CN107675139A - Coating apparatus and film plating process - Google Patents
Coating apparatus and film plating process Download PDFInfo
- Publication number
- CN107675139A CN107675139A CN201711118432.2A CN201711118432A CN107675139A CN 107675139 A CN107675139 A CN 107675139A CN 201711118432 A CN201711118432 A CN 201711118432A CN 107675139 A CN107675139 A CN 107675139A
- Authority
- CN
- China
- Prior art keywords
- tool
- coating apparatus
- plated film
- madial wall
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating Apparatus (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a kind of coating apparatus and film plating process, it is related to the technical field of plated film, including tool and supporting mechanism；Tool is covered in the madial wall for the substrate package for needing plated film, and tool is detachably connected with madial wall；The tool for connecting the substrate package of plated film in need hang on supporting mechanism, and Coating Materials splash is to madial wall during for preventing plated film.Coating apparatus and film plating process provided by the invention can effectively avoid AF thin-film materials from overflowing and be plated to housing interior side-wall, solve the problems, such as that the subsequent technique caused by plating of overflowing is difficult and conductive bad, and coating apparatus is simple in construction, flexibility and reliability.
Description
Technical field
The present invention relates to coating technique field, more particularly, to a kind of coating apparatus and film plating process.
Background technology
Resistance and fingerprint resistance film (AF Coating) is mainly used in consumption electronic product shell and panel field, can be attached to gold
The substrate surface such as category, glass and ceramics, its main function be play reduce fingerprint residual, be easy to remove surface it is dirty, anti-
Only base material oxide etch and lifting product sense of touch.Because dark appearance product (especially black) is with the steady perception of its low-key
Pursuing for consumer is obtained, but fingerprint is easier to show in dark colored surface, so, AF films obtain widely in such product
Use.Meanwhile dark metal shell (based on anodised aluminium), due to big surface friction coefficient (0.6~0.7), feel is thick
Rough, AF films can play a part of reducing coefficient of friction (0.2 or so), lifting sense of touch.
Because AF thin-film material surfaces can be low, therefore all surfaces for being coated with AF films will be difficult to be adhered to by adhesive.AF is plated
After membrane process is typically disposed in shell completion of processing (including shaping, anode, dyeing and sealing of hole etc.), relevant internal components are not organized vertical
Before, and many components need to be adhered on the inside of shell by adhesive.Meanwhile conductiving point is also often accompanied by the inside of shell, and AF is plated
SiO required in membrane process2Film is insulating materials, once being plated to inner side, will be caused conductive bad.Therefore, how in AF
Coating process controls coating film area, and preventing from overflowing is plated on the inside of shell, turns into one of AF plated film key technologies.
The content of the invention
It is an object of the invention to provide a kind of coating apparatus and film plating process, can effectively avoid AF thin-film materials from overflowing and plate
It is simple in construction, flexibly may be used on the inside of shell, solving the problems, such as because the subsequent technique caused by plating of overflowing is difficult and conduction is bad
Lean on.
To achieve the above object, the present invention provides following technical scheme：
In a first aspect, the present invention provides a kind of coating apparatus, including：Tool and supporting mechanism；
The tool is covered in the madial wall for the substrate package for needing plated film, and the tool and the madial wall are detachable
Connection；
The tool for being connected with the substrate package for needing plated film hang on the supporting mechanism, for preventing plated film
When Coating Materials splash to the madial wall.
Further, the tool designs with the shape, and the knot of the madial wall of substrate package of the design structure with needing plated film
Structure matches.
Further, the periphery of the tool is provided with the groove with the madial wall grafting of the substrate package.
Further, the middle part of the tool is engraved structure.
Further, the tool is provided with reinforcement, and the reinforcement is connected to the relative both sides of the engraved structure.
Further, the reinforcement is provided with multiple hollow holes.
Further, the supporting mechanism is roller, and the roller can be around the own axis of vertical direction, to drive
The tool and the substrate package for needing plated film being connected on the tool together rotate.
Further, the side of the roller is that multiple planes are formed by connecting.
Further, the tool hang on the plane of the roller, and the plane is more than the substrate for needing plated film
Shell.
Further, the plane of the roller is provided with multiple mounting holes for being used to hang the tool.
Further, the both ends of the roller are respectively provided with the projection of the cylinder support.
Second aspect, the present invention also provide a kind of film plating process, including：
The madial wall for the substrate package for needing plated film is connected to tool, so that tool covering needs the substrate package of plated film
Madial wall；
Tool is hung on supporting mechanism；
Coating Materials is sprayed in the outside of the substrate package for needing plated film.
Coating apparatus and film plating process provided by the invention have the advantages that：
First aspect present invention provides a kind of coating apparatus, including：Tool and supporting mechanism；Tool, which is covered in, needs plated film
Substrate package madial wall, and tool is detachably connected with madial wall；The tool for connecting the substrate package of plated film in need is hung
Located at supporting mechanism, Coating Materials splash is to madial wall during for preventing plated film.
It can be overflow for AF thin-film materials and be plated to the medial surface of substrate package, cause subsequent technique to be difficult to carry out, caused simultaneously
The problem of conductive bad, in the coating apparatus that first aspect present invention provides, it is covered in using tool outside the substrate for needing plated film
The madial wall of shell, the tool for connecting the substrate package of plated film in need hang on supporting mechanism, effectively prevent AF thin-film materials
Overflow through housing perimeter and be plating to housing interior side-wall, influence subsequent technique.During plated film, tool side is connected with shell opposite side and hung on
In supporting construction, because tool together with supporting mechanism covers housing interior side-wall, in coating process, the appearance of shell is only existed
At the time of the face target of face, now sputtering particle can not enter the madial wall of shell through the gap shell and tool, have
Effect avoid AF thin-film materials overflow be plated to housing interior side-wall, and can effectively control coating film area and overflow plating depth.
The coating apparatus that first aspect present invention provides can effectively avoid AF thin-film materials from overflowing and be plated to housing interior side-wall, solve
Determine due to the subsequent technique caused by plating of overflowing is difficult and conduction is bad the problem of, simple in construction, flexibility and reliability.
The coating apparatus that the film plating process that second aspect of the present invention provides mainly provides using first aspect present invention is to outer
Shell etc. carries out AF plated films and directly hung over compared to shell in the prior art on hanger, effectively prevent AF films material in coating process
Material, which overflows, is plated to housing interior side-wall, and the perfect key technology of AF plated films, the development to follow-up coating technique are significant.
Brief description of the drawings
, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical scheme of the prior art
The required accompanying drawing used is briefly described in embodiment or description of the prior art, it should be apparent that, in describing below
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before creative work is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of coating apparatus provided in an embodiment of the present invention；
Fig. 2 is the structural representation of tool provided in an embodiment of the present invention；
Fig. 3 is the structural representation of tool provided in an embodiment of the present invention and substrate；
Fig. 4 is the structural representation of roller provided in an embodiment of the present invention.
Icon：100- tools；200- supporting mechanisms；300- substrate packages；101- void regions；102- hollow holes；103-
Screw positioning hole；110- grooves；120- reinforcements；210- rollers；201- mounting holes.
Embodiment
Technical scheme is clearly and completely described below in conjunction with accompanying drawing, it is clear that described implementation
Example is part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
In the description of the invention, it is necessary to explanation, term " " center ", " on ", " under ", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " interior ", " outer " be based on orientation shown in the drawings or position relationship, merely to
Be easy to the description present invention and simplify description, rather than instruction or imply signified device or element must have specific orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.In addition, term " first ", " second ",
" the 3rd " is only used for describing purpose, and it is not intended that instruction or hint relative importance.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection；Can be joined directly together, can also be indirectly connected by intermediary, Ke Yishi
The connection of two element internals.For the ordinary skill in the art, with concrete condition above-mentioned term can be understood at this
Concrete meaning in invention.
The embodiment of the present invention is described in detail below in conjunction with accompanying drawing.It should be appreciated that this place is retouched
The embodiment stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
Fig. 1, Fig. 2, Fig. 3 and Fig. 4 are refer to, below in conjunction with accompanying drawing to coating apparatus provided in an embodiment of the present invention and plating
Film method elaborates.
It can be overflow for AF films and be plated to housing interior side-wall, cause subsequent technique to be difficult to carry out, while caused conductive bad
Problem, embodiments of the invention provide a kind of coating apparatus, and the coating apparatus can effectively control coating film area and plating depth of overflowing.
The producing cause of the excessive plating of analysis after tested, and layer is not thought afterwards, for plating SiO2Plating of overflowing afterwards causes conductive bad
Problem, larger mainly due to target particle energy in magnetron sputtering membrane process, in product casing edge, sputtering particle is through " anti-
Penetrate " after fall wall inside the shell, and be deposited on housing interior side-wall.Meanwhile in coating process, product is with hanger together true
Public rotation in cavity body, at the time of having face target inside product casing, now sputtering particle may pass through shell and hanger
Seam crossing and enter madial wall, the excessive plating depth caused by this kind of reason is up to 1-3cm, to cause conductive bad main original
Cause.And it is poor for adhesion caused by plating of being overflow after evaporation AF films, the problem of vertical can not be subsequently organized, mainly due to deposition material
Among vacuum cavity, and product casing does public spinning motion with hanger around it, also has housings face evaporation material
At the time of material, deposition material is caused to be deposited on the inside of shell.
To solve the problems, such as above-mentioned key problem in technology, the embodiment of first aspect present invention provides a kind of coating apparatus, including：
Tool 100 and supporting mechanism 200；
Tool 100 is covered in the madial wall for the substrate package 300 for needing plated film, and tool 100 detachably connects with madial wall
Connect；
The tool 100 for connecting the substrate package 300 of plated film in need hang on supporting mechanism 200, during for preventing plated film
Coating Materials splash is to madial wall.
In the coating apparatus that the embodiment of first aspect present invention provides, the base for needing plated film is covered in using tool 100
The madial wall of plate shell 300, the tool 100 for connecting the substrate package 300 of plated film in need hang on supporting mechanism 200, effectively
Avoid AF thin-film materials and be plating to housing interior side-wall through housing perimeter is excessive, influence subsequent technique.During plated film, the side of tool 100 connects
Shell opposite side is connected to hang in supporting construction, because tool 100 together with supporting mechanism 200 covers housing interior side-wall,
In coating process, at the time of only existing the outer surface face target of shell, now sputtering particle can not pass through shell and tool 100
Between gap enter the madial wall of shell, effectively prevent AF thin-film materials and overflow and be plated to housing interior side-wall, and can be effective
Control coating film area and overflow and plate depth.
Tool 100 is elaborated below：
In the present embodiment, tool 100 designs with the shape, and the madial wall of substrate package 300 of the design structure with needing plated film
Structure match.The interior side contacts of substrate package 300 of the tool 100 with needing plated film in the coating apparatus that the present embodiment provides
Face is adapted, and tool 100 is close to the madial wall of substrate package 300, and the two gap is less than 0.1mm.
In the alternative of the present embodiment, further, the periphery of tool 100 is provided with the inner side with substrate package 300
The groove 110 of wall grafting.The periphery of substrate package 300 may be inserted into groove 110, the outboard sidewalls of shell edge respectively with groove
110 two side walls contact, it effectively prevent AF thin-film materials and be plating to through housing perimeter is excessive on the inside of shell, influence subsequent technique.
In the alternative of the present embodiment, further, the weight of tool 100 is being considered to supporting mechanism 200
Burden and overflow plating depth be less than 3cm, inner side center section does not have plating of overflowing, and above-mentioned tool 100 is done into hollow processing,
To mitigate the weight of tool 100.In the present embodiment, the middle part of tool 100 is engraved structure.Specifically, set on tool 100
There is void region 101, void region 101 can mitigate the weight of tool 100.
In the alternative of the present embodiment, further, tool 100 is provided with reinforcement 120, and reinforcement 120 connects
In the relative both sides of engraved structure.The tool 100 that the present embodiment provides is provided with reinforcement 120, avoids because hollow processing is led
Tool 100 is caused to be easily damaged.The middle part of tool 100 is engraved structure, and reinforcement 120 is connected to the relative both sides of engraved structure.
In the alternative of the present embodiment, further, reinforcement 120 is provided with multiple hollow holes 102.Hollow hole
102 design is easy to mitigate the weight of tool 100, and then mitigates the load of supporting mechanism 200.
In the alternative of the present embodiment, the material of tool 100 includes but is not limited to：Makrolon material or Asia gram
Dead-wood material.Makrolon abbreviation PC, also known as PC plastic.PC has advantages below：High intensity and coefficient of elasticity, high impact,
Use temperature range is wide；Heigh clarity and free dyeability；Shaping shrinkage rate is low, dimensional stability is good；Weatherability is good；Electricity
Gas characteristic is excellent, excellent insulating property, and moist, high temperature can also keep electric performance stablity, is manufacture electronics, the preferable material of electric parts
Material, dielectric coefficient：3.0-3.2, arc resistance：120s.Acrylic is called PMMA or lucite, and acrylic board has splendid
Weatherability, higher case hardness and lustrous surface, and preferable high-temperature behavior.Acrylic board has good processing characteristics,
Both thermoforming, the mode that can also be machined into can be used.The wearability of acrylic board approaches with aluminium, and stability is good, resistance to
Multi-chemical corrodes.
Supporting mechanism 200 is elaborated below：
In the present embodiment, supporting mechanism 200 is roller 210, roller 210 can around the own axis of vertical direction, with
Tool 100 and the substrate package 300 for needing plated film being connected on tool 100 is driven together to rotate.Further to suppress shell
Overflow and plate caused by during the face Coating Materials of the inside, hanger of the prior art is changed to the form of roller 210, roller in the present embodiment
210 with tool 100 coordinate effectively prevent overflow plating phenomenon occur.
In the present embodiment, the side of roller 210 is formed by connecting for multiple planes.It can hang and control in plurality of plane
Tool 100.
In the present embodiment, tool 100 hang on the plane of roller 210, and plane is more than the substrate package 300 for needing plated film.
, it is necessary to which the substrate package 300 of plated film is connected on tool 100 in above-mentioned alternative, tool 100 is hung on roller 210
Plane.When the hollow out of tool 100 designs, the plane of roller 210 can block the madial wall of substrate package 300, prevent substrate package
At the time of 300 the inside face target, Coating Materials can cause plating of overflowing by the engraved structure at the middle part of tool 100 into housings
The appearance of phenomenon.
In the present embodiment, the plane of roller 210 is provided with multiple mounting holes 201 for being used to hang tool 100.Tool 100
Screw positioning hole 103 is provided with for the fixation with roller 210.Screw positioning hole 103 can be located at the edge of tool 100.Rolling
In 210 planes of cylinder can regular perforate, tool 100 can be connected by screw with the mounting hole 201 opened in the plane of roller 210
Connect.
In the present embodiment, the both ends of roller 210 are respectively provided with the projection for supporting roller 210.Specifically, roller
210 upper and lower side is provided with projection, for roller 210 to be fixed and support.
In the alternative of the present embodiment, the material of roller 210 includes but is not limited to：Common iron or stainless steel
Material.More preferably, the roller 210 of stainless steel has the advantage that compared to the roller 210 of other materials：The weight of stainless steel drum 210
Amount is relatively light, the heat-resisting quantity of stainless steel drum 210, good corrosion resistance；It is good that stainless steel drum 210 is wear-resistant；Stainless steel drum 210 is anti-
Draw performance, lateral pressure resistant strong.
The embodiment of second aspect of the present invention provides a kind of film plating process, including：
The madial wall for the substrate package 300 for needing plated film is connected to tool 100, so that the covering of tool 100 needs plated film
Substrate package 300 madial wall；
Tool 100 is hung on supporting mechanism 200；
Coating Materials is sprayed in the outside for the substrate package 300 for needing plated film.
The film plating process that the embodiment of second aspect of the present invention provides mainly carries using the embodiment of first aspect present invention
The coating apparatus of confession carries out AF plated films to shell etc. and directly hung over compared to shell in the prior art on hanger, effectively prevent plating
AF thin-film materials, which overflow, in membrane process is plated to housing interior side-wall, the perfect key technology of AF plated films, to the hair of follow-up coating technique
Exhibition is significant.
After product casing and tool 100 are fastened, tool 100 is hung on roller 210, then carries out AF plated films, plated film
After the completion of using dyne test shell on the inside of, whether shrink to be used as using dyne pen print and judge that AF overflows the standard of plating.In addition, use
Resistance between ohmmeter test product inner conductive point, as judgement SiO2The standard of excessive plating.
Do not find that AF overflows through a dyne pen test, on the inside of shell and plate phenomenon；
Tested through ohmmeter, resistance is 3 ohm between conductiving point before plated film, and resistance is 3 ohm after plated film, and SiO does not occur2Overflow
Plating.
Therefore, using tool 100 produced by the film plating process that roller 210 is combined can be solved effectively in AF coating process
Excessive plating problem.
The coating apparatus and film plating process of the present invention are illustrated above, still, the present invention is not limited to above-mentioned tool
The embodiment of body, without departing from the scope of claim, various deformations or change can be carried out.The present invention includes
Various modifications within the scope of the claims and change.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
Invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：It is still
Technical scheme described in foregoing embodiments can be modified, either which part or all technical characteristic are carried out
Equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technical side
The scope of case.
Claims (12)
- A kind of 1. coating apparatus, it is characterised in that including：Tool (100) and supporting mechanism (200)；The tool (100) is covered in the madial wall for the substrate package (300) for needing plated film, and the tool (100) with it is described Madial wall is detachably connected；The tool (100) for being connected with the substrate package (300) for needing plated film hang on the supporting mechanism (200), Coating Materials splash is to the madial wall during for preventing plated film.
- 2. coating apparatus according to claim 1, it is characterised in that the tool (100) is designed with the shape, and design structure Match with the structure of the madial wall for the substrate package (300) for needing plated film.
- 3. coating apparatus according to claim 2, it is characterised in that the periphery of the tool (100) is provided with and the base The groove (110) of the madial wall grafting of plate shell (300).
- 4. coating apparatus according to claim 1, it is characterised in that the middle part of the tool (100) is engraved structure.
- 5. coating apparatus according to claim 4, it is characterised in that the tool (100) is provided with reinforcement (120), The reinforcement (120) is connected to the relative both sides of the engraved structure.
- 6. coating apparatus according to claim 5, it is characterised in that the reinforcement (120) is provided with multiple hollow holes (102)。
- 7. coating apparatus according to claim 1, it is characterised in that the supporting mechanism (200) is roller (210), institute Stating roller (210) can be around the own axis of vertical direction, to drive the tool (100) and be connected to the tool (100) substrate package (300) for needing plated film on together rotates.
- 8. coating apparatus according to claim 7, it is characterised in that the side of the roller (210) connects for multiple planes Connect and form.
- 9. coating apparatus according to claim 8, it is characterised in that the tool (100) hang on the roller (210) Plane, the plane is more than the substrate package (300) for needing plated film.
- 10. coating apparatus according to claim 8, it is characterised in that the plane of the roller (210) is provided with multiple use In the mounting hole (201) for hanging the tool (100).
- 11. coating apparatus according to claim 7, it is characterised in that the both ends of the roller (210) are respectively provided with The projection that the roller (210) is supported.
- A kind of 12. film plating process, it is characterised in that including：The madial wall for the substrate package (300) for needing plated film is connected to tool (100), so that tool (100) covering needs to plate The madial wall of the substrate package (300) of film；Tool (100) is hung on supporting mechanism (200)；Coating Materials is sprayed in the outside of the substrate package (300) for needing plated film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711118432.2A CN107675139B (en) | 2017-11-13 | 2017-11-13 | Film coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711118432.2A CN107675139B (en) | 2017-11-13 | 2017-11-13 | Film coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107675139A true CN107675139A (en) | 2018-02-09 |
| CN107675139B CN107675139B (en) | 2020-02-07 |
Family
ID=61146542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711118432.2A Active CN107675139B (en) | 2017-11-13 | 2017-11-13 | Film coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107675139B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109055912A (en) * | 2018-08-21 | 2018-12-21 | 环旭电子股份有限公司 | A kind of sputtering carrier and method for sputtering |
| CN114381697A (en) * | 2022-01-10 | 2022-04-22 | 昆山市杰尔电子科技股份有限公司 | Notebook casing new generation can prevent AF filming equipment of fingerprint interference |
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| CN207452243U (en) * | 2017-11-13 | 2018-06-05 | 赫得纳米科技(昆山)有限公司 | Coating apparatus |
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| CN202430282U (en) * | 2012-01-13 | 2012-09-12 | 广东志成冠军集团有限公司 | Novel fixture for magnetron sputtering coating substrate |
| CN104120384A (en) * | 2013-04-28 | 2014-10-29 | 天津富可达塑胶制品加工有限公司 | Anti-evaporation shield jig structure |
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| CN114381697A (en) * | 2022-01-10 | 2022-04-22 | 昆山市杰尔电子科技股份有限公司 | Notebook casing new generation can prevent AF filming equipment of fingerprint interference |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107675139B (en) | 2020-02-07 |
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