CN115074808A - Electroplating carrying platform for placing packaging assembly and electroplating method - Google Patents

Abstract

The present invention provides an electroplating stage for placing package components and an electroplating method. The electroplating stage has at least one receiving groove, a table surface defining a notch of the receiving groove, and facing the notch from the periphery of the notch. An annular adhesive layer protruding in the receiving groove; the annular adhesive layer can be engaged with the edge of the outer surface of the package assembly and the edge solder balls, so that the outer surface and the components such as ball grid arrays on the outer surface It is sealed in the receiving groove, so as to protect the outer surface and the components such as the ball grid array on the outer surface, and prevent the phenomenon of overflow plating, and is suitable for the electroplating process of the package assembly with the ball grid array.

Description

Electroplating stage for placing package components and electroplating method

technical field

The present invention relates to the field of manufacturing package components, in particular to an electroplating carrier for placing package components and an electroplating method for electroplating the package components by using the electroplating carrier.

Background technique

The electroplating process of the existing package assembly mainly includes the following two: 1) A UV film is set on the electroplating stage, and the outer surface and the components on the outer surface are embedded in the UV film to protect the outer surface during the electroplating process. Not to be electroplated; 2) Set a receiving groove on the electroplating stage, and paste the double-sided tape on the carrier at the position corresponding to the edge of the receiving groove, and overlap the edge of the outer surface on the double-sided tape. At this time, the outer surface The upper part is accommodated in the accommodating groove to protect the outer surface from being electroplated.

However, for a package with a ball grid array on the external surface, because the solder balls in the ball grid array are relatively high and the thickness of the UV film is limited, the solder balls cannot be fully embedded, which is likely to cause overflow soldering; at the same time, the ball grid The distance between the edge solder balls in the array and the external surface is small, so that the external surface cannot be accurately mounted on the double-sided tape, and it is also easy to cause overflow soldering, that is, the package components with the ball grid array on the external surface are not suitable for The above two electroplating processes are used.

In view of this, it is necessary to provide a new electroplating stage for placing package components and an electroplating method for electroplating package components by using the electroplating stage to solve the above problems.

SUMMARY OF THE INVENTION

The object of the present invention is to provide an electroplating stage for placing a package component and an electroplating method for electroplating a package component using the electroplating stage, and the package component has a ball grid array.

In order to achieve the above purpose of the invention, the present invention adopts the following technical solutions: an electroplating stage for placing package components, having at least one receiving groove, a table surface defining a notch of the receiving groove, and facing from the peripheral edge of the notch The annular adhesive layer protruding in the receiving groove.

As a further improved technical solution of the present invention, the inner circumference of the annular adhesive layer is provided with a plurality of notches.

As a further improved technical solution of the present invention, the outer surface of the package component is rectangular, and the notch is rectangular; the notch is located at a position corresponding to the right angle of the annular adhesive layer and the notch.

As a further improved technical solution of the present invention, the size of the notch is not smaller than the size of the outer surface, and the size of the ring formed by connecting the outer ends of the plurality of notches is not larger than the size of the outer surface.

As a further improved technical solution of the present invention, a first adhesive layer is attached to the table surface near the notch, and the first adhesive layer is integrally provided with the annular adhesive layer.

As a further improved technical solution of the present invention, the electroplating stage further includes a support plate protruding from the notch toward the receiving groove, the support plate is located on the lower side of the annular adhesive layer, the The support plate has a support state extending obliquely downward from the notch into the receiving groove.

As a further improved technical solution of the present invention, the support plate is rotatably connected to the notch in the up-down direction, and the annular adhesive layer is attached to the upper surface of the support plate.

As a further improved technical solution of the present invention, the support plate has a horizontal state that is on the same plane as the notch, and the electroplating stage further includes an elastic member for keeping the support plate in a horizontal state.

As a further improved technical solution of the present invention, the elastic member is a spring connected between the lower surface of the support plate and the receiving groove.

As a further improved technical solution of the present invention, the package component has an outer surface, a ball grid array disposed on the outer surface and having a plurality of solder balls, and the ball grid array has edge solder close to the edge of the outer surface ball; after the package assembly is aligned with the receiving groove, the support plate in a horizontal state contacts the corresponding edge solder balls.

As a further improved technical solution of the present invention, after the package assembly is aligned with the receiving groove, the inner end of the support plate in a horizontal state contacts the lowest point of the corresponding edge solder ball.

In order to achieve the above purpose of the invention, the present invention also provides an electroplating method using the above-mentioned electroplating stage for placing package components, comprising the following steps:

Align the package assembly with the receiving groove;

placing the package assembly downward in the receiving groove, so that the edge of the outer surface is engaged with the annular adhesive layer;

plating;

After completion, the packaged assembly is removed.

The beneficial effect of the present invention is that: the electroplating stage in the present invention is provided with an annular adhesive layer protruding toward the receiving groove at the edge of the receiving groove, so that the electroplating carrying stage is suitable for use with a ball grid array on the outer surface. In the package assembly, during the electroplating process, the annular bonding layer is bonded to the edge of the outer surface and the edge solder balls, so that the outer surface and the components such as ball grid arrays on the outer surface are sealed to the outer surface. In the receiving groove, the outer surface and the components such as the ball grid array located on the outer surface are protected, the overflow plating phenomenon is prevented, and the process difficulty of electroplating of the package assembly with the ball grid array on the outer surface is overcome.

Description of drawings

FIG. 1 is a schematic diagram of the structure of the electroplating stage in the present invention, at this time, the support plate is in a horizontal state.

FIG. 2 is a schematic structural diagram of the annular adhesive layer in FIG. 1 .

FIG. 3 is a schematic structural diagram of a package assembly in the present invention.

FIG. 4 is a schematic view of the structure of the present invention after the package assembly is aligned with the receiving groove in the electroplating stage.

FIG. 5 is a schematic structural diagram of the package assembly of the present invention after being installed in the receiving groove.

FIG. 6 is a schematic structural diagram of the package assembly of the present invention after electroplating.

FIG. 7 is a flow chart of the electroplating method in the present invention.

Detailed ways

The present invention will be described in detail below with reference to the various embodiments shown in the accompanying drawings. Please refer to FIG. 1 to FIG. 7 , which are preferred embodiments of the present invention. However, it should be noted that these embodiments do not limit the present invention, and equivalent transformations or substitutions in functions, methods, or structures made by those of ordinary skill in the art according to these embodiments all fall within the protection scope of the present invention.

Referring to FIGS. 1 to 6 , the present invention provides an electroplating stage 10 for placing package components 20 . After the package components 20 are placed on the electroplating stage 10 , during the electroplating process, The outer surface 21 of the package assembly 20 and the components on the outer surface 21 can be protected from being sputtered, and the phenomenon of overflow plating can be prevented.

In the present invention, the package assembly 20 is taken as an example of the package assembly 20 having the ball grid array on the outer surface 21 for specific description. However, it should be noted that the technical spirit involved in the following embodiments can be alternatively applied to the electroplating process of other forms of packaging components 20, such as double-sided packaging components 20 or POP packaging components 20 or other packaging components with ball mounting. the package assembly 20.

The electroplating stage 10 has at least one accommodating groove 1 and a table 2 defining a slot of the accommodating groove 1 . Generally, the electroplating stage 10 has a plurality of accommodating grooves 1, so as to be able to perform electroplating on a plurality of the package components 20 at the same time, thereby enhancing the work efficiency.

In a specific embodiment, the electroplating stage 10 includes a support plate 3 , and the receiving groove 1 is formed concavely downward from the upper surface of the support plate 3 , that is, the upper surface of the support plate 3 is The table top 2. Of course, it is not limited to this. It can be understood that, in other embodiments, the electroplating stage 10 may further include a first through hole disposed on the support plate 3 and having a through hole disposed in the up-down direction. The through hole and the support plate 3 are formed together to form the receiving groove 1 . At this time, the upper surface of the first plate is the table top 2 .

Further, the electroplating stage 10 further includes an annular adhesive layer 4 protruding from the periphery of the slot toward the receiving groove 1 , and the size of the outer surface 21 is larger than that of the annular adhesive layer 4 . The size of the inner circumference, after the package assembly 20 is aligned with the receiving groove 1 and subjected to downward pressure, the edge solder balls 22 in the ball grid array close to the edge of the outer surface 21 are first connected to the The annular adhesive layer 4 is in contact with the annular adhesive layer 4, and the annular adhesive layer 4 is bent downward, and finally the peripheral edge of the outer surface 21 is joined to the annular adhesive layer 4, that is, the outer surface 21 and the Components such as the ball grid array on the outer surface 21 are sealed in the receiving groove 1 , so as to protect the outer surface 21 and the components such as the ball grid array located on the outer surface 21 and prevent overplating.

As shown in FIG. 6 , after the package assembly 20 is located in the receiving groove 1 , the peripheral edge of the external surface 21 is bonded to the annular adhesive layer 4 , which can prevent the external The surface 21 is sputtered, so as to achieve the effect of preventing overplating, that is, after electroplating, plating layers are only formed on the other five surfaces of the package component 20 except the outer surface 21 .

It can be understood that the annular adhesive layer 4 has flexibility and elasticity, and during the process of pressing the package assembly 20 down, the annular adhesive layer 4 can deform to a certain extent to adapt to the movement of the package assembly 20 , and finally the peripheral edge of the outer surface 21 is joined to the annular adhesive layer 4 .

Specifically, the material of the annular adhesive layer 4 is double-sided tape.

Further, as shown in FIG. 2 , a plurality of notches 41 are formed in the inner circumference of the annular adhesive layer 4 . During the process of the encapsulation component 20 pressing down and pushing the annular adhesive layer 4 to bend downwards , making the gap 41 larger, which can reduce the resistance of the packaging component 20 moving down, and facilitate the installation of the packaging component 20 .

Further, the size of the notch is not smaller than the size of the outer surface 21, and the size of the ring formed by connecting the outer ends of the plurality of notches 41 is not larger than the size of the outer surface 21, so that the outer surface 21 can be tightly bonded with the annular adhesive layer 4 to ensure that the outer surface 21 and the ball grid array and other components on the outer surface 21 are sealed in the receiving groove 1, thereby protecting the outer surface. 21 and components such as ball grid arrays located on the outer surface 21 to prevent overplating.

It can be understood that the notch 41 extends along the protruding direction of the annular adhesive layer 4 , and the inner end of the notch 41 refers to the end of the notch 41 corresponding to the inner circumference of the annular adhesive layer 4 . The outer end of the notch 41 refers to the end opposite to the inner end of the notch 41 .

In a specific embodiment, the outer surface 21 of the packaging component 20 is rectangular, and the notch is rectangular. Correspondingly, the annular adhesive layer 4 is rectangular, and the notch 41 is located in the annular adhesive layer. The position of the layer 4 corresponding to the right angle of the notch, that is, the notch 41 is located at the right angle of the annular adhesive layer 4 .

Specifically, the annular adhesive layer 4 includes two opposite first sides and two opposite second sides, and the two first sides and the two second sides are connected end to end to form a rectangular shape. The annular adhesive layer 4 is described. The notch 41 is located between the adjacent first sides and the second sides.

It can be understood that the adjacent first sides and the second sides are partially connected, so that the size of the notch is not smaller than the size of the outer surface 21, and the outer ends of the plurality of notches 41 are connected to form The size of the annular ring is not larger than the size of the outer surface 21, so that after the package assembly 20 is installed, the edge of the outer surface 21 can be bonded to the annular adhesive layer 4 to seal the package assembly 4. edge.

It can be understood that the size of the aforementioned notch is not smaller than the size of the outer surface 21 , that is, the length and width of the notch are not smaller than the length and width of the outer surface 21 , respectively.

Further, a first adhesive layer 5 is attached to the table 2 near the notch, and the first adhesive layer 5 is integrally arranged with the annular adhesive layer 4 to enhance the connection between the annular adhesive layer 4 and the annular adhesive layer 4. The bonding strength between the table tops 2 .

The above-mentioned integrated arrangement can be understood as a whole piece of double-sided adhesive tape, partly as the first adhesive layer 5 and partly as the annular adhesive layer 4 .

Further, the electroplating stage 10 further includes a support plate 6 protruding from the notch toward the receiving groove 1 , the annular adhesive layer 4 is located on the upper side of the support plate 6 , and the support plate 6 The plate 6 has a supporting state that extends from the notch to the receiving groove 1 and extends downward obliquely. After the peripheral edge of the outer surface 21 is in close contact with the annular adhesive layer 4, the annular adhesive The layer 4 is attached to the upper surface of the support plate 6 , and the support plate 6 can support the package component 20 to position the package component 20 .

It can be understood that, in the embodiment with the support plate 6 , the annular adhesive layer 4 may be directly attached to the support plate 6 , or the annular adhesive layer 4 may be placed on the package assembly 20 . After being driven, it is bent and attached to the support plate 6 .

In a specific embodiment, the support plate 6 is rotated and connected to the slot in the up-down direction, the annular adhesive layer 4 is attached to the upper surface of the support plate 6, and the support plate 6 also has The notch is in a horizontal state on the same plane, that is, before the package assembly 20 is not disposed on the plating stage 10, the support plate 6 is in a horizontal state, and the package assembly 20 is mounted on the electroplating stage 10. After the stage 10 is mounted, the support plate 6 is in a supported state, and the package assembly 20 is supported on the support plate 6 .

In the embodiment in which the slot is rectangular, the electroplating stage 10 includes four supporting plates 6 rotatably connected with the four sides of the slot, respectively, two oppositely arranged first supporting plates, two There are two oppositely arranged second support plates. When the support plates 6 are in a horizontal state, the adjacent first support plates and the second support plates face each other to form an annular shape.

After the package assembly 20 is aligned with the receiving groove 1 , the support plate 6 in a horizontal state is in contact with the corresponding edge solder balls 22 , that is, the annular adhesive layer 4 is only in contact with the edge solder balls 22 The contact area between the ball grid array and the annular adhesive layer 4 is reduced, the probability of glue residue can be reduced, and the downward rotation of the support plate 6 is more favorable.

Referring to FIG. 5 , after the package assembly 20 is aligned with the receiving groove 1 and subjected to downward pressure, the edge solder ball drives the support plate 6 to rotate downward, and the annular adhesive layer 4 is simultaneously bent down with the support plate 6 until the edge of the outer surface 21 is joined to the annular adhesive layer 4 .

Further, after the package assembly 20 is aligned with the receiving groove 1, the inner end of the support plate 6 in a horizontal state is in contact with the lowest point of the corresponding edge solder ball 22, so that in the package After the assembly 20 is subjected to downward pressure, it is easier to drive the support plate 6 to rotate downward.

Further, the electroplating stage 10 further includes an elastic member 7 for keeping the support plate 6 in a horizontal state. During the downward rotation of the support plate 6, the elastic member 7 is elastically deformed, and the support plate 6 is elastically deformed. The elastic restoring force exerted by the elastic member 7 makes the supporting plate 6 have a tendency to rotate upward, so that after the electroplating is completed, the elastic member 7 can cooperate with the suction nozzle to take out the electroplated package assembly 20 , which is more conducive to the removal of the package assembly 20 .

In a specific embodiment, the elastic member 7 is a spring connected between the lower surface of the support plate 6 and the receiving groove 1 . During the downward rotation of the support plate 6 , the spring After shrinking, after the electroplating is completed, the package assembly 20 is taken out under the action of the suction force of the suction nozzle and the upward elastic restoring force of the spring.

It can be understood that, when the supporting plate 6 is in the supporting state, although the elastic member 7 exerts an elastic restoring force for the upward rotation tendency of the supporting plate 6, the annular adhesive layer 4 and the Under the combined action of the bonding force between the packaging components 20 and the gravity of the packaging components 20 , the supporting plate 6 can be kept in the supporting state.

Of course, in other embodiments, a limiter capable of maintaining the support plate 6 in a supported state may also be provided, so as to enhance the support effect of the support plate 6 .

Further, as shown in FIG. 7 , the present invention also provides an electroplating method, based on the above-mentioned electroplating stage 10 for placing the package components 20 , the structure of the electroplating stage 10 is as described above, and here, no Repeat.

The electroplating method includes the following steps:

Align the package assembly 20 with the receiving groove 1;

Place the package assembly 20 in the receiving groove 1 downward, so that the edge of the outer surface 21 is engaged with the annular adhesive layer 4;

plating;

After completion, the package assembly 20 is taken out.

Specifically, the step of "putting the package assembly 20 downward in the receiving groove 1, so that the edge of the outer surface 21 is engaged with the annular adhesive layer 4" is specifically: giving the package assembly 20 A downward pressure is applied to move the package assembly 20 downward. During the downward movement of the package assembly 20, the support plate 6 is driven to rotate downward, and the annular adhesive layer 4 is bent downward synchronously. Until the edge of the outer surface 21 is engaged with the annular adhesive layer 4, at this time, the supporting plate 6 is in a supporting state.

Further, after taking out the package assembly 20, the used annular adhesive layer 4 can be torn off and replaced with a new annular adhesive layer 4 to prepare for the next electroplating process.

To sum up, in the electroplating stage 10 of the present invention, the annular adhesive layer 4 protruding toward the receiving groove 1 is provided on the edge of the receiving groove 1 , so that the electroplating carrying stage 10 is suitable for the outer surface 21 having In the package assembly 20 of the ball grid array, during the electroplating process, the annular bonding layer is bonded to the edge of the outer surface 21 and the edge solder balls 22 , so that the outer surface 21 and the solder balls on the outer surface 21 are bonded. Components such as ball grid arrays are sealed in the receiving groove 1, so as to protect the outer surface 21 and the components such as the ball grid array located on the outer surface 21, prevent overplating phenomenon, and overcome the problem that the outer surface 21 has a ball grid. Difficulties in the electroplating process of the package components 20 of the array.

It should be understood that although this specification is described in terms of embodiments, not every embodiment only includes an independent technical solution, and this description in the specification is only for the sake of clarity, and those skilled in the art should take the specification as a whole, and each The technical solutions in the embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

The series of detailed descriptions listed above are only specific descriptions for the feasible embodiments of the present invention, and they are not used to limit the protection scope of the present invention. Changes should all be included within the protection scope of the present invention.

Claims (12)

1. An electroplating stage for placing package components, comprising at least one receiving groove and a stage defining a slot of the receiving slot; wherein the electroplating stage further comprises a surface extending from the peripheral edge of the slot. The annular adhesive layer protruding in the receiving groove. 2 . The electroplating stage for placing package components as claimed in claim 1 , wherein a plurality of notches are formed in the inner circumference of the annular adhesive layer. 3 . 3 . The electroplating stage for placing package components according to claim 2 , wherein: the outer surface of the package component is rectangular, the notch is rectangular; the gap is located in the annular adhesive layer. 4 . at a position corresponding to the right angle of the notch. 4. The electroplating stage for placing package components according to claim 2 or 3, wherein the size of the notch is not smaller than the size of the outer surface, and the outer ends of a plurality of the notches are connected to form The size of the ring is not larger than the size of the outer surface. 5 . The electroplating stage for placing package components as claimed in claim 1 , wherein a first adhesive layer is attached to the surface near the notch, and the first adhesive layer and the The annular adhesive layer is integrally arranged. 6 . The electroplating stage for placing package components as claimed in claim 1 , wherein the electroplating stage further comprises a support plate protruding from the notch toward the receiving groove, the support plate 6 . The plate is located on the lower side of the annular adhesive layer, and the support plate has a support state extending obliquely downward from the notch into the receiving groove. 7 . The electroplating stage for placing package components as claimed in claim 6 , wherein the support plate is rotated and connected to the slot in the up-down direction, and the annular adhesive layer is attached to the support. 8 . the upper surface of the board. 8 . The electroplating stage for placing package components as claimed in claim 7 , wherein the support plate has a horizontal state that is on the same plane as the notch, and the electroplating stage further comprises making the The elastic member with the support plate in a horizontal state. 9 . The electroplating stage for placing package components as claimed in claim 8 , wherein the elastic member is a spring connected between the lower surface of the support plate and the receiving groove. 10 . 10. The electroplating stage for placing package components as claimed in claim 7, wherein the package components have an outer surface, a ball grid array disposed on the outer surface and having a plurality of solder balls, the The ball grid array has edge solder balls close to the edge of the outer surface; after the package assembly is aligned with the receiving groove, the support plate in a horizontal state contacts the corresponding edge solder balls. 11 . The electroplating stage for placing package components according to claim 10 , wherein after the package components are aligned with the receiving groove, the inner end of the support plate in a horizontal state corresponds to the corresponding The edges of the solder balls are in contact with the lowest point. 12. An electroplating method using the electroplating stage for placing package components according to any one of claims 1-11, wherein the electroplating method comprises the following steps: Align the package assembly with the receiving groove; placing the package assembly downward in the receiving groove, so that the edge of the outer surface is engaged with the annular adhesive layer; plating; After completion, the packaged assembly is removed.

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