CN115053159A - 用于光子集成电路的结构 - Google Patents

用于光子集成电路的结构 Download PDF

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Publication number
CN115053159A
CN115053159A CN202180011378.XA CN202180011378A CN115053159A CN 115053159 A CN115053159 A CN 115053159A CN 202180011378 A CN202180011378 A CN 202180011378A CN 115053159 A CN115053159 A CN 115053159A
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CN
China
Prior art keywords
waveguide
type semiconductor
semiconductor material
substrate
pic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180011378.XA
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English (en)
Chinese (zh)
Inventor
瑞·曼纽尔·莱莫斯·阿尔瓦雷斯·多斯·桑托斯
史蒂文·埃弗拉德·菲利普斯·克莱因
彼特鲁斯·约翰内斯·阿德里亚努斯·蒂斯
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Simin Photonics Holdings Co ltd
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Simin Photonics Holdings Co ltd
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Filing date
Publication date
Application filed by Simin Photonics Holdings Co ltd filed Critical Simin Photonics Holdings Co ltd
Publication of CN115053159A publication Critical patent/CN115053159A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004Combinations of two or more optical elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • G02B6/1225Basic optical elements, e.g. light-guiding paths comprising photonic band-gap structures or photonic lattices
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13Integrated optical circuits characterised by the manufacturing method
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/43Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035Materials
    • G02B2006/12078Gallium arsenide or alloys (GaAs, GaAlAs, GaAsP, GaInAs)
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083Constructional arrangements
    • G02B2006/12123Diode
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083Constructional arrangements
    • G02B2006/1213Constructional arrangements comprising photonic band-gap structures or photonic lattices
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133Functions
    • G02B2006/12159Interferometer
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • H10F30/22Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
    • H10F30/223Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PIN barrier
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0363Manufacture or treatment of packages of optical field-shaping means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/821Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Light Receiving Elements (AREA)
CN202180011378.XA 2020-01-31 2021-01-29 用于光子集成电路的结构 Pending CN115053159A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB2001404.9 2020-01-31
GB2001404.9A GB2592906B (en) 2020-01-31 2020-01-31 Structure for a photonic integrated circuit
PCT/EP2021/052198 WO2021152143A1 (en) 2020-01-31 2021-01-29 Structure for a photonic integrated circuit

Publications (1)

Publication Number Publication Date
CN115053159A true CN115053159A (zh) 2022-09-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180011378.XA Pending CN115053159A (zh) 2020-01-31 2021-01-29 用于光子集成电路的结构

Country Status (6)

Country Link
US (1) US12546936B2 (cg-RX-API-DMAC7.html)
EP (1) EP4097517B1 (cg-RX-API-DMAC7.html)
JP (1) JP2023512931A (cg-RX-API-DMAC7.html)
CN (1) CN115053159A (cg-RX-API-DMAC7.html)
GB (1) GB2592906B (cg-RX-API-DMAC7.html)
WO (1) WO2021152143A1 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB202212686D0 (en) * 2022-08-31 2022-10-12 Smart Photonics Holding B V Method of providing a wafer
GB2638384A (en) * 2024-01-12 2025-08-27 Smart Photonics Holding B V Part of photonic integrated circuit and method of manufacturing same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040028105A1 (en) * 2002-08-12 2004-02-12 Peters Frank H. Electrical isolation of optical components in photonic integrated circuits (PICs)
US20100310256A1 (en) * 2007-02-27 2010-12-09 Celight, Inc. Parallel optical receiver for optical systems
US20110147874A1 (en) * 2009-12-23 2011-06-23 Infinera Corporation Photodiode isolation in a photonic integrated circuit
CN103236645A (zh) * 2013-01-11 2013-08-07 索尔思光电(成都)有限公司 低功耗绝缘调制电极
JP2015122440A (ja) * 2013-12-24 2015-07-02 富士通株式会社 光半導体装置及びその製造方法
KR20180085221A (ko) * 2017-01-18 2018-07-26 엘지이노텍 주식회사 반도체 소자 및 이를 포함하는 광 모듈
CN108351467A (zh) * 2015-07-22 2018-07-31 Bb光电公司 具有介质波导的化合物半导体光子集成电路

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264334A (ja) * 2002-03-08 2003-09-19 Hitachi Ltd 半導体レーザ素子及び半導体レーザモジュール
JP5260909B2 (ja) * 2007-07-23 2013-08-14 住友電気工業株式会社 受光デバイス
CN113176676B (zh) * 2021-04-16 2022-11-15 上海曦智科技有限公司 光学调制器和光学集成系统

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040028105A1 (en) * 2002-08-12 2004-02-12 Peters Frank H. Electrical isolation of optical components in photonic integrated circuits (PICs)
US20100310256A1 (en) * 2007-02-27 2010-12-09 Celight, Inc. Parallel optical receiver for optical systems
US20110147874A1 (en) * 2009-12-23 2011-06-23 Infinera Corporation Photodiode isolation in a photonic integrated circuit
CN103236645A (zh) * 2013-01-11 2013-08-07 索尔思光电(成都)有限公司 低功耗绝缘调制电极
JP2015122440A (ja) * 2013-12-24 2015-07-02 富士通株式会社 光半導体装置及びその製造方法
CN108351467A (zh) * 2015-07-22 2018-07-31 Bb光电公司 具有介质波导的化合物半导体光子集成电路
KR20180085221A (ko) * 2017-01-18 2018-07-26 엘지이노텍 주식회사 반도체 소자 및 이를 포함하는 광 모듈

Also Published As

Publication number Publication date
GB202001404D0 (en) 2020-03-18
GB2592906A (en) 2021-09-15
US12546936B2 (en) 2026-02-10
WO2021152143A1 (en) 2021-08-05
EP4097517A1 (en) 2022-12-07
US20220365276A1 (en) 2022-11-17
EP4097517B1 (en) 2024-03-06
GB2592906B (en) 2024-01-10
JP2023512931A (ja) 2023-03-30

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