CN115084182A - 半导体元件及其制造方法、半导体装置及显示面板 - Google Patents
半导体元件及其制造方法、半导体装置及显示面板 Download PDFInfo
- Publication number
- CN115084182A CN115084182A CN202210259482.7A CN202210259482A CN115084182A CN 115084182 A CN115084182 A CN 115084182A CN 202210259482 A CN202210259482 A CN 202210259482A CN 115084182 A CN115084182 A CN 115084182A
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- China
- Prior art keywords
- semiconductor
- metal element
- layer
- semiconductor layer
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
Landscapes
- Led Devices (AREA)
- Liquid Crystal (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/203,293 US11894489B2 (en) | 2021-03-16 | 2021-03-16 | Semiconductor device, semiconductor component and display panel including the same |
| US17/203,293 | 2021-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115084182A true CN115084182A (zh) | 2022-09-20 |
Family
ID=83114734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210259482.7A Pending CN115084182A (zh) | 2021-03-16 | 2022-03-16 | 半导体元件及其制造方法、半导体装置及显示面板 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11894489B2 (https=) |
| JP (1) | JP2022142782A (https=) |
| KR (1) | KR20220129490A (https=) |
| CN (1) | CN115084182A (https=) |
| DE (1) | DE102022105994A1 (https=) |
| TW (1) | TW202239017A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116130572A (zh) * | 2023-04-18 | 2023-05-16 | 江西兆驰半导体有限公司 | 发光二极管外延片及其制备方法、发光二极管 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115172557A (zh) * | 2022-08-03 | 2022-10-11 | 天津三安光电有限公司 | 发光二极管,发光二极管封装体和发光装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6586762B2 (en) * | 2000-07-07 | 2003-07-01 | Nichia Corporation | Nitride semiconductor device with improved lifetime and high output power |
| JP4581540B2 (ja) * | 2003-06-30 | 2010-11-17 | 日亜化学工業株式会社 | 半導体発光素子とそれを用いた発光装置 |
| JP5255759B2 (ja) * | 2005-11-14 | 2013-08-07 | パロ・アルト・リサーチ・センター・インコーポレーテッド | 半導体デバイス用超格子歪緩衝層 |
| JP2008034822A (ja) * | 2006-06-28 | 2008-02-14 | Nichia Chem Ind Ltd | 半導体発光素子 |
| TWI378573B (en) * | 2007-10-31 | 2012-12-01 | Young Lighting Technology Corp | Light emitting diode package |
| KR101221281B1 (ko) * | 2008-03-13 | 2013-01-11 | 쇼와 덴코 가부시키가이샤 | 반도체 발광 소자 및 그 제조 방법 |
| JP5334601B2 (ja) * | 2009-01-21 | 2013-11-06 | 株式会社東芝 | 半導体発光ダイオード素子及び半導体発光装置 |
| US8592847B2 (en) | 2011-04-15 | 2013-11-26 | Epistar Corporation | Light-emitting device |
| KR20140146467A (ko) | 2013-06-17 | 2014-12-26 | 한국전자통신연구원 | 발광 다이오드 및 그 제조 방법 |
| KR102512027B1 (ko) * | 2016-03-08 | 2023-03-21 | 엘지이노텍 주식회사 | 반도체 소자, 표시패널, 표시장치 및 표시패널 제조방법 |
| KR101763072B1 (ko) * | 2016-06-09 | 2017-08-04 | 고려대학교 산학협력단 | 광 추출 효율 및 전류 주입 효율 개선을 위한 led 소자 |
| CN108336194A (zh) * | 2018-01-11 | 2018-07-27 | 太原理工大学 | 一种led电极的制备方法 |
| KR102552655B1 (ko) | 2018-08-10 | 2023-07-06 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 패키지 및 광원 모듈 |
| KR102616245B1 (ko) * | 2018-10-05 | 2023-12-21 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| JP7603260B2 (ja) * | 2019-03-29 | 2024-12-20 | パナソニックIpマネジメント株式会社 | 光デバイス、光電変換装置、および燃料生成装置 |
| US11152540B2 (en) * | 2019-07-29 | 2021-10-19 | Lextar Electronics Corporation | Light emitting diode structure and method of manufacturing thereof |
| TWI715437B (zh) | 2020-02-12 | 2021-01-01 | 光鋐科技股份有限公司 | 紫外光發光二極體及其製造方法 |
| CN115315820A (zh) * | 2020-03-20 | 2022-11-08 | 传感器电子技术股份有限公司 | 光学损失减少的光电子器件 |
-
2021
- 2021-03-16 US US17/203,293 patent/US11894489B2/en active Active
-
2022
- 2022-03-15 DE DE102022105994.4A patent/DE102022105994A1/de active Pending
- 2022-03-16 CN CN202210259482.7A patent/CN115084182A/zh active Pending
- 2022-03-16 TW TW111109542A patent/TW202239017A/zh unknown
- 2022-03-16 KR KR1020220032791A patent/KR20220129490A/ko active Pending
- 2022-03-16 JP JP2022040869A patent/JP2022142782A/ja active Pending
-
2023
- 2023-12-26 US US18/396,320 patent/US12426411B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116130572A (zh) * | 2023-04-18 | 2023-05-16 | 江西兆驰半导体有限公司 | 发光二极管外延片及其制备方法、发光二极管 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20220302346A1 (en) | 2022-09-22 |
| TW202239017A (zh) | 2022-10-01 |
| US12426411B2 (en) | 2025-09-23 |
| JP2022142782A (ja) | 2022-09-30 |
| US11894489B2 (en) | 2024-02-06 |
| DE102022105994A1 (de) | 2022-09-22 |
| KR20220129490A (ko) | 2022-09-23 |
| US20240186449A1 (en) | 2024-06-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Country or region after: Taiwan, China Address after: Hsinchu City, Taiwan, China Applicant after: Fucai Optoelectronics Co., Ltd. Address before: Hsinchu City, Taiwan, China Applicant before: EPISTAR Corp. Country or region before: Taiwan, China |