CN114829433A - 嵌段共聚物、树脂组合物、伸缩性导体、电子元件和粘着膜 - Google Patents
嵌段共聚物、树脂组合物、伸缩性导体、电子元件和粘着膜 Download PDFInfo
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- CN114829433A CN114829433A CN202080084791.4A CN202080084791A CN114829433A CN 114829433 A CN114829433 A CN 114829433A CN 202080084791 A CN202080084791 A CN 202080084791A CN 114829433 A CN114829433 A CN 114829433A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/387—Block-copolymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F293/00—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule
- C08F293/005—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule using free radical "living" or "controlled" polymerisation, e.g. using a complexing agent
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
- C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
- C08F297/026—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising acrylic acid, methacrylic acid or derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/34—Introducing sulfur atoms or sulfur-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2438/00—Living radical polymerisation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2438/00—Living radical polymerisation
- C08F2438/03—Use of a di- or tri-thiocarbonylthio compound, e.g. di- or tri-thioester, di- or tri-thiocarbamate, or a xanthate as chain transfer agent, e.g . Reversible Addition Fragmentation chain Transfer [RAFT] or Macromolecular Design via Interchange of Xanthates [MADIX]
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Graft Or Block Polymers (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-225478 | 2019-12-13 | ||
| JP2019225478 | 2019-12-13 | ||
| JP2020-060765 | 2020-03-30 | ||
| JP2020060765A JP6814317B1 (ja) | 2019-12-13 | 2020-03-30 | ブロック共重合体、樹脂組成物、伸縮性導体、電子デバイスおよび粘着フィルム |
| PCT/JP2020/045680 WO2021117723A1 (ja) | 2019-12-13 | 2020-12-08 | ブロック共重合体、樹脂組成物、伸縮性導体、電子デバイスおよび粘着フィルム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114829433A true CN114829433A (zh) | 2022-07-29 |
Family
ID=74096388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080084791.4A Pending CN114829433A (zh) | 2019-12-13 | 2020-12-08 | 嵌段共聚物、树脂组合物、伸缩性导体、电子元件和粘着膜 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12534563B2 (https=) |
| JP (2) | JP6814317B1 (https=) |
| KR (1) | KR102783969B1 (https=) |
| CN (1) | CN114829433A (https=) |
| TW (1) | TWI869509B (https=) |
| WO (1) | WO2021117723A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7294107B2 (ja) * | 2019-12-13 | 2023-06-20 | 東洋インキScホールディングス株式会社 | 粘着剤組成物、粘着フィルム |
| JP2022173644A (ja) * | 2021-05-10 | 2022-11-22 | Dic株式会社 | 星形ポリマー、塗料、塗膜、及び星形ポリマーの製造方法 |
| WO2023074722A1 (ja) * | 2021-10-27 | 2023-05-04 | 大阪有機化学工業株式会社 | 導電性エラストマー形成用組成物、導電性エラストマー、及び、重合体 |
| JP7822463B2 (ja) * | 2022-03-30 | 2026-03-02 | 三井化学株式会社 | マクロ重合開始剤、および、マクロ重合開始剤の製造方法 |
| WO2024262758A1 (ko) * | 2023-06-19 | 2024-12-26 | 삼성에스디아이 주식회사 | 경화성 조성물, 상기 조성물을 이용하여 제조된 경화막, 상기 경화막을 포함하는 디스플레이 장치 |
| JPWO2025018369A1 (https=) * | 2023-07-18 | 2025-01-23 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003147312A (ja) * | 2001-11-14 | 2003-05-21 | Kanegafuchi Chem Ind Co Ltd | エマルジョン型粘着剤 |
| JP2017043741A (ja) * | 2015-08-28 | 2017-03-02 | 株式会社クラレ | チオール基を分子末端に有するポリマー、該ポリマーの製造方法、炭素−炭素二重結合を分子末端に有するポリマーおよびパターン形成方法 |
| JP2018177926A (ja) * | 2017-04-11 | 2018-11-15 | 大日精化工業株式会社 | コーティング剤、被膜、及び被膜の製造方法 |
| CN109476797A (zh) * | 2016-07-21 | 2019-03-15 | 大塚化学株式会社 | 嵌段共聚物、组合物和膜 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4627532B1 (https=) * | 1967-07-22 | 1971-08-10 | ||
| AU653561B2 (en) * | 1990-12-20 | 1994-10-06 | Minnesota Mining And Manufacturing Company | Removable adhesive tape |
| JP3609321B2 (ja) * | 1995-06-07 | 2005-01-12 | 株式会社日本触媒 | ダンボール封緘用テープ |
| US7005031B2 (en) * | 2002-01-16 | 2006-02-28 | 3M Innovative Properties Company | Pressure sensitive adhesives having quaternary ammonium functionality, articles, and methods |
| JP5563411B2 (ja) * | 2009-10-16 | 2014-07-30 | リンテック株式会社 | 粘着剤組成物、粘着剤および光学フィルム |
| US9334345B2 (en) * | 2011-09-08 | 2016-05-10 | Ppg Industries Ohio, Inc. | Polymerizable compositions containing (meth)acrylate monomers having sulfide linkages |
| KR20140087014A (ko) | 2012-11-21 | 2014-07-08 | 도카이 고무 고교 가부시키가이샤 | 유연 도전 부재 및 그것을 사용한 트랜스듀서 |
| US10176903B2 (en) | 2014-02-05 | 2019-01-08 | Japan Science And Technology Agency | Stretchable conductor, method for manufacturing same, and paste for forming stretchable conductor |
| WO2016067406A1 (ja) | 2014-10-30 | 2016-05-06 | 積水化学工業株式会社 | 粘着テープ |
| JP6607718B2 (ja) | 2015-07-15 | 2019-11-20 | 綜研化学株式会社 | 偏光板用粘着剤組成物 |
| US20180230287A1 (en) | 2015-08-07 | 2018-08-16 | Taiyo Ink Mfgs. Co., Ltd. | Electroconductive composition, conductor, and flexible printed wiring board |
| WO2017188031A1 (ja) * | 2016-04-28 | 2017-11-02 | 株式会社日本触媒 | マレイミド系ブロック共重合体の製造方法 |
| JP7170382B2 (ja) * | 2016-04-28 | 2022-11-14 | 株式会社日本触媒 | マレイミド系ブロック共重合体の製造方法 |
| EP3518252B1 (en) | 2016-09-20 | 2024-05-08 | Osaka Organic Chemical Industry Ltd. | (meth)acrylic conductive material |
| JP6814691B2 (ja) | 2017-04-26 | 2021-01-20 | アロン化成株式会社 | 熱可塑性エラストマー組成物 |
| JP7039999B2 (ja) * | 2017-12-26 | 2022-03-23 | 東亞合成株式会社 | 重合体の製造方法 |
-
2020
- 2020-03-30 JP JP2020060765A patent/JP6814317B1/ja active Active
- 2020-10-30 JP JP2020182307A patent/JP2021095562A/ja active Pending
- 2020-12-08 CN CN202080084791.4A patent/CN114829433A/zh active Pending
- 2020-12-08 WO PCT/JP2020/045680 patent/WO2021117723A1/ja not_active Ceased
- 2020-12-08 KR KR1020227022297A patent/KR102783969B1/ko active Active
- 2020-12-08 US US17/784,097 patent/US12534563B2/en active Active
- 2020-12-10 TW TW109143651A patent/TWI869509B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003147312A (ja) * | 2001-11-14 | 2003-05-21 | Kanegafuchi Chem Ind Co Ltd | エマルジョン型粘着剤 |
| JP2017043741A (ja) * | 2015-08-28 | 2017-03-02 | 株式会社クラレ | チオール基を分子末端に有するポリマー、該ポリマーの製造方法、炭素−炭素二重結合を分子末端に有するポリマーおよびパターン形成方法 |
| CN109476797A (zh) * | 2016-07-21 | 2019-03-15 | 大塚化学株式会社 | 嵌段共聚物、组合物和膜 |
| JP2018177926A (ja) * | 2017-04-11 | 2018-11-15 | 大日精化工業株式会社 | コーティング剤、被膜、及び被膜の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202136345A (zh) | 2021-10-01 |
| JP2021095554A (ja) | 2021-06-24 |
| JP6814317B1 (ja) | 2021-01-13 |
| TWI869509B (zh) | 2025-01-11 |
| US20230050336A1 (en) | 2023-02-16 |
| KR102783969B1 (ko) | 2025-03-21 |
| KR20220111300A (ko) | 2022-08-09 |
| US12534563B2 (en) | 2026-01-27 |
| WO2021117723A1 (ja) | 2021-06-17 |
| JP2021095562A (ja) | 2021-06-24 |
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Country or region after: Japan Address after: Japan Tokyo central Beijing two chome 2 No. 1 Applicant after: Aitiansi Co.,Ltd. Country or region after: Singapore Applicant after: NANYANG TECHNOLOGICAL University Address before: Japan Tokyo central Beijing two chome 2 No. 1 Applicant before: TOYO INK SC HOLDINGS Co.,Ltd. Country or region before: Japan Applicant before: NANYANG TECHNOLOGICAL University Country or region before: Singapore |
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Application publication date: 20220729 |
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