CN115024029A - 电磁波屏蔽膜 - Google Patents

电磁波屏蔽膜 Download PDF

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Publication number
CN115024029A
CN115024029A CN202180013589.7A CN202180013589A CN115024029A CN 115024029 A CN115024029 A CN 115024029A CN 202180013589 A CN202180013589 A CN 202180013589A CN 115024029 A CN115024029 A CN 115024029A
Authority
CN
China
Prior art keywords
electromagnetic wave
wave shielding
layer
shielding film
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180013589.7A
Other languages
English (en)
Chinese (zh)
Inventor
上农宪治
森元昌平
田岛宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Publication of CN115024029A publication Critical patent/CN115024029A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
CN202180013589.7A 2020-03-03 2021-03-03 电磁波屏蔽膜 Pending CN115024029A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020035598 2020-03-03
JP2020-035598 2020-03-03
PCT/JP2021/008033 WO2021177328A1 (ja) 2020-03-03 2021-03-03 電磁波シールドフィルム

Publications (1)

Publication Number Publication Date
CN115024029A true CN115024029A (zh) 2022-09-06

Family

ID=77613530

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180013589.7A Pending CN115024029A (zh) 2020-03-03 2021-03-03 电磁波屏蔽膜

Country Status (5)

Country Link
JP (1) JP7506150B2 (ko)
KR (1) KR20220148802A (ko)
CN (1) CN115024029A (ko)
TW (1) TWI812889B (ko)
WO (1) WO2021177328A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116669410B (zh) * 2023-07-03 2024-02-20 广州方邦电子股份有限公司 一种电磁屏蔽罩和线路板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122883A (ja) 1993-10-21 1995-05-12 Nitto Denko Corp 電磁波シ−ルド材
JP4759899B2 (ja) * 2001-09-28 2011-08-31 大日本印刷株式会社 電磁波シールド材および電磁波シールド付きフラットケーブル
JP6196131B2 (ja) * 2013-11-15 2017-09-13 三井金属鉱業株式会社 プレス接着用金属箔及び電子部品パッケージ
KR102280175B1 (ko) * 2016-03-23 2021-07-20 타츠타 전선 주식회사 전자파 차폐 필름
US10224304B2 (en) * 2016-09-22 2019-03-05 Apple Inc. Conductive adhesive film structures
TW201841559A (zh) * 2017-02-10 2018-11-16 日商東洋油墨Ｓｃ控股股份有限公司 構件搭載基板、構件搭載基板的製造方法、積層體、電磁波遮蔽板以及電子機器
JP6546975B2 (ja) * 2017-10-16 2019-07-17 タツタ電線株式会社 導電性接着剤
JP6970025B2 (ja) * 2018-01-10 2021-11-24 タツタ電線株式会社 電磁波シールドフィルム
JP6511550B1 (ja) * 2018-01-30 2019-05-15 タツタ電線株式会社 電磁波シールドフィルム
KR102597127B1 (ko) 2018-02-14 2023-11-01 가부시끼가이샤 쓰리본드 도전성 접착제 및 그 경화물

Also Published As

Publication number Publication date
TW202135638A (zh) 2021-09-16
JP7506150B2 (ja) 2024-06-25
KR20220148802A (ko) 2022-11-07
TWI812889B (zh) 2023-08-21
WO2021177328A1 (ja) 2021-09-10
JPWO2021177328A1 (ko) 2021-09-10

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