CN109055912A - A kind of sputtering carrier and method for sputtering - Google Patents
A kind of sputtering carrier and method for sputtering Download PDFInfo
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- CN109055912A CN109055912A CN201810956936.XA CN201810956936A CN109055912A CN 109055912 A CN109055912 A CN 109055912A CN 201810956936 A CN201810956936 A CN 201810956936A CN 109055912 A CN109055912 A CN 109055912A
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- adhesion coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- Engineering & Computer Science (AREA)
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- Mechanical Engineering (AREA)
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- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of sputtering carrier and method for sputtering, sputtering carrier includes an ontology, the ontology is a slab construction, with the working face and bottom surface being oppositely arranged, ontology is equipped with multiple stepped holes, stepped hole penetrates through the working face of ontology to bottom surface, stepped hole includes from first sub-through hole and the second sub-through hole for working and extending towards bottom surface, the upper surface of first sub-through hole is the working face of ontology, the lower end of first sub-through hole converges on the upper surface of the second sub-through hole, and first sub-through hole lower end overall size be greater than the second sub-through hole upper end overall size, the lower end surface of second sub-through hole is the bottom surface of ontology；Sputtering carrier further includes an adhesion coating, and adhesion coating is adhered on the working face of ontology, and adhesion coating offers through-hole at the corresponding position of stepped hole one by one.What sputtering carrier of the invention can effectively solve in sputter process excessive crosses phenomenon and product bottom fines problem.
Description
Technical field
The present invention relates to the production line technical field of improvement to sputter product, espespecially a kind of sputtering carrier and method for sputtering.
Background technique
Sputter is under vacuum conditions, to be passed through inert gas appropriate as medium, lean on inert gas accelerating impact target,
It is knocked out target material surface atom, and forms plated film on surface, sputter program is that semiconductor chip is made to avoid external electromagnetic
The important step of interference.The carrier generally used in existing sputter step, as shown in Figure 1, carrier ontology A is a plate knot
Structure is equipped with the constant through-hole of a bore on carrier ontology A and adhesion coating B is first pressed together on to the work of carrier ontology A before sputter
Make on face (i.e. the upper surface of carrier ontology A), then will be pressed on to sputter products C on adhesion coating B, to sputter products C and adhesion
The partial contact zones of layer B will appear gap, in sputter process, part sputter gas (such as copper or stainless steel metal steam) meeting
It overflows into from gap and the bottom face PAD (pad face) to sputter product is caused to overflow plating, the metal fragment that plating generates of overflowing between PAD can be into
One step causes product short-circuit.Those skilled in the art attempted to press using larger pressure to sputter product and adhesion coating, avoided
There is gap in the contact area of the two, this method can not thoroughly solve the problems, such as plating of overflowing, and localized metallic clast will increase, this
A little clasts can fall to product bottom, be easy to cause PAD short-circuit.
Therefore, the application is dedicated to providing a kind of novel sputtering carrier and method for sputtering.
Summary of the invention
The object of the present invention is to provide a kind of sputtering carrier and method for sputtering, sputtering carrier can effectively solve sputter process
In excessive cross phenomenon and product bottom fines problem.
Technical solution provided by the invention is as follows:
A kind of sputtering carrier, comprising: ontology, the ontology are a slab construction, have the working face being oppositely arranged and bottom
Face, the ontology are equipped with the stepped hole of multiple array arrangements, and the stepped hole penetrates through the working face of the ontology to bottom surface, institute
Stating stepped hole includes that the first sub-through hole and the second sub-through hole that bottom surface is set gradually are extended to from the working face, and described first
The upper surface of sub-through hole is the working face of the ontology, and the lower end of first sub-through hole converges on the upper of second sub-through hole
End face, and the lower ending opening size of first sub-through hole be greater than second sub-through hole upper end opening size, described second
The lower end surface of sub-through hole is the bottom surface of the ontology；Adhesion coating, the adhesion coating is adhered on the working face of the ontology, described
Adhesion coating offers through-hole at the corresponding position of the stepped hole one by one.
Preferably, the upper end opening shape of first sub-through hole is identical as the chamfered shape to sputter product, and described
Upper end opening the widest part size of one sub-through hole extends out 0.1 on profile the widest part size basis to sputter product~
0.5mm；Upper end opening the widest part size of second sub-through hole is smaller by 1 than profile the widest part size to sputter product~
2mm；And/or；Arrangement spacing on the working face of the ontology between the adjacent stepped hole is greater than 3mm.
Preferably, through-hole aperture the widest part size of the adhesion coating is in profile the widest part size to sputter product
On the basis of reduce 0.5~2.5mm；And/or；The adhesion coating with a thickness of 0.1~1.0mm.
Preferably, the working face of the ontology is equipped with air discharge duct, and the air discharge duct is opened in the surrounding of the stepped hole,
And a public air discharge duct between two adjacent stepped holes, the air discharge duct have predetermined depth.
Preferably, the groove depth of the air discharge duct is 1~2mm, and width is 1~2mm；And/or；The air discharge duct perforation
The side wall of the ontology；The adhesion coating is equipped with the first engraved structure, and first engraved structure is correspondingly arranged in the row
The top of air drain.
Preferably, gas vent is additionally provided on the working face of the ontology, the gas vent is laid in the exhaust of two intersections
The infall of slot, and the gas vent penetrates through the working face of the ontology to bottom surface.
Preferably, the adhesion coating is equipped with the second engraved structure, and second engraved structure is correspondingly arranged in the row
The top of stomata.
A kind of method for sputtering, the sputtering carrier used for sputtering carrier described in any one of the above, comprising steps of
S1, it is laid with one layer of adhesion coating on the working face of the ontology in the sputtering carrier, will be preset on the adhesion coating
Through-hole, the first engraved structure and the second engraved structure respectively on the working face of the ontology of the sputtering carrier stepped hole,
Air discharge duct and gas vent correspond；
S2, it will be placed on to sputter product on the adhesion coating, and the bottom to sputter product be completely covered described
The through-hole of adhesion coating；
S3, downwards pressing are described to sputter product, fall into the bottom to sputter product in first sub-through hole；
S4, sputtering process is carried out.
Preferably, in the step S3, described after the bottom of sputter product is fallen into the first through hole, it is described
Bottom margin to sputter product is covered by the adhesion coating.
Preferably, the bottom to sputter product is equipped with multiple tin balls, and the step S3 further comprises:
Apply pressure force to sputter product to described, the tin ball to sputter product bottom is made to be sunk completely to described the
In one through-hole, and the lateral surface for being located at the tin ball of most peripheral is covered by the adhesion coating.
A kind of sputtering carrier and method for sputtering provided by the invention can bring it is following at least one the utility model has the advantages that
1, sputtering carrier provided by the invention needs pressing to be placed in sputter and carries when being applied to sputter process to sputter product
On the adhesion coating of the working face of the ontology of tool, since sputtering carrier is equipped with stepped hole, applying pressure work to sputter product
It under, falls into sputter product to first through hole, the through-hole marginal portion stress of adhesion coating can lead to the first son of stepped hole
The inner sidewall in hole is bent, to fill up to the gap between sputter product bottom sidewall and the first sub-through hole inner sidewall, and is covered
The bottom margin of sputter product, when the bottom surface of sputter product is equipped with tin ball, the adhesion coating that is bent to first sub-through hole
Through-hole edges cover is simultaneously bonded the bottom tin ball to sputter product on the side of adhesion coating, that is to say, that sputter product
After being pressed on adhesion coating, do not need to apply very big pressure force, adhesion coating can also be filled with the bottom margin to sputter product
Point fitting, does not have therebetween gap substantially, it is possible to prevente effectively from excessive when sputter crosses problem, also, completes sputter, will be wait splash
After plated product is taken off from adhesion coating, the bottom to sputter product is substantially without clast.
2, method for sputtering of the invention uses the sputtering carrier with stepped hole, the upper end opening shape of the first sub-through hole
It is identical as the chamfered shape to sputter product, and 0.1~0.5mm is extended out on the basis of the overall size to sputter product, guarantee
When sputter product, bottom and being welded under the tin ball of bottom is fallen into the first sub-through hole when by pressure force, and adhesion coating is logical
Bore edges stress can be bent to the first sub-through hole, to fill up to the seam between sputter product side wall and the first sub-through hole inner sidewall
Gap, and cover to the bottom margin of sputter product and the lateral surface of periphery tin ball, to effectively avoid generating in sputter process
It is excessive cross problem, can also further avoid overflow cross caused by product bottom fines problem.
3, upper end opening the widest part size of the first sub-through hole of sputtering carrier of the invention is compared with the profile to sputter product
The size that extends out that 0.1~0.5mm is extended out on the widest part size basis is optimal selection by verifying repeatedly, extends out excessive be easy
It causes integrally to sink to sputter product into the first sub-through hole, extends out undersized, be unable to reach sagging effect, can not solve
Certainly excessive plating problem.
4, the sagging depth of the invention to sputter product in the first sub-through hole be no longer limited to adhesion coating thickness and
Decrement, but equally play improvement excessive the problem of crossing and reducing clast.
5, the ontology of sputtering carrier of the invention is equipped with air discharge duct and gas vent, and adhesion coating is equipped with corresponding hollow out knot
The setting of structure, air discharge duct and gas vent is conducive to adhesion coating air-dispersing in sputter process, avoids adhesion coating and locally occurs
Bubbling phenomenon.
Detailed description of the invention
Below by clearly understandable mode, preferred embodiment is described with reference to the drawings, to above-mentioned characteristic of the invention, skill
Art feature, advantage and its implementation are further described.
Fig. 1 is the structural schematic diagram of sputtering carrier in the prior art；
Fig. 2 is the top view of ontology in sputtering carrier of the invention；
Fig. 3 is the partial structural diagram of ontology in sputtering carrier shown in Fig. 2；
Fig. 4 is ontology partial structural diagram in sputtering carrier shown in Fig. 2；
Fig. 5 is the structural schematic diagram of sputtering carrier in a state of use；
Fig. 6 is the structural schematic diagram of adhesion coating in sputtering carrier.
Drawing reference numeral explanation:
A, ontology, B, adhesion coating, C, to sputter product, D, tin ball；
1, ontology, 2, stepped hole, the 21, first sub-through hole, the 22, second sub-through hole, 3, air discharge duct, 4, gas vent；5, it adheres
Layer, 51, adhesion coating through-hole, the 52, first engraved structure, the 53, second engraved structure, 6, to sputter product, 7, tin ball, D1, wait splash
Profile the widest part size of plated product, upper end opening the widest part size of D2, the first sub-through hole, the upper end of D3, the second sub-through hole
Be open the widest part size, through-hole the widest part size of D4, adhesion coating.
Specific embodiment
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, Detailed description of the invention will be compareed below
A specific embodiment of the invention.It should be evident that drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing, and obtain other embodiments.To make simplified form, only schematically showing and phase of the present invention in each figure
The part of pass, they do not represent its practical structures as product.
Embodiment one
As shown in Figure 2-5, this specific embodiment discloses a kind of specific embodiment of sputtering carrier, including an ontology 1,
Ontology 1 is a slab construction, and there is the working face (upper surface of ontology 1 i.e. shown in Fig. 2) being oppositely arranged and bottom surface (to scheme
The lower surface of ontology 1 shown in 2), ontology 1 is equipped with the stepped hole 2 of multiple array arrangements.The work of the perforation ontology 1 of stepped hole 2
Make face to bottom surface, stepped hole 2 includes that the first sub-through hole 21 set gradually that bottom surface is extended to from working face and the second son lead to
Hole 22, the upper surface of the first sub-through hole 21 are the working face of ontology 1, and the lower end of the first sub-through hole 21 converges on the second sub-through hole 22
Upper surface, and the lower ending opening size of the first sub-through hole 21 is greater than the upper end opening size of the second sub-through hole 22, and the second son is logical
The lower end surface in hole 22 is the bottom surface of ontology 1.
In the present embodiment, as shown in Figure 2 and Figure 5, the first sub-through hole 21 and the second sub-through hole 22 be aperture size not
The through-hole of change.Chamfered shape to sputter product 6 be it is irregular trapezoidal, the size of profile the widest part is D1, also, the first son
The shape of through holes of through-hole 21 is identical as the chamfered shape to sputter product 6, i.e., also to be irregular trapezoidal, the first sub-through hole is most
The dimension D 2 at wide place extends out on the basis of dimension D 1 to 6 profile the widest part of sputter product, i.e. D2=D1+ (0.1~0.5mm).
When being arranged in this way, its bottom part when sputter product 6 is in sputter can be made to fall into first through hole.Second sub-through hole is most
The dimension D 3 at wide place is than profile the widest part dimension D 1 small 1~2mm, i.e. D3=D1- (1~2mm) to sputter product.In this way
Setting can treat sputter product 6 and play position-limiting action, avoid dropping out from stepped hole 2 to sputter product 6.
Specifically, the first sub-through hole 21 and the second sub-through hole 22 can also be the through-hole of aperture size variation, the first sub-through hole
21 shape of through holes is identical as the chamfered shape to sputter product 6, and the lower end of the first sub-through hole 21 converges on the second sub-through hole 22
Upper surface, and the lower ending opening size of the first sub-through hole 21 be greater than the second sub-through hole 22 upper end opening size.For example, first
The longitudinal cross-section of sub-through hole 21 be it is wide at the top and narrow at the bottom trapezoidal, the longitudinal cross-section of the second sub-through hole 22 be it is wide at the top and narrow at the bottom trapezoidal, then
D2, D3 are respectively upper end opening the widest part size of the first sub-through hole, upper end opening the widest part size of the second sub-through hole, D2,
D3 still meets following relationship: D2=D1+ (0.1~0.5mm), D3=D1- (1~2mm).
In short, in other specific embodiments of sputtering carrier of the invention, the first sub-through hole 21 and the second sub-through hole 22
Aperture size can be set to fixed dimension, Variable rate or irregular size, as long as it can guarantee to sputter
The bottom of product 6 can sink into the first sub-through hole 21, be sufficiently bonded with 51 edge of through-hole of adhesion coating 5 and will not drop out rank
Terraced hole 2.
In the present embodiment, as shown in figure 3, the working face of ontology 1 is equipped with air discharge duct 3, air discharge duct 3 is opened in stepped hole
2 surrounding, and a public air discharge duct 3 between two adjacent stepped holes 2, air discharge duct 3 have predetermined depth, and air discharge duct 3
The side wall of ontology 1 is penetrated through, the side wall that air discharge duct 3 penetrates through ontology 1 arranges the gas in air discharge duct 3 from the side-walls of ontology 1
Out.The predetermined depth of air discharge duct 3 is 1~2mm, and predetermined width is 1~2mm.In addition, being additionally provided with exhaust on the working face of ontology 1
Hole 4, gas vent 4 is laid in the infall of the air discharge duct 3 of two intersections, and gas vent 4 penetrates through the working face of ontology 1 to bottom surface.
Air discharge duct 3 and gas vent 4 avoid adhesion coating from generating bubbling phenomenon for the gas generated in sputtering process to be discharged.
Preferably, the arrangement spacing between stepped hole 2 adjacent on ontology 1 is greater than 3mm.Due to two adjacent stepped holes
An air discharge duct 3 is opened up between 2, the predetermined width of air discharge duct 3 is 1~2mm, is placed on stepped hole 2 when to sputter product 6
Later, in order to guarantee the side to sputter product 6 also will by sputter, on the ontology 1 of sputtering carrier two adjacent stepped holes 2 it
Between should have spacing appropriate.For example, the arrangement spacing between adjacent stepped hole 2 should be greater than 3mm.
Further, as shown in Figure 5 and Figure 6, sputtering carrier further includes an adhesion coating 5, and adhesion coating 5 is adhered to the work of ontology 1
Make on face, adhesion coating 5 offers through-hole 51 at the corresponding position of stepped hole 2 one by one.Specifically, the shape of through holes of adhesion coating 5 with
Chamfered shape to sputter product 6 is identical, and the opening size of the through-hole 51 of adhesion coating 5 is in the overall size to sputter product 6
On the basis of reduce 0.5~2.5mm, adhesion coating 5 with a thickness of 0.1~1.0mm.
In addition, adhesion coating 5 is equipped with the first engraved structure 52 and the second engraved structure 53, the first engraved structure 52 correspondence is set
It is placed in the top of the air discharge duct 3 of ontology 1, the second engraved structure 53 is correspondingly arranged in the top of the gas vent 4 of ontology 1.Due to splashing
The gas that can be generated in plating processing procedure, air discharge duct 3 and gas vent 4 can play the role of exporting gas, 52 He of the first engraved structure
The gas in air discharge duct 3 and gas vent 4 can be effectively discharged in the setting of second engraved structure 53, so as to avoid the production of adhesion coating 5
Raw bubbling phenomenon, realizes better sputter effect.
Certainly, air discharge duct 3 and gas vent 4 can according to need selective setting, correspondingly, the first hollow out of adhesion coating 5
Also the property of can choose is arranged for structure 52 and the second engraved structure 53, for example, when air discharge duct 3 penetrates through the side wall of ontology, air discharge duct 3
In gas can be emptied from the side-walls of ontology, the first engraved structure 51 can be not provided on adhesion coating 5；When on adhesion coating 5
51 when equipped with the first engraved structure, air discharge duct 3 can not penetrate through the side wall of ontology；In addition, the gas that sputter generates can be via
Air discharge duct 3 and gas vent 4 empty, and can also be not provided with the second engraved structure 53 on adhesion coating 5.
Embodiment two
In conjunction with shown in Fig. 2~6, present embodiment discloses a kind of method for sputtering, the sputtering carrier that this method uses is implementation
Sputtering carrier disclosed in example one, method for sputtering include the following steps:
Step S1, one layer of adhesion coating 5, the through-hole on adhesion coating 5 are laid on the working face of the ontology 1 in sputtering carrier
51, the first engraved structure 52 and the second engraved structure 53 respectively with stepped hole 2, air discharge duct 3 and the gas vent 4 on ontology 1 one by one
It is corresponding.
Specifically, it is contemplated that if one whole adhesion coating 5 can be divided by the first engraved structure 52 and the second engraved structure 53
Adhesion coating 5, is posted on the working face of ontology 1 of sputtering carrier by dry small unit for convenience, thus can be in adhesion coating 5
Through-hole 51 is only issued on adhesion coating 5 before putting up, after adhesion coating 5 is puted up, then in air discharge duct 3 and gas vent 4 on adhesion coating 5
Issue the first engraved structure 52 and the second engraved structure 53 in corresponding position.In this way, first is that can guarantee the through-hole on adhesion coating 5
51, the first engraved structure 52 and the second engraved structure 53 respectively with stepped hole 2, air discharge duct 3 and the gas vent 4 on ontology 1 one by one
It is corresponding, quickly and accurately adhesion coating 5 is posted on the working face of ontology 1 of sputtering carrier second is that can realize.
Step S2, it will be placed on the adhesion coating 5 of working face of ontology 1, and make complete to sputter product 6 to sputter product 6
The through-hole 51 of all standing adhesion coating 5.
Step S3, pressing downwards is described to sputter product, so that the bottom to sputter product is fallen into first son logical
Kong Zhong.
Specifically, in step s3, after the bottom of sputter product 6 is fallen into first through hole 21, to sputter product 6
The sidewall edge of bottom is covered by adhesion coating 5, forms sealing.
Profile the widest part size since the through-hole 51 of adhesion coating 5 is opened on the stepped hole 2 of ontology 1, to sputter product 6
D1 therefore can part when by pressure force when sputter product 6 less than upper end opening the widest part dimension D 2 of the first sub-through hole 21
It sink into the first sub-through hole 21, the inner sidewall that the edge of the through-hole 51 of adhesion coating 5 is squeezed meeting to the first sub-through hole 21 is curved
Folding, so that the bottom margin to sputter product 6 be completely covered, and fills up the side wall and the first sub-through hole to 6 bottom of sputter product
Gap between 21 inner sidewall makes sufficiently to press formation sealing to 6 bottom of sputter product and the through-hole edge of adhesion coating 5, keep away
Exempted from sputter ontology 1 and to the gap between 6 bottom of sputter product, thus effectively avoid occurring to overflow in sputter process cross it is existing
As further improve makes the product for completing sputter be not easy to send out as the fines problem caused by crossed to 6 bottom of sputter product of overflowing
Raw PAD short circuit phenomenon.
When the bottom of sputter product 6 is equipped with tin ball 7, step S3 further comprises: treating sputter product 6 and applies downwards
Pressure force, the tin ball 7 to 6 bottom of sputter product can all sink into the first sub-through hole 21, while the through-hole 51 of adhesion coating 5
Edge compression be bent in the first sub-through hole 21, and effectively cover most peripheral tin ball 7 close to the inside of the first sub-through hole 21
The one side of wall, that is to say, that for be equipped with tin ball 7 to sputter product 6, the sputtering carrier in the present embodiment can also be solved effectively
It certainly overflows and crosses phenomenon and bottom fines problem.
Step S4, sputtering process is carried out.
In this method for sputtering, since the ontology 1 of the sputtering carrier of use is equipped with stepped hole 2, to sputter product
After 6 are pressed on adhesion coating 5, sink into the first sub-through hole 21 under bottom, 51 edge of through-hole of adhesion coating is squeezed to
Bent in one sub-through hole 21, adhesion coating 5 be sufficiently bonded with to sputter product 6, adhesion coating 5 and to sputter product 6 it
Between abutting edge substantially without gap, therefore, will not be generated in sputter process overflow cross phenomenon, can also further avoid to
Clast is formed on the bottom of sputter product 6.In addition, when the bottom of sputter product 6 is equipped with multiple tin balls 7, to 6 bottom of sputter product
The tin ball 7 in portion is trapped in first through hole 21, so that the covering of adhesion coating 5 is located at the outside of the tin ball 7 of most peripheral, so as to add
By force to the sealing between sputter product 6 and adhesion coating 5, further avoids overflowing and cross the generation of problem and clast.
It of courses, in other specific embodiments of method for sputtering of the invention, the overall size of through-hole, load on adhesion coating
Have ontology upper shoulder hole size, can root to the relativeness between the exterior contour size and each size of sputter product
According to needing to be adjusted, as long as it can guarantee that adhesion coating can sufficiently fit in bottom margin and the periphery to sputter product
The lateral surface of tin ball.In addition, it is necessary to illustrate, the method for sputtering in the present invention can be applied not only to bottom equipped with tin
Ball to sputter product, can also be applied to bottom not have tin ball to sputter product.
It should be noted that above-described embodiment can be freely combined as needed.The above is only of the invention preferred
Embodiment, it is noted that for those skilled in the art, in the premise for not departing from the principle of the invention
Under, several improvements and modifications can also be made, these modifications and embellishments should also be considered as the scope of protection of the present invention.
Claims (10)
1. a kind of sputtering carrier characterized by comprising
Ontology, the ontology are a slab construction, have the working face being oppositely arranged and bottom surface, and the ontology is equipped with multiple battle arrays
The stepped hole of arrangement is arranged, the stepped hole penetrates through the working face of the ontology to bottom surface, and the stepped hole includes from the work
Face extends to the first sub-through hole and the second sub-through hole that bottom surface is set gradually, and the upper surface of first sub-through hole is the ontology
Working face, the lower end of first sub-through hole converges on the upper surface of second sub-through hole, and first sub-through hole
Lower ending opening size is greater than the upper end opening size of second sub-through hole, and the lower end surface of second sub-through hole is the ontology
Bottom surface；
Adhesion coating, the adhesion coating are adhered on the working face of the ontology, and the adhesion coating is in the corresponding portion of the stepped hole
Position offers through-hole one by one.
2. sputtering carrier according to claim 1, it is characterised in that:
The upper end opening shape of first sub-through hole is identical as the chamfered shape to sputter product, first sub-through hole it is upper
End opening the widest part size extends out 0.1~0.5mm on profile the widest part size basis to sputter product；
The size of upper end opening the widest part of second sub-through hole is smaller by 1 than the widest part size of the profile to sputter product
~2mm；
And/or；
Arrangement spacing on the working face of the ontology between the adjacent stepped hole is greater than 3mm.
3. sputtering carrier according to claim 1, it is characterised in that:
Aperture the widest part size of the through-hole of the adhesion coating is on the basis of profile the widest part size to sputter product
Reduce 0.5~2.5mm；
And/or；
The adhesion coating with a thickness of 0.1~1.0mm.
4. sputtering carrier according to claim 1, it is characterised in that:
The working face of the ontology is equipped with air discharge duct, and the air discharge duct is opened in the surrounding of the stepped hole, and adjacent two
A public air discharge duct between a stepped hole, the air discharge duct have predetermined depth.
5. sputtering carrier according to claim 4, it is characterised in that:
The groove depth of the air discharge duct is 1~2mm, and width is 1~2mm；
And/or；
The air discharge duct penetrates through the side wall of the ontology；
And/or；
The adhesion coating is equipped with the first engraved structure, and first engraved structure is correspondingly arranged in the top of the air discharge duct.
6. sputtering carrier according to claim 4, it is characterised in that:
Gas vent is additionally provided on the working face of the ontology, the gas vent is laid in the infall of the air discharge duct of two intersections,
And the gas vent penetrates through the working face of the ontology to bottom surface.
7. sputtering carrier according to claim 6, it is characterised in that:
The adhesion coating is equipped with the second engraved structure, and second engraved structure is correspondingly arranged in the top of the gas vent.
8. a kind of method for sputtering, which is characterized in that its sputtering carrier used splashes to be described in any one of claims 1 to 6
Carrier is plated, comprising steps of
S1, one layer of adhesion coating is laid on the working face of the ontology in the sputtering carrier, by institute preset on the adhesion coating
Through-hole, first engraved structure and second engraved structure are stated respectively and on the working face of the ontology of the sputtering carrier
Stepped hole, air discharge duct and gas vent correspond；
S2, it will be placed on to sputter product on the adhesion coating, and make the bottom to sputter product that the adhesion be completely covered
The through-hole of layer；
S3, downwards pressing are described to sputter product, fall into the bottom to sputter product in first sub-through hole；
S4, sputtering process is carried out.
9. method for sputtering as claimed in claim 8, it is characterised in that:
In the step S3, described after the bottom of sputter product is fallen into the first through hole, it is described to sputter product
Bottom margin covered by the adhesion coating.
10. method for sputtering as claimed in claim 8, it is characterised in that:
The bottom to sputter product is equipped with multiple tin balls, and the step S3 further comprises:
Apply pressure force to sputter product to described, so that the tin ball to sputter product bottom is sunk completely to described first and lead to
Kong Zhong, and the lateral surface for being located at the tin ball of most peripheral is covered by the adhesion coating.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111411331A (en) * | 2020-02-17 | 2020-07-14 | 深圳市海铭德科技有限公司 | Jig splicing structure for chip coating process |
| CN114577506A (en) * | 2020-11-30 | 2022-06-03 | 核工业理化工程研究院 | Sampling device and sampling method for vacuum coating sample |
| CN115074808A (en) * | 2021-03-16 | 2022-09-20 | 江苏长电科技股份有限公司 | Electroplating carrying platform for placing packaging assembly and electroplating method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101492810A (en) * | 2008-01-25 | 2009-07-29 | 中芯国际集成电路制造(上海)有限公司 | Wafer support assembly |
| CN102157664A (en) * | 2011-01-13 | 2011-08-17 | 江苏永兴多媒体有限公司 | LED (light-emitting diode) lamp panel adopting sputtering circuit and production method thereof |
| CN103805950A (en) * | 2012-11-02 | 2014-05-21 | 矽品精密工业股份有限公司 | Clamp for sputtering process and method for sputtering semiconductor package |
| CN105826211A (en) * | 2016-05-11 | 2016-08-03 | 苏州日月新半导体有限公司 | Semiconductor product, and tool and method for manufacturing the semiconductor product |
| CN107675139A (en) * | 2017-11-13 | 2018-02-09 | 赫得纳米科技(昆山)有限公司 | Coating apparatus and film plating process |
-
2018
- 2018-08-21 CN CN201810956936.XA patent/CN109055912B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101492810A (en) * | 2008-01-25 | 2009-07-29 | 中芯国际集成电路制造(上海)有限公司 | Wafer support assembly |
| CN102157664A (en) * | 2011-01-13 | 2011-08-17 | 江苏永兴多媒体有限公司 | LED (light-emitting diode) lamp panel adopting sputtering circuit and production method thereof |
| CN103805950A (en) * | 2012-11-02 | 2014-05-21 | 矽品精密工业股份有限公司 | Clamp for sputtering process and method for sputtering semiconductor package |
| CN105826211A (en) * | 2016-05-11 | 2016-08-03 | 苏州日月新半导体有限公司 | Semiconductor product, and tool and method for manufacturing the semiconductor product |
| CN107675139A (en) * | 2017-11-13 | 2018-02-09 | 赫得纳米科技(昆山)有限公司 | Coating apparatus and film plating process |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111411331A (en) * | 2020-02-17 | 2020-07-14 | 深圳市海铭德科技有限公司 | Jig splicing structure for chip coating process |
| CN111411331B (en) * | 2020-02-17 | 2022-05-10 | 深圳市海铭德科技有限公司 | Jig splicing structure for chip coating process |
| CN114577506A (en) * | 2020-11-30 | 2022-06-03 | 核工业理化工程研究院 | Sampling device and sampling method for vacuum coating sample |
| CN115074808A (en) * | 2021-03-16 | 2022-09-20 | 江苏长电科技股份有限公司 | Electroplating carrying platform for placing packaging assembly and electroplating method |
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