CN114773038A - 温度传感和切削功能一体化的陶瓷刀具及制备方法与应用 - Google Patents
温度传感和切削功能一体化的陶瓷刀具及制备方法与应用 Download PDFInfo
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- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 claims abstract description 12
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Abstract
本发明属于机械加工技术领域，涉及铣削加工和切削加工，具体涉及温度传感和切削功能一体化的陶瓷刀具及制备方法与应用。包括陶瓷基体，陶瓷基体的两面分别设置正负极热电层；陶瓷基体由基体材料、结合剂和增强相烧结形成，热电层由热电材料烧结形成；基体材料为Al2O3、Si3N4、CBN中的一种或多种；结合剂为Mo、Ni、Co、W、Cr中的一种或多种；增强相为TiC、WC、SiC、MgO、Cr2O3、TiO2、ZrO2中的一种或多种；正极热电层的热电材料为ZrB2和SiC；负极热电层的热电材料为ZrB2、SiC和石墨。本发明的陶瓷刀具将切削温度测量功能和高力学性能集于一体。
Description
技术领域
本发明属于机械加工技术领域，涉及铣削加工和切削加工，具体涉及温度传感和切削功能一体化的陶瓷刀具及制备方法与应用。
背景技术
公开该背景技术部分的信息仅仅旨在增加对本发明的总体背景的理解，而不必然被视为承认或以任何形式暗示该信息构成已经成为本领域一般技术人员所公知的现有技术。
切削温度是反映机械加工(例如铣削加工和切削加工)状态的重要信息来源，其大小与动态变化反映了刀具切削状态的变化与零件加工质量的变化。通过对切削温度的监测可以预测刀具磨损状态、刀具寿命、工件表面质量，从而对加工工艺参数(例如刀具转速等)进行优化，提高加工质量与加工效率。
目前，切削温度普遍采用接触式测温方法和非接触测温法。据发明人研究了解，接触式测温中的自然热电偶测温及非接触测温法受周围环境影响较大，无法精确测量切削区域的绝对温度，而夹丝热电偶测温会破坏刀具强度，而热接点湿热电势响应会滞后，难于测量变化过快的温度。薄膜热电偶存在高温时薄膜与石英结合强度不够，有脱落现象，线性较差。因而现有常规检测切削温度的方法存在测温难度大、测量不精确的问题，使得铣削加工和切削加工的加工质量与加工效率有待提高。
发明内容
为了解决现有技术的不足，本发明的目的是提供温度传感和切削功能一体化的陶瓷刀具及制备方法与应用，该陶瓷刀具将切削温度测量功能和高力学性能集于一体，使其在满足切削性能要求的前提下能够测量切削温度，即切削时不需要额外测温传感器，即可测量切削温度，具有结构简单、体积小、硬度高、抗弯强度与断裂韧度高、安装方便等优点。
为了实现上述目的，本发明的技术方案为：
一方面，一种温度传感和切削功能一体化的陶瓷刀具，包括陶瓷基体，陶瓷基体的两面设置一层正负极热电层；所述陶瓷基体由第一基体材料、第一结合剂和第一增强相烧结形成，所述热电层由热电材料烧结形成；
所述第一基体材料为Al2O3、Si3N4、CBN中的一种或多种；
所述第一结合剂为Mo、Ni、Co、W、Cr中的一种或多种；
所述第一增强相为TiC、WC、SiC、MgO、Cr2O3、TiO2、ZrO2中的一种或多种；
正极热电层的热电材料为ZrB2和SiC；
负极热电层的热电材料为ZrB2、SiC和石墨。
本发明通过在陶瓷基体两面设置热电材料不同的正负极热电层，使得陶瓷刀具具有热电效应，当具有热电效应的梯度陶瓷刀具切削零件材料时，能将温度信号转换成热电动势信号,再通过电气仪表(二次仪表)转换成被测介质的温度，能实时测量切削区域或切削点的切削温度，监测梯度陶瓷刀具的工作状态。
同时，本发明通过陶瓷基体材料的选择以及热电材料的选择，各材料、组分相互配合，提高陶瓷刀具的力学性能，从而使其不仅具有温度传感性能，而且保证陶瓷刀具的切削性能。
另一方面，一种上述温度传感和切削功能一体化的陶瓷刀具的制备方法，将各层材料制成粉体，按顺序将各层材料粉体逐层填铺并压实，最后进行真空热压烧结，即得。
本发明首先将材料制成粉体，有利于材料中各成分之间的混合，增加各组分之间的协同作用，提高陶瓷刀具的力学性能，通过真空热压烧结不仅能够保证烧结后的材料更密实，进一步提高陶瓷刀具的力学性能，而且避免石墨氧化，增加陶瓷刀具的温度传感性能。
第三方面，一种上述温度传感和切削功能一体化的陶瓷刀具在切削加工/或铣削加工中的应用。
第四方面，一种切削机床，包括机座，机座安装切削刀具和温度测量仪表，所述切削刀具为上述温度传感和切削功能一体化的陶瓷刀具，温度测量仪表通过两根导线分别连接所述陶瓷刀具中陶瓷基体两面的热电层。
当陶瓷刀具切削工件时，切削温度会导致陶瓷刀具内有电流通过从而产生热电动势，通过补偿导线与温度测量仪表的连接，实现切削温度的实时测量，进而根据实时测量的切削温度调节刀具转速等加工参数，从而加工质量与加工效率。
本发明的有益效果为：
本发明通过材料的选择以及刀具结构的设置，实现陶瓷刀具的切削功能与传感功能融为一体，刀具既是切削工具又是传感器，对机床系统没有影响，具有良好的兼容性与互换性，且安装简单，安全可靠，无需对现有机床结构与系统进行改变即可使用。本发明获得陶瓷刀具的维氏硬度为20～22GPa，抗弯强度为800～1000MPa，断裂韧度为8～10MPa·m1/2。
附图说明
构成本发明的一部分的说明书附图用来提供对本发明的进一步理解，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。
图1为本发明实施例中温度传感和切削功能一体化的陶瓷刀具的切削温度测量与刀具状态监测原理图；其中，1、温度传感和切削功能一体化的陶瓷刀具，2、紧定螺钉，3、刀柄，4、切削点，5、补偿导线，6、温度测量仪表。
图2为本发明实施例1的温度传感和切削功能一体化的陶瓷刀具的结构示意图。
图3为本发明实施例2的温度传感和切削功能一体化的陶瓷刀具的结构示意图。
图4为本发明实施例3的温度传感和切削功能一体化的陶瓷刀具的结构示意图。
图5为本发明实施例4的温度传感和切削功能一体化的陶瓷刀具的结构示意图。
具体实施方式
应该指出，以下详细说明都是示例性的，旨在对本发明提供进一步的说明。除非另有指明，本文使用的所有技术和科学术语具有与本发明所属技术领域的普通技术人员通常理解的相同含义。
需要注意的是，这里所使用的术语仅是为了描述具体实施方式，而非意图限制根据本发明的示例性实施方式。如在这里所使用的，除非上下文另外明确指出，否则单数形式也意图包括复数形式，此外，还应当理解的是，当在本说明书中使用术语“包含”和/或“包括”时，其指明存在特征、步骤、操作、器件、组件和/或它们的组合。
正如背景技术所介绍的，现有常规检测切削温度的方法存在测温难度大、测量不精确的问题，为了解决如上的技术问题，本发明温度传感和切削功能一体化的陶瓷刀具及制备方法与应用
本发明的一种典型实施方式，提供了一种温度传感和切削功能一体化的陶瓷刀具，包括陶瓷基体，陶瓷基体的两面分别设置一层正负热电层；所述陶瓷基体由第一基体材料、第一结合剂和第一增强相烧结形成，所述热电层由热电材料烧结形成；
所述第一基体材料为Al2O3、Si3N4、CBN中的一种或多种；
所述第一结合剂为Mo、Ni、Co、W、Cr中的一种或多种；
所述第一增强相为TiC、WC、SiC、MgO、Cr2O3、TiO2、ZrO2中的一种或多种；
正极热电层的热电材料为ZrB2和SiC；
负极热电层的热电材料为ZrB2、SiC和石墨。
本发明通过材料的选择、结构的设计，不仅提高了陶瓷刀具的力学性能，而且赋予陶瓷刀具热电性能，从而实现温度传感和切削功能一体化。
该实施方式的一些实施例中，陶瓷基体与热电层之间设置混合层，所述混合层中的原料为Al2O3、Si3N4、CBN、Ni、Co、MgO中的一种或多种。能够增加陶瓷基体与热电层之间的粘接性能。
在一种或多种实施例中，混合层的总厚度为陶瓷刀具总厚度的5～15％。
该实施方式的一些实施例中，热电层表面设置基体层，所述基体层由第二基体材料、第二结合剂和第二增强相烧结形成；
所述第二基体材料为Al2O3、Si3N4、CBN中的一种或多种；
所述第二结合剂为Mo、Ni、Co、W、Cr中的一种或多种；
所述第二增强相为TiC、WC、SiC、MgO、Cr2O3、TiO2、ZrO2中的一种或多种。进一步增加陶瓷刀具表面的力学性能。
在一种或多种实施例中，陶瓷基体与基体层的总厚度为陶瓷刀具总厚度的50～70％。当没有基体层时，陶瓷基体的厚度为陶瓷刀具总厚度的50～70％。能够保证陶瓷刀具的力学性能，同时保证陶瓷刀具的温度传感性能。
在一种或多种实施例中，基体层与热电层之间设置混合层。该混合层与上述混合层的材料选择一致，用于提高热电层与基体层之间的粘接性能。
该实施方式的一些实施例中，所述陶瓷刀具为三角形，两层热电层的一端连接。能够更方便检测切削点的温度。
该实施方式的一些实施例中，陶瓷基体中，第一结合剂的质量百分数为0～5％，第一增强相的质量百分数为30～45％。
该实施方式的一些实施例中，热电层中ZrB2的质量百分数为60～85％。
该实施方式的一些实施例中，热电层中石墨的质量百分数为0～20％。
具体地，温度传感和切削功能一体化的陶瓷刀具由陶瓷基体和两个热电层构成的三层结构。两个热电层的总厚度占总刀具厚度的30～50％，该层具有热电效应，能够将切削温度信号转换为热电动势信号。陶瓷基体的厚度占总刀具厚度的50～70％，该层具有高硬度、高耐磨性、高抗弯强度与高断裂韧度，起到切削金属的功能。
具体地，温度传感和切削功能一体化的陶瓷刀具为五层结构，不仅包括陶瓷基体和两个热电层，而且陶瓷基体与热电层之间设置混合层。此时，两个热电层的总厚度占总刀具厚度的25～45％，该层具有热电效应，能够将切削温度信号转换为热电动势信号。陶瓷基体的厚度占总刀具厚度的50～70％，该层具有高硬度、高耐磨性、高抗弯强度与高断裂韧度，起到切削金属的功能。两个混合层总厚度占总刀具厚度的5～15％，该层起到粘结陶瓷基体与热电层作用。
具体地，温度传感和切削功能一体化的陶瓷刀具为五层结构，不仅包括陶瓷基体和两个热电层，而且两个热电层表面均设置基体层。两个热电层的总厚度占总刀具厚度的30～50％，该层具有热电效应，能够将切削温度信号转换为电荷信号。两个基体层与陶瓷基体的总厚度占刀具总厚度的50％～70％，具有高硬度、高耐磨性、高抗弯强度与高断裂韧度，起到切削零件材料的功能。
具体地，温度传感和切削功能一体化的陶瓷刀具为九层结构，不仅包括陶瓷基体和两个热电层，而且两个热电层表面均设置基体层，还包括四个混合层，四个混合层分别位于陶瓷基体与热电层之间以及基体层与热电层之间。两个基体层与陶瓷基体的总厚度占刀具总厚度的50％～70％，具有高硬度、高耐磨性、高抗弯强度与高断裂韧度，起到切削零件材料的功能。两个热电层的总厚度占总刀具厚度的15～30％，该层具有热电效应，能够将切削温度信号转换为热电动势信号。四个混合层总厚度占总刀具厚度的5～20％，该层起到粘结陶瓷基体与热电层作用。
本发明的另一种实施方式，提供了一种上述温度传感和切削功能一体化的陶瓷刀具的制备方法，将各层材料制成粉体，按顺序将各层材料粉体逐层填铺并压实，最后进行真空热压烧结，即得。
本发明首先将材料制成粉体，有利于材料中各成分之间的混合，增加各组分之间的协同作用，提高陶瓷刀具的力学性能，通过真空热压烧结不仅能够保证烧结后的材料更密实，进一步提高陶瓷刀具的力学性能，而且避免石墨氧化，增加陶瓷刀具的温度传感性能。
该实施方式的一些实施例中，制成粉体的过程为球磨、干燥。
该实施方式的一些实施例中，压实采用的压强(压力)4～6MPa。
该实施方式的一些实施例中，真空热压烧结中，烧结温度为1500～1800℃，烧结时间为50～60min，烧结压强(压力)为30～35MPa。
本发明的第三种实施方式，提供了一种上述温度传感和切削功能一体化的陶瓷刀具在切削加工/或铣削加工中的应用。
本发明的第四种实施方式，提供了一种切削机床，包括机座，机座安装切削刀具和温度测量仪表，所述切削刀具为上述温度传感和切削功能一体化的陶瓷刀具，温度测量仪表通过两根导线分别连接所述陶瓷刀具中陶瓷基体两面的热电层。
为了使得本领域技术人员能够更加清楚地了解本发明的技术方案，以下将结合具体的实施例详细说明本发明的技术方案。应理解，这些实施例仅用于说明本发明而不用于限制本发明的范围。下列实施例中未注明具体条件的实验方法，通常按照常规条件或按照制造厂商所建议的条件。
以下实施例中，将各层材料粉末混合，并以无水乙醇为介质进行球磨处理，经真空干燥与过筛后，将粉体逐层填铺并压实，压实后进行真空热压烧结，制成温度传感和切削功能一体化的陶瓷刀具材料。温度传感和切削功能一体化的陶瓷刀具材料经切割抛光，制成温度传感和切削功能一体化的陶瓷刀具。切削温度测量与刀具状态监测原理，如图1所示。温度传感和切削功能一体化的陶瓷刀具1被紧定螺钉2固定在刀柄3上，当温度传感和切削功能一体化的陶瓷刀具1切削零件材料时，切削点4的切削温度会导致温度传感和切削功能一体化的陶瓷刀具内有电流通过从而产生热电动势。通过补偿导线5与温度测量仪表6连接，实现切削温度的实时测量。
实施例1
温度传感和切削功能一体化的陶瓷刀具结构如图2所示，具有三层结构，第一层为ZrB2、SiC等热电材料，其厚度为刀具总厚度的20％；第二层为Al2O3或Si3N4基陶瓷材料，其厚度占刀具总厚度的60％。第三层为ZrB2、SiC、石墨等热电材料，其厚度为刀具总厚度的20％。
本实施例中，制备温度传感和切削功能一体化的陶瓷刀具所需粉末材料如表1所示，给出了A1(第一层)、A2(第二层)、A3(第三层)粉料组分重量比(wt.％)。
表1粉末组分重量比(wt.％)
将粉末材料分别装入球磨罐中，以硬质合金球为磨球、无水乙醇为介质，球磨时间为48h，将球磨后的悬浮液在真空干燥箱中进行干燥，干燥后过100目筛子，封存备用。随后按照陶瓷刀具每层材料的要求将粉末均匀混合，并通过控制每层厚度，将粉末材料按照A1/A2/A3的顺序逐层装填入模具中，每层粉末均需要铺平压实，直至粉末填装完毕。将粉末进行5MPa的预压实处理，随后将其放入真空热压烧结炉中进行热压烧结，烧结温度为1650℃，烧结时间为50min，烧结压力为30MPa。烧结后获得致密度高的陶瓷坯料，经切割抛光加工后制成具有三层结构的温度传感和切削功能一体化的陶瓷刀具。将刀具与电荷收集装置安装至刀柄上，即可实现切削力实时测量。
实施例2
温度传感和切削功能一体化的陶瓷刀具结构如图3所示，具体有五层结构，第一层为ZrB2、SiC等热电材料，其厚度为刀具总厚度的15％；第五层为ZrB2、SiC、石墨等热电材料，其厚度为刀具总厚度的15％；第三层为Al2O3或Si3N4基陶瓷材料，其厚度占刀具总厚度的50％；第二层和第四层为Al2O3、Si3N4、CBN、Ni、Co、MgO等多种材料的混合层，其厚度为刀具总厚度的10％。
本实施例中，制备温度传感和切削功能一体化的陶瓷刀具所需粉末材料如表2所示，给出了B1(第一层)、B2(第二层和第四层)、B3(第三层)、B4(第五层)粉料组分重量比(wt.％)。
表2粉末组分重量比(wt.％)
将粉末材料分别装入球磨罐中，以硬质合金球为磨球、无水乙醇为介质，球磨时间为48h，将球磨完成后悬浮液在真空干燥箱中进行干燥，干燥后过100目筛子，封存备用。随后按照陶瓷刀具每层材料要求将粉末均匀混合，并通过控制每层厚度，将粉末材料按照B1/B2/B3/B2/B4的顺序逐层装填入模具中，每层粉末均需要铺平压实，直至粉末填装完毕。将粉末进行5MPa的预压实处理，随后将其放入真空热压烧结炉中进行热压烧结，烧结温度为1650℃，烧结时间为50min，烧结压力为30MPa。烧结后获得致密度高的陶瓷坯料，经切割抛光加工后制成具有五层结构的温度传感和切削功能一体化的陶瓷刀具。将刀具与电荷收集装置安装至刀柄上，即可实现切削力实时测量。
实施例3
温度传感和切削功能一体化的陶瓷刀具结构如图4所示，具有五层结构，第一层、第三层和第五层为Al2O3或Si3N4基陶瓷材料，其厚度占刀具总厚度的50％；第二层为ZrB2、SiC等热电材料，其厚度为刀具总厚度的20％；第四层为ZrB2、SiC、石墨等热电材料，其厚度为刀具总厚度的20％。
本实施例中，制备温度传感和切削功能一体化的陶瓷刀具所需粉末材料如表3所示，给出了C1(第一层、第三层和第五层)、C2(第二层)、C3(第四层)粉料组分重量比(wt.％)。
表3粉末组分重量比(wt.％)
将粉末材料分别装入球磨罐中，以硬质合金球为磨球、无水乙醇为介质，球磨时间为48h，将球磨后悬的浮液在真空干燥箱中进行干燥，干燥后过100目筛子，封存备用。随后按照陶瓷刀具每层材料要求将粉末均匀混合，并通过控制每层厚度，将粉末材料按照C1/C2/C1/C3/C1的顺序逐层装填如磨具中，每层粉末均需要铺平压实，直至粉末填装完毕。将粉末进行5MPa的预压实处理，然后将其放入真空热压烧结炉中进行热压烧结，烧结温度为1650℃，烧结时间为50min，烧结压力为30MPa。烧结后获得致密度高的陶瓷坯料，经切割抛光加工后制成具有五层结构的温度传感和切削功能一体化的陶瓷刀具。将刀具与电荷收集装置安装至刀柄上，即可实现切削力实时测量。
实施例4
温度传感和切削功能一体化的陶瓷刀具结构如图5所示，具有热电效应的九层梯度陶瓷刀具第一层、第五层和第九层为Al2O3或Si3N4基陶瓷材料，其厚度占刀具总厚度的50％；第二层、第四层、第六层、第八层为Al2O3、Si3N4、CBN、Ni、Co、MgO等多种材料的混合层，其厚度占刀具总厚度的16％；第三层为ZrB2、SiC等热电材料，其厚度为刀具总厚度的17％；第七层为ZrB2、SiC、石墨等热电材料，其厚度为刀具总厚度的17％。
本实施例中，制备温度传感和切削功能一体化的陶瓷刀具所需粉末材料如表4所示，给出了D1(第一层、第五层和第九层)、D2(第二层、第四层、第六层和第八层)、D3(第三层)、D4(第七层)粉料组分重量比(wt.％)。
表4粉末组分重量比(wt.％)
将粉末材料分别装入球磨罐中，以硬质合金球为磨球、无水乙醇为介质，球磨时间为48h，将球磨后的悬浮液在真空干燥箱中进行干燥，干燥后过100目筛子，封存备用。随后按照陶瓷刀具每层材料要求将粉末均匀混合，并通过控制每层厚度，将粉末材料按照D1/D2/D3/D2/D1/D2/D4/D2/D1的顺序逐层装填如磨具中，每层粉末均需要铺平压实，直至粉末填装完毕。将粉末进行5MPa的预压实处理，然后将其放入真空热压烧结炉中进行热压烧结，烧结温度为1650℃，烧结时间为50min，烧结压力为30MPa。烧结后获得致密度高的陶瓷坯料，经切割抛光加工后制成具有九层结构的温度传感和切削功能一体化的陶瓷刀具。将刀具与电荷收集装置安装至刀柄上，即可实现切削力实时测量。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
Claims (10)
1.一种温度传感和切削功能一体化的陶瓷刀具，其特征是，包括陶瓷基体，陶瓷基体的两面分别至少设置一层热电层；所述陶瓷基体由第一基体材料、第一结合剂和第一增强相烧结形成，所述热电层由热电材料烧结形成；
所述第一基体材料为Al2O3、Si3N4、CBN中的一种或多种；
所述第一结合剂为Mo、Ni、Co、W、Cr中的一种或多种；
所述第一增强相为TiC、WC、SiC、MgO、Cr2O3、TiO2、ZrO2中的一种或多种；
正极热电层的热电材料为ZrB2和SiC；
负极热电层的热电材料为ZrB2、SiC和石墨。
2.如权利要求1所述的温度传感和切削功能一体化的陶瓷刀具，其特征是，陶瓷基体与热电层之间设置混合层，所述混合层中的原料为Al2O3、Si3N4、CBN、Ni、Co、MgO中的一种或多种；
优选地，混合层的总厚度为陶瓷刀具总厚度的5～15％。
3.如权利要求1所述的温度传感和切削功能一体化的陶瓷刀具，其特征是，热电层表面设置基体层，所述基体层由第二基体材料、第二结合剂和第二增强相烧结形成；
所述第二基体材料为Al2O3、Si3N4、CBN中的一种或多种；
所述第二结合剂为Mo、Ni、Co、W、Cr中的一种或多种；
所述第二增强相为TiC、WC、SiC、MgO、Cr2O3、TiO2、ZrO2中的一种或多种。
4.如权利要求3所述的温度传感和切削功能一体化的陶瓷刀具，其特征是，陶瓷基体与基体层的总厚度为陶瓷刀具总厚度的50～70％；
或，基体层与热电层之间设置混合层。
5.如权利要求1所述的温度传感和切削功能一体化的陶瓷刀具，其特征是，所述陶瓷刀具为三角形，两层热电层的一端连接。
6.如权利要求1所述的温度传感和切削功能一体化的陶瓷刀具，其特征是，陶瓷基体中，第一结合剂的质量百分数为0～5％，第一增强相的质量百分数为30～45％；
或，热电层中ZrB2的质量百分数为60～85％；
或，热电层中石墨的质量百分数为0～20％。
7.一种权利要求1～6任一所述的温度传感和切削功能一体化的陶瓷刀具的制备方法，其特征是，将各层材料制成粉体，按顺序将各层材料粉体逐层填铺并压实，最后进行真空热压烧结，即得。
8.如权利要求7所述的的温度传感和切削功能一体化的陶瓷刀具的制备方法，其特征是，制成粉体的过程为球磨、干燥；
或，压实采用的压强4～6MPa；
或，真空热压烧结中，烧结温度为1500～1800℃，烧结时间为50～60min，烧结压强为30～35MPa。
9.一种权利要求1～6任一所述的温度传感和切削功能一体化的陶瓷刀具在切削加工/或铣削加工中的应用。
10.一种切削机床，包括机座，其特征是，机座安装切削刀具和温度测量仪表，所述切削刀具为权利要求1～6任一所述的温度传感和切削功能一体化的陶瓷刀具，温度测量仪表通过两根导线分别连接所述陶瓷刀具中陶瓷基体两面的热电层。
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| CN114773038B (zh) | 2023-02-17 |
| US20230364690A1 (en) | 2023-11-16 |
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