CN115074808A - Electroplating carrying platform for placing packaging assembly and electroplating method - Google Patents
Electroplating carrying platform for placing packaging assembly and electroplating method Download PDFInfo
- Publication number
- CN115074808A CN115074808A CN202110282406.3A CN202110282406A CN115074808A CN 115074808 A CN115074808 A CN 115074808A CN 202110282406 A CN202110282406 A CN 202110282406A CN 115074808 A CN115074808 A CN 115074808A
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- electroplating
- notch
- adhesive layer
- supporting plate
- carrier
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
The invention provides an electroplating carrying platform and an electroplating method for placing a packaging assembly, wherein the electroplating carrying platform is provided with at least one accommodating groove, a table top for limiting a notch of the accommodating groove, and an annular bonding layer protruding from the periphery of the notch into the accommodating groove; the annular adhesive layer can be jointed with the edge of the external connection surface of the packaging assembly and the edge solder balls, so that the external connection surface and the ball grid array and other components on the external connection surface are sealed in the containing groove, the external connection surface and the ball grid array and other components on the external connection surface are protected, the phenomenon of excessive plating is prevented, and the method is suitable for the electroplating process of the packaging assembly with the ball grid array.
Description
Technical Field
The invention relates to the field of manufacturing of packaging assemblies, in particular to an electroplating carrying platform for placing a packaging assembly and an electroplating method for electroplating the packaging assembly by adopting the electroplating carrying platform.
Background
The electroplating process of the existing packaging assembly mainly comprises the following two steps: 1) arranging a UV film on the electroplating carrying platform, and embedding the external connection surface and the part on the external connection surface into the UV film so as to protect the external connection surface from being electroplated in the electroplating process; 2) a containing groove is arranged on an electroplating carrying platform, a double-faced adhesive tape is adhered to a position, corresponding to the edge of the containing groove, on the carrying platform, the edge of an external connection surface is lapped on the double-faced adhesive tape, and at the moment, a component on the external connection surface is contained in the containing groove so as to protect the external connection surface from being electroplated.
However, for the package assembly having the ball grid array on the external connection surface, the solder balls in the ball grid array are higher, and the thickness of the UV glue film is limited, so that the solder balls cannot be completely embedded, which is likely to cause solder overflow; meanwhile, the distance between the edge solder balls in the ball grid array and the outer joint surface is small, so that the outer joint surface cannot be accurately carried on the double-sided adhesive, and the overflow welding is easily caused.
In view of the above, it is desirable to provide a new electroplating carrier for placing a package and an electroplating method for electroplating the package using the electroplating carrier to solve the above problems.
Disclosure of Invention
The invention aims to provide an electroplating carrying platform for placing a packaging assembly and an electroplating method for electroplating the packaging assembly by adopting the electroplating carrying platform, wherein the packaging assembly is provided with a ball grid array.
In order to achieve the purpose, the invention adopts the following technical scheme: an electroplating carrier for placing a package assembly has at least one receiving cavity, a table defining a notch of the receiving cavity, and an annular adhesive layer protruding from a periphery of the notch into the receiving cavity.
As a further improved technical scheme of the invention, the inner periphery of the annular bonding layer is provided with a plurality of notches.
As a further improved technical scheme of the invention, the external surface of the packaging assembly is rectangular, and the notch is rectangular; the notch is located at a position where the annular adhesive layer corresponds to a right angle of the notch.
As a further improved technical scheme of the invention, the size of the notch is not smaller than that of the outer junction surface, and the size of a ring formed by connecting the outer ends of the notches is not larger than that of the outer junction surface.
As a further improved technical scheme of the invention, a first adhesive layer is attached to the table top close to the notch, and the first adhesive layer and the annular adhesive layer are integrally arranged.
As a further improved aspect of the present invention, the plating stage further includes a support plate protruding from the notch toward the inside of the housing groove, the support plate being located below the annular adhesive layer, and the support plate having a support state extending from the notch toward the inside of the housing groove and inclining downward.
As a further improved technical scheme of the invention, the support plate is rotatably connected with the notch along the vertical direction, and the annular adhesive layer is attached to the upper surface of the support plate.
As a further improved technical solution of the present invention, the support plate has a horizontal state in which the support plate and the notch are located on the same plane, and the electroplating stage further includes an elastic member that makes the support plate in the horizontal state.
As a further improved technical solution of the present invention, the elastic member is a spring connected between the lower surface of the support plate and the receiving groove.
As a further improved technical solution of the present invention, the package assembly has an external joint surface, a ball grid array provided on the external joint surface and having a plurality of solder balls, the ball grid array having edge solder balls near the edge of the external joint surface; after the packaging assembly is aligned with the containing groove, the supporting plate in a horizontal state is contacted with the corresponding edge solder ball.
As a further improved technical solution of the present invention, after the package assembly is aligned with the receiving groove, the inner end of the support plate in a horizontal state contacts with the lowest point of the corresponding edge solder ball.
In order to achieve the above object, the present invention further provides an electroplating method using the above electroplating carrier for placing a package assembly, including the following steps:
aligning a package assembly with the receiving slot;
placing the packaging assembly downwards into the accommodating groove, and enabling the edge of the external joint surface to be jointed with the annular adhesive layer;
electroplating;
after completion, the package assembly is removed.
The invention has the beneficial effects that: according to the electroplating carrier disclosed by the invention, the annular adhesive layer protruding towards the inside of the accommodating groove is arranged at the edge of the accommodating groove, so that the electroplating carrier is suitable for a packaging component with a ball grid array on the external surface.
Drawings
Fig. 1 is a schematic structural view of the plating stage according to the present invention, in which the support plate is in a horizontal state.
Fig. 2 is a schematic view of the structure of the annular adhesive layer in fig. 1.
Fig. 3 is a schematic structural view of a package assembly in the present invention.
Fig. 4 is a schematic structural view of the package assembly of the present invention aligned with the receiving cavity of the electroplating carrier.
Fig. 5 is a schematic structural view of the package assembly of the present invention mounted in the receiving groove.
Fig. 6 is a schematic diagram of the structure of the package assembly after electroplating.
FIG. 7 is a flow chart of an electroplating method in the present invention.
Detailed Description
The present invention will be described in detail with reference to the embodiments shown in the drawings, and reference is made to fig. 1 to 7, which are preferred embodiments of the present invention. It should be noted that these embodiments do not limit the invention, and the functional, method, or structural equivalents and substitutions that are made by those skilled in the art according to these embodiments are all within the scope of the invention.
Referring to fig. 1 to 6, the present invention provides an electroplating carrier 10 for placing a package assembly 20, which can protect the external connection surface 21 of the package assembly 20 and the components on the external connection surface 21 from being sputtered during the electroplating process after the package assembly 20 is placed on the electroplating carrier 10, so as to prevent the occurrence of the over-plating phenomenon.
The present invention is specifically described by taking the package assembly 20 as an example in which the external surface 21 is a ball grid array package assembly 20. It should be noted that the technical spirit involved in the embodiments described below may be alternatively applied to the electroplating process of other types of package assemblies 20, such as double-sided package assemblies 20 or POP package assemblies 20 or other package assemblies 20 with ball-planting.
The plating stage 10 has at least one receiving tank 1, and a table 2 defining a notch of the receiving tank 1. Generally, the plating stage 10 has a plurality of receiving grooves 1 so that a plurality of packages 20 can be plated at the same time, thereby enhancing work efficiency.
In one embodiment, the electroplating stage 10 includes a supporting plate 3, and the accommodating groove 1 is formed by being recessed downward from an upper surface of the supporting plate 3, that is, the upper surface of the supporting plate 3 is the stage 2. Of course, it is understood that, in other embodiments, the plating stage 10 may further include a first plate disposed on the supporting plate 3 and having a through hole penetrating in the vertical direction, the through hole and the supporting plate 3 together enclosing the receiving slot 1, and in this case, the upper surface of the first plate is the table top 2.
Further, the electroplating carrier 10 further includes a ring-shaped adhesive layer 4 protruding from the periphery of the notch toward the receiving cavity 1, the size of the outer contact surface 21 is larger than the size of the inner periphery of the ring-shaped adhesive layer 4, after the package assembly 20 is aligned with the receiving cavity 1 and is pressed downward, the edge solder balls 22 near the edge of the outer contact surface 21 in the ball grid array first contact the ring-shaped adhesive layer 4, and bend the ring-shaped adhesive layer 4 downward, and finally the periphery of the outer contact surface 21 is bonded to the ring-shaped adhesive layer 4, that is, the outer contact surface 21 and the ball grid array and other components on the outer contact surface 21 are sealed in the receiving cavity 1, so as to protect the outer contact surface 21 and the ball grid array and other components on the outer contact surface 21, and prevent the occurrence of the phenomenon of the over-plating.
As shown in fig. 6, after the package assembly 20 is positioned in the receiving cavity 1, the periphery of the external contact surface 21 is bonded to the annular adhesive layer 4, so that sputtering on the external contact surface 21 can be prevented during electroplating, and the phenomenon of over-plating can be prevented, that is, after electroplating, plating is formed only on five surfaces of the package assembly 20 except the external contact surface 21.
It will be appreciated that the annular adhesive layer 4 is flexible and resilient, and that during depression of the packaging assembly 20, the annular adhesive layer 4 can deform to accommodate movement of the packaging assembly 20, and ultimately the peripheral edge of the outer abutment surface 21 engages the annular adhesive layer 4.
Specifically, the material of the annular adhesive layer 4 is a double-sided adhesive tape.
Further, as shown in fig. 2, a plurality of notches 41 are formed on the inner periphery of the annular adhesive layer 4, and in the process that the packaging assembly 20 is pressed downward to push the annular adhesive layer 4 to bend downward, the notches 41 are enlarged, so that the resistance of downward movement of the packaging assembly 20 can be reduced, and the packaging assembly 20 can be conveniently mounted.
Further, the size of the notch is not smaller than the size of the outer contact surface 21, and the size of the ring formed by connecting the outer ends of the plurality of notches 41 is not larger than the size of the outer contact surface 21, so that the periphery of the outer contact surface 21 can be tightly engaged with the ring-shaped adhesive layer 4, and it is ensured that the outer contact surface 21 and the components such as the ball grid array on the outer contact surface 21 are sealed in the receiving groove 1, thereby protecting the outer contact surface 21 and the components such as the ball grid array on the outer contact surface 21 and preventing the occurrence of the flash phenomenon.
It is understood that the notch 41 extends along the protruding direction of the annular adhesive layer 4, and the inner end of the notch 41 refers to the end of the notch 41 corresponding to the inner circumference of the annular adhesive layer 4, and correspondingly, the outer end of the notch 41 refers to the end opposite to the inner end of the notch 41.
In one embodiment, the outer contact surface 21 of the package assembly 20 is rectangular, the notch is rectangular, correspondingly, the annular adhesive layer 4 is rectangular, and the notch 41 is located at a position where the annular adhesive layer 4 corresponds to a right angle of the notch, that is, the notch 41 is located at a right angle of the annular adhesive layer 4.
Specifically, the annular adhesive layer 4 includes two opposite first sides and two opposite second sides, and the two first sides and the two second sides are connected end to form the rectangular annular adhesive layer 4. The notch 41 is located between the adjacent first and second edges.
It will be appreciated that the adjacent first edges are partially connected to the second edges such that the size of the notches is not smaller than the size of the external contact surface 21, and the size of the loop formed by connecting the outer ends of the notches 41 is not larger than the size of the external contact surface 21, so that the edge of the external contact surface 21 can be bonded to the loop-shaped adhesive layer 4 to seal the edge of the package assembly 4 after the package assembly 20 is mounted.
It is understood that the dimensions of the notch described above are not less than the dimensions of the outer abutment surface 21, i.e. the length and width of the notch are not less than the length and width of the outer abutment surface 21, respectively.
Furthermore, a first bonding layer 5 is attached to the table top 2 close to the notch, the first bonding layer 5 and the annular bonding layer 4 are integrally arranged, and the bonding strength between the annular bonding layer 4 and the table top 2 is enhanced.
The integral arrangement described above is to be understood as a one-piece double-sided adhesive part as the first adhesive layer 5 and partly as the annular adhesive layer 4.
Further, the plating stage 10 further includes a support plate 6 projecting from the notch into the housing groove 1, the annular adhesive layer 4 is located on an upper side of the support plate 6, the support plate 6 has a support state of being inclined downward from the notch into the housing groove 1, the annular adhesive layer 4 is attached to an upper surface of the support plate 6 after a peripheral edge of the outer contact surface 21 is tightly engaged with the annular adhesive layer 4, and the support plate 6 can support the package 20 to position the package 20.
It is understood that in the embodiment having the supporting plate 6, the annular adhesive layer 4 may be directly attached to the supporting plate 6, or the annular adhesive layer 4 is attached to the supporting plate 6 after being bent by the packing assembly 20.
In one embodiment, the supporting plate 6 is rotatably connected to the notch in the vertical direction, the annular adhesive layer 4 is attached to the upper surface of the supporting plate 6, the supporting plate 6 is in a horizontal state in which the supporting plate is positioned on the same plane as the notch, that is, the supporting plate 6 is in the horizontal state before the package 20 is not disposed on the plating stage 10, the supporting plate 6 is in a supporting state after the package 20 is mounted on the plating stage 10, and the package 20 is supported on the supporting plate 6.
In the embodiment where the notch is rectangular, the electroplating stage 10 includes four support plates 6 rotatably connected to four sides of the notch, two first support plates disposed opposite to each other, and two second support plates disposed opposite to each other, and when the support plates 6 are in a horizontal state, the adjacent first support plates and the adjacent second support plates are in butt joint to form a ring.
After the package assembly 20 is aligned with the receiving groove 1, the supporting plate 6 in a horizontal state is in contact with the corresponding edge solder balls 22, that is, the annular adhesive layer 4 is only in contact with the edge solder balls 22, so that the contact area between the ball grid array and the annular adhesive layer 4 is reduced, the probability of adhesive residue can be reduced, and the supporting plate 6 can be more favorably rotated downwards.
Referring to fig. 5, after the package assembly 20 is aligned with the receiving slot 1 and is pressed downward, the edge solder balls drive the supporting plate 6 to rotate downward, and the annular adhesive layer 4 is bent downward along with the supporting plate 6 until the edge of the outer contact surface 21 is bonded to the annular adhesive layer 4.
Further, after the package assembly 20 is aligned with the receiving slot 1, the inner end of the supporting plate 6 in the horizontal state contacts with the lowest point of the corresponding edge solder ball 22, so that the supporting plate 6 is more easily driven to rotate downward after the package assembly 20 is pressed downward.
Further, the electroplating carrier 10 further includes an elastic member 7 for making the support plate 6 in a horizontal state, and in the process of downward rotation of the support plate 6, the elastic member 7 is elastically deformed, and the support plate 6 receives an elastic restoring force which is applied by the elastic member 7 and enables the support plate 6 to have a tendency of upward rotation, so that after electroplating is completed, the elastic member 7 can be matched with a suction nozzle to take out the electroplated packaging assembly 20, which is more beneficial to taking out the packaging assembly 20.
In one embodiment, the elastic member 7 is a spring connected between the lower surface of the support plate 6 and the receiving groove 1, the spring contracts during the downward rotation of the support plate 6, and the enclosure assembly 20 is taken out under the suction force of the suction nozzle and the upward elastic restoring force of the spring after the electroplating is completed.
It is understood that, while the support plate 6 is in the supported state, the support plate 6 can be maintained in the supported state by the combined action of the engaging force between the annular adhesive layer 4 and the packing 20 and the weight force of the packing 20, although the elastic members 7 apply the elastic restoring force to the tendency of the support plate 6 to rotate upward.
Of course, in another embodiment, a stopper capable of holding the support plate 6 in the supported state may be provided to enhance the supporting effect of the support plate 6.
Further, referring to fig. 7, the present invention also provides an electroplating method, based on the above-mentioned electroplating carrier 10 for placing the package assembly 20, the structure of the electroplating carrier 10 is as described above, and thus, the details are not repeated herein.
The electroplating method comprises the following steps:
aligning a package assembly 20 with the receiving groove 1;
placing the package assembly 20 downward in the receiving groove 1, so that the edge of the outer contact surface 21 is bonded to the annular adhesive layer 4;
electroplating;
after completion, the package assembly 20 is removed.
Specifically, the step of placing the package assembly 20 downward into the receiving groove 1 to bond the edge of the outer joint surface 21 and the annular adhesive layer 4 is as follows: downward pressure is applied to the packing assembly 20, the packing assembly 20 moves downwards, the supporting plate 6 is driven to rotate downwards in the process of moving the packing assembly 20 downwards, the annular bonding layer 4 is synchronously bent downwards until the edge of the outer joint surface 21 is jointed with the annular bonding layer 4, and at the moment, the supporting plate 6 is in a supporting state.
Further, after the package assembly 20 is removed, the used annular adhesive layer 4 may be torn off and replaced with a new annular adhesive layer 4 to prepare for the next plating process.
In summary, in the electroplating carrier 10 of the present invention, the annular adhesive layer 4 protruding into the receiving cavity 1 is disposed at the edge of the receiving cavity 1, so that the electroplating carrier 10 is suitable for the package 20 having the ball grid array on the external connection surface 21, and during the electroplating process, the annular adhesive layer is bonded to the edge of the external connection surface 21 and the edge solder balls 22, so as to seal the external connection surface 21 and the components such as the ball grid array on the external connection surface 21 in the receiving cavity 1, thereby protecting the external connection surface 21 and the components such as the ball grid array on the external connection surface 21, preventing the occurrence of the over-plating phenomenon, and overcoming the process difficulty of electroplating the package 20 having the ball grid array on the external connection surface 21.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (12)
1. An electroplating carrying platform for placing a packaging assembly is provided with at least one containing groove and a table top for limiting a notch of the containing groove; the method is characterized in that: the electroplating carrying platform also comprises an annular bonding layer protruding from the periphery of the notch towards the inside of the containing groove.
2. The electroplating carrier for housing package components of claim 1, wherein: a plurality of notches are formed in the inner periphery of the annular bonding layer.
3. The electroplating carrier for holding package components of claim 2, wherein: the external surface of the packaging assembly is rectangular, and the notch is rectangular; the notch is located at a position where the annular adhesive layer corresponds to a right angle of the notch.
4. The electroplating carrier for holding package components of claim 2 or 3, wherein: the size of the notch is not smaller than that of the outer contact surface, and the size of a ring formed by connecting the outer ends of the notches is not larger than that of the outer contact surface.
5. The electroplating carrier for housing package components of claim 1, wherein: a first adhesive layer is attached to the table top close to the notch, and the first adhesive layer and the annular adhesive layer are integrally arranged.
6. The electroplating carrier for housing package components of claim 1, wherein: the electroplating carrying platform also comprises a supporting plate which protrudes from the notch towards the inside of the containing groove, the supporting plate is positioned at the lower side of the annular adhesive layer, and the supporting plate has a supporting state which extends from the notch towards the inside of the containing groove and inclines downwards.
7. The electroplating carrier for holding package components of claim 6, wherein: the supporting plate is connected to the notch in a vertical rotating mode, and the annular adhesive layer is attached to the upper surface of the supporting plate.
8. The electroplating carrier for holding package components of claim 7 wherein: the supporting plate is in a horizontal state which is positioned on the same plane with the notch, and the electroplating carrying platform further comprises an elastic piece which enables the supporting plate to be in a horizontal state.
9. The electroplating carrier for holding package components of claim 8, wherein: the elastic piece is a spring connected between the lower surface of the supporting plate and the containing groove.
10. The electroplating carrier for holding package components of claim 7, wherein: the packaging assembly is provided with an external joint surface and a ball grid array which is arranged on the external joint surface and is provided with a plurality of solder balls, and the ball grid array is provided with edge solder balls close to the edge of the external joint surface; after the packaging assembly is aligned with the containing groove, the supporting plate in a horizontal state is contacted with the corresponding edge solder ball.
11. The electroplating carrier for housing package assemblies as recited in claim 10, wherein: after the packaging assembly is aligned with the containing groove, the inner end of the supporting plate in a horizontal state is contacted with the lowest point of the corresponding edge solder ball.
12. An electroplating method using the electroplating carrier for placing the package assembly as claimed in any one of claims 1 to 11, wherein: the electroplating method comprises the following steps:
aligning a package assembly with the receiving slot;
placing the packaging assembly downwards into the accommodating groove, and enabling the edge of the external joint surface to be jointed with the annular adhesive layer;
electroplating;
after completion, the package assembly is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110282406.3A CN115074808A (en) | 2021-03-16 | 2021-03-16 | Electroplating carrying platform for placing packaging assembly and electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110282406.3A CN115074808A (en) | 2021-03-16 | 2021-03-16 | Electroplating carrying platform for placing packaging assembly and electroplating method |
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| CN115074808A true CN115074808A (en) | 2022-09-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110282406.3A Pending CN115074808A (en) | 2021-03-16 | 2021-03-16 | Electroplating carrying platform for placing packaging assembly and electroplating method |
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| CN109055912A (en) * | 2018-08-21 | 2018-12-21 | 环旭电子股份有限公司 | A kind of sputtering carrier and method for sputtering |
| CN209266360U (en) * | 2018-11-19 | 2019-08-16 | 苏州日月新半导体有限公司 | Device for integrated antenna package |
| CN110565058A (en) * | 2019-08-29 | 2019-12-13 | 江苏长电科技股份有限公司 | magnetron sputtering method of BGA product |
| CN111058006A (en) * | 2019-12-11 | 2020-04-24 | 江苏长电科技股份有限公司 | Magnetron sputtering method of BGA electromagnetic shielding product |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105826211A (en) * | 2016-05-11 | 2016-08-03 | 苏州日月新半导体有限公司 | Semiconductor product, and tool and method for manufacturing the semiconductor product |
| CN109055912A (en) * | 2018-08-21 | 2018-12-21 | 环旭电子股份有限公司 | A kind of sputtering carrier and method for sputtering |
| CN109023277A (en) * | 2018-08-29 | 2018-12-18 | 江苏长电科技股份有限公司 | Magnetron sputtering method for BGA packaged electronic product |
| CN209266360U (en) * | 2018-11-19 | 2019-08-16 | 苏州日月新半导体有限公司 | Device for integrated antenna package |
| CN110565058A (en) * | 2019-08-29 | 2019-12-13 | 江苏长电科技股份有限公司 | magnetron sputtering method of BGA product |
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