for carrying the electronic components on the transfer nozzle 53 and a discharge end 612 for outputting the completed braid of the electronic components, the feed end 611 is in running fit with the transfer turntable 52, and a feed chute 613 for conveying the electronic components is provided on the upper surface of the carrier tape rail 61. In this embodiment, the tape placement module 63 is located at the discharge end 612 and the braid module 62 is located directly above the carrier tape track 61.
Referring to fig. 1 and 8, the tape-setting assembly 63 includes a material roll 631, a film roll 632, and a winding roll 633, the material roll 631 being used for placing a material tape, the film roll 632 being used for placing a packaging film, and the winding roll 633 being used for winding the material tape completed with the braiding. The material coil 631, the winding coil 633 and the film coil 632 are all installed on the frame, the material coil 631 and the film coil 632 are located on the upper end face of the substrate, and the winding coil 633 is located on the lower end face of the substrate.
The electronic components on the transfer suction nozzle 53 move to the feeding end 611 of the carrier tape rail 61, the electronic components are placed on the material tape in the material conveying groove 613, the tape driving piece drives the material tape roll 631 to drive, the electronic components move to the lower part of the tape assembly 62 along with the material tape, the tape assembly 62 carries out tape braiding operation on the electronic components, the packaging film is heat-sealed above the material tape, the electronic components are stored between the packaging film and the material tape, the tape is formed by the electronic components after tape completion, the material tape is discharged from the discharging end 612, and the tape is wound by the winding tape roll 633, so that the tape braiding of the electronic components is completed.
The implementation principle of the multi-pad electronic component test braid equipment provided by the embodiment of the application is as follows: the electronic components are orderly and directionally arranged on the feeding track 211 through the vibration disc 21, enter into the containing groove 3111 through the feeding track 211, and rotate through the first motor driving rotating chuck 311 so that a plurality of containing grooves 3111 are all fed. The rotating chuck 311 rotates to drive the electronic components in the plurality of material accommodating grooves 3111 to judge the directions of the electronic components through the pole measuring assembly 32, the directions of the electronic components are adjusted to be consistent through the reversing assembly 33, and the electronic components with consistent directions flow to the photoelectric parameter testing assembly 34; the second driving piece 344 drives the connecting rod 342 to rotate relative to the testing base 343, the connecting rod 342 drives the plurality of testing needles 341 to approach towards the direction of the chuck assembly 31, so that the plurality of testing needles 341 are contacted with bonding pads of the electronic component, and the other ends of the testing needles 341 are connected with external wires, so that the photoelectric parameter testing of the electronic component with the plurality of bonding pads is realized. Different types of electronic components are classified according to the electrical parameters, the electronic components with the largest quantity are sucked through the transfer suction nozzles 53, and the third driving piece 54 drives the transfer rotary table 52 to rotate so as to transfer the electronic components on the transfer suction nozzles 53 to the image correction component 56 for defect detection; the rest different types of electronic components enter through the feeding pipe 41, and the different types of electronic components are respectively loaded into the material collecting barrel 42 through the single-shaft loading assembly 43, so that the electronic components are classified. The image correction component 56 drives the transfer suction nozzle 53 to flow to the braiding mechanism 6 through the transfer turntable 52 for braiding the electronic components which are qualified in detection, and the electronic components which are unqualified in detection enter the recovery cylinder 57 for recovery.
The foregoing description of the preferred embodiments of the present application should not be construed as limiting the scope of the application, wherein like parts are designated by like reference numerals, and it should be noted that the terms "left", "right", "upper" and "lower" used in the description refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward or away from the geometric center of a particular part, respectively. Therefore: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.

Claims (7)

1. A multi-pad electronic component testing braid apparatus is characterized by comprising,
a frame (1), wherein the frame (1) is provided with a bedplate (12);
the feeding mechanism (2) is arranged on the frame (1) and is used for conveying electronic components;
the test mechanism (3) is used for carrying out photoelectric test on the electronic components, the test mechanism (3) is mounted on the platen (12), the test mechanism (3) comprises a chuck assembly (31) used for bearing the circulation of the electronic components at different stations and a photoelectric parameter test assembly (34) used for carrying out electric parameter test on the electronic components, the photoelectric parameter test assembly (34) comprises a test needle (341) used for being electrically connected with electronic component bonding pads, a connecting rod (342), a test base (343) and a second driving piece (344), the second driving piece (344) and the test base (343) are mounted on the platen (12), the test needle (341) is fixedly connected with the connecting rod (342), the connecting rod (342) is hinged with the test base (343), the second driving piece (344) drives the connecting rod (342) to drive the test needle (341) to be in contact with the electronic component bonding pads on the chuck assembly (31), the test needle (341) is provided with a plurality of test needles (341), and the test needles (341) are in one-to-one correspondence with the electronic component bonding pads.
The chuck assembly (31) comprises a rotating chuck (311), a first motor for driving the rotating chuck (311) to rotate and a fixed seat (313), wherein the fixed seat (313) is arranged on the bedplate (12), the output end of the first motor is fixedly connected with the rotating chuck (311), and the other end of the first motor is arranged on the fixed seat (313); the rotating chuck (311) is provided with a plurality of material accommodating grooves (3111) for accommodating electronic components;
the material distribution mechanism (4) is used for classifying according to the number of different electronic components, the material distribution mechanism (4) comprises a feeding pipe (41), a plurality of material collecting barrels (42) used for containing different types of electronic components and a single-shaft material loading assembly (43) used for loading the different electronic components into the material collecting barrels (42), the material collecting barrels (42) and the single-shaft material loading assembly (43) are both installed on the frame (1), the rotating chuck (311) is provided with a material distribution station (3112), and the feeding pipe (41) is installed on the material distribution station (3112);
the single-shaft charging assembly (43) comprises a charging installation frame (431), a charging head (432), a driving wheel (433), a driving belt (434) and a second motor (435) for driving the driving wheel (433) to rotate, wherein the driving wheel (433) is installed at the output end of the second motor (435) and is rotationally connected with the charging installation frame (431), the driving belt (434) is installed at the periphery of the driving wheel (433), the charging head (432) is fixedly connected with the driving belt (434), a plurality of charging barrels (42) are arranged side by side and located below the charging head (432), one end of the charging head (432) is communicated with the feeding pipe (41), and the other end of the charging head (432) is aligned with an opening of the charging barrel (42).
2. The multi-pad electronic component testing taping device according to claim 1, wherein the optoelectronic parameter testing assembly (34) further comprises a guiding block (345) for guiding the testing needle (341), the guiding block (345) is provided with a guiding groove (3451), two opposite side walls of the guiding groove (3451) are obliquely arranged, and extension lines of the two side walls converge towards the direction of the chuck assembly (31).
3. A multi-pad electronic component testing taping device according to claim 1, wherein the feeding mechanism (2) comprises a vibrating disc (21), the vibrating disc (21) is provided with a feeding track (211), and one end of the feeding track (211) is in butt joint with the Rong Liaocao (3111) so that the electronic component enters the receiving groove (3111).
4. The multi-pad electronic component testing taping device according to claim 1, wherein the feeding mechanism (2) further comprises a feeding separation assembly (22) for separating electronic components entering the Rong Liaocao (3111), the feeding separation assembly (22) comprises a separation mounting seat (221) mounted on the platen (12), a separation substrate (222) for bearing the electronic components, a separation thimble (223) for separating the electronic components, and a first driving member (224) for driving the separation thimble (223) to lift, the separation substrate (222) is provided with a separation through hole (2221), and the separation thimble (223) is arranged between two adjacent electronic components in a penetrating way.
5. The multi-pad electronic component testing braid device of claim 4, wherein the feeding separation assembly (22) further comprises an air tap (225), the air tap (225) is mounted below the separation substrate (222), the separation substrate (222) is provided with a separation avoidance groove (2222) for avoiding the rotation chuck (311) and an air passage through hole (2223) for allowing air to pass through, one end of the air tap (225) is communicated with the air passage through hole (2223), and the other end of the air tap (225) is connected with an external air inlet pump.
6. The multi-pad electronic component testing braid apparatus of claim 1, further comprising a transfer mechanism (5), wherein the transfer mechanism (5) comprises a transfer mounting plate (51), a transfer turntable (52), a transfer suction nozzle (53), a third driving member (54) for driving the transfer turntable (52) to rotate, and a fourth driving member (55) for controlling the movement stroke of the transfer suction nozzle (53), the transfer mounting plate (51) is fixedly connected with the frame (1), the third driving member (54) and the fourth driving member (55) are both mounted on the frame (1), and the transfer suction nozzle (53) is mounted on the transfer turntable (52).
7. A multi-pad electronic component testing taping device according to claim 6, further comprising a taping mechanism (6), the taping mechanism (6) comprising a carrier tape track (61), a taping assembly (62) for taping electronic components to a feed tape, a tape placement assembly (63) for transporting a tape, and a taping drive for driving tape movement on the carrier tape track (61), the carrier tape track (61) being mounted to the frame (1), the taping assembly (62) being located above the carrier tape track (61) and being arranged in correspondence to the carrier tape track (61); the carrier band track (61) is provided with a feeding end (611) for carrying the electronic components on the transfer suction nozzle (53) and a discharging end (612) for outputting finished electronic component braids, and the feeding end (611) is rotationally connected with the transfer turntable (52).
CN202210886183.6A 2022-07-26 2022-07-26 Multi-pad electronic component testing braid equipment Active CN115196111B (en)

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CN117433886B (en) * 2023-12-13 2024-03-22 苏州华兴源创科技股份有限公司 Braid peeling force testing device and braid peeling force testing method

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CN203740667U (en) * 2014-03-12 2014-07-30 何选民 Feeding structure for LED light splitting machine or tape loading machine
CN206494163U (en) * 2016-11-03 2017-09-15 深圳市炫硕光电科技有限公司 Enter material separating device and enter the braider of material separating device provided with this
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