TWI249262B - Apparatus of antenna with heat slug and its fabrication process - Google Patents

Apparatus of antenna with heat slug and its fabrication process Download PDF

Info

Publication number
TWI249262B
TWI249262B TW094119508A TW94119508A TWI249262B TW I249262 B TWI249262 B TW I249262B TW 094119508 A TW094119508 A TW 094119508A TW 94119508 A TW94119508 A TW 94119508A TW I249262 B TWI249262 B TW I249262B
Authority
TW
Taiwan
Prior art keywords
antenna
metal
metal piece
heat sink
piece
Prior art date
Application number
TW094119508A
Other languages
Chinese (zh)
Other versions
TW200601610A (en
Inventor
Chia-Lun Tang
Shih-Huang Yeh
Zih-Hao Lu
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW094119508A priority Critical patent/TWI249262B/en
Publication of TW200601610A publication Critical patent/TW200601610A/en
Application granted granted Critical
Publication of TWI249262B publication Critical patent/TWI249262B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

An apparatus of antenna with heat slug and its fabricating process are provided, in which the antenna with heat slug can be realized with a single sheet or double sheets of metal. A dual-band antenna module with a mask cover is taken as an example to realize the apparatus. Each single sheet of metal can be achieved by simply cutting and bending a metal plate. Thereby, it is a simple and low-cost fabricating process. In the known fabricating process of integrated circuit, the heat slug and the antenna can be combined in a module at the same step. Therefore, integrating the antenna with heat slug in a fabricating process needs not to develop a new process.

Description

1249262 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種天線(antenna)暨散熱金屬片 (heat slug)之裝置與製程，係應用於多晶片模組 (multi-chip-module packaging)之中0 【先前技術】 隨著高度整合性模組的發展，多晶片模組封裝越來 越受到重視。由於，多晶片模組封裝包含了許多晶片， 整個封裝内的功率消耗量因而增加，因此，晶片封裝時 必須搭配散熱片以排除晶片操作時所帶來的熱能，以避 免產生過熱的情況進而導致操作晶片的損壞。目前，射 頻前端模組(RF front-end-module，RF FEM)已經將平衡 非平衡轉換器（balance/unbalance，balun)、功率放大器 (power amplifier)、雙工器(diplexer)、交換器(switch)、 帶通濾波器(band-pass filter)及低雜訊放大器(l〇w noise amplifier，LNA)整合進入了單一封裝當中。雖然，射頻 前端模組已經達到高度整合的目的，但是，無線通訊系 統中最前端的元件-天線，卻仍需要另外安置於模組之 外。然而隨著前端模組整合性的增加，天線勢必也將整 進射頻前端模組當中，以達到更高度的整合目的。 第一 A〜第一 D圖顯示習知具有散熱片之半導體製 程。第一 A圖是多晶片模組經過晶片12〇黏接(die attach)、打金線b〇nd)m等步驟後的測視圖，第一 B圖疋多晶片模組置入散熱片114之後再做灌膠 C〇mpound)160步驟後的測視圖。其中，散熱片114通常 為圓形並且具有數根支撐元件（support) 115來支撐，如 第一 C圖所示。散熱片的製作乃藉由金屬片的切割或壓 模形成’在猎由折彎彎折線(bendHne)〗％形成近似门字 型之後，於置入散熱片步驟中將彎折之散熱片114安置 在多晶片模組中。第一 〇圖是多晶片模組置入多個金屬 焊球步驟後的測視圖。 相關技術如美國第6,686,649B1號專利，其揭示先 將天線與一遮蔽罩分別製作在一帽形介質(dielectric cap)的兩側，之後再將上述結構於晶片封裝時安置在晶 片上方’以達到馬度整合的目的。不過，此種設計方式 較為複雜，製作帽形介質的成本較高。此外，將帽形介 質安置的步驟並不適用於目前的IC封裝方式，必須另 外開發製程。 另一篇美國公告開申請案2004/0032371，揭露應用 於行動產品(mobile products)的一種兼具天線與電磁遮 1249262 蔽罩(electromagnetic shield)的裝置與製程。金屬化的天 線與電磁遮罩分別形成於一介質體（dielectric body)的 上下兩側，此介質體可固定於印刷電路板(printed circuit board，PCB)上。此種方式使得介質製作成本較高，而天 線與電磁遮罩金屬片製作時，額外的沉積(deposit)與電 鍍(plate)步驟，以及後續加入金屬圖案的步驟，亦提高 了生產成本。 至於歐洲第1126522號專利，其揭露一天線與多個 接地面利用多層化架構製作在介質的兩邊，此架構中元 件間垂直的連接，例如天線饋入與接地線等，主要是靠 導通孔(via hole)來實施，換言之，必須再加上鑽孔與灌 錫的兩道手續，而這些手續的精確度問題提高了製作成 本。又，此封裝方式亦非1C封裝標準製程，亦提高製 作成本。 有鑒於上述問題，有必要開發一種結構簡單、製作 容易的天線，並且在不增加封裝步驟的情況下將天線安 置於封裝内部，以達成製作成本降低的需求。 【發明内容】 為解決上述習知天線製作與封裝過程成本高的問 7 題’因此本發_主要目的在提供—財效降低天線製 作成本的天線暨散熱金屬片之裝置與製程。 本發明的另-目的在提供一種天線暨散熱金屬片 之裝置與製程’於不增加封裝步驟、不須另外開發製程 的情況下，將天線安置於封裝内部。 本發明的又-目的在提供—種天線暨散熱金屬片之 裝H程其中天線的結構簡單、製作容易以及成本 低廉。 本發明的另一目的在提供一種天線暨散熱金屬片 之裝置與製程，其中天線暨散熱金屬片為單金屬片或雙 金屬片的結構。 為達到本發明上述的目的，本發明之天線暨散熱金 屬片之裝置主要包含-基板、_天線訊號傳輸線、至少 一片、至少一條金屬帶、至少一金屬片以及一封膠體。 此基板備有上、下表面，其下表面設有多篮盒屋择球 (solder ball)，用以電氣連接至一外部電路。天線訊號傳輸 線與金屬帶形成於基板的上表面，晶片則設置於基板的 上表面，並與天線訊號傳輸線形成電氣連接。此至少一 金屬片，具有天線與散熱的功能，設置於該基板的上表 面。封膠體至少包覆晶片、天線訊號傳輸線以及金屬帶。 又，根據本發明，此至少一金屬片分為單金屬片與 雙金屬片結構。此單金屬片係經由切割單一金屬片或以 壓模的方式形成一特定樣式之後，彎折而成，此單金屬 片又分為兩種結構，第一種結構包含一備有天線之散熱 金屬片以及其多根支撐元件。備有天線之散熱金屬片設 置於晶片的上方並與晶片保持一預設距離。而多根支撐 元件其中之一為天線饋入金屬片，用以電氣連接至天線 訊號傳輸線，其餘的支撐元件則與各金屬帶形成電氣連 接’而部分的金屬帶可連接至系統接地面。 單金屬片的第二種結構包含一散熱片、一天線、至 夕'一連接金屬片以及一天線饋入金屬片。散熱片設置於 晶片的上方並與晶片保持一預設距離，散熱片的下方設 有多個支撐元件，散熱片藉由多個支撐元件電氣連接至 各金屬帶，各金屬帶再接地。至於天線則設置於散熱片 的上方並與散熱片保持一預設距離，而連接金屬片用以 連接天線與散熱片，天線饋入金屬片的一端連接天線， 另一端則連接至天線訊號傳輸線。 1249262 於雙金屬片結構中，各金屬片係經由切割單一金屬 片或以麼模的方式形成一特定樣式之後，彎折而成，此 雙金屬片其中之一包含一散熱片與其多根支撐元件，此 散熱片設置於晶片的上方並與晶片保持一預設距離，而 各支撐元件與各金屬帶形成電氣連接，各金屬帶再接 地。此外，雙金屬片其中之另一片包含一天線與一天線 饋入金屬片，天線設置於散熱片的上方並與散熱片保持 一預設距離，而天線饋入金屬片的一端連接天線，另一 端則連接至天線訊號傳輸線。其中，在散熱片的上方與 多根支擇元件的外側包覆一層封膠體，天線位於封膠體 的上方，而天線饋入金屬片則由側面饋入。 此天線暨散熱金屬片的製程為：（a)提供一基板，此 基板的上表面已黏接至少一晶片已打上金線，而且已形 成一天線訊號傳輸線與多條金屬帶，(b)安置一天線與一 散熱片於基板上表面，並灌入一封膠，（c)最後，置入多 個金屬焊球於基板下表面。 根據本發明，天線暨散熱金屬片由單金屬片或雙金 屬片所製成，在步驟(b)中有不同的做法。若天線暨散熱 金屬片由單金屬片所製成，此單金屬片設有多根支撲元 件，則步驟(b)更包含以下步驟：（1)切割或壓模此單金 10 屬片形成一特定的樣式，（2)弯折此單金屬片，（3)安置 此單金屬片於此至少一晶片的上方，將天線饋入金屬片 與天線訊號傳輸線之間、各支撐元件與各金屬帶之間連 接起來，（4)最後，灌入一封膠體，至少包覆此至少一晶 片、天線訊號傳輸線與多條金屬帶。 另一方面，若天線暨散熱金屬片係分別由雙金屬 片所製成，此雙金屬片其中之一包含一散熱片與多根支 撐元件，雙金屬片其中之另一片包含一天線與一天線饋 入金屬片，則步驟(b)更包含以下步驟：（1)切割或壓模 此雙金屬片各形成一特定的樣式，（2)弯折此雙金屬 片，使天線與天線饋入金屬片之間以及散熱片與多根支 撐元件之間約略成90度，（3)安置此散熱片於此至少一 晶片的上方，連接各支撐元件與各金屬帶，（4)灌入一 封膠體於散熱片的上方、多根支撐元件的外側，並至少 包覆天線訊號傳輸線、多條金屬帶與此至少一晶片，（5) 最後，放置天線於封膠體的上方，並連接天線饋入金屬 片與天線訊號傳輸線。 本發明中以雙頻天線模組來實現天線為例，作進一步 的說明。根據量測結果，此天線暨散熱金屬片的共振點 分別在低頻為2·4 GHz，在高頻為5.2 GHz。在低頻或高 1249262 頻範圍裡，其返回損失(retum loss)比15册好。在低頻帶 2.4 GHz時’天線增益(antenna ga叫可達3 5畑，而在高 頻帶5.1GHz時，天線增益可達2 〇舰。 本發明中的天線暨散熱金屬片，在製作時只須由 單金屬片或雙金屬片進行切割、弯折等動作即可完成， 使得單金屬片形式的天線暨散熱金屬片具備一體成型 的特徵；而無論單或雙金屬片的形式，由於製作簡單所 以可以達到低成本的優點。此外，在封裝過程當中，因 為單金屬片的天線暨散熱金屬片是一體成型的形式，所 以在安置散熱片的步驟時就是在安置天線，因此無須另 外安置天線的步驟，亦無需要開發新的製程，可以利用 舊有的製程即可以將本發明封裝至多晶片模組當中，達 到高度整合與降低成本的目的。 茲配合下列圖示、實施例之詳細說明及申請專利範 圍，將上述及本發明之其他目的與優點詳述於後。 【實施方式】 第二圖說明本發明中單金屬片架構的天線暨散熱 金屬片之裝置的示意圖。本發明包含至少一晶片220、 一天線訊號傳輸線221、多條金屬帶240、天線暨散熱 單元210、一封膠體260以及一基板230。晶片220設 12 1249262 置於基板上表面231，經由金線222分別連接至天線 訊號傳輸線221與接合焊墊。天線訊 號傳輸線221與金屬帶240形成於基板上表面231， 封膠體260則包覆住晶片220、天線訊號傳輸線221 與多條金屬帶240。天線暨散熱單元21()包含天線饋 入金屬片212、天線21卜散熱片214與其多根支撐元 件215是一體成型的單金屬片結構(及第二圖中包含虛 線的單金屬片結構），其中也可以將第二圖中的天線饋 入金屬片212和天線211的功能併入散熱片214與其 多根支撐元件215，天線暨散熱單元21〇即成為一個 不包含虛線的门形單金屬片結構。天線暨散熱單元21〇 置於晶片220的上方，藉由多根支撐元件215與金屬 帶240連接。此外，天線饋入金屬片212 一端連接天 線’另一端則連接至基板上表面231的天線訊號傳輸 線221 ’此天線訊號傳輸線221亦與晶片220相連接。 晶片220經由基板下表面232的多個金屬焊球25〇連 接至外部電路。 須注意的是第二圖中天線訊號傳輸線221與金屬 帶240之間因視角的緣故有重疊的現象，實際上兩者 並沒有相互連接。 13 以下詳述本發明之裝置的三個實施例，第一實施 例和第二實施例為單金屬片的結構，而第三實施例為 雙金屬片的結構。 第三A圖是本發明第一實施例的透視圖。此實施 例中，本發明之天線暨散熱金屬片之裝置包含一天線 31卜一天線饋入金屬片312、至少一連接金屬片313、 一散熱片314、至少一晶片320、一天線訊號傳輸線 321、多條金屬帶340、一封膠體360以及一基板330。 其中天線暨散熱單元310係由天線311、天線饋入金 屬片312、至少一連接金屬片313、散熱片314與支撐 元件315所構成的單金屬片結構。 基板330備有上、下表面，上表面331上形成一 天線訊號傳輸線321與多條金屬帶340，並黏磋一晶 片320。晶片320則經由金線322分別連接至天線訊 號傳輸線321與接合焊墊341。連接金屬片313 —端 與天線311連接，而另一端則與散熱片314連接，連 接金屬片313與天線311之間的夹角，以及連接金屬 片313與天線311之間的夾角均約為9〇度，因此天線 311與散熱片314接近平行。天線饋入金屬片312 — 端與天線311連接，兩者的夾角約為9〇度，另一端則 1249262 連接至天線訊號傳輸線321，將天線訊號由基板上表 面331傳送至天線311，以達到激發天線311的目的。 再者，散熱片314設有多根支撐元件315，用以 連接至金屬帶340並使得散熱片314與晶片320間有 一間隔，以避免晶片320與散熱片314接觸。至於各 金屬帶340則連接至電子裝置的接地端。 第三B圖是本發明第一實施例的一個剖面圖，其 中封膠體360係使用模塑化合物（molding compound)，例如：環氧樹酯(ep0Xy resin)，經由注模 成型，其至少包覆晶片320、天線訊號傳輸線32卜金 屬帶340，亦可同時包覆天線3U的下側、天線饋入 金屬片312與支撐元件315的外側等，以保護晶片320 避免受到外力侵害、氧化等等。 ' 在基板下表面332設有多個金屬焊球350，此多 個金屬焊球350用來連接至外部電路、主機板或是其 他電子裝置。而散熱片314除了具有散熱功能外，亦 具備隔離天線輻射訊號干擾晶片的功能。 第三C圖是本發明第一實施例的一個側視圖。連 15 接金屬片313分別連接天線311與散熱片314，而散 熱片314又與支稽元件315相互連接。此外，天線311 亦與天線饋入金屬片312相互連接。所以，可以使上 述元件成為一體成型的架構，在製作時只須將單一金 屬片進行切割、彎折等動作即可完成。 以下參考第四A〜第四E圖說明本發明第一實施例 的製程。 首先，於已形成一天線訊號傳輸線321與多條金 屬帶340的一基板330的上表面331上黏接至少一晶 片320，並打上金線322。已舖好接合焊墊34卜天線 訊號傳輸線321與多條金屬帶340的基板330可利用 滴膠機(epoxy dispensor)滴膠將晶片320黏接至基板 330，再以打線機(wire bond capillary)打上金線322(如 第四A、第四B圖所示）。 接著，切割或壓模單一金屬片形成一特定的樣式。 連接金屬片313、天線311、散熱片314與其多根支撐 元件315相互連接，為一體成型的架構，在製作時將 單一金屬片切割，或以壓模方式將單一金屬片壓製成 一特定的樣式。參考第四C圖，為本發明第一實施例 1249262 的天線暨散熱單元310之單金屬片展開圖。其中，天 線饋入金屬片312的長度等於連接金屬片313的長度 冗加支撐元件315寬度而，以使得天線饋入金屬片 312容易連接至天線訊號傳輸線321。本發明因具有一 體成型的特色，所以可以降低生產成本。 然後，彎折此單金屬片，使散熱片314與多根支樓 _ 元件315之間、連接金屬片313與散熱片314之間以 及連接金屬片313與天線311之間約略成90度。第四 D圖是單金屬片沿彎折線316折彎之後的形狀。 下一步驟是安置此單金屬片於基板上表面331，並 將天線饋入金屬片312與天線訊號傳輸線321之間、各 支撐元件315與各金屬帶340之間連接起來，並灌入封 _ 膠體360。安置單金屬片時，天線饋入金屬片312可以 接觸到天線訊號傳輸線321，因此無須另外設計天線饋 入電路。並灌入封膠體360，至少包覆晶片320、天線 訊號傳輸線321、金屬帶340，亦可同時包覆天線311 的下側、天線饋入金屬片312與支撐元件315的外側 等，以固定模組。 最後，於基板下表面332置入多個金屬焊球350， 17 1249262 以連接至外部電路(如第四E圖所示）。 須注意的是第三8、第四8、第四£圖中天線訊 ， 號傳輸線321與金屬帶340之間因視角的緣故有重疊 ' ❸現象’由第三A、第四A圖可看出實際上兩者並沒 有相互連接。 • *上述的說明可知，在封裝過程中，所有步驟均 與第-圖的習知具有散熱片之半導體製程一樣，只有 在安置散熱片的步驟時將原來的散熱片用本發明取 代’之後繼續進行晶片封裝的步驟，因此並不需要另 外開發製程，所以可以簡化封裝步驟的複雜度，並能 達到高度整合與降低成本的目的。 φ 帛五®是本發㈣二實酬的舰目。天線暨散 熱單元510的結構類似於第一實施例，主要元件為備 有天線之散熱金屬片514，其除了散熱的功能外，亦 具備天線的功能，並設有多根支擇元件515，也是一 趙成型的單金屬片結構。此多根支律元件其中之一是 天線饋入金屬片512，其再連接至基板上表面531的 天線訊號傳輸線531。其餘支擇元件M3則連接至各 金屬帶540，而部分的金屬帶可連接至系統接地面。 18 第/、A〜第六e圖說明本發明之第二實施例的製 程0 第-實施例與第-實施例的的製程類似，差別在 於切割步驟巾’單金屬#所洲或壓獅樣式與第一 實施例的獨。枝，如第六簡所示，於已形成一 天線訊號傳輸線521與多條金屬帶540的-基板530 的上表面531上黏接至少-晶片520,並打上金線522。 接著，切割或Μ模單_金屬片形成―特定的樣 式。如第六B、第六c圖所示，備有天線之散熱金屬 片514可為傳統散熱片的形狀-圓形，亦可為長方形 等形狀，而天線饋人金屬# 512則是其中一根支樓元 件。接下來的料步驟巾，f折此單金屬>|，使備有 天線之散熱金屬片5M與其多根支撐元件515之間略 成90度如第、B、第六C圖所示，沿著弯折線516 彎折製作而成。 下一步驟，如第六D圖所示，安置此單金屬片於 基板上表面531，並將天線馈入金屬片512與天線訊 號傳輸線521之間、各支標元件5!5與各金屬帶54〇 之間連接起來，並灌人娜想56G。其中，天線鑌入 金屬片512的高度為第六B、第六c圖中;^的長度。 最後，於基板下表面532置入多個金屬焊球550， 以連接至外部電路(如第六E圖所示）。 第七圖所示為本發明第三實施例之側面圖。第三 實施例與第一實施例的結構亦相似，其最大差異在 於’天線暨散熱單元為雙金屬片結構。換言之，天線 711與天線饋入金屬片712由一金屬片所製成，而散 熱片714與其多根支撐元件715由另一金屬片所製 成。散熱片714的多根支撐元件715,用以連接至金 屬帶740並使得散熱片714與晶片720間有一間隔， 以避免晶片720與散熱片714接觸。封膠體760至少 披覆於散熱片714的上方與其多根支撐元件715的外 側，天線711再安置於封膠體760的上方，天線711 與散熱片714之間有封膠體760當作基底材質 (substrate)。另一方面，天線饋入金屬片712 一端連 接天線711 ’兩者之間約略成90度，另一端則連接至 天線訊號傳輸線721，故天線訊號可經由側面的天線 饋入金屬片712饋入。 須注意的是第七圖中與以下將說明之第八E卜第 1249262 八G圖中天線訊號傳輸線721與支撐元件715之間因 視角的緣故有重疊的現象，實際上兩者並沒有相互連 接0 以下參考第八A〜第八G圖說明本發明之第=實 施例的製程。 首先，於已形成一天線訊號傳輸線721與多條金 屬帶740的一基板730的上表面731上黏接至少一晶 片720，並打上多條金線722，如第八a圖所示。 接著，切割或廢模雙金屬片各形成一特定的樣 式。由於本實施例的天線與散熱片為雙金屬片結構， 所以分別切割或壓模各形成不同的樣式。如第八B、 第八C圖所示，天線711可為長方形、圓形等形狀， 而天線饋人金屬片712可為近似三角形、長方形等形 狀。至於散熱片714與其多根支樓元件71S的金屬片 則切割或壓模成第一C圖的樣式。 然後，分別皆折此雙金屬片，使天線711與天線 饋入金屬片712之間以及散熱片714與該多根支樓元 件715之間約略成90度。如第八B、第八C與第一 c 21 1249262 圖所示沿著彎折線716與116彎折製作而成。 接著’安置散熱片714於基板上表面731，連接 各該支撐元件715與各該金屬帶740，如第八D圖所 示。隨後，再灌入封膠體760，至少包覆晶片720、部 分的天線訊號傳輸線72卜金屬帶740以及散熱片714 的上方與多根支撐元件715的外側，如第八E圖所示。 下一個步驟是放置天線711於封膠體760的上 方，並連接天線饋入金屬片712與天線訊號傳輸線 740 ’如第八ρ圖所示。其中，天線饋入金屬片712 的尚度為第八B、第八C圖中屈的長度。 最後’於基板下表面732置入多個焊球750， 以連接至外部電路(如第八G圖所示）。 ' 第九圖是根據本發明之裝置的一透視圖的一個例 子，其中該天線係以一雙頻天線模組來實現。第九圖 中’此雙頻天線模組包含一天線單元911、一第一路 徑天線單元911a、和一第二路徑天線單元9Ub。此二 路經天線單元有各自的操作頻率範圍。其中之一係在 高頻率範圍(5150-5350 MHz)操作，另一係在低頻率範 22 1249262 圍(2400-2484 MHz)#作。此雙頻天線模組置於一遮罩 蓋940的上方。此遮罩蓋940具有散熱功能。基板930 上表面931上有一高頻電路920，此高頻電路裡具有 一天線訊號傳輸線(未示於圖中）。天線饋入金屬片912 的一端連接至天線單元911，另一端電性連接至天線 訊號傳輸線。第一連接金屬片913a的一端連接至第一 路徑天線單元911a，另一端電性連接至遮罩蓋940。 第二連接金屬片913b的一端連接至第二路徑天線單 元911b，另一端連接至遮罩蓋940。封膠體960至少 包覆高頻電路920，以固定此雙頻天線模組。 在第九圖的例子裡，此雙頻天線模組係置於遮罩 蓋940的上方，並與遮罩蓋940保持一距離，如 2mm。此遮罩蓋940可包括一散熱片和多根支撐元 件。封膠體960也可以包覆此雙頻天線模組的下方和 支撐元件的外邊(outer side)，以固定此雙頻天線模 第十圖是第九圖的頂視圖。參考第十圖，此雙頻 天線模組具有L或倒L (inverted-L)形狀，但達成雙 頻或多頻操作的天線模組形狀不限於上述兩種形狀。 23 1249262 第十一圖是未折疊(unfolded)之雙頻天線模組暨 遮罩蓋的展開圖，此雙頻天線模組連接至天線饋入金 屬片和連接金屬片。參考第十一圖，天線饋入金屬片 • 912、連接金屬片913a-913b、和雙頻天線模組形成 . 在同一片的單一金屬片。如前所述，此雙頻天線模組 暨遮罩蓋可由單金屬片或雙金屬片製成。在雙金屬片 的結構裡，此遮罩蓋形成在另一金屬片裡。 在本發明中，將第九圖裡天線暨散熱金屬片的結 構的操作效果(operating efficiency)作分析。量測了 返回損失和天線增益的特性。根據量測結果，第九圖 裡的天線暨散熱金屬片的共振點分別在低頻為24 GHz ,在高頻為5·2<3Ηζ。在低頻範圍裡，其返回損 失比15dB好，而在高頻範圍裡，其返回損失比2〇胆 φ 好，此由第十二圖裡可看出。此外，在低頻帶2.4 GHz 時’天線增益可達3·5 dBi，而在高頻帶5 1GRz時， 天線增益可達2.0 dBi。 综上所述’本發明中的天線暨散熱金屬片，無論 單或雙金屬片的形式，皆具結構簡單、製作容易的特 色。本發明利用單金屬片的天線暨散熱金屬片為—體 成型的形式，在安置散熱片的步驟，同時將天線與散 24 1249262 熱片安置於封裝内部，之後繼續進行晶片封裝的步 驟，因此並不需要另外開發製程，所以可以簡化封裝 步驟的複雜度。相較於前案必須將天線另外製作、開 發新的封裝方式等，本發明可達成天線製作成本降低 的需求。 惟’以上所述者，僅為本發明之較佳實施例而 已，當不能以此限定本發明實施之範圍。即大凡依本 發明申請專利範圍所作之均等變化與修飾，皆應仍屬 本發明專利涵蓋之範圍内。 25 1249262 【圖式簡單說明】 第一 A圖為已黏接晶片與打金線之習知多晶片模組封 裝的一個側視圖。 第一 B圖為具有散熱片與已灌膠之習知多晶片模組封 裝的一個側視圖。 第一 C圖為習知散熱片的一個展開圖。 第一 D圖為置入多個金屬焊球後之習知多晶片模組封 裝的一個側視圖。 第二圖為本發明天線暨散熱金屬片之裝置的單金屬片 架構一個剖面圖。 第二A圖為本發明第一實施例的一個透視圖。 第三B圖為本發明第一實施例的一個剖面圖。 第二C圖為本發明第一實施例的一個側視圖。 第四A-第四E圖係顯示本發明第一實施例的製程。 第五圖為本發明第二實施例的一個剖面圖。' 第κ、Α〜第六E圖係顯示本發明第二實施例的製程。 第七圖為本發明第三實施例的一個剖面圖。 第八Α〜第八G圖係顯示本發明第三實施例的製程。 第九圖是根據本發明之裝置的一透視圖的一個例子。 第十圖是第九圊的頂視圓。 第十一圖是未折疊之雙頻天線模組暨遮罩蓋的展開 圖，此雙頻天線模組連接至天線饋入金屬片和連接金 26 1249262 屬片。 第十二圖是第九圖裡之雙頻天線模組的返回損失對操 作頻率的量測結果圖。 【主要元件符號說明】 210、 310、510天線暨散熱單元 211、 311、711 天線 _ 212、312、512、712天線饋入金屬片 313連接金屬片 114、 214、314、714 散熱片 514備有天線之散熱金屬片 115、 215、315、515、715 支撐元件 116、 316、516、716 彎折線 120、220、320、520、720 晶片 ' # 22卜321、52卜721天線訊號傳輸線 122、222、322、522、722 金線 130、230、330、530、730 基板 231、 331基板上表面 232、 332基板下表面 240、 340、540、740 金屬帶 241、 341接合焊墊 27 1249262 150、250、350、550、750 金屬焊球 160、260、360、560、760 封膠體1249262 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to an apparatus and a process for an antenna and a heat slug, which are applied to a multi-chip module (multi-chip-module packaging). Among them 0 [Prior Art] With the development of highly integrated modules, multi-chip module packaging has received more and more attention. Since the multi-chip module package contains many wafers, the power consumption in the whole package is increased. Therefore, the chip package must be equipped with a heat sink to eliminate the heat energy generated during the operation of the wafer to avoid overheating. Operating the wafer for damage. Currently, RF front-end-module (RF FEM) has balanced/unbalanced (balun), power amplifier, diplexer, and switch (switch). ), a band-pass filter and a low noise amplifier (LNA) are integrated into a single package. Although the RF front-end module has achieved a high level of integration, the most advanced component of the wireless communication system, the antenna, still needs to be placed outside the module. However, with the increase in the integration of front-end modules, the antennas are bound to be integrated into the RF front-end modules to achieve a higher level of integration. The first A to the first D diagrams show a conventional semiconductor process having a heat sink. The first A picture is a measurement view of the multi-wafer module after the steps of the die 12, the die attaching, the gold wire b〇nd)m, and the first B image is placed after the heat sink 114 Then do the glue C〇mpound) 160 steps after the measurement view. Among them, the fins 114 are generally circular and have a plurality of support members 115 for supporting, as shown in the first C-picture. The heat sink is produced by cutting or stamping the metal sheet. After the approximate bending pattern is formed by the bending bend line (bendHne) %, the bent heat sink 114 is placed in the step of inserting the heat sink. In multi-chip modules. The first map is a view of the multi-wafer module after the step of placing multiple metal solder balls. Related Art, for example, U.S. Patent No. 6,686,649 B1, which discloses that the antenna and a mask are separately formed on both sides of a dielectric cap, and then the structure is placed on the wafer at the time of wafer packaging to achieve The purpose of the integration of the horse. However, this type of design is more complicated and the cost of making hat-shaped media is higher. In addition, the step of placing the cap-shaped medium is not applicable to the current IC packaging method, and an additional process must be developed. Another U.S. publication application 2004/0032371 discloses a device and process for an antenna shield and an electromagnetic shield 1249262 applied to mobile products. The metalized antenna and the electromagnetic mask are respectively formed on the upper and lower sides of a dielectric body, and the dielectric body can be fixed on a printed circuit board (PCB). This approach results in higher media fabrication costs, and the additional deposition and plating steps of the antenna and the electromagnetic mask metal sheet, as well as subsequent steps of adding metal patterns, also increase production costs. As for the European Patent No. 1126522, it is disclosed that an antenna and a plurality of ground planes are fabricated on both sides of the medium by using a multi-layered structure. Vertical connections between components in the architecture, such as antenna feeding and grounding lines, are mainly through vias ( Via hole), in other words, it is necessary to add two procedures for drilling and tinning, and the accuracy of these procedures increases the production cost. Moreover, this packaging method is not a standard process of the 1C package, and the manufacturing cost is also increased. In view of the above problems, it is necessary to develop an antenna which is simple in structure and easy to manufacture, and to place the antenna inside the package without increasing the packaging step, thereby achieving a reduction in manufacturing cost. SUMMARY OF THE INVENTION In order to solve the above-mentioned problem of the high cost of the conventional antenna fabrication and packaging process, the main purpose of the present invention is to provide an apparatus and a process for reducing the antenna manufacturing cost of the antenna and the heat dissipation metal piece. Another object of the present invention is to provide an antenna and heat sink metal device and process that can be placed inside the package without adding packaging steps and without requiring additional development of the process. Still another object of the present invention is to provide an antenna for mounting an antenna and a heat dissipating metal piece, wherein the antenna has a simple structure, is easy to manufacture, and is low in cost. Another object of the present invention is to provide an apparatus and process for an antenna and a heat dissipating metal piece, wherein the antenna and the heat dissipating metal piece are of a single metal piece or a bimetal piece. In order to achieve the above object of the present invention, the apparatus for the antenna and the heat-dissipating metal sheet of the present invention mainly comprises a substrate, an antenna signal transmission line, at least one piece, at least one metal strip, at least one metal piece, and a gel. The substrate is provided with upper and lower surfaces, and a lower basket is provided with a plurality of basket balls for electrical connection to an external circuit. The antenna signal transmission line and the metal strip are formed on the upper surface of the substrate, and the wafer is disposed on the upper surface of the substrate and electrically connected to the antenna signal transmission line. The at least one metal piece has an antenna and a heat dissipating function and is disposed on the upper surface of the substrate. The encapsulant covers at least the wafer, the antenna signal transmission line, and the metal strip. Further, according to the present invention, the at least one metal piece is divided into a single metal piece and a bimetal structure. The single metal sheet is formed by cutting a single metal sheet or forming a specific pattern by pressing, and the single metal sheet is further divided into two structures. The first structure includes a heat dissipating metal provided with an antenna. The piece and its multiple support elements. A heat sink metal sheet provided with an antenna is placed over the wafer and held at a predetermined distance from the wafer. One of the plurality of support members feeds the metal piece to the antenna for electrical connection to the antenna signal transmission line, and the remaining support elements are electrically connected to the metal strips and a portion of the metal strip can be connected to the system ground plane. The second structure of the single metal piece includes a heat sink, an antenna, an overnight metal piece, and an antenna feed metal piece. The heat sink is disposed above the wafer and maintained at a predetermined distance from the wafer. A plurality of support members are disposed under the heat sink. The heat sink is electrically connected to each metal strip by a plurality of support members, and the metal strips are grounded. The antenna is disposed above the heat sink and maintained at a predetermined distance from the heat sink, and the connecting metal piece is used to connect the antenna and the heat sink. One end of the antenna feeding the metal piece is connected to the antenna, and the other end is connected to the antenna signal transmission line. 1249262 In a bimetal structure, each metal sheet is bent by cutting a single metal sheet or by forming a specific pattern, and one of the bimetals includes a heat sink and a plurality of supporting members thereof. The heat sink is disposed above the wafer and maintained at a predetermined distance from the wafer, and each of the support members is electrically connected to each of the metal strips, and the metal strips are grounded again. In addition, the other of the bimetals includes an antenna and an antenna fed into the metal piece, the antenna is disposed above the heat sink and maintained at a predetermined distance from the heat sink, and the antenna is fed into the metal piece at one end of the antenna, and the other end is connected to the antenna. Then connect to the antenna signal transmission line. Wherein, the outer side of the heat sink and the outer side of the plurality of supporting elements are covered with a layer of sealing body, the antenna is located above the sealing body, and the antenna feeding the metal piece is fed by the side. The process of the antenna and the heat dissipating metal sheet is: (a) providing a substrate, the upper surface of the substrate has been bonded to at least one of the wafers and has been gold-plated, and an antenna signal transmission line and a plurality of metal strips have been formed, (b) An antenna and a heat sink are disposed on the upper surface of the substrate, and a glue is poured into the substrate. (c) Finally, a plurality of metal solder balls are placed on the lower surface of the substrate. According to the present invention, the antenna and heat sink metal sheets are made of a single metal piece or a double metal piece, and there are different approaches in the step (b). If the antenna and the heat dissipating metal piece are made of a single metal piece, the single metal piece is provided with a plurality of baffle elements, and the step (b) further comprises the following steps: (1) cutting or pressing the single gold 10 pieces to form a specific pattern, (2) bending the single metal piece, (3) placing the single metal piece above the at least one wafer, feeding the antenna between the metal piece and the antenna signal transmission line, each supporting element and each metal The strips are connected together. (4) Finally, a gel is poured into the at least one wafer, the antenna signal transmission line and the plurality of metal strips. On the other hand, if the antenna and the heat-dissipating metal sheet are respectively made of a bimetal, one of the bimetals includes a heat sink and a plurality of supporting members, and the other of the bimetals includes an antenna and an antenna. When the metal piece is fed, the step (b) further comprises the following steps: (1) cutting or molding the bimetal to form a specific pattern, and (2) bending the bimetal to feed the antenna and the antenna into the metal. Between the sheets and between the heat sink and the plurality of support members, about 90 degrees, (3) placing the heat sink above the at least one wafer, connecting the support members and the metal strips, and (4) pouring a colloid Above the heat sink, outside of the plurality of support members, and covering at least the antenna signal transmission line, the plurality of metal strips and the at least one wafer, (5) Finally, placing the antenna above the sealant and connecting the antenna to the metal Chip and antenna signal transmission line. In the present invention, an antenna is implemented by using a dual-frequency antenna module as an example for further explanation. According to the measurement results, the resonance point of the antenna and the heat sinking metal piece is respectively at a low frequency of 2.4 GHz and at a high frequency of 5.2 GHz. In the low frequency or high 1249262 frequency range, the return loss (retum loss) is better than 15 volumes. In the low frequency band 2.4 GHz, the antenna gain (antenna ga is up to 35 畑, and in the high frequency band 5.1 GHz, the antenna gain is up to 2 〇. The antenna and heat sink metal sheet of the present invention are only required for production. It can be completed by cutting or bending a single metal piece or a bimetal piece, so that the antenna and the heat dissipating metal piece in the form of a single metal piece have an integral molding feature; and the form of the single or bimetal piece is simple, so The advantage of low cost can be achieved. In addition, in the packaging process, since the antenna and the heat-dissipating metal piece of the single metal piece are integrally formed, the step of arranging the heat sink is to arrange the antenna, so there is no need to separately arrange the antenna. There is no need to develop a new process, and the present invention can be packaged into a multi-chip module by using the old process to achieve high integration and cost reduction. The following diagrams, detailed descriptions of the examples, and patent applications are provided. The foregoing and other objects and advantages of the present invention will be described in detail below. [Embodiment] The second figure illustrates the single gold in the present invention. The present invention includes at least one wafer 220, an antenna signal transmission line 221, a plurality of metal strips 240, an antenna and heat sink unit 210, a gel 260, and a substrate 230. The wafer 220 12 1249262 is disposed on the upper surface 231 of the substrate, and is respectively connected to the antenna signal transmission line 221 and the bonding pad via the gold wire 222. The antenna signal transmission line 221 and the metal strip 240 are formed on the upper surface 231 of the substrate, and the sealing body 260 covers the wafer 220. The antenna signal transmission line 221 and the plurality of metal strips 240. The antenna and heat dissipating unit 21 () includes an antenna feeding metal piece 212, an antenna 21, a heat sink 214 and a plurality of supporting elements 215 thereof are integrally formed into a single metal piece structure (and In the second figure, a single metal sheet structure with a broken line is included. The function of feeding the antenna in the second figure into the metal piece 212 and the antenna 211 can also be incorporated into the heat sink 214 and its plurality of supporting elements 215, and the antenna and heat dissipating unit 21 That is, it becomes a gate-shaped single metal piece structure without a dotted line. The antenna and heat dissipating unit 21 is placed above the wafer 220 by a plurality of supporting members 215 and gold. In addition, the antenna feeding metal piece 212 has one end connected to the antenna 'the other end is connected to the antenna signal transmission line 221 ' of the upper surface 231 of the substrate. The antenna signal transmission line 221 is also connected to the wafer 220. The wafer 220 is passed through the lower surface 232 of the substrate. A plurality of metal solder balls 25 are connected to an external circuit. It should be noted that the antenna signal transmission line 221 and the metal strip 240 in the second figure overlap due to the viewing angle, and the two are not actually connected to each other. Three embodiments of the apparatus of the present invention are detailed below, the first embodiment and the second embodiment being a single metal piece structure, and the third embodiment being a bimetal piece structure. Figure 3A is a perspective view of the first embodiment of the present invention. In this embodiment, the device for the antenna and the heat dissipating metal sheet of the present invention comprises an antenna 31, an antenna feeding metal piece 312, at least one connecting metal piece 313, a heat sink 314, at least one chip 320, and an antenna signal transmission line 321 A plurality of metal strips 340, a colloid 360, and a substrate 330. The antenna and heat dissipating unit 310 is a single metal piece structure composed of an antenna 311, an antenna feeding metal piece 312, at least one connecting metal piece 313, a heat sink 314 and a supporting member 315. The substrate 330 is provided with upper and lower surfaces, and an antenna signal transmission line 321 and a plurality of metal strips 340 are formed on the upper surface 331, and a wafer 320 is adhered. The wafer 320 is connected to the antenna signal transmission line 321 and the bonding pad 341 via gold wires 322, respectively. The connecting metal piece 313 is connected to the antenna 311 at the other end, and the other end is connected to the heat sink 314, the angle between the connecting metal piece 313 and the antenna 311, and the angle between the connecting metal piece 313 and the antenna 311 are about 9 The twist, so the antenna 311 is nearly parallel to the heat sink 314. The antenna is fed into the metal piece 312, and the end is connected to the antenna 311. The angle between the two is about 9 degrees. The other end is 12429262, which is connected to the antenna signal transmission line 321, and the antenna signal is transmitted from the upper surface 331 of the substrate to the antenna 311 to be excited. The purpose of the antenna 311. Furthermore, the heat sink 314 is provided with a plurality of support members 315 for connecting to the metal strip 340 and having a space between the heat sink 314 and the wafer 320 to prevent the wafer 320 from coming into contact with the heat sink 314. As for each metal strip 340, it is connected to the ground of the electronic device. Figure 3B is a cross-sectional view of the first embodiment of the present invention, wherein the encapsulant 360 is molded by injection molding using at least a molding compound such as epoxy resin (ep0Xy resin). The chip 320, the antenna signal transmission line 32, and the metal strip 340 may also cover the underside of the antenna 3U, the antenna feeding the metal piece 312 and the outside of the supporting member 315, etc., to protect the wafer 320 from external force, oxidation, and the like. The substrate lower surface 332 is provided with a plurality of metal solder balls 350 for connection to external circuits, motherboards or other electronic devices. In addition to the heat dissipation function, the heat sink 314 also has the function of isolating the antenna radiation signal to interfere with the chip. The third C diagram is a side view of the first embodiment of the present invention. The connecting metal piece 313 is connected to the antenna 311 and the heat sink 314, respectively, and the heat radiating piece 314 is connected to the branching element 315. In addition, the antenna 311 is also connected to the antenna feed metal piece 312. Therefore, the above-mentioned components can be formed into an integrated structure, and only a single metal piece can be cut and bent in the production process. The process of the first embodiment of the present invention will be described below with reference to Figs. 4A to 4E. First, at least one wafer 320 is bonded to the upper surface 331 of a substrate 330 on which an antenna signal transmission line 321 and a plurality of metal strips 340 have been formed, and a gold wire 322 is applied. The substrate 330 having the bonding pad 34 and the antenna signal transmission line 321 and the plurality of metal strips 340 is pasted, and the wafer 320 can be adhered to the substrate 330 by epoxy dispensor, and then the wire bond capillary is used. Put on the gold wire 322 (as shown in the fourth A, fourth B). Next, a single piece of metal is cut or stamped to form a particular pattern. The connecting metal piece 313, the antenna 311, the heat sink 314 and its plurality of supporting members 315 are connected to each other as an integrally formed structure, and a single metal piece is cut at the time of fabrication, or a single metal piece is pressed into a specific pattern by compression molding. Referring to FIG. 4C, a single metal sheet development view of the antenna and heat dissipation unit 310 of the first embodiment 1249262 of the present invention is shown. The length of the antenna feeding metal piece 312 is equal to the length of the connecting metal piece 313 and the width of the supporting member 315 is redundant, so that the antenna feeding metal piece 312 is easily connected to the antenna signal transmission line 321. The present invention can reduce the production cost because of its integral molding characteristics. Then, the single metal piece is bent so that the heat sink 314 and the plurality of branch_components 315, between the connection metal piece 313 and the heat sink 314, and between the connection metal piece 313 and the antenna 311 are approximately 90 degrees. The fourth D diagram is the shape of the single metal sheet after being bent along the bending line 316. The next step is to place the single metal piece on the upper surface 331 of the substrate, and feed the antenna between the metal piece 312 and the antenna signal transmission line 321, connect the supporting members 315 and the metal strips 340, and fill the sealing _ Colloid 360. When the single metal piece is placed, the antenna feeding metal piece 312 can contact the antenna signal transmission line 321, so that the antenna feeding circuit does not need to be separately designed. And filling the sealing body 360, at least covering the chip 320, the antenna signal transmission line 321, the metal strip 340, and simultaneously covering the lower side of the antenna 311, the antenna feeding the metal piece 312 and the outer side of the supporting element 315, etc. group. Finally, a plurality of metal solder balls 350, 17 1249262 are placed on the lower surface 332 of the substrate to be connected to an external circuit (as shown in FIG. 4E). It should be noted that in the third, fourth, and fourth figures, the antenna signal, the number of transmission lines 321 and the metal strip 340 overlap due to the viewing angle. '❸ phenomenon' can be seen from the third A and fourth A pictures. In fact, the two are not connected to each other. • *The above description shows that in the packaging process, all the steps are the same as those of the conventional semiconductor process with the heat sink of the first figure, and the original heat sink is replaced by the present invention only when the heat sink is placed. The steps of wafer encapsulation are performed, so that no additional development process is required, so the complexity of the packaging step can be simplified, and the purpose of high integration and cost reduction can be achieved. φ 帛 ® ® ® is the ship of this (4) two paid. The structure of the antenna and heat dissipating unit 510 is similar to that of the first embodiment. The main component is a heat dissipating metal piece 514 provided with an antenna, which has the function of an antenna in addition to the function of dissipating heat, and is provided with a plurality of supporting elements 515. A Zhao-shaped single metal sheet structure. One of the plurality of branching elements is an antenna feed metal piece 512 which is in turn coupled to an antenna signal transmission line 531 on the upper surface 531 of the substrate. The remaining support elements M3 are connected to respective metal strips 540, and a portion of the metal strips can be connected to the system ground plane. 18th, A, and 6th e drawings illustrate a process 0 of the second embodiment of the present invention. The first embodiment is similar to the process of the first embodiment, with the difference being that the cutting step towel 'single metal #洲洲 or lion style Unique to the first embodiment. As shown in the sixth embodiment, at least the wafer 520 is bonded to the upper surface 531 of the substrate 530 on which an antenna signal transmission line 521 and a plurality of metal strips 540 have been formed, and a gold wire 522 is applied. Next, the cut or die sheet metal sheet forms a "specific pattern." As shown in the sixth B and the sixth c, the heat dissipating metal piece 514 provided with the antenna may be in the shape of a conventional heat sink, or may be a rectangle or the like, and the antenna feeding metal # 512 is one of them. Branch building components. The next material step towel, f is folded into the single metal >|, so that the heat-dissipating metal piece 5M provided with the antenna and its plurality of supporting members 515 are slightly 90 degrees as shown in the first, B, and sixth C-pictures. The bending line 516 is bent and made. In the next step, as shown in FIG. 6D, the single metal piece is placed on the upper surface 531 of the substrate, and the antenna is fed between the metal piece 512 and the antenna signal transmission line 521, and each of the branch elements 5! 5 and each metal strip 54〇 is connected, and I want to think about 56G. The height of the antenna intrusion metal piece 512 is the length of the sixth B and the sixth c picture; Finally, a plurality of metal solder balls 550 are placed on the lower surface 532 of the substrate to be connected to an external circuit (as shown in FIG. 6E). Figure 7 is a side view showing a third embodiment of the present invention. The third embodiment is similar to the structure of the first embodiment, and the biggest difference is that the 'antenna and heat sink unit is a bimetal structure. In other words, the antenna 711 and the antenna feed metal piece 712 are made of a metal piece, and the heat radiating piece 714 and its plurality of support members 715 are made of another metal piece. A plurality of support members 715 of the heat sink 714 are coupled to the metal strip 740 and have a space between the heat sink 714 and the wafer 720 to prevent the wafer 720 from contacting the heat sink 714. The sealing body 760 is disposed at least on the outer side of the heat sink 714 and the outer side of the plurality of supporting members 715. The antenna 711 is disposed above the sealing body 760, and the sealing body 760 is used as the base material between the antenna 711 and the heat sink 714. ). On the other hand, the antenna feeding metal piece 712 has one end connected to the antenna 711' at approximately 90 degrees, and the other end is connected to the antenna signal transmission line 721, so that the antenna signal can be fed through the side antenna feeding metal piece 712. It should be noted that there is a phenomenon in the seventh figure and the antenna signal transmission line 721 and the supporting element 715 in the eighth E-1282962 八G diagram which will be described below due to the angle of view. Actually, the two are not connected to each other. 0 The process of the third embodiment of the present invention will be described below with reference to Figs. 8A to 8G. First, at least one wafer 720 is bonded to the upper surface 731 of a substrate 730 on which an antenna signal transmission line 721 and a plurality of metal strips 740 have been formed, and a plurality of gold wires 722 are applied, as shown in FIG. Next, the cut or scrap molded bimetals each form a specific pattern. Since the antenna and the heat sink of the embodiment have a bimetal structure, the respective cutting or stamping forms different patterns. As shown in Figs. 8B and 8C, the antenna 711 may have a rectangular shape, a circular shape, or the like, and the antenna feeding metal piece 712 may have a shape of an approximately triangular shape, a rectangular shape, or the like. As for the fins 714 and the metal sheets of the plurality of branch members 71S, they are cut or stamped into the pattern of the first C-picture. Then, the bimetal is folded, so that the antenna 711 and the antenna are fed between the metal pieces 712 and the heat sink 714 and the plurality of branch elements 715 are approximately 90 degrees. As shown in the eighth B, eighth C and first c 21 1249262, the bending lines 716 and 116 are bent and formed. Next, a heat sink 714 is disposed on the upper surface 731 of the substrate, and each of the support members 715 and each of the metal strips 740 are connected, as shown in FIG. Subsequently, the encapsulant 760 is refilled, at least covering the wafer 720, a portion of the antenna signal transmission line 72, the metal strip 740, and the heat sink 714 above and the outside of the plurality of support members 715, as shown in FIG. The next step is to place the antenna 711 above the encapsulant 760 and connect the antenna feed metal piece 712 and the antenna signal transmission line 740' as shown in the eighth ρ. The extent to which the antenna is fed into the metal piece 712 is the length of the eighth B and the eighth C. Finally, a plurality of solder balls 750 are placed on the lower surface 732 of the substrate to be connected to an external circuit (as shown in the eighth G diagram). The ninth diagram is an example of a perspective view of a device in accordance with the present invention, wherein the antenna is implemented as a dual frequency antenna module. In the ninth diagram, the dual-frequency antenna module comprises an antenna unit 911, a first path antenna unit 911a, and a second path antenna unit 9Ub. This two-way antenna unit has its own operating frequency range. One of them operates in the high frequency range (5150-5350 MHz) and the other in the low frequency range 22 1249262 (2400-2484 MHz). The dual band antenna module is placed above a mask cover 940. This mask cover 940 has a heat dissipation function. The upper surface 931 of the substrate 930 has a high frequency circuit 920 having an antenna signal transmission line (not shown). One end of the antenna feeding metal piece 912 is connected to the antenna unit 911, and the other end is electrically connected to the antenna signal transmission line. One end of the first connecting metal piece 913a is connected to the first path antenna unit 911a, and the other end is electrically connected to the mask cover 940. One end of the second connecting metal piece 913b is connected to the second path antenna unit 911b, and the other end is connected to the mask cover 940. The encapsulant 960 covers at least the high frequency circuit 920 to fix the dual frequency antenna module. In the example of the ninth figure, the dual band antenna module is placed over the mask cover 940 and at a distance from the mask cover 940, such as 2 mm. The mask cover 940 can include a heat sink and a plurality of support members. The encapsulant 960 can also cover the lower side of the dual-frequency antenna module and the outer side of the support member to fix the dual-frequency antenna module. The tenth view is a top view of the ninth figure. Referring to the tenth figure, the dual-frequency antenna module has an L or inverted-L shape, but the shape of the antenna module that achieves dual-frequency or multi-frequency operation is not limited to the above two shapes. 23 1249262 The eleventh figure is an unfolded dual-band antenna module and a cover of the mask cover. The dual-frequency antenna module is connected to the antenna feed metal piece and the connecting metal piece. Referring to the eleventh figure, the antenna is fed into the metal piece • 912, the connecting metal piece 913a-913b, and the dual-frequency antenna module are formed. A single piece of metal in the same piece. As mentioned above, the dual-frequency antenna module and the cover can be made of a single metal piece or a bimetal. In the bimetal structure, the mask cover is formed in another metal sheet. In the present invention, the operational efficiency of the structure of the ninth antenna and the heat dissipating metal piece is analyzed. The characteristics of return loss and antenna gain were measured. According to the measurement results, the resonance points of the antenna and the heat sinking metal piece in the ninth figure are respectively at a low frequency of 24 GHz and at a high frequency of 5·2 < 3 Ηζ. In the low frequency range, the return loss is better than 15 dB, and in the high frequency range, the return loss is better than 2 〇 φ φ, as can be seen from Fig. 12. In addition, the antenna gain can reach 3·5 dBi in the low frequency band of 2.4 GHz, and the antenna gain can reach 2.0 dBi in the high frequency band of 5 1GRz. As described above, the antenna and the heat dissipating metal sheet of the present invention have a simple structure and an easy-to-manufacture characteristic regardless of the form of the single or bimetal. The invention utilizes the antenna of the single metal piece and the heat dissipating metal piece in the form of body forming, and in the step of arranging the heat sink, at the same time, the antenna and the dispersing 24 1249262 hot piece are placed inside the package, and then the step of wafer encapsulation is continued, and thus No additional development process is required, so the complexity of the packaging steps can be simplified. Compared with the previous case, the antenna must be separately fabricated and a new packaging method is developed, and the present invention can achieve the requirement of reducing the antenna manufacturing cost. However, the above description is only for the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. That is, the equivalent changes and modifications made by the invention in accordance with the scope of the invention are still within the scope of the invention. 25 1249262 [Simple Description of the Drawings] The first A is a side view of a conventional multi-chip module package with bonded wafers and gold wires. Figure 1B is a side view of a conventional multi-chip module package with heat sink and glued. The first C picture is an expanded view of a conventional heat sink. The first D is a side view of a conventional multi-wafer module package after placing a plurality of metal solder balls. The second figure is a cross-sectional view of a single metal sheet structure of the device for the antenna and the heat sinking metal sheet of the present invention. Figure 2A is a perspective view of the first embodiment of the present invention. Figure 3B is a cross-sectional view showing the first embodiment of the present invention. The second C diagram is a side view of the first embodiment of the present invention. The fourth A to fourth E drawings show the process of the first embodiment of the present invention. Figure 5 is a cross-sectional view showing a second embodiment of the present invention. The 'κ, Α, and sixth E drawings show the process of the second embodiment of the present invention. Figure 7 is a cross-sectional view showing a third embodiment of the present invention. The eighth to eighth G drawings show the process of the third embodiment of the present invention. The ninth drawing is an example of a perspective view of the apparatus according to the present invention. The tenth picture is the top view circle of the ninth. Figure 11 is an unfolded dual-band antenna module and a cover of the mask cover. The dual-band antenna module is connected to the antenna feed metal piece and the connection gold 26 1249262. The twelfth figure is a measurement result of the return loss versus the operating frequency of the dual-frequency antenna module in the ninth figure. [Main component symbol description] 210, 310, 510 antenna and heat dissipation unit 211, 311, 711 antenna _ 212, 312, 512, 712 antenna feed metal piece 313 connection metal piece 114, 214, 314, 714 heat sink 514 is provided Heat sink metal strip 115, 215, 315, 515, 715 support element 116, 316, 516, 716 bend line 120, 220, 320, 520, 720 wafer '# 22 321 , 52 721 antenna signal transmission line 122, 222 322, 522, 722 gold wire 130, 230, 330, 530, 730 substrate 231, 331 substrate upper surface 232, 332 substrate lower surface 240, 340, 540, 740 metal strip 241, 341 bonding pad 27 1249262 150, 250 , 350, 550, 750 metal solder balls 160, 260, 360, 560, 760 sealant

911天線單元 911b第二路徑天線單元 913a、913b連接金屬片 930基板 940遮罩蓋 911a第一路徑天線單元 912天線饋入金屬片 920高頻電路 931基板上表面 960封膠體911 antenna unit 911b second path antenna unit 913a, 913b connection metal piece 930 substrate 940 mask cover 911a first path antenna unit 912 antenna feed metal piece 920 high frequency circuit 931 substrate upper surface 960 sealant

2828

Claims (1)

1249262 十、申請專利範圍： 1· 一種天線暨散熱金屬片之裝置，包含： 一基板，備有上、下表面，該下表面設有多個金屬焊球， 用以電氣連接至一外部電路； 一天線訊號傳輸線，形成於該基板的上表面； 至少一晶片，設置於該基板的上表面，並與該天線訊號 傳輸線形成電氣連接； 至少一條金屬帶，形成於該基板的上表面； 至少一金屬片，具有天線與散熱之功能，設置於該基板 的上表面；以及 一封膠體，至少包覆該至少一晶片、該天線訊號傳輸線 以及該金屬帶。 2·如申請專利範圍第1項所述之天線暨散熱金屬片之裝置， 其中該至少一金屬片為單金屬片，該單金屬片係經由切割 單一金屬片或以壓模的方式形成一特定樣式之後；彎折而 成，該單金屬片包含： 一備有天線之散熱金屬片，設置於該至少一晶片的上方並 與該至少一晶片保持一預設距離；以及 多根支撐元件，其中一根支撐元件為天線饋入金屬片，用 以電氣連接至該天線訊號傳輸線，其餘的支撐元件則與各 該金屬帶形成電氣連接。 3·如申請專利範圍第2項所述之天線暨散熱金屬片之裝置， 29 1249262 其中該備有天線之散熱金屬片的形狀為圓形或長方形之其 中一種。 4·如申請專利範圍第2項所述之天線暨散熱金屬片之裝置， 其中該備有天線之散熱金屬片與該多根支撐元件之間約 略成90度。 5·如申請專利範圍第2項所述之天線暨散熱金屬片之裝置， 其中該備有天線之散熱金屬片與該基板平行。 6·如申請專利範圍第1項所述之天線暨散熱金屬片之裝置， 其中該至少一金屬片為早金屬片’該金屬片係經由切割單 一金屬片或以壓模的方式形成一特定樣式之後，彎折而 成，該金屬片包含： 一散熱片，設置於該至少一晶片的上方並與該至少一晶片 保持一預設距離，該散熱片的下方設有多個支撐元件，該 散熱片藉由該多個支撐元件電氣連接至各該金屬帶，各該 金屬帶再接地； ' 一天線，設置於該散熱片的上方並與該散熱片保持一預設 距離； 至少一連接金屬片，用以連接該天線與該散熱片；以及 一天線饋入金屬片，其一端連接該天線，另一端則連接至 該天線訊號傳輪線。 7·如申請專利範圍第6項所述之天線暨散熱金屬片之裝置， 其中該連接金屬片與該散熱片之間以及該連接金屬片與該 30 1249262 天線之間約略成90度。 8·如申請專利範圍第6項所述之天線暨散熱金屬片之裝置， 其中該封膠趙更包覆於該天線的下方、該散熱片的上方以 及該多個支撐元件與該連接金屬片的外側。 9 ·如申請專利範圍第1項所述之天線暨散熱金屬片之裝置， 其中該至少一金屬片為雙金屬片，各該雙金屬片係經由 切割單一金屬片或以壓模的方式形成一特定樣式之後， 彎折而成，該雙金屬片其中之一包含： 散熱片，設置於該至少一晶片的上方並與該至少一晶片 保持一預設距離；以及 多根支撐元件，各支撐元件與各該金屬帶形成電氣連接， 各該金屬帶再接地； 該雙金屬片其中之另一片包含： 一天線，設置於該散熱片的上方並與該散熱片保持一預設 距離；以及 ' 一天線饋入金屬片，其一端連接該天線，另一端則連接至 該天線訊號傳輸線； 其中，在該散熱片的上方與該多根支撐元件的外側包覆一 層該封膠體，該天線位於該封膠體的上方，而該天線饋入 金屬片則由側面饋入該天線。 10·如申請專利範圍第9項所述之天線暨散熱金屬片之裝 置，其中該天線的形狀為圓形或長方形之其中一種。 31 1249262 U·如申料利範圍第9項所述之天線暨散熱金屬片之裝 置’其中該天線饋人金屬片的形狀為三角碱長方形之 其中一種。 12·如申凊專利範圍第6或9項所述之天線暨散熱金屬片之裝 • 置，其中該散熱片與該多根支撐元件之間約略成90度。 13·如申睛專利範圍第6或9項所述之天線暨散熱金屬片之裝 置，其中該散熱片與該天線約略平行並且朝同一方向延 • 伸。 14·如申請專利範圍第6或9項所述之天線暨散熱金屬片之裝 置，其中該散熱片與該基板平行。 15·如申請專利範圍第6或9項所述之天線暨散熱金屬片之 裴置，其中該天線饋入金屬片與該天線之間約略成90度。 16* 一種天線暨散熱金屬片毛製程，包含以下步驟： 提供一基板，該基板的上表面已黏接至少一晶片並已打上 % 金線’並已形成一天線訊號傳輸線與多條金屬帶； 安置一天線與一散熱片於該基板的上表面，並灌入一封膠 體；以及 •置入多個金屬焊球於該基板的下表面。 _ 17·如申請專利範圍第16項所述之天線暨散熱金屬片之製 程’其中該安置與灌膠步驟中，該天線與該散熱片係由單 一金屬片所製成，該單金屬片設有多根支撐元件，該安置 與灌膠步驟更包含以下步驟： 32 1249262 切割或壓模該單金屬片形成一特定的樣式； 彎折該單金屬片；以及 安置該單金屬片於該至少一晶片的上方，將該天線饋入 金屬片與該天線訊號傳輸線之間、各該支樓元件與各該 金屬帶之間連接起來；以及 灌入一封膠體，至少包覆該至少一晶片、該天線訊號傳輸 線與該多條金屬帶。 18·如申請專利範圍第π項所述之天線暨散熱金屬片之製 程’其中該單金屬片更包含一備有天線之散熱金屬片，而 該早金屬片的該多根支撐元件其中之一為一天線饋入金 屬片。 19·如申請專利範圍第π項所述之天線暨散熱金屬片之製 程，其中該單金屬片更包含至少一連接金屬片與一天線饋 入金屬片。 20·如申請專利範圍第16項所述之天線暨散熱金屬片之製 程，其中該安置與灌膠步驟中，該天線與該散熱片係分別 由雙金屬片所製成，該雙金屬片其中之一包含一散熱片與 多根支撐元件，該雙金屬片其中之另一片包含一天線與一 天線饋入金屬片，該安置與灌穋步驟更包含以下步驟： 切割或壓模該雙金屬片各形成一特定的樣式； 彎折該雙金屬片，使該天線與該天線饋入金屬片之間以及 該散熱片與該多根支樓元件之間約略成9〇度； 33 1249262 安置該散熱片於該至少-晶片的上方，連接各該支樓元件 與各該金屬帶； 灌入一封膠體於該散熱片的上方與該多根支撐元件的外 側，並至少包覆該至少一晶片、該天線訊號傳輸線與該多 條金屬帶；以及 放置該天線⑽娜體社^，並連麟天雜入金屬片 與該天線訊號傳輸線。 21· —種天線暨散熱金屬片之玉戈，包含： 一基板，備有上、下表面； 一高頻電路，該高頻電路裡具有一天線訊號傳輸線； 一遮罩蓋，形成於該基板的上表面，且具有散熱功能； 一金屬片，至少包含一雙頻天線模組，且該雙頻天線模 組設置於該遮罩蓋的上方；以及 一封膠體，至少包覆該高頻電路。 22·如申請專利範圍第21項所述之天線暨散熱金屬片之裝 置，其中該雙頻天線模組更包含一天線單元、一操作於一 南頻率範圍的第一路徑天線單元、和一作於低頻率範圍的 第二路徑天線單元。 23·如申請專利範圍第21項所述之天線暨散熱金屬片之裝 置，其中該金屬片更包括該一遮罩蓋。 24·如申請專利範圍第21項所述之天線暨散熱金屬片之裝 置，其中該遮罩蓋更包括一散熱片和多根支撐元件。 34 1249262 25·如申請專利範圍第21項所述之天線暨散熱金屬片之裝 置，其中該封膠體包覆該雙頻天線模組的下方和該支撐元 件的外邊，以固定該雙頻天線模組。 26. 如申請專利範圍第22項所述之天線暨散熱金屬片之裝 置，其中該金屬片更包括一天線饋入金屬片以電性連接至 該天線訊號傳輸線，以及至少兩連接金屬片以連接至該第 一和第二路徑天線單元與該遮罩蓋。 27. 如申請專利範圍第22項所述之天線暨散熱金屬片之裝 置，其中該裝置安排另一金屬片以建構該遮罩蓋。 351249262 X. Patent application scope: 1. An antenna and a heat dissipating metal sheet device, comprising: a substrate provided with upper and lower surfaces, wherein the lower surface is provided with a plurality of metal solder balls for electrically connecting to an external circuit; An antenna signal transmission line is formed on the upper surface of the substrate; at least one wafer is disposed on the upper surface of the substrate and electrically connected to the antenna signal transmission line; at least one metal strip is formed on the upper surface of the substrate; at least one a metal sheet having an antenna and a heat dissipating function disposed on an upper surface of the substrate; and a gel covering at least the wafer, the antenna signal transmission line, and the metal strip. 2. The device of claim 1 , wherein the at least one metal piece is a single metal piece, the single metal piece forming a specific shape by cutting a single metal piece or by stamping After the pattern; bent, the single metal piece comprises: a heat dissipating metal piece provided with an antenna, disposed above the at least one wafer and maintaining a predetermined distance from the at least one wafer; and a plurality of supporting elements, wherein A support member feeds the metal piece to the antenna for electrically connecting to the antenna signal transmission line, and the remaining support members are electrically connected to each of the metal strips. 3. The device for applying an antenna and a heat dissipating metal piece according to item 2 of the patent application, 29 1249262 wherein the heat dissipating metal piece provided with the antenna has a shape of one of a circle or a rectangle. 4. The apparatus of claim 2, wherein the heat dissipating metal piece provided with the antenna and the plurality of supporting elements are approximately 90 degrees. 5. The device of claim 2, wherein the heat dissipating metal piece provided with the antenna is parallel to the substrate. 6. The device of claim 1 , wherein the at least one metal piece is an early metal piece. The metal piece forms a specific pattern by cutting a single metal piece or by stamping. After being bent, the metal piece comprises: a heat sink disposed above the at least one wafer and maintaining a predetermined distance from the at least one wafer, and a plurality of supporting elements are disposed under the heat sink, the heat dissipation The piece is electrically connected to each of the metal strips by the plurality of supporting members, and the metal strips are grounded again; 'an antenna disposed above the heat sink and maintaining a predetermined distance from the heat sink; at least one connecting metal piece The antenna is connected to the heat sink; and an antenna is fed into the metal piece, one end of which is connected to the antenna, and the other end is connected to the antenna signal transmission line. 7. The device of claim 6, wherein the connecting metal piece and the heat sink and the connecting metal piece and the 30 1249262 antenna are approximately 90 degrees. 8. The device of claim 6, wherein the sealant is coated under the antenna, above the heat sink, and the plurality of support members and the connecting metal piece. The outside. 9. The device of claim 1 , wherein the at least one metal piece is a bimetal, each of the bimetals being formed by cutting a single piece of metal or by stamping. After the specific pattern is bent, one of the bimetals includes: a heat sink disposed above the at least one wafer and maintaining a predetermined distance from the at least one wafer; and a plurality of support members, each support member Electrically connecting with each of the metal strips, each of the metal strips being grounded; wherein the other of the bimetals comprises: an antenna disposed above the heat sink and maintaining a predetermined distance from the heat sink; and The wire is fed into the metal piece, one end of which is connected to the antenna, and the other end is connected to the antenna signal transmission line; wherein, the outer side of the heat sink and the outer side of the plurality of supporting elements are covered with a layer of the sealing body, the antenna is located in the sealing piece Above the gel, the antenna is fed into the metal piece and fed into the antenna from the side. 10. The device for antenna and heat sinking metal sheet according to claim 9, wherein the antenna has one of a circular shape or a rectangular shape. 31 1249262 U. The device for antenna and heat sink metal piece according to claim 9 wherein the antenna feed piece has a shape of a triangular base rectangle. 12. The antenna and heat sink metal sheet of claim 6 or claim 9, wherein the heat sink is approximately 90 degrees from the plurality of support members. 13. The antenna and heat sink metal sheet of claim 6 or claim 9, wherein the heat sink is approximately parallel to the antenna and extends in the same direction. 14. The device for antenna and heat sink metal sheet of claim 6 or claim 9, wherein the heat sink is parallel to the substrate. 15. The antenna and heat sink metal sheet of claim 6 or claim 9, wherein the antenna is fed between the metal sheet and the antenna at approximately 90 degrees. 16* An antenna and heat sinking metal sheet process comprises the steps of: providing a substrate having at least one wafer bonded to an upper surface thereof and having been coated with a % gold wire and having formed an antenna signal transmission line and a plurality of metal strips; An antenna and a heat sink are disposed on the upper surface of the substrate, and a gel is filled; and a plurality of metal solder balls are placed on the lower surface of the substrate. _ 17· The process of the antenna and the heat-dissipating metal piece described in claim 16 of the patent application. In the step of placing and filling the glue, the antenna and the heat sink are made of a single metal piece, and the single metal piece is set. There are a plurality of supporting members, and the placing and filling step further comprises the following steps: 32 1249262 cutting or pressing the single metal sheet to form a specific pattern; bending the single metal sheet; and positioning the single metal sheet at the at least one Above the wafer, the antenna is fed between the metal piece and the antenna signal transmission line, and each of the branch elements is connected with each of the metal strips; and a glue is poured into the at least one wafer, The antenna signal transmission line and the plurality of metal strips. 18. The process of claim 2, wherein the single metal piece further comprises a heat dissipating metal piece provided with an antenna, and one of the plurality of supporting elements of the early metal piece A metal piece is fed into an antenna. 19. The process of claim 2, wherein the single metal sheet further comprises at least one connecting metal piece and an antenna feeding metal piece. 20. The process of the antenna and the heat dissipating metal sheet according to claim 16, wherein in the placing and filling step, the antenna and the heat sink are respectively made of a bimetal, wherein the bimetal One includes a heat sink and a plurality of support members, and the other of the bimetals includes an antenna and an antenna for feeding the metal sheet, and the placing and filling step further comprises the steps of: cutting or molding the bimetal Forming a specific pattern; bending the bimetal such that the antenna and the antenna are fed between the metal sheets and between the heat sink and the plurality of branch elements are approximately 9 degrees; 33 1249262 is disposed to dissipate the heat a sheet above the at least wafer, connecting each of the branch elements and each of the metal strips; filling a gel over the heat sink and outside of the plurality of support members, and covering at least one of the wafers, The antenna signal transmission line and the plurality of metal strips; and the antenna (10) are placed in the body, and the Lintian is mixed with the metal piece and the antenna signal transmission line. 21·—A type of antenna and heat sink metal sheet, comprising: a substrate having upper and lower surfaces; a high frequency circuit having an antenna signal transmission line; and a mask cover formed on the substrate The upper surface has a heat dissipation function; a metal piece comprising at least one dual-frequency antenna module, and the dual-frequency antenna module is disposed above the mask cover; and a gel body covering at least the high-frequency circuit . The device of claim 2, wherein the dual-frequency antenna module further comprises an antenna unit, a first path antenna unit operating in a south frequency range, and a A second path antenna unit of low frequency range. The device of claim 2, wherein the metal sheet further comprises the mask cover. The device of claim 2, wherein the mask cover further comprises a heat sink and a plurality of support members. The device of claim 2, wherein the sealant covers the lower portion of the dual-frequency antenna module and the outer side of the support member to fix the dual-frequency antenna module. group. 26. The device of claim 22, wherein the metal piece further comprises an antenna feeding metal piece electrically connected to the antenna signal transmission line, and at least two connecting metal pieces for connecting To the first and second path antenna units and the mask cover. 27. The device for antenna and heat sink metal sheet of claim 22, wherein the device arranges another metal sheet to construct the mask cover. 35
TW094119508A 2004-06-23 2005-06-13 Apparatus of antenna with heat slug and its fabrication process TWI249262B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094119508A TWI249262B (en) 2004-06-23 2005-06-13 Apparatus of antenna with heat slug and its fabrication process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW93118061 2004-06-23
TW094119508A TWI249262B (en) 2004-06-23 2005-06-13 Apparatus of antenna with heat slug and its fabrication process

Publications (2)

Publication Number Publication Date
TW200601610A TW200601610A (en) 2006-01-01
TWI249262B true TWI249262B (en) 2006-02-11

Family

ID=37429512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094119508A TWI249262B (en) 2004-06-23 2005-06-13 Apparatus of antenna with heat slug and its fabrication process

Country Status (1)

Country Link
TW (1) TWI249262B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9704857B2 (en) 2010-06-15 2017-07-11 STATS ChipPAC, Pte. Ltd. Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103022011B (en) * 2011-09-23 2015-10-07 讯芯电子科技（中山）有限公司 Semiconductor package and manufacture method thereof
TWI663701B (en) * 2017-04-28 2019-06-21 矽品精密工業股份有限公司 Electronic package and method for fabricating the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9704857B2 (en) 2010-06-15 2017-07-11 STATS ChipPAC, Pte. Ltd. Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate

Also Published As

Publication number Publication date
TW200601610A (en) 2006-01-01

Similar Documents

Publication Publication Date Title
US7145511B2 (en) Apparatus of antenna with heat slug and its fabricating process
US7042398B2 (en) Apparatus of antenna with heat slug and its fabricating process
US6982485B1 (en) Stacking structure for semiconductor chips and a semiconductor package using it
KR101434003B1 (en) Semiconductor package and manufacturing method thereof
US6770955B1 (en) Shielded antenna in a semiconductor package
JP2008543092A (en) Apparatus and method for packaging an antenna for an integrated circuit chip for millimeter wave applications
EP1374305B1 (en) Enhanced die-down ball grid array and method for making the same
US7504721B2 (en) Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips
US8952521B2 (en) Semiconductor packages with integrated antenna and method of forming thereof
US20070007643A1 (en) Semiconductor multi-chip package
US8039930B2 (en) Package structure for wireless communication module
US20070170583A1 (en) Multilayer integrated circuit for RF communication and method for assembly thereof
US9245858B2 (en) Semiconductor device package with integrated antenna for wireless applications
JP2003124433A (en) Multichip package
JP2004006564A (en) Stacked semiconductor device
TWI249262B (en) Apparatus of antenna with heat slug and its fabrication process
JP4284744B2 (en) High frequency integrated circuit device
JP2003086726A (en) High-power monolithic microwave integrated circuit package
US6847102B2 (en) Low profile semiconductor device having improved heat dissipation
CN110634842A (en) Packaging structure with electromagnetic shielding function and preparation method
TWM394582U (en) Antenna module
JP2004165429A (en) Semiconductor device and its manufacturing method, passive element and its accumulation structure, and lead frame
CN100395918C (en) Device of antenna and heat radiation metal plate and mfg. method
CN112312678A (en) Structure and method of non-packaged chip direct-buried printed circuit board and chip packaging structure
EP0996155A2 (en) Radio frequency integrated circuit apparatus