CN101376974A - Vacuum sputtering EMI film and electrophoresis combined coating technology for processing micro-arc oxidation workpiece - Google Patents
Vacuum sputtering EMI film and electrophoresis combined coating technology for processing micro-arc oxidation workpiece Download PDFInfo
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- CN101376974A CN101376974A CNA2007101313709A CN200710131370A CN101376974A CN 101376974 A CN101376974 A CN 101376974A CN A2007101313709 A CNA2007101313709 A CN A2007101313709A CN 200710131370 A CN200710131370 A CN 200710131370A CN 101376974 A CN101376974 A CN 101376974A
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- arc oxidation
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- oxidation workpiece
- emi
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Abstract
The invention provides a process of micro arc oxidized work piece vacuum EMI film sputtering and electrophoretic coating, which comprises the following procedures: base material selection -> base plate surface pre-treatment -> micro arc oxidation -> EMI film sputtering -> electrophoretic coating; first, a selected base material receive surface pre-treatment and micro arc oxidation treatment, to obtain a micro arc oxidized work piece; the micro arc oxidized work piece is cleaned and coated with a metal layer by EMI sputtering, so that the surface of the micro arc oxidation work piece is EMI resistant and conductive; the conductive micro arc oxidized work piece receives electrophoretic coating; the process has simple procedures, high yield, and very good application prospect because the work piece treated by the process has the effect of ceramics, color transparency and EMI resistance.
Description
[technical field]
The relevant a kind of micro-arc oxidation workpiece surface processing technique of the present invention, and be particularly to a kind of technology that adopts vacuum sputtering EMI film and electrophoresis combined coating that micro-arc oxidation workpiece is processed.
[background technology]
Differential arc oxidization technique is simple with its technology, efficient is high, pollution-free, characteristics such as processing power is strong, is developed rapidly.(Microarc oxidation MAO) is the abbreviation of microplasma surface ceramic deposition technology to differential arc oxidization technique, and development both at home and abroad in recent years is a new and high technology faster.MAO generates fine intensified ceramic film in the workpiece surface original position with metal such as Mg, Al, Ti, Zr, Ta, Nb or its alloy (being referred to as Valve Metal).This technology is a metal surface properties modification technology with wide application prospect.
As everyone knows, during being applied to produce, most micro-arc oxidation workpiece often needs to reprocess as EMI suppression (Electromagnetic Interference is translated into electromagnetic interference) processing, application processing etc., existing EMI technology adopts the galvanized mode of water that problem of environment pollution caused is arranged, and traditional application techniques mainly contains the application of modes such as spraying, static, powder, but inevitable problem of environmental pollution is arranged all aspect environmental protection, as adopt air blowing type spray gun painting operation, not only waste paint but also operating efficiency are low.
In view of this, be necessary to develop a kind of complete processing of micro-arc oxidation workpiece in fact, the complete processing processing procedure of this micro-arc oxidation workpiece is simple, production is high and make processing work have pottery, saturating coloured silk and EMI suppression effect concurrently.
[summary of the invention]
The object of the invention is to provide a kind of complete processing of micro-arc oxidation workpiece, and the complete processing processing procedure of this micro-arc oxidation workpiece is simple, production is high and make processing work have pottery, saturating coloured silk and EMI suppression effect concurrently.
For achieving the above object, the invention provides a kind of micro-arc oxidation workpiece vacuum sputtering EMI film and electrophoresis combined coating technology for processing, its technical process is: selected base material → substrate surface pre-treatment → differential arc oxidation processing → EMI sputter processing → electrophoretic painting is handled; Wherein:
The substrate surface pre-treatment is handled selected base material through degreasing, ultrasonic cleaning, oven dry;
Differential arc oxidation is handled, and will put into electrolytic solution through the base material of surperficial pre-treatment, carries out surface by micro-arc oxidation and handles, and makes this base material generate micro-arc oxidation workpiece, and with this micro-arc oxidation workpiece surface cleaning, and oven dry;
Sputtering EMI film is handled, with plating metal level by the vacuum splashing and plating processing on the micro-arc oxidation workpiece surface, so that the micro-arc oxidation workpiece surface has electroconductibility and EMI suppression effect;
Electrophoretic painting is handled, and the micro-arc oxidation workpiece that tool is conducted electricity carries out the electrophoretic painting processing, separates out even, the insoluble coating of water on the micro-arc oxidation workpiece surface.
Especially, but described selected base material can be metal or its alloy of passivation such as Al, Mg, Ti;
Especially, it is anode that described differential arc oxidation is handled selected metal base, and stainless steel or stereotype are negative electrode, and by processing parameters such as control voltage and times, generating thickness on metallic substrate surface is 3～20 μ m ceramic layers;
Especially, it is to plate Cu metal conducting layer and SUS protective layer on micro-arc oxidation workpiece that described EMI sputter is handled, this SUS protective layer is used to prevent that the Cu metal is oxidized, and Cu metallic conduction layer thickness is 0.5～1 μ m, the SUS overcoat thickness is 0.1～0.3 μ m, and this moment, micro-arc oxidation workpiece possessed EMI suppression and electroconductibility;
Especially, described electrophoretic painting processing is the micro-arc oxidation workpiece with tool electroconductibility, be immersed in and be equipped with in the electrophoretic paint trough as anode (or negative electrode), in groove, establish corresponding negative electrode (or anode) in addition, direct current at the logical certain hour of two interpolars, on the micro-arc oxidation workpiece surface, separate out even, the insoluble coating of water, and coat-thickness is 0.1～10 μ m.
Compared to prior art, the invention provides a kind of micro-arc oxidation workpiece vacuum sputtering EMI film and electrophoresis combined coating technology for processing, effectively in conjunction with the advantage of vacuum sputtering EMI processing procedure and electrophoresis application technique, on micro-arc oxidation workpiece, obtain having concurrently the aesthetic coating of ceramic effect and EMI effect, have good application prospects.
For purpose of the present invention, technical process and function thereof are had further understanding, conjunction with figs. is described in detail as follows now:
[description of drawings]
Fig. 1 is the process flow sheet of micro-arc oxidation workpiece vacuum sputtering EMI film and electrophoresis combined coating technology for processing one preferred embodiment of the present invention.
[embodiment]
See also Fig. 1, be the process flow sheet of micro-arc oxidation workpiece vacuum sputtering EMI film and electrophoresis combined coating technology for processing one preferred embodiment of the present invention.
As schematically shown in Figure 1, this technical process is:
Step 101, selected base material, but this base material can be metal or its alloy of passivation such as Al, Mg, Ti, selected aluminum alloy base material in the present embodiment;
Step 102, the substrate surface pre-treatment, aluminum alloy base material is through degreasing, ultrasonic cleaning, oven dry, and is stand-by;
Step 103, differential arc oxidation is handled, and will clean the back aluminum alloy base material and put into electrolytic solution, and metal base is an anode, and stainless steel is a negative electrode, carries out differential arc oxidation and handles.By processing parameters such as control voltage and times, generating thickness on Al alloy base material surface is 3～20 μ m ceramic layers, makes this Al alloy base material generate micro-arc oxidation workpiece; And with this micro-arc oxidation workpiece at ultrasonic cleaning 5 ~ 10min, dry stand-by;
Step 104, sputtering EMI film is handled, on micro-arc oxidation workpiece, plate Cu metal conducting layer and SUS protective layer, this SUS protective layer is used to prevent that the Cu metal is oxidized, and Cu metallic conduction layer thickness is 0.5～1 μ m, the SUS overcoat thickness is 0.1～0.3 μ m, and this moment, micro-arc oxidation workpiece possessed EMI suppression and electroconductibility;
Step 105, electrophoretic painting is handled, micro-arc oxidation workpiece with the tool conduction, be immersed in and be equipped with in the electrophoretic paint trough as anode (or negative electrode), and in groove, establish corresponding negative electrode (or anode) in addition, at the direct current of the logical certain hour of two interpolars, on the micro-arc oxidation workpiece surface, separate out even, the insoluble coating of water, and coat-thickness is 0.1～10 μ m.Utilize the covering property of electrophoretic painting can product bent angle and the application of hole position is complete.
Compared to prior art, micro-arc oxidation workpiece vacuum sputtering EMI film and electrophoresis combined coating technology for processing of the present invention has the following advantages:
1. processing procedure and technology are simple, the production height;
2. enhance productivity, save the coating expense;
3. environmental protection: produce hardly any discarded object, environment facies are worked as friendly;
4. the coating densification is attractive in appearance, has pottery and EMI effect concurrently.
Claims (6)
1, a kind of micro-arc oxidation workpiece vacuum sputtering EMI film and electrophoresis combined coating technology for processing, it is characterized in that: this technical process is:
Selected base material;
The substrate surface pre-treatment is handled selected base material through degreasing, ultrasonic cleaning, oven dry;
Differential arc oxidation is handled, and will put into electrolytic solution through the base material of surperficial pre-treatment, carries out surface by micro-arc oxidation and handles, and makes this base material generate micro-arc oxidation workpiece, and with this micro-arc oxidation workpiece surface cleaning, and oven dry;
Sputtering EMI film is handled, with plating metal level by the vacuum splashing and plating processing on the micro-arc oxidation workpiece surface, so that the micro-arc oxidation workpiece surface has electroconductibility and EMI suppression effect;
Electrophoretic painting is handled, and the micro-arc oxidation workpiece that tool is conducted electricity carries out the electrophoretic painting processing, separates out even, the insoluble coating of water on the micro-arc oxidation workpiece surface.
2, micro-arc oxidation workpiece vacuum sputtering EMI film and electrophoresis combined coating technology for processing according to claim 1 is characterized in that: but described selected base material can be metal or its alloy of passivation such as Al, Mg, Ti.
3, micro-arc oxidation workpiece vacuum sputtering EMI film and electrophoresis combined coating technology for processing according to claim 1, it is characterized in that: it is anode that described differential arc oxidation is handled selected metal base, stainless steel or stereotype are negative electrode, by processing parameters such as control voltage and times, generating thickness on metallic substrate surface is 3～20 μ m ceramic layers.
4, micro-arc oxidation workpiece vacuum sputtering EMI film and electrophoresis combined coating technology for processing according to claim 1, it is characterized in that: it is to plate Cu metal conducting layer and SUS protective layer on micro-arc oxidation workpiece that described EMI sputter is handled, this SUS protective layer is used to prevent that the Cu metal is oxidized, and this moment, micro-arc oxidation workpiece possessed EMI suppression and electroconductibility.
5, micro-arc oxidation workpiece vacuum sputtering EMI film and electrophoresis combined coating technology for processing according to claim 1, it is characterized in that: described electrophoretic painting processing is the micro-arc oxidation workpiece with tool electroconductibility, be immersed in and be equipped with in the electrophoretic paint trough as anode (or negative electrode), in groove, establish corresponding negative electrode (or anode) in addition, direct current at the logical certain hour of two interpolars, separate out even, the insoluble coating of water on the micro-arc oxidation workpiece surface, coat-thickness is 0.1～10 μ m.
6, micro-arc oxidation workpiece vacuum sputtering EMI film and electrophoresis combined coating technology for processing according to claim 4, it is characterized in that: it is 0.5～1 μ m that described EMI sputter is handled the Cu metallic conduction layer thickness that is plated on the micro-arc oxidation workpiece, and the SUS overcoat thickness is 0.1～0.3 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101313709A CN101376974A (en) | 2007-08-28 | 2007-08-28 | Vacuum sputtering EMI film and electrophoresis combined coating technology for processing micro-arc oxidation workpiece |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101313709A CN101376974A (en) | 2007-08-28 | 2007-08-28 | Vacuum sputtering EMI film and electrophoresis combined coating technology for processing micro-arc oxidation workpiece |
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| CN101376974A true CN101376974A (en) | 2009-03-04 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104589459A (en) * | 2015-01-05 | 2015-05-06 | 中国东方电气集团有限公司 | Weight control method for electrophoretic deposition ceramic green body |
| CN104928678A (en) * | 2015-05-15 | 2015-09-23 | 佳木斯大学 | Method for preparing micro-nano-structured magnesium titanate active function coating layer on surface of titanium-contained test piece and application |
| CN109628980A (en) * | 2018-11-07 | 2019-04-16 | 研精舍(上海)精密机械加工有限公司 | A kind of electrophoresis coating technique of magnesium alloy appearance part |
| CN113684519A (en) * | 2021-08-23 | 2021-11-23 | 泰兴市华盛银洋新材料科技有限公司 | Process for machining micro-arc oxidized workpiece by vacuum sputtering and electrophoretic coating technology |
-
2007
- 2007-08-28 CN CNA2007101313709A patent/CN101376974A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104589459A (en) * | 2015-01-05 | 2015-05-06 | 中国东方电气集团有限公司 | Weight control method for electrophoretic deposition ceramic green body |
| CN104928678A (en) * | 2015-05-15 | 2015-09-23 | 佳木斯大学 | Method for preparing micro-nano-structured magnesium titanate active function coating layer on surface of titanium-contained test piece and application |
| CN104928678B (en) * | 2015-05-15 | 2019-06-14 | 佳木斯大学 | A kind of method that titaniferous surface of test piece prepares micro-nano structure magnesium titanate active function coating |
| CN109628980A (en) * | 2018-11-07 | 2019-04-16 | 研精舍(上海)精密机械加工有限公司 | A kind of electrophoresis coating technique of magnesium alloy appearance part |
| CN113684519A (en) * | 2021-08-23 | 2021-11-23 | 泰兴市华盛银洋新材料科技有限公司 | Process for machining micro-arc oxidized workpiece by vacuum sputtering and electrophoretic coating technology |
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