TW201519343A - Multi-track feeding rotary type crystal grain detection device - Google Patents

Multi-track feeding rotary type crystal grain detection device Download PDF

Info

Publication number
TW201519343A
TW201519343A TW102140813A TW102140813A TW201519343A TW 201519343 A TW201519343 A TW 201519343A TW 102140813 A TW102140813 A TW 102140813A TW 102140813 A TW102140813 A TW 102140813A TW 201519343 A TW201519343 A TW 201519343A
Authority
TW
Taiwan
Prior art keywords
feeding
die
track
rotary
turret
Prior art date
Application number
TW102140813A
Other languages
Chinese (zh)
Inventor
De-Kun Huang
Original Assignee
Think Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Think Technologies Ltd filed Critical Think Technologies Ltd
Priority to TW102140813A priority Critical patent/TW201519343A/en
Priority to CN201420076728.8U priority patent/CN203787390U/en
Priority to CN201410059941.2A priority patent/CN104637840A/en
Publication of TW201519343A publication Critical patent/TW201519343A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations

Abstract

The present invention relates to a multi-track feeding rotary type crystal grain detection device, mainly comprising a rotating turret, a plurality of crystal grain taking and putting devices, a plurality of feeding devices, a plurality of detecting stations and a plurality of classification stations. The plurality of crystal grain taking and putting devices are circularly arranged on the rotating turret at an equal interval. The plurality of feeding devices, the plurality of detecting stations, and the plurality of classification stations are circularly arranged along the radial extension direction of the rotating turret at an equal interval. After the crystal grain taking and putting devices take crystal grains from the feeding devices, the rotating turret rotates and transfers the crystal grains to the detecting stations for detection, then the rotating turret rotates and transfers the crystal grains to the classification stations and places the crystal grains, and the classification stations classify the crystal grains. Accordingly, the present invention employs a multi-track feeding and rotation feeding transference mode simultaneously, so as to detect and classify the crystal grains one by one, thereby being a high-efficiency continuous detection and classification technology.

Description

多軌進料之旋轉式晶粒檢測設備 Rotary grain detecting device for multi-track feeding

本發明係關於一種多軌進料之旋轉式晶粒檢測設備,尤指一種適用於檢測半導體晶粒之檢測設備。 The invention relates to a rotary grain detecting device for multi-track feeding, in particular to a detecting device suitable for detecting semiconductor crystal grains.

半導體晶粒在製造過程中通常會經過二次的檢測,一是半成品檢測,另一是成品檢測。其中,半成品檢測通常針對完成基本半導體製程後之晶粒,其主要目的在於先行篩檢過濾瑕疵晶粒,以免瑕疵晶粒流入後續包括黏晶(die mount)、打線(wire bond)、封膠(mold)、以及印字(mark)等製程,造成成本上無謂之耗費,並且影響良率。 Semiconductor dies are usually subjected to secondary inspection during the manufacturing process, one for semi-finished products and the other for finished product inspection. Among them, the semi-finished product inspection is usually aimed at the die after the completion of the basic semiconductor process, and its main purpose is to first screen and filter the germanium crystal grains so as to avoid the inflow of germanium crystal grains, including die mount, wire bond, and sealant ( Mold), as well as printing and other processes, cause unnecessary cost and affect the yield.

習知之晶粒檢測設備可參考中華民國公告第M439261號專利。亦即,如第1圖所示,其揭露一種V型旋臂90,每一個旋臂各裝設有一取放裝置91、92。當其中一取放裝置91在進給裝置93吸取晶粒後,便移到進給裝置93一側之探針座94上進行測試。此時,另一取放裝置91則回到進給裝置93上吸取次一個晶粒,據此V型旋臂90不斷地往復擺轉進給及測試。此外,當取放裝置91上的晶粒測試完成後,便直接使完測晶粒掉落於下方之分料裝置(圖中未示出),以對該完測晶粒進行分類。 The conventional grain detecting equipment can refer to the Patent No. M439261 of the Republic of China. That is, as shown in Fig. 1, a V-shaped spiral arm 90 is disclosed, each of which is provided with a pick-and-place device 91, 92. When one of the pick-and-place devices 91 picks up the die at the feed device 93, it moves to the probe holder 94 on the side of the feed device 93 for testing. At this time, another pick-and-place device 91 returns to the feeding device 93 to pick up the next die, whereby the V-shaped arm 90 continuously reciprocates the feed and test. In addition, when the die test on the pick-and-place device 91 is completed, the finished die is directly dropped to the lower dosing device (not shown) to classify the finished die.

據此,習知晶粒檢測設備以上述循環擺轉之 方式來進行測試,雖然其不論測試之準確率、或測試效率都已經達到相當穩定之程度。但是,當面臨更高測試速度之需求之下,習知晶粒檢測設備已面臨瓶頸,已無法再明顯提升。 Accordingly, the conventional crystal grain detecting apparatus is circulated in the above cycle. The way to test, although it has reached a fairly stable level regardless of the accuracy of the test, or the efficiency of the test. However, when faced with the need for higher test speeds, the conventional die inspection equipment has faced bottlenecks and can no longer be significantly improved.

有鑑於此,一種可大幅提高檢測速度,又具備彈性擴充功能之晶粒檢測設備,實在是目前產業上的一種迫切需要。 In view of this, a die inspection device capable of greatly improving the detection speed and having an elastic expansion function is an urgent need in the industry.

本發明之主要目的係在提供一種多軌進料之旋轉式晶粒檢測設備,俾能多軌晶粒同時進料、同時移載晶粒、同時測試晶粒、以及同時分類晶粒,且每一旋轉移載之角度相同,可顯著地縮短移載時間,相較於習知晶粒檢測設備,能以數倍的方式,大幅提升檢測速度,且更為彈性,可視實際需求任意擴充或變更各種測試功能。 The main object of the present invention is to provide a multi-track feed rotary crystal grain detecting apparatus capable of simultaneously feeding multi-track crystal grains, simultaneously transferring crystal grains, simultaneously testing crystal grains, and simultaneously classifying crystal grains, and each The same angle of rotation transfer can significantly shorten the transfer time. Compared with the conventional grain inspection equipment, the detection speed can be greatly improved in several times, and it is more flexible. Any test can be expanded or changed according to actual needs. Features.

為達成上述目的,本發明一種多軌進料之旋轉式晶粒檢測設備,主要包括一轉動架、複數晶粒取放裝置、複數進料裝置、複數檢測站、以及複數分類站。其中,轉動架包括一中心軸,而轉動架沿著中心軸旋轉;複數晶粒取放裝置等距地環設於轉動架上;複數進料裝置等距地環設於該轉動架之徑向延伸方向上,且每一進料裝置鄰近轉動架之一側包括一晶粒拾取區;複數檢測站與複數分類站也等距地環設於轉動架之徑向延伸方向上。其中,複數晶粒取放裝置係分別至複數進料裝置之晶粒拾取區上取得一晶粒後,轉動架旋轉而複數晶粒 取放裝置移載晶粒至複數檢測站進行測試,接著轉動架又旋轉而複數晶粒取放裝置移載晶粒至複數分類站放置晶粒,而複數分類站對晶粒分類。 To achieve the above object, a multi-track feed rotary crystal grain detecting apparatus of the present invention mainly comprises a turret, a plurality of die pick-and-place devices, a plurality of feeding devices, a plurality of detecting stations, and a plurality of sorting stations. Wherein, the turret includes a central shaft, and the turret rotates along the central axis; the plurality of die pick-and-place devices are equidistantly disposed on the turret; the plurality of feeding devices are equidistantly disposed in the radial direction of the turret In the extending direction, each feeding device includes a die picking area adjacent to one side of the turret; the plurality of detecting stations and the plurality of sorting stations are also equidistantly disposed in a radial extending direction of the turret. Wherein, the plurality of die pick-and-place devices respectively obtain a grain on the die pick-up area of the plurality of feeding devices, and the turret rotates to form a plurality of grains The pick-and-place device transfers the die to a plurality of detection stations for testing, and then the turret rotates and the plurality of die pick-and-place devices transfer the die to the plurality of sorting stations to place the grains, and the plurality of sorting stations classify the grains.

據此,本發明所提供之多軌進料之旋轉式晶粒檢測設備可利用一轉動架以不斷地旋轉進給移載的方式,逐一地將晶粒由進料裝置搬運至檢測站進行測試,當測試完畢又將晶粒搬運至分類站進行分類,實為一高效率之連續檢測、及分類技術。此外,本發明又以同時多軌進料的方式,大幅提高了測試產能。 Accordingly, the multi-track feed rotary crystal grain detecting apparatus provided by the present invention can utilize a turret to continuously rotate the feed transfer mode, and transport the crystal grains from the feeding device to the inspection station one by one for testing. When the test is completed and the die is transported to the sorting station for classification, it is a high-efficiency continuous detection and classification technology. In addition, the present invention greatly increases the test throughput by means of simultaneous multi-track feeding.

較佳的是,本發明之複數進料裝置包括一第一進料裝置、及一第二進料裝置,其遙遙相對地設置於轉動架之相對應二側。換言之,本發明可以採取雙軌進料的方式,而該二進料裝置間的夾角可為180度,據此相較於習知之單軌進給測試之方式本發明可提高兩倍以上之測試產能,且體積上也不致增加太多。不過,本發明不以雙軌進料方式為限,亦可為三軌進料、四軌進料、或其他之多軌進料,其中三軌進料方式時二相鄰之進料裝置間的夾角可為120度,四軌進料方式時二相鄰之進料裝置間的夾角可為90度。 Preferably, the plurality of feeding devices of the present invention comprise a first feeding device and a second feeding device which are disposed opposite each other on opposite sides of the turret. In other words, the present invention can adopt a dual-track feeding mode, and the angle between the two feeding devices can be 180 degrees, whereby the present invention can increase the test capacity by more than twice as compared with the conventional single-track feeding test. And the volume does not increase too much. However, the present invention is not limited to the dual-track feeding mode, and may also be a three-track feeding, a four-track feeding, or other multi-track feeding, wherein the three-track feeding mode is between two adjacent feeding devices. The angle can be 120 degrees, and the angle between two adjacent feeding devices can be 90 degrees in the four-track feeding mode.

再者,本發明之每一進料裝置可包括一震動餵料盤、一進料軌道、及一迴料軌道,而震動餵料盤可包括一餵料口,其係連通至進料軌道,且晶粒拾取區可位於進料軌道上與震動餵料盤遙遙相對之一側,另外迴料軌道可設置於進料軌道下方,並用以承接自進料軌道掉落之晶粒。 Furthermore, each of the feeding devices of the present invention may include a vibrating feed tray, a feed rail, and a return rail, and the vibrating feed tray may include a feed port that communicates with the feed rail. And the die picking area may be located on one side of the feeding track remotely from the vibration feeding tray, and the returning track may be disposed under the feeding track and used to receive the die falling from the feeding track.

此外,本發明之每一檢測站可包括一探針座、及至少一探針,而至少一探針之一側可固定於探針座,另一側可自探針座之側端凸伸露出;其中,複數晶粒取放裝置係移載晶粒至該至少一探針上方並電性接觸該至少一探針。另外,本發明之每一晶粒取放裝置可包括一吸嘴、及一升降機構,而升降機構可組設於轉動架上並驅使吸嘴上升或下降。 In addition, each detecting station of the present invention may include a probe holder and at least one probe, and one side of the at least one probe may be fixed to the probe holder, and the other side may protrude from the side end of the probe holder. Exposed; wherein the plurality of die pick-and-place devices transfer the die to the top of the at least one probe and electrically contact the at least one probe. In addition, each of the die pick-and-place devices of the present invention may include a nozzle and a lifting mechanism, and the lifting mechanism may be assembled on the turret to drive the nozzle up or down.

再且,本發明之每一分類站可包括一旋轉分料管、以及複數容倉,旋轉分料管可包括一入料口、一出料口,而入料口可連通至旋轉分料管之出料口,且旋轉分料管可旋轉並使出料口對準於複數容倉其中之一;其中複數晶粒取放裝置旋轉移載晶粒至入料口並放置晶粒。另外,本發明之每一分類站可更包括一轉動驅動器,其係連接並驅動旋轉分料管旋轉。 Moreover, each of the sorting stations of the present invention may include a rotating dispensing tube and a plurality of receiving compartments, the rotating dispensing tube may include an inlet opening and a discharge opening, and the inlet opening may be connected to the rotating dispensing tube The discharge port, and the rotating branch pipe is rotatable and the discharge port is aligned with one of the plurality of storage bins; wherein the plurality of die pick-and-place devices rotate the transfer die to the inlet port and place the die. Additionally, each of the sorting stations of the present invention may further include a rotary drive that couples and drives the rotary splitter tube to rotate.

又,本發明之複數檢測站可包括複數第一檢測站、及複數第二檢測站,而複數進料裝置、複數第一檢測站、複數第二檢測站、及複數分類站可分別依序地佈設於轉動架之徑向延伸的環週方向上。而且,本發明之轉動架可沿著中心軸朝同一旋轉方向步進式地旋轉。 Moreover, the complex detection station of the present invention may include a plurality of first detection stations and a plurality of second detection stations, and the plurality of feeding devices, the plurality of first detecting stations, the plurality of second detecting stations, and the plurality of sorting stations may be sequentially The arrangement is arranged in a circumferential direction of the radial extension of the turret. Moreover, the turret of the present invention can be rotated stepwise in the same direction of rotation along the central axis.

〔習知〕 [study]

90‧‧‧V型旋臂 90‧‧‧V-type arm

91、92‧‧‧取放裝置 91, 92‧‧‧ pick and place device

93‧‧‧進給裝置 93‧‧‧Feeding device

94‧‧‧探針座 94‧‧‧ probe holder

〔本創作〕 [this creation]

2‧‧‧轉動架 2‧‧‧ turret

21‧‧‧中心軸 21‧‧‧ center axis

3‧‧‧晶粒取放裝置 3‧‧‧Grad pick and place device

31‧‧‧吸嘴 31‧‧‧ nozzle

32‧‧‧升降機構 32‧‧‧ Lifting mechanism

4‧‧‧進料裝置 4‧‧‧Feeding device

41‧‧‧第一進料裝置 41‧‧‧First feeding device

42‧‧‧第二進料裝置 42‧‧‧Second feeding device

43‧‧‧震動餵料盤 43‧‧‧Vibration feeding tray

431‧‧‧餵料口 431‧‧‧ Feeding port

44‧‧‧進料軌道 44‧‧‧Feed track

45‧‧‧迴料軌道 45‧‧‧Return track

40‧‧‧晶粒拾取區 40‧‧‧Grad picking area

5‧‧‧檢測站 5‧‧‧Checkpoint

51‧‧‧探針座 51‧‧‧ probe holder

52‧‧‧探針 52‧‧‧ probe

53‧‧‧第一檢測站 53‧‧‧First test station

54‧‧‧第二檢測站 54‧‧‧Second test station

6‧‧‧分類站 6‧‧‧ sorting station

61‧‧‧入料口 61‧‧‧Inlet

62‧‧‧旋轉分料管 62‧‧‧Rotating distributor

621‧‧‧出料口 621‧‧‧Outlet

63‧‧‧容倉 63‧‧‧ 容仓

64‧‧‧轉動驅動器 64‧‧‧Rotating drive

第1圖係習知晶粒檢測設備。 Figure 1 is a conventional grain inspection apparatus.

第2圖係本發明第一實施例之俯視示意圖。 Figure 2 is a top plan view of a first embodiment of the present invention.

第3圖係本發明第一實施例之俯視局部放大圖。 Fig. 3 is a partially enlarged plan view showing the first embodiment of the present invention.

第4圖係本發明第一實施例之進料裝置之晶粒拾取 區的側視圖。 Figure 4 is a die pick-up of the feeding device of the first embodiment of the present invention. Side view of the district.

第5圖係本發明第一實施例之檢測站的側視圖。 Fig. 5 is a side view of the detecting station of the first embodiment of the present invention.

第6圖係本發明第一實施例之分類站的側視圖。 Figure 6 is a side view of the sorting station of the first embodiment of the present invention.

第7圖係本發明第二實施例之俯視示意圖。 Figure 7 is a top plan view of a second embodiment of the present invention.

第8圖係本發明第三實施例之俯視示意圖。 Figure 8 is a top plan view showing a third embodiment of the present invention.

本發明多軌進料之旋轉式晶粒檢測設備在本實施例中被詳細描述之前,要特別注意的是,以下的說明中,類似的元件將以相同的元件符號來表示。 Prior to the detailed description of the multi-track feed rotary die inspection apparatus of the present invention, in the following description, like elements will be denoted by the same reference numerals.

以下本發明之第一實施例係以雙軌進料方式進行說明,請同時參閱第2圖、及第3圖,第2圖係本發明第一實施例之俯視示意圖,第3圖係本發明第一實施例之俯視局部放大圖。 The following first embodiment of the present invention is described in a two-track feeding manner. Please refer to FIG. 2 and FIG. 3 simultaneously. FIG. 2 is a top plan view of the first embodiment of the present invention, and FIG. 3 is a first embodiment of the present invention. A partially enlarged view of an embodiment.

圖中顯示有一轉動架2,其包括一中心軸21,且轉動架2沿著中心軸21旋轉。在本實施例中,轉動架2是受一致動器(圖中未示)驅動而沿著中心軸21朝同一旋轉方向步進式地旋轉。再者,二組晶粒取放裝置3包括一第一進料裝置41、及一第二進料裝置42,其等距地環設於轉動架2之徑向延伸方向上,也就是以180度夾角的方式遙遙相對地設置於轉動架2外之相對應二側。 The figure shows a turret 2 comprising a central shaft 21 and the turret 2 is rotated along a central axis 21. In the present embodiment, the turret 2 is driven to rotate stepwise in the same rotational direction along the central axis 21 by an actuator (not shown). Furthermore, the two sets of die pick-and-place devices 3 include a first feeding device 41 and a second feeding device 42 which are equidistantly arranged in the radial direction of the turret 2, that is, 180. The angle of the angle is relatively oppositely disposed on the corresponding two sides outside the turret 2.

在本實施例中,每一進料裝置4包括一震動餵料盤43、一進料軌道44、及一迴料軌道45,而震動餵料盤43包括一餵料口431,其係連通至進料軌道44。而且,進料軌道44鄰近轉動架2之一側包括一晶粒拾取區40,亦即晶粒拾取區40係位於進料軌道44上與震動餵料盤43遙 遙相對之一側。至於迴料軌道45,其係設置於進料軌道44下方,用以承接自進料軌道44掉落之晶粒C。 In the present embodiment, each feeding device 4 includes a vibration feeding tray 43, a feeding rail 44, and a return rail 45, and the vibration feeding tray 43 includes a feeding port 431 which is connected to Feed rail 44. Moreover, the feed rail 44 includes a die picking area 40 adjacent one side of the turret 2, that is, the die picking area 40 is located on the feed rail 44 and the vibrating feed tray 43 One side of the opposite side. As for the return rail 45, it is disposed below the feed rail 44 for receiving the die C dropped from the feed rail 44.

請再一併參閱第4圖,第4圖係本發明第一實施例之進料裝置4之晶粒拾取區40的側視圖。其中,在轉動架2上等距地環設有八組晶粒取放裝置3。如第4圖所示,在本實施例中,每一晶粒取放裝置3包括一吸嘴31、及一升降機構32,而升降機構32係組設於轉動架2上並可驅使吸嘴31上升或下降。 Referring to Fig. 4 again, Fig. 4 is a side view of the die picking area 40 of the feeding device 4 of the first embodiment of the present invention. Among them, eight sets of die pick-and-place devices 3 are equidistantly arranged on the turret 2. As shown in FIG. 4, in the present embodiment, each of the die pick-and-place devices 3 includes a nozzle 31 and a lifting mechanism 32, and the lifting mechanism 32 is assembled on the turret 2 and can drive the nozzle. 31 rises or falls.

請再一併參閱第5圖,第5圖係本發明第一實施例之檢測站5的側視圖。如第2圖中示,本實施例之檢測站5包括二個第一檢測站53、及二個第二檢測站54,而該等檢測站是分別依序地佈設於轉動架2之徑向延伸的環週方向上,且位於進料軌道44之一側。其中,第一檢測站53、及第二檢測站54分別對晶粒C進行二種不同的測試。不過,本發明並不以此為限,亦可為單一檢測站或其他多個檢測站之形式。此外,在本實施例中,每一檢測站5包括一探針座51、二根探針52,而二根探針52之一側係固定於探針座51,另一側係自探針座51之側端凸伸露出。其中,探針52係用以電性接觸晶粒C,並對晶粒C進行測試。 Referring to Fig. 5 again, Fig. 5 is a side view of the detecting station 5 of the first embodiment of the present invention. As shown in FIG. 2, the detecting station 5 of the present embodiment includes two first detecting stations 53 and two second detecting stations 54, and the detecting stations are sequentially arranged in the radial direction of the turret 2, respectively. It extends in the circumferential direction and is located on one side of the feed rail 44. The first detecting station 53 and the second detecting station 54 perform two different tests on the die C, respectively. However, the invention is not limited thereto, and may be in the form of a single detection station or other multiple detection stations. In addition, in this embodiment, each detecting station 5 includes a probe base 51 and two probes 52, and one side of the two probes 52 is fixed to the probe base 51, and the other side is self-probe. The side end of the seat 51 is convexly exposed. The probe 52 is used to electrically contact the die C and test the die C.

請再一併參閱第6圖,第6圖係本發明第一實施例之分類站6的側視圖。如第2圖中示,二分類站6等距地環設於轉動架2之徑向延伸方向上,且位於第二檢測站54之一側。在本實施例中,每一分類站6包括一旋轉分料管62、一轉動驅動器64、以及五個容倉63,且旋轉分料 管62包括一入料口61、一出料口621。其中,入料口61係連通至旋轉分料管62之出料口621,而轉動驅動器64係連接並驅動旋轉分料管62旋轉,且五個容倉63分別為不同等級之晶粒C所放置之處。換言之,本實施例之分類站6可透過轉動驅動器64驅動旋轉分料管62旋轉並使出料口621對準於五個容倉63其中之一,以對晶粒C進行分類。 Referring again to Fig. 6, Fig. 6 is a side view of the sorting station 6 of the first embodiment of the present invention. As shown in FIG. 2, the two sorting stations 6 are equidistantly disposed in the radial extension direction of the turret 2 and on one side of the second detecting station 54. In the present embodiment, each sorting station 6 includes a rotary branching tube 62, a rotary drive 64, and five receiving compartments 63, and the rotating material is divided. The tube 62 includes a feed port 61 and a discharge port 621. The inlet port 61 is connected to the discharge port 621 of the rotary branch pipe 62, and the rotary drive 64 is connected to drive the rotary branch pipe 62 to rotate, and the five storage bins 63 are respectively different grades of the crystal C. Placed. In other words, the sorting station 6 of the present embodiment can drive the rotary splitter 62 to rotate through the rotary drive 64 and align the discharge port 621 with one of the five receptacles 63 to classify the crystal grains C.

本實施例之多軌進料之旋轉式晶粒檢測設備實際作動方式說明如下,首先二晶粒取放裝置3係分別至二側之進料裝置4之晶粒拾取區40上分別取得一晶粒C後。接著,轉動架2逆時針旋轉而二晶粒取放裝置3分別移載待測試之晶粒C至二個第一檢測站53,以進行第一階段的測試。待第一檢測站53檢測完畢後,轉動架2又再次逆時針旋轉將晶粒C移載到第二檢測站54,以進行第二階段的測試。 The actual operation mode of the multi-track feed rotary crystal grain detecting apparatus of the present embodiment is as follows. First, the two-grain pick-and-place device 3 respectively obtains a crystal on the die pick-up area 40 of the feeding device 4 on the two sides. After the grain C. Next, the turret 2 rotates counterclockwise and the two-grain pick-and-place device 3 respectively transfers the die C to be tested to the two first detecting stations 53 for the first stage of testing. After the detection by the first detecting station 53 is completed, the turret 2 is again rotated counterclockwise to transfer the die C to the second detecting station 54 for the second stage of testing.

於此值得特別說明的是,於第一檢測站53與第二檢測站54進行測試時,晶粒取放裝置3始終吸取著晶粒C。待第二檢測站54檢測完畢後,轉動架2再次逆時針旋轉,晶粒取放裝置3便將測完的晶粒C移載至分類站6之入料口61上方,並使其掉落進入該入料口61,由旋轉分料管62對該晶粒C僅行分類,使其落入對應的容倉63內。其中,在本實施例中,當第二檢測站54一旦測試完畢,其檢測結果便隨即傳送至分類站6,故等到晶粒取放裝置3將測完的晶粒C移載至分類站6之入料口61時,旋轉分料管62之出料口621也已經對準對應之容倉63了,等待 晶粒C落下了。據此,本實施例之晶粒取放裝置3在分類站6並無閒置之等待時間,一旦放置晶粒C可隨即進行下一步驟之取放任務。 It should be particularly noted that when the first detecting station 53 and the second detecting station 54 are tested, the die pick-and-place device 3 always sucks the crystal grains C. After the detection by the second detecting station 54 is completed, the turret 2 rotates counterclockwise again, and the die pick-and-place device 3 transfers the measured die C to the loading port 61 of the sorting station 6 and drops it. The inlet port 61 is entered, and the crystal grains C are sorted by the rotary dividing pipe 62 so as to fall into the corresponding receiving compartments 63. In this embodiment, when the second detection station 54 is tested, the detection result is immediately transmitted to the sorting station 6, so that the die pick-and-place device 3 transfers the measured die C to the sorting station 6 When the feed port 61 is opened, the discharge port 621 of the rotary branch pipe 62 has also been aligned with the corresponding container 63, waiting The grain C has fallen. Accordingly, the die pick-and-place device 3 of the present embodiment does not have an idle waiting time at the sorting station 6, and once the die C is placed, the pick-and-drop task of the next step can be performed.

然而,本發明並不以第一實施例之雙軌進料為限,亦可三軌進料、四軌進料、或其他更多軌之進料方式。如第7圖所示之第二實施例,其為三軌進料之實施型態,其中二相鄰之進料裝置4間的夾角為120度,以此方式配置測試產能可提高三倍以上。另外,如第8圖所示為一四軌進料方式,其中二相鄰之進料裝置4間的夾角為90度,以此方式配置則測試產能可提高四倍以上。 However, the present invention is not limited to the dual rail feed of the first embodiment, and may also be a three rail feed, a four rail feed, or other more rail feed modes. The second embodiment shown in FIG. 7 is an embodiment of the three-track feed, wherein the angle between the two adjacent feeding devices 4 is 120 degrees, and the test capacity can be increased by more than three times in this manner. . In addition, as shown in Fig. 8, a four-track feeding mode in which the angle between two adjacent feeding devices 4 is 90 degrees, the test capacity can be increased by more than four times in this manner.

上述實施例僅係為了方便說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。 The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

2‧‧‧轉動架 2‧‧‧ turret

21‧‧‧中心軸 21‧‧‧ center axis

3‧‧‧晶粒取放裝置 3‧‧‧Grad pick and place device

4‧‧‧進料裝置 4‧‧‧Feeding device

41‧‧‧第一進料裝置 41‧‧‧First feeding device

42‧‧‧第二進料裝置 42‧‧‧Second feeding device

43‧‧‧震動餵料盤 43‧‧‧Vibration feeding tray

431‧‧‧餵料口 431‧‧‧ Feeding port

44‧‧‧進料軌道 44‧‧‧Feed track

45‧‧‧迴料軌道 45‧‧‧Return track

5‧‧‧檢測站 5‧‧‧Checkpoint

53‧‧‧第一檢測站 53‧‧‧First test station

54‧‧‧第二檢測站 54‧‧‧Second test station

6‧‧‧分類站 6‧‧‧ sorting station

Claims (10)

一種多軌進料之旋轉式晶粒檢測設備,包括:一轉動架,其包括一中心軸,該轉動架沿著該中心軸旋轉;複數晶粒取放裝置,其等距地環設於該轉動架上;複數進料裝置,其等距地環設於該轉動架之徑向延伸方向上,每一進料裝置鄰近該轉動架之一側包括一晶粒拾取區;複數檢測站,其等距地環設於該轉動架之徑向延伸方向上;以及複數分類站,其等距地環設於該轉動架之徑向延伸方向上;其中,該複數晶粒取放裝置係分別至該複數進料裝置之該晶粒拾取區上取得晶粒後,該轉動架旋轉而該複數晶粒取放裝置移載該晶粒至該複數檢測站進行測試,該轉動架又旋轉,而該複數晶粒取放裝置移載該晶粒至該複數分類站,放置該晶粒,該複數分類站對該晶粒分類。 A multi-track feed rotary crystal grain detecting apparatus comprising: a turret comprising a central shaft, the turret rotating along the central axis; a plurality of die pick-and-place devices equidistantly disposed at the a plurality of feeding devices equidistantly disposed in a radial extension direction of the turret, each feeding device including a die picking area adjacent to one side of the turret; a plurality of detecting stations, Is equidistantly disposed in a radial extension direction of the turret; and a plurality of sorting stations are equidistantly disposed in a radial extension direction of the turret; wherein the plurality of dies are respectively attached to the gantry After the die is obtained on the die pick-up area of the plurality of feeding devices, the turret rotates and the plurality of die pick-and-place devices transfer the die to the plurality of detecting stations for testing, and the turret rotates again. A plurality of die pick-and-place devices transfer the die to the complex sorting station, place the die, and the complex sorting station classifies the die. 如申請專利範圍第1項所述多軌進料之旋轉式晶粒檢測設備,其中,該複數進料裝置包括一第一進料裝置、及一第二進料裝置,於該轉動架外側相對地設置。 The multi-track feeding rotary crystal grain detecting apparatus according to claim 1, wherein the plurality of feeding devices comprise a first feeding device and a second feeding device, and the outer side of the rotating frame is opposite Ground setting. 如申請專利範圍第1項所述多軌進料之旋轉式晶粒檢測設備,其中,每一進料裝置包括一震動餵料盤、及一進料軌道,該震動餵料盤包括一餵料口,其係連通至該進料軌道,該晶粒拾取區係位於該進料軌道上與 該震動餵料盤相對之一側。 The rotary grain detecting device for multi-track feeding according to claim 1, wherein each feeding device comprises a vibration feeding tray and a feeding rail, and the vibration feeding tray comprises a feeding material. a port that is connected to the feed track, the die picking zone being located on the feed track and The vibrating feed tray is on one side. 如申請專利範圍第3項所述多軌進料之旋轉式晶粒檢測設備,其中,每一進料裝置更包括一迴料軌道,其係設置於該進料軌道下方,用以承接自該進料軌道掉落之該晶粒。 The rotary grain detecting device for multi-track feeding according to claim 3, wherein each feeding device further comprises a returning track disposed under the feeding track for receiving The grain falling from the feed track. 如申請專利範圍第1項所述多軌進料之旋轉式晶粒檢測設備,其中,每一檢測站包括一探針座、及至少一探針,該至少一探針之一側係固定於該探針座,另一側係自該探針座之側端凸伸露出;該複數晶粒取放裝置係移載該晶粒至該至少一探針上方並電性接觸該至少一探針。 The multi-track feeding rotary crystal grain detecting apparatus according to claim 1, wherein each detecting station comprises a probe holder and at least one probe, and one of the at least one probe is fixed to one side The probe holder has the other side protruding from the side end of the probe holder; the plurality of die pick-and-place devices transfer the die to the at least one probe and electrically contact the at least one probe . 如申請專利範圍第1項所述多軌進料之旋轉式晶粒檢測設備,其中,每一晶粒取放裝置包括一吸嘴、及一升降機構,該升降機構係組設於該轉動架上並驅使該吸嘴上升或下降。 The rotary die detecting device of the multi-track feeding method of claim 1, wherein each of the die pick-and-place devices comprises a nozzle and a lifting mechanism, and the lifting mechanism is assembled on the rotating frame And drive the nozzle up or down. 如申請專利範圍第1項所述多軌進料之旋轉式晶粒檢測設備,其中,每一分類站包括一旋轉分料管、以及複數容倉,該旋轉分料管包括一入料口、及一出料口,該入料口係連通至該旋轉分料管之該出料口,該旋轉分料管旋轉並使該出料口對準於該複數容倉其中之一;該複數晶粒取放裝置旋轉移載該晶粒至該入料口並放置該晶粒。 The rotary grain detecting device of the multi-track feeding according to claim 1, wherein each sorting station comprises a rotating branching pipe and a plurality of receiving bins, wherein the rotating branching pipe comprises an inlet port, And a discharge port, the inlet port is connected to the discharge port of the rotary branch pipe, the rotary branch pipe rotates and the discharge port is aligned with one of the plurality of storage bins; the plurality of crystals The pellet picking and placing device rotationally transfers the die to the inlet port and places the die. 如申請專利範圍第7項所述多軌進料之旋轉式晶粒檢測設備,其中,每一分類站更包括一轉動驅動器,其係連接並驅動該旋轉分料管旋轉。 The multi-track feed rotary die inspection apparatus of claim 7, wherein each sorting station further comprises a rotary drive that connects and drives the rotary splitter to rotate. 如申請專利範圍第1項所述多軌進料之旋轉式晶粒檢測設備,其中,該複數檢測站包括複數第一檢測站、及複數第二檢測站,該複數進料裝置、該複數第一檢測站、該複數第二檢測站、及該複數分類站係分別依序地佈設於該轉動架之徑向延伸的環週方向上。 The multi-track feeding rotary crystal grain detecting apparatus according to claim 1, wherein the plurality of detecting stations comprise a plurality of first detecting stations and a plurality of second detecting stations, the plurality of feeding devices, the plurality of feeding devices A detection station, the plurality of second detection stations, and the plurality of classification stations are sequentially disposed in a circumferential direction of the radial extension of the turret. 如申請專利範圍第1項所述多軌進料之旋轉式晶粒檢測設備,其中,該轉動架沿著該中心軸朝同一旋轉方向步進式地旋轉。 The multi-track feed rotary grain detecting apparatus according to claim 1, wherein the turret is stepwise rotated in the same rotational direction along the central axis.
TW102140813A 2013-11-11 2013-11-11 Multi-track feeding rotary type crystal grain detection device TW201519343A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW102140813A TW201519343A (en) 2013-11-11 2013-11-11 Multi-track feeding rotary type crystal grain detection device
CN201420076728.8U CN203787390U (en) 2013-11-11 2014-02-21 Rotary type crystal grain detection equipment with multi-rail feeding
CN201410059941.2A CN104637840A (en) 2013-11-11 2014-02-21 Rotary type crystal grain detection equipment with multi-rail feeding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102140813A TW201519343A (en) 2013-11-11 2013-11-11 Multi-track feeding rotary type crystal grain detection device

Publications (1)

Publication Number Publication Date
TW201519343A true TW201519343A (en) 2015-05-16

Family

ID=51323547

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102140813A TW201519343A (en) 2013-11-11 2013-11-11 Multi-track feeding rotary type crystal grain detection device

Country Status (2)

Country Link
CN (2) CN104637840A (en)
TW (1) TW201519343A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201519343A (en) * 2013-11-11 2015-05-16 Think Technologies Ltd Multi-track feeding rotary type crystal grain detection device
CN113363177A (en) * 2020-03-04 2021-09-07 均华精密工业股份有限公司 High-yield die bonding device
CN114944351A (en) * 2022-04-24 2022-08-26 济南鲁晶半导体有限公司 Semiconductor wafer chip classification device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1968876B (en) * 2004-04-13 2012-10-31 Tdk株式会社 Chip part conveyance device, appearance inspection device
KR100979721B1 (en) * 2008-12-04 2010-09-03 (주)에이피텍 Combined apparatus of vision inspection and sorting for semiconductor die
CN202075380U (en) * 2011-05-10 2011-12-14 久元电子股份有限公司 Light-emitting element detecting and classifying device
JP5815345B2 (en) * 2011-09-16 2015-11-17 ファスフォードテクノロジ株式会社 Die bonder and bonding method
CN103247562B (en) * 2013-05-17 2015-11-25 嘉兴景焱智能装备技术有限公司 Crystal grain rotary type tower fetching device
TW201519343A (en) * 2013-11-11 2015-05-16 Think Technologies Ltd Multi-track feeding rotary type crystal grain detection device

Also Published As

Publication number Publication date
CN203787390U (en) 2014-08-20
CN104637840A (en) 2015-05-20

Similar Documents

Publication Publication Date Title
TWI398393B (en) Transfer apparatus and method for handling electronic components
CN107533993B (en) High-speed rotary sorter
CN101804405B (en) Electronic device sorter comprising dual buffers
CN102921644B (en) Turret test selector
CN106981437A (en) Sorting characterization processes and its equipment for QFN BGA semiconductor chips
CN106451025A (en) Automatic multi-station carbon brush assembly machine
KR101264399B1 (en) Solar Cell Wafer Sorter
CN108212828B (en) Full-automatic battery inspection equipment
JP2012513324A (en) Mold tablet sorting and feeding device
KR101120938B1 (en) Handling system for inspecting and sorting electronic components
CN105689278B (en) IC appearance test devices
TW201519343A (en) Multi-track feeding rotary type crystal grain detection device
CN210010203U (en) Disc type visual detection mechanism
TWM479510U (en) Multitrack feeding rotation die testing apparatus
CN202893706U (en) Test sorter for minimal type semiconductor devices
TWI434799B (en) Classifying device for a chip tester
CN206148784U (en) Multistation carbon brush automatic assembly machine
CN206560991U (en) A kind of sensor automatic detecting machine
CN208245225U (en) A kind of acoustic pressure detects selection equipment automatically
TW201946856A (en) Substrate tilt conrol in high speed rotary sorter
US4146134A (en) Cold end for glass container production line
US3869042A (en) Inspecting and stacking machine for containers
WO2024001595A1 (en) Method for detecting appearance of dies after wafer dicing
CN115196111B (en) Multi-pad electronic component testing braid equipment
TWI778126B (en) Inspection and selection method of chip electronic components