CN114981958A - 一种封装结构及其制作方法、通信设备 - Google Patents

一种封装结构及其制作方法、通信设备 Download PDF

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Publication number
CN114981958A
CN114981958A CN202080093345.XA CN202080093345A CN114981958A CN 114981958 A CN114981958 A CN 114981958A CN 202080093345 A CN202080093345 A CN 202080093345A CN 114981958 A CN114981958 A CN 114981958A
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China
Prior art keywords
substrate
frame body
power device
package structure
lead
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Pending
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CN202080093345.XA
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English (en)
Inventor
罗威
徐骁
王庆峰
陈特伟
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Publication of CN114981958A publication Critical patent/CN114981958A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

本申请公开了一种封装结构及其制作方法、通信设备，以在满足功率器件的高散热需求以及高应力释放需求的前提下，实现低成本封装。封装结构包括基板、功率器件、引脚框架及封装盖板，其中：基板为热膨胀系数CTE为6～24ppm/℃的金属合金基板；引脚框架设置于基板的第一面，包括框架本体和引脚，框架本体与基板之间形成用于容纳功率器件的容纳腔，引脚嵌设于框架本体上，引脚的第一端暴露在容纳腔内侧，第二端暴露在容纳腔外侧；功率器件设置于基板的第一面且位于容纳腔内，功率器件与引脚的第一端电连接；封装盖板固定于框架本体背离基板的一面。

Description

PCT国内申请，说明书已公开。

Claims (17)

  1. PCT国内申请，权利要求书已公开。
CN202080093345.XA 2020-05-11 2020-05-11 一种封装结构及其制作方法、通信设备 Pending CN114981958A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/089650 WO2021226799A1 (zh) 2020-05-11 2020-05-11 一种封装结构及其制作方法、通信设备

Publications (1)

Publication Number Publication Date
CN114981958A true CN114981958A (zh) 2022-08-30

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ID=78526090

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CN202080093345.XA Pending CN114981958A (zh) 2020-05-11 2020-05-11 一种封装结构及其制作方法、通信设备

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CN (1) CN114981958A (zh)
WO (1) WO2021226799A1 (zh)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198701A (ja) * 1992-01-22 1993-08-06 Mitsubishi Electric Corp 半導体装置用パッケージ
JPH09232475A (ja) * 1996-02-22 1997-09-05 Nitto Denko Corp 半導体装置及びその製造方法
JPH10163400A (ja) * 1996-11-28 1998-06-19 Nitto Denko Corp 半導体装置及びそれに用いる２層リードフレーム
CN1168140C (zh) * 2000-11-24 2004-09-22 矽品精密工业股份有限公司 半导体封装件及其制造方法

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Publication number Publication date
WO2021226799A1 (zh) 2021-11-18

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