CN107675139B

CN107675139B - Film coating device

Info

Publication number: CN107675139B
Application number: CN201711118432.2A
Authority: CN
Inventors: 黄国兴; 王旭; 万志
Original assignee: HARTEC TECHNOLOGY (KUNSHAN) Co Ltd
Current assignee: HARTEC TECHNOLOGY (KUNSHAN) Co Ltd
Priority date: 2017-11-13
Filing date: 2017-11-13
Publication date: 2020-02-07
Anticipated expiration: 2037-11-13
Also published as: CN107675139A

Abstract

The invention provides a film coating device, which relates to the technical field of film coating and comprises a jig and a supporting mechanism; the jig covers the inner side wall of the substrate shell needing film coating, and the jig is detachably connected with the inner side wall; the jig connected with the substrate shell needing film coating is hung on the supporting mechanism and used for preventing the film coating materials from splashing to the inner side wall during film coating. The coating device provided by the invention can effectively prevent the AF film material from being overflowed to the inner side wall of the shell, solves the problems of difficult subsequent process and poor conductivity caused by the overflowed, and has simple structure, flexibility and reliability.

Description

Film coating device

Technical Field

The invention relates to the technical field of coating, in particular to a coating device.

Background

The anti-fingerprint film (AF Coating) is mainly applied to the fields of consumer electronics shells and panels, can be attached to the surfaces of substrates such as metal, glass, ceramics and the like, and has the main functions of reducing fingerprint residue, easily removing surface dirt, preventing the oxidation and corrosion of the substrates and improving the touch feeling of products. AF films are widely used in dark-looking products (especially black) because the products are appealing to consumers with their low tonal, steady look, but fingerprints are more easily visible on dark surfaces. Meanwhile, the dark metal shell (mainly made of anodized aluminum) has a rough hand feeling due to a large surface friction coefficient (0.6-0.7), and the AF film can play a role in reducing the friction coefficient (about 0.2) and improving the touch feeling.

Because the surface energy of the AF film material is low, the surface plated with the AF film is difficult to be adhered by the adhesive. The AF coating process is generally performed after the housing is finished (including molding, anodizing, dyeing, sealing, etc.) and before the related internal components are assembled, and many components need to be adhered to the inside of the housing by means of an adhesive. Meanwhile, the inner side of the shell is often accompanied with conductive points, and SiO is required in the AF coating process₂The film is an insulating material and once plated to the inside, poor conduction will result. Therefore, how to control the coating area in the AF coating process to prevent the coating from overflowing to the inner side of the shell becomes one of the key technologies of AF coating.

Disclosure of Invention

The invention aims to provide a coating device which can effectively prevent AF film materials from being overflowed to the inner side of a shell, solves the problems of difficult subsequent process and poor conductivity caused by the overflowed coating, and has simple, flexible and reliable structure.

In order to achieve the purpose, the invention provides the following technical scheme:

the invention provides a coating device, comprising: the fixture and the supporting mechanism;

the jig covers the inner side wall of the substrate shell needing film coating, and is detachably connected with the inner side wall;

the jig connected with the substrate shell needing to be coated is hung on the supporting mechanism and used for preventing coating materials from splashing to the inner side wall during coating;

the middle part of the jig is of a hollow structure;

the supporting mechanism is a roller, and the roller can rotate around the self axis in the vertical direction so as to drive the jig and the substrate shell which is connected to the jig and needs to be coated to rotate together; the side surface of the roller is formed by connecting a plurality of planes; further, the jig is hung on the plane of the roller, and the plane is larger than the substrate shell needing film coating.

Furthermore, the jig is designed along with the shape, and the design structure is matched with the structure of the inner side wall of the substrate shell needing film coating.

Furthermore, the periphery of the jig is provided with a groove which is inserted into the inner side wall of the substrate shell.

Furthermore, reinforcing ribs are arranged on the jig and connected to two opposite sides of the hollow structure.

Furthermore, a plurality of hollow holes are formed in the reinforcing ribs.

Furthermore, a plurality of mounting holes for hanging the jig are formed in the plane of the roller.

Furthermore, two ends of the roller are respectively provided with a bulge for supporting the roller.

The coating device provided by the invention has the following beneficial effects:

the first aspect of the present invention provides a coating apparatus comprising: the fixture and the supporting mechanism; the jig covers the inner side wall of the substrate shell needing film coating, and the jig is detachably connected with the inner side wall; the jig connected with the substrate shell needing film coating is hung on the supporting mechanism and used for preventing the film coating materials from splashing to the inner side wall during film coating.

Aiming at the problems that the AF thin film material is overflowly plated on the inner side surface of the substrate shell, so that the subsequent process is difficult to execute and poor electric conduction is caused, in the coating device provided by the first aspect of the invention, the jig is adopted to cover the inner side wall of the substrate shell needing coating, and the jig connected with the substrate shell needing coating is hung on the supporting mechanism, so that the AF thin film material is effectively prevented from being overflowly plated on the inner side wall of the shell through the periphery of the shell, and the subsequent process is influenced. During coating, one side of the jig is connected with the shell, the other side of the jig is hung on the supporting structure, the inner side wall of the shell is shielded by the jig and the supporting mechanism, only the moment that the outer surface of the shell is just opposite to the target exists in the coating process, sputtering particles cannot penetrate through a gap between the shell and the jig to enter the inner side wall of the shell, the AF film material is effectively prevented from being coated on the inner side wall of the shell, and the coating area and the coating depth can be effectively controlled.

The coating device provided by the invention can effectively prevent the AF film material from being overflowed to the inner side wall of the shell, solves the problems of difficult subsequent process and poor conductivity caused by the overflowed coating, and has simple structure, flexibility and reliability.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of a coating apparatus according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a jig according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a fixture and a substrate according to an embodiment of the invention;

fig. 4 is a schematic structural diagram of a drum according to an embodiment of the present invention.

Icon: 100-a jig; 200-a support mechanism; 300-a substrate housing; 101-a hollowed-out area; 102-a hollowed-out hole; 103-screw positioning holes; 110-a groove; 120-reinforcing ribs; 210-a roller; 201-mounting holes.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.

Referring to fig. 1, fig. 2, fig. 3 and fig. 4, the following describes an embodiment of the present invention in detail with reference to the drawings.

The embodiment of the invention provides a coating device which can effectively control a coating area and an excessive coating depth and aims to solve the problems that an AF film is excessively coated on the inner side wall of a shell, so that a subsequent process is difficult to execute and poor conductivity is caused.

The cause of the flash plating is analyzed by testing and is considered to be for SiO plating after being layered₂The problem of poor electric conduction caused by back overflow plating is mainly that sputtering particles at the edge of a shell of a product fall on the inner side wall of the shell after being reflected due to large energy of target particles in a magnetron sputtering coating process and are deposited on the inner side wall of the shell. Meanwhile, in the coating process, the product and the hanging rack rotate and revolve in the vacuum cavity, the moment when the inside of the shell of the product is opposite to the target material exists, sputtering particles can penetrate through the joint of the shell and the hanging rack to enter the inner side wall, the excessive plating depth caused by the reason can reach 1-3cm, and the phenomenon is a main reason for poor electric conduction. The problem that the adhesion is poor and subsequent assembly cannot be achieved due to the fact that the AF film is coated through evaporation, mainly because the evaporation material is located in the middle of the vacuum cavity, the product shell moves along with the hanging rack in a rotating and rotating mode around the vacuum cavity, and the evaporation material is deposited on the inner side of the shell when the inside of the shell is opposite to the evaporation material.

In order to solve the above technical key problems, an embodiment of a first aspect of the present invention provides a coating apparatus, including: a jig 100 and a support mechanism 200;

the jig 100 covers the inner side wall of the substrate housing 300 to be coated, and the jig 100 is detachably connected with the inner side wall;

the jig 100 connected with the substrate housing 300 to be coated is hung on the supporting mechanism 200, and is used for preventing the coating material from splashing to the inner side wall during coating.

In the coating apparatus provided in the embodiment of the first aspect of the present invention, the jig 100 is adopted to cover the inner side wall of the substrate housing 300 to be coated, and the jig 100 connected with the substrate housing 300 to be coated is hung on the supporting mechanism 200, so as to effectively prevent the AF thin film material from being overflowed to the inner side wall of the housing through the periphery of the housing, thereby affecting the subsequent processes. During coating, the other side of the shell connected with one side of the jig 100 is hung on the supporting structure, and because the jig 100 and the supporting mechanism 200 shield the inner side wall of the shell, only the moment that the outer surface of the shell is just opposite to the target exists in the coating process, sputtering particles cannot penetrate through a gap between the shell and the jig 100 to enter the inner side wall of the shell, the AF film material is effectively prevented from being coated on the inner side wall of the shell in an overflowing manner, and the coating area and the overflowing coating depth can be effectively controlled.

The jig 100 is described in detail below:

in this embodiment, the jig 100 is designed in a conformal manner, and the design structure is matched with the structure of the inner sidewall of the substrate housing 300 to be coated. In the coating apparatus provided in this embodiment, the jig 100 is adapted to the inner contact surface of the substrate housing 300 to be coated, so that the jig 100 is tightly attached to the inner sidewall of the substrate housing 300, and the gap between the jig 100 and the inner sidewall is less than 0.1 mm.

In an alternative of this embodiment, further, the fixture 100 is provided with a groove 110 at the periphery thereof for being inserted into the inner side wall of the substrate housing 300. The periphery of the substrate shell 300 can be inserted into the groove 110, and the inner side wall and the outer side wall of the edge of the shell are respectively contacted with the two side walls of the groove 110, so that the problem that the AF film material is overflowed to the inner side of the shell through the periphery of the shell to influence the subsequent process is effectively avoided.

In an alternative of this embodiment, further, the jig 100 is hollowed out to reduce the weight of the jig 100, considering the burden of the weight of the jig 100 on the supporting mechanism 200 and the depth of the flash plating is less than 3cm, and the flash plating does not occur in the middle portion of the inner side. In this embodiment, the middle of the fixture 100 is a hollow structure. Specifically, the jig 100 is provided with a hollow area 101, and the hollow area 101 can reduce the weight of the jig 100.

In an alternative of this embodiment, further, the jig 100 is provided with a reinforcing rib 120, and the reinforcing rib 120 is connected to two opposite sides of the hollow structure. The jig 100 provided by the present embodiment is provided with the reinforcing ribs 120, so as to prevent the jig 100 from being easily damaged due to the hollowing-out process. The middle of the jig 100 is a hollow structure, and the reinforcing ribs 120 are connected to two opposite sides of the hollow structure.

In an alternative embodiment, the reinforcing rib 120 is further provided with a plurality of hollow holes 102. The hollow holes 102 are designed to reduce the weight of the jig 100, thereby reducing the load of the supporting mechanism 200.

In an alternative of this embodiment, the material of the fixture 100 includes, but is not limited to: polycarbonate material or acrylic material. Polycarbonate is abbreviated as PC and is also called PC plastic. PC has the following advantages: high strength, elastic coefficient, high impact strength and wide application temperature range; high transparency and free dyeability; low forming shrinkage and good dimensional stability; the weather resistance is good; the material has excellent electrical characteristics and insulating property, can keep the electrical property stable even under the conditions of humidity and high temperature, is an ideal material for manufacturing electronic and electrical parts, and has the following dielectric coefficient: 3.0-3.2, arc resistance: 120 s. Acrylic is also called PMMA or organic glass, and the acrylic plate has excellent weather resistance, higher surface hardness and surface gloss and better high-temperature performance. The acrylic plate has good processing performance, and can be subjected to hot forming or mechanical processing. The wear resistance of the acrylic plate is close to that of an aluminum material, the stability is good, and the acrylic plate is resistant to corrosion of various chemicals.

The support mechanism 200 is described in detail below:

in this embodiment, the supporting mechanism 200 is a roller 210, and the roller 210 can rotate around its own axis in the vertical direction to drive the jig 100 and the substrate housing 300 connected to the jig 100 and requiring film coating to rotate together. In order to further inhibit the excessive plating caused when the inside of the housing is directly facing the coating material, the hanging rack in the prior art is changed into the roller 210 form in the present embodiment, and the roller 210 and the fixture 100 cooperate to effectively prevent the excessive plating phenomenon.

In this embodiment, the side surface of the roller 210 is formed by connecting a plurality of planes. The jig 100 can be hung on a plurality of planes.

In this embodiment, the jig 100 is hung on the plane of the roller 210, and the plane is larger than the substrate housing 300 to be coated. In the above alternative, the substrate housing 300 to be coated is connected to the jig 100, and the jig 100 is hung on the plane of the drum 210. When the jig 100 is designed to be hollow, the plane of the roller 210 can shield the inner side wall of the substrate shell 300, so that the phenomenon that the coating material overflows when the inside of the substrate shell 300 is just opposite to the target material is prevented from occurring when the coating material enters the shell through the hollow structure in the middle of the jig 100.

In this embodiment, a plurality of mounting holes 201 for hanging the jig 100 are formed on the plane of the drum 210. The jig 100 is provided with screw positioning holes 103 for fixing with the roller 210. The screw positioning holes 103 may be disposed at the edge of the jig 100. Holes can be regularly formed on the plane of the roller 210, and the jig 100 can be connected with the mounting holes 201 formed on the plane of the roller 210 through screws.

In this embodiment, the two ends of the roller 210 are respectively provided with a protrusion for supporting the roller 210. Specifically, the upper and lower ends of the drum 210 are provided with protrusions for fixing and supporting the drum 210.

In an alternative of this embodiment, the material of the drum 210 includes, but is not limited to: ordinary steel or stainless steel material. Preferably, the stainless steel roller 210 has the following advantages over other rollers 210: the stainless steel roller 210 is light in weight, and the stainless steel roller 210 is high temperature resistant and good in corrosion resistance; the stainless steel roller 210 has good wear resistance; the stainless steel roller 210 has high tensile strength and high lateral pressure resistance.

An embodiment of the second aspect of the present invention provides a plating method, including:

connecting the inner side wall of the substrate shell 300 needing film coating to the jig 100, so that the jig 100 covers the inner side wall of the substrate shell 300 needing film coating;

hanging the jig 100 on the supporting mechanism 200;

the coating material is sprayed on the outside of the substrate housing 300 to be coated.

Compared with the prior art in which the shell is directly hung on the hanger, the coating method provided by the embodiment of the second aspect of the invention mainly applies the coating device provided by the embodiment of the first aspect of the invention to carry out AF coating on the shell and the like, effectively prevents AF film materials from being overflowed to the inner side wall of the shell in the coating process, perfects the key technology of AF coating, and has great significance for the development of subsequent coating technologies.

After the product shell is buckled with the jig 100, the jig 100 is hung on the roller 210, then AF coating is carried out, and the inside of the shell is tested by adopting a dyne pen after coating is finished so as to determine the standard of AF excessive coating by whether the dyne pen mark shrinks or not. Further, the resistance between the inner conductive points of the product was measured by an ohmmeter to determine SiO₂And (5) standard of overflow plating.

No AF overflow plating phenomenon is found on the inner side of the shell through the dyne pen test;

the resistance between the conductive points before film coating is 3 ohm, the resistance after film coating is 3 ohm, and SiO does not occur₂And (4) performing overflow plating.

Therefore, the coating method combining the jig 100 and the roller 210 can effectively solve the problem of the overflow plating generated in the AF coating process.

The plating apparatus and the plating method of the present invention have been described above, but the present invention is not limited to the above specific embodiments, and various modifications and changes can be made without departing from the scope of the embodiments of the present invention. The present invention includes various modifications and alterations within the scope of the claims.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, those skilled in the art will appreciate that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A plating device, characterized by comprising: a jig (100) and a support mechanism (200);

the jig (100) covers the inner side wall of the substrate shell (300) needing to be coated, and the jig (100) is detachably connected with the inner side wall;

the jig (100) connected with the substrate shell (300) needing to be coated is hung on the supporting mechanism (200) and used for preventing coating materials from splashing to the inner side wall during coating;

the middle part of the jig (100) is of a hollow structure;

the supporting mechanism (200) is a roller (210), and the roller (210) can rotate around the axis of the roller in the vertical direction so as to drive the jig (100) and the substrate shell (300) which is connected to the jig (100) and needs to be coated to rotate together; the side surface of the roller (210) is formed by connecting a plurality of planes; the jig (100) is hung on the plane of the roller (210), and the plane is larger than the substrate shell (300) needing film coating.

2. The coating device according to claim 1, wherein the fixture (100) is designed in a form-fitting manner, and the design structure is matched with the structure of the inner side wall of the substrate shell (300) to be coated.

3. The plating device according to claim 2, wherein the fixture (100) is provided with a groove (110) at the periphery thereof for being inserted into the inner side wall of the substrate housing (300).

4. The plating device according to claim 1, wherein the jig (100) is provided with a reinforcing rib (120), and the reinforcing rib (120) is connected to two opposite sides of the hollow structure.

5. The plating device according to claim 4, wherein the reinforcing rib (120) is provided with a plurality of hollowed-out holes (102).

6. The coating device according to claim 1, wherein the roller (210) has a plurality of mounting holes (201) on the surface thereof for hanging the fixture (100).

7. The plating device according to claim 1, wherein both ends of the roller (210) are provided with protrusions for supporting the roller (210), respectively.