CN114829433A - 嵌段共聚物、树脂组合物、伸缩性导体、电子元件和粘着膜 - Google Patents

嵌段共聚物、树脂组合物、伸缩性导体、电子元件和粘着膜 Download PDF

Info

Publication number
CN114829433A
CN114829433A CN202080084791.4A CN202080084791A CN114829433A CN 114829433 A CN114829433 A CN 114829433A CN 202080084791 A CN202080084791 A CN 202080084791A CN 114829433 A CN114829433 A CN 114829433A
Authority
CN
China
Prior art keywords
group
block copolymer
polymer block
block
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080084791.4A
Other languages
English (en)
Chinese (zh)
Inventor
大庭一敏
松田雪恵
水野雄贵
中里睦
后藤淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Artience Co Ltd
Nanyang Technological University
Original Assignee
Toyo Ink SC Holdings Co Ltd
Nanyang Technological University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Ink SC Holdings Co Ltd, Nanyang Technological University filed Critical Toyo Ink SC Holdings Co Ltd
Publication of CN114829433A publication Critical patent/CN114829433A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/387Block-copolymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/38Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F293/00Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule
    • C08F293/005Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule using free radical "living" or "controlled" polymerisation, e.g. using a complexing agent
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • C08F297/02Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
    • C08F297/026Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising acrylic acid, methacrylic acid or derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • C08F8/34Introducing sulfur atoms or sulfur-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02Single bars, rods, wires, or strips
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2438/00Living radical polymerisation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2438/00Living radical polymerisation
    • C08F2438/03Use of a di- or tri-thiocarbonylthio compound, e.g. di- or tri-thioester, di- or tri-thiocarbamate, or a xanthate as chain transfer agent, e.g . Reversible Addition Fragmentation chain Transfer [RAFT] or Macromolecular Design via Interchange of Xanthates [MADIX]
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/0806Silver
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/06Elements
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/16Solid spheres
    • C08K7/18Solid spheres inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Graft Or Block Polymers (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Insulated Conductors (AREA)
CN202080084791.4A 2019-12-13 2020-12-08 嵌段共聚物、树脂组合物、伸缩性导体、电子元件和粘着膜 Pending CN114829433A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019-225478 2019-12-13
JP2019225478 2019-12-13
JP2020-060765 2020-03-30
JP2020060765A JP6814317B1 (ja) 2019-12-13 2020-03-30 ブロック共重合体、樹脂組成物、伸縮性導体、電子デバイスおよび粘着フィルム
PCT/JP2020/045680 WO2021117723A1 (ja) 2019-12-13 2020-12-08 ブロック共重合体、樹脂組成物、伸縮性導体、電子デバイスおよび粘着フィルム

Publications (1)

Publication Number Publication Date
CN114829433A true CN114829433A (zh) 2022-07-29

Family

ID=74096388

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080084791.4A Pending CN114829433A (zh) 2019-12-13 2020-12-08 嵌段共聚物、树脂组合物、伸缩性导体、电子元件和粘着膜

Country Status (6)

Country Link
US (1) US12534563B2 (https=)
JP (2) JP6814317B1 (https=)
KR (1) KR102783969B1 (https=)
CN (1) CN114829433A (https=)
TW (1) TWI869509B (https=)
WO (1) WO2021117723A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7294107B2 (ja) * 2019-12-13 2023-06-20 東洋インキScホールディングス株式会社 粘着剤組成物、粘着フィルム
JP2022173644A (ja) * 2021-05-10 2022-11-22 Dic株式会社 星形ポリマー、塗料、塗膜、及び星形ポリマーの製造方法
WO2023074722A1 (ja) * 2021-10-27 2023-05-04 大阪有機化学工業株式会社 導電性エラストマー形成用組成物、導電性エラストマー、及び、重合体
JP7822463B2 (ja) * 2022-03-30 2026-03-02 三井化学株式会社 マクロ重合開始剤、および、マクロ重合開始剤の製造方法
WO2024262758A1 (ko) * 2023-06-19 2024-12-26 삼성에스디아이 주식회사 경화성 조성물, 상기 조성물을 이용하여 제조된 경화막, 상기 경화막을 포함하는 디스플레이 장치
JPWO2025018369A1 (https=) * 2023-07-18 2025-01-23

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003147312A (ja) * 2001-11-14 2003-05-21 Kanegafuchi Chem Ind Co Ltd エマルジョン型粘着剤
JP2017043741A (ja) * 2015-08-28 2017-03-02 株式会社クラレ チオール基を分子末端に有するポリマー、該ポリマーの製造方法、炭素−炭素二重結合を分子末端に有するポリマーおよびパターン形成方法
JP2018177926A (ja) * 2017-04-11 2018-11-15 大日精化工業株式会社 コーティング剤、被膜、及び被膜の製造方法
CN109476797A (zh) * 2016-07-21 2019-03-15 大塚化学株式会社 嵌段共聚物、组合物和膜

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4627532B1 (https=) * 1967-07-22 1971-08-10
AU653561B2 (en) * 1990-12-20 1994-10-06 Minnesota Mining And Manufacturing Company Removable adhesive tape
JP3609321B2 (ja) * 1995-06-07 2005-01-12 株式会社日本触媒 ダンボール封緘用テープ
US7005031B2 (en) * 2002-01-16 2006-02-28 3M Innovative Properties Company Pressure sensitive adhesives having quaternary ammonium functionality, articles, and methods
JP5563411B2 (ja) * 2009-10-16 2014-07-30 リンテック株式会社 粘着剤組成物、粘着剤および光学フィルム
US9334345B2 (en) * 2011-09-08 2016-05-10 Ppg Industries Ohio, Inc. Polymerizable compositions containing (meth)acrylate monomers having sulfide linkages
KR20140087014A (ko) 2012-11-21 2014-07-08 도카이 고무 고교 가부시키가이샤 유연 도전 부재 및 그것을 사용한 트랜스듀서
US10176903B2 (en) 2014-02-05 2019-01-08 Japan Science And Technology Agency Stretchable conductor, method for manufacturing same, and paste for forming stretchable conductor
WO2016067406A1 (ja) 2014-10-30 2016-05-06 積水化学工業株式会社 粘着テープ
JP6607718B2 (ja) 2015-07-15 2019-11-20 綜研化学株式会社 偏光板用粘着剤組成物
US20180230287A1 (en) 2015-08-07 2018-08-16 Taiyo Ink Mfgs. Co., Ltd. Electroconductive composition, conductor, and flexible printed wiring board
WO2017188031A1 (ja) * 2016-04-28 2017-11-02 株式会社日本触媒 マレイミド系ブロック共重合体の製造方法
JP7170382B2 (ja) * 2016-04-28 2022-11-14 株式会社日本触媒 マレイミド系ブロック共重合体の製造方法
EP3518252B1 (en) 2016-09-20 2024-05-08 Osaka Organic Chemical Industry Ltd. (meth)acrylic conductive material
JP6814691B2 (ja) 2017-04-26 2021-01-20 アロン化成株式会社 熱可塑性エラストマー組成物
JP7039999B2 (ja) * 2017-12-26 2022-03-23 東亞合成株式会社 重合体の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003147312A (ja) * 2001-11-14 2003-05-21 Kanegafuchi Chem Ind Co Ltd エマルジョン型粘着剤
JP2017043741A (ja) * 2015-08-28 2017-03-02 株式会社クラレ チオール基を分子末端に有するポリマー、該ポリマーの製造方法、炭素−炭素二重結合を分子末端に有するポリマーおよびパターン形成方法
CN109476797A (zh) * 2016-07-21 2019-03-15 大塚化学株式会社 嵌段共聚物、组合物和膜
JP2018177926A (ja) * 2017-04-11 2018-11-15 大日精化工業株式会社 コーティング剤、被膜、及び被膜の製造方法

Also Published As

Publication number Publication date
TW202136345A (zh) 2021-10-01
JP2021095554A (ja) 2021-06-24
JP6814317B1 (ja) 2021-01-13
TWI869509B (zh) 2025-01-11
US20230050336A1 (en) 2023-02-16
KR102783969B1 (ko) 2025-03-21
KR20220111300A (ko) 2022-08-09
US12534563B2 (en) 2026-01-27
WO2021117723A1 (ja) 2021-06-17
JP2021095562A (ja) 2021-06-24

Similar Documents

Publication Publication Date Title
KR102783969B1 (ko) 블록 공중합체, 수지 조성물, 신축성 도체, 전자 디바이스 및 점착 필름
JP2022098300A (ja) ブロック共重合体、樹脂組成物、伸縮性導体、電子デバイス及び粘着フィルム
EP3518252B1 (en) (meth)acrylic conductive material
JP2021095440A (ja) 樹脂組成物、伸縮性導体、電子デバイスおよび粘着フィルム
US7759406B2 (en) Process for producing polysilsesquioxane graft polymer, pressure-sensitive adhesive, and pressure-sensitive adhesive sheet
JP2013543038A (ja) 制御可能な架橋度を有する材料
TWI603999B (zh) Organic polyxanthane compound containing isocyanate group, method for producing the same, adhesive agent, adhesive and coating agent
Liu et al. UV-curing polyurethane pressure-sensitive adhesive with high shear strength and good adhesion properties inspired by spider silk
KR102664999B1 (ko) 광 습기 경화형 수지 조성물, 전자 부품용 접착제 및 표시 소자용 접착제
CN106232652A (zh) 嵌段聚合物
JP7342711B2 (ja) 導電ペースト、導電膜、伸縮性導電膜および電子デバイス
Nguyen et al. Fabrication and Characterization of Self-Healable Polydisulfide Network-Based Composites
JP7784439B2 (ja) マレイミドおよびチオールを含む硬化性接着剤組成物
JP7537273B2 (ja) 導電膜、積層体、電子デバイス、及び導電ペースト
TWI812767B (zh) 硬化性樹脂組合物、及聚合物、(甲基)丙烯酸系彈性體及片材
JP7767907B2 (ja) 導電性組成物、導電体、ストレッチャブル導電材、電子デバイス
JP2014019831A (ja) 電子伝導性重合体、その製造方法、該電子伝導性重合体を含む塗料及び制電性被覆物、並びに導電性重合体組成物
JP7719879B2 (ja) 導電性エラストマー形成用組成物、導電性エラストマー、及び、重合体
JP2021095441A (ja) 樹脂組成物、粘着剤樹脂組成物および粘着フィルム
JP7367586B2 (ja) 導電ペースト、導電膜、積層体及び電子デバイス
JP7380185B2 (ja) ブロック共重合体、樹脂組成物および粘着フィルム
WO2016093120A1 (ja) 粘着剤層付き透明導電性フィルム
CN105392562B (zh) 反应促进剂、以及使用其的氨基甲酸酯化合物、硫代氨基甲酸酯化合物、酰胺化合物或脲化合物的制造方法
Yi Design of Polymer Network for Stretchable Pressure-Sensitive Adhesives with Movable Cross-Linking
이모범 Design of Polymer Network for Stretchable Pressure-Sensitive Adhesives with Movable Cross-Linking

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Country or region after: Japan

Address after: Japan Tokyo central Beijing two chome 2 No. 1

Applicant after: Aitiansi Co.,Ltd.

Country or region after: Singapore

Applicant after: NANYANG TECHNOLOGICAL University

Address before: Japan Tokyo central Beijing two chome 2 No. 1

Applicant before: TOYO INK SC HOLDINGS Co.,Ltd.

Country or region before: Japan

Applicant before: NANYANG TECHNOLOGICAL University

Country or region before: Singapore

CB02 Change of applicant information
RJ01 Rejection of invention patent application after publication

Application publication date: 20220729

RJ01 Rejection of invention patent application after publication