JPWO2021177328A1 - - Google Patents

Info

Publication number
JPWO2021177328A1
JPWO2021177328A1 JP2022504413A JP2022504413A JPWO2021177328A1 JP WO2021177328 A1 JPWO2021177328 A1 JP WO2021177328A1 JP 2022504413 A JP2022504413 A JP 2022504413A JP 2022504413 A JP2022504413 A JP 2022504413A JP WO2021177328 A1 JPWO2021177328 A1 JP WO2021177328A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022504413A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021177328A1 publication Critical patent/JPWO2021177328A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
JP2022504413A 2020-03-03 2021-03-03 Pending JPWO2021177328A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020035598 2020-03-03
PCT/JP2021/008033 WO2021177328A1 (ja) 2020-03-03 2021-03-03 電磁波シールドフィルム

Publications (1)

Publication Number Publication Date
JPWO2021177328A1 true JPWO2021177328A1 (ko) 2021-09-10

Family

ID=77613530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022504413A Pending JPWO2021177328A1 (ko) 2020-03-03 2021-03-03

Country Status (5)

Country Link
JP (1) JPWO2021177328A1 (ko)
KR (1) KR20220148802A (ko)
CN (1) CN115024029A (ko)
TW (1) TWI812889B (ko)
WO (1) WO2021177328A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116669410B (zh) * 2023-07-03 2024-02-20 广州方邦电子股份有限公司 一种电磁屏蔽罩和线路板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122883A (ja) 1993-10-21 1995-05-12 Nitto Denko Corp 電磁波シ−ルド材
JP4759899B2 (ja) * 2001-09-28 2011-08-31 大日本印刷株式会社 電磁波シールド材および電磁波シールド付きフラットケーブル
JP6196131B2 (ja) * 2013-11-15 2017-09-13 三井金属鉱業株式会社 プレス接着用金属箔及び電子部品パッケージ
KR102280175B1 (ko) * 2016-03-23 2021-07-20 타츠타 전선 주식회사 전자파 차폐 필름
US10224304B2 (en) * 2016-09-22 2019-03-05 Apple Inc. Conductive adhesive film structures
TW201841559A (zh) * 2017-02-10 2018-11-16 日商東洋油墨Ｓｃ控股股份有限公司 構件搭載基板、構件搭載基板的製造方法、積層體、電磁波遮蔽板以及電子機器
JP6546975B2 (ja) * 2017-10-16 2019-07-17 タツタ電線株式会社 導電性接着剤
JP6970025B2 (ja) * 2018-01-10 2021-11-24 タツタ電線株式会社 電磁波シールドフィルム
JP6511550B1 (ja) * 2018-01-30 2019-05-15 タツタ電線株式会社 電磁波シールドフィルム

Also Published As

Publication number Publication date
TW202135638A (zh) 2021-09-16
TWI812889B (zh) 2023-08-21
KR20220148802A (ko) 2022-11-07
WO2021177328A1 (ja) 2021-09-10
CN115024029A (zh) 2022-09-06

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