CN114737178A - 一种高性能电磁屏蔽胶条的成型方法 - Google Patents
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Abstract
本发明涉及一种高性能电磁屏蔽胶条的成型方法，该方法通过激光直接成型技术在现有普通的塑胶元件上赋予电气互连、塑料壳体的支撑和密封功能，以及结合由机械实体与导电图形产生屏蔽功能，即在模塑成型的胶体外表面直接形成导电层，进而成型电磁屏蔽胶条，与现有技术相比，本发明的屏蔽胶体形状多样化，体积更加紧凑、产品更加小型化、装配更精密、产品屏蔽效果好、可靠性更高、寿命更长，适用于高速信号和高密度互联电子产品、高精密机械配合和电磁屏蔽的场合及各类高性能RFID智能柜。
Description
技术领域
本发明涉及高性能电磁屏蔽胶条制备领域，尤其是涉及一种高性能电磁屏蔽胶条的成型方法。
背景技术
为了保证电子电气设备的正常工作、减少电子电气设备电磁辐射对人体造成的危害，需要对电磁波辐射进行控制，在通常采用的技术中，电磁屏蔽技术就是最有效的技术之一，电磁屏蔽技术是以金属隔离的原理来控制电磁干扰由一个区域向另一个区域感应和辐射传播的技术。
而现有的技术方案采用导电布胶条和全方位导电海绵，其剖面图如图1所示，导电布胶条具体为在导电纤维布(导电布)外包裹阻燃PU泡棉构成，在经过处理后形成各种形状的导电泡棉。
但是，现有的导电布胶条中，由于导电布内阻高，屏蔽效果一般，其制备工艺主要有电镀、化学镀、金属丝混纺、磁控溅射和真空蒸镀等几种工艺，其中使用最广泛的是化学镀工艺，尽管化学镀的技术成熟、效率很高，但存在产品性能不稳定，产品含有磷等有害元素，并且化学镀还有废液难以处理，污染严重的缺点。
而PU泡棉主要由高分子材料混合物发泡形成，通常弹力不够，比较稀和蓬松，导致表面电阻值差异很大，导电性能不均匀，屏蔽效果欠佳。
发明内容
本发明的目的就是为了克服上述现有技术存在的缺陷而提供一种高性能电磁屏蔽胶条的成型方法。
本发明的目的可以通过以下技术方案来实现：
一种高性能电磁屏蔽胶条的成型方法，该方法通过激光直接成型技术在模塑成型的胶体外表面直接化镀形成金属导电层，进而成型电磁屏蔽胶条。
所述的胶体由橡胶或硅胶原材料混合设定比例的激光粉后发泡成型。
所述的激光粉为羟基磷酸铜。
所述的金属导电层具体为铜皮。
所述的胶体形状根据待电磁屏蔽密封件实际形状模塑成型后，通过计算机控制激光沿胶体轮廓在其外表面上镭射烧蚀铜皮覆着痕迹，活化出铜皮图案，再通过化镀和电镀在胶体外表面形成一层高导电率的金属导电层。
为防止作为金属导电层的铜皮被氧化，在胶体形成铜箔后进行电镀，以进一步提升金属层的导电率，即提升屏蔽效果。
所述的电镀包括镀银和镀金，在电镀后使电镀层氧化，以提升电磁屏蔽胶条的使用寿命。
该电磁屏蔽胶条通过过盈配合的方式安装在待电磁屏蔽密封件的密封面处，并通过挤压的方式贴合。
所述的电磁屏蔽胶条应用于高速信号和高密度互联电子产品、高精密机械配合与电磁屏蔽的场合以及高性能RFID智能柜。
该电磁屏蔽胶条的成型形状包括口字形、王字形、日字形、O字形和T字形。与现有技术相比，本发明具有以下优点：
本发明的屏蔽胶体形状多样化，体积更加紧凑、产品更加小型化、装配更精密、产品屏蔽效果好、可靠性更高、寿命更长，非常适用于高速信号和高密度互联电子产品、高精密机械配合和电磁屏蔽的场合，尤其适合各类需要经常开关门和对密封度要求特别高的高性能RFID智能柜(如RFID冷链柜、RFID恒温恒湿疫苗存储柜等)。
附图说明
图1为现有的导电布胶条结构剖面图。
图2为本发明的高性能屏蔽胶条结构剖面图。
具体实施方式
下面结合附图和具体实施例对本发明进行详细说明。
本发明提供一种高性能电磁屏蔽胶条的成型方法，该方法利用激光直接成型技术，(英文简称LDS(LASER DIRECT STRUCTRING)，该技术是指通过计算机按照导电图形的轨迹控制激光的运动，将激光投照到模塑成型的三维橡胶或硅胶外表面或发泡成型的各类泡面表面上，沿着胶体轮廓在其表面上烧蚀铜皮覆着痕迹，活化出铜皮图案，从而创建出一个三维器件(3D-mid)，对于本发明电磁屏蔽胶条的导电层和胶体(如图2所示)，在发泡成型的橡胶或硅胶条上，利用激光镭射技术直接在胶体上化镀形成金属pattern(铜皮)。
在电磁屏蔽胶条的加工过程中，首先采用羟基磷酸铜粉末混合橡胶或硅胶后发泡模塑成型(根据实际需要屏蔽密封的器件形状确定)后，根据设计方案在橡胶或硅胶的胶体外表面上用激光烧蚀铜皮覆盖痕迹，然后在对激光烧蚀的部分进行金属化镀，在胶体外表面上均匀形成一层高导电性铜皮，即导电层。
3D-mid带来了非常明显的设计和制造优势，屏蔽胶体(胶条、胶圈或特定形状的胶体件)使得屏蔽胶体形状多样化，体积更加紧凑、产品更加小型化、装配更精密、产品屏蔽效果好、可靠性更高、寿命更长，非常适用于高速信号和高密度互联电子产品、高精密机械配合和电磁屏蔽的场合及各类高性能RFID智能柜。
实施例1
当本发明生成的电磁屏蔽胶条应用于RFID智能柜时，首先按照RFID智能柜的柜门密封面形状模塑胶体，并采用激光进行金属化镀，在胶体外表面上均匀形成一层导电铜皮，形成符合密封形状要求的电磁屏蔽胶条，不同于现有的导电布胶条通过胶粘的方式粘贴在去除表面喷漆的柜门密封面上，本发明的电磁屏蔽胶条采用嵌设的方式直接设置柜门密封面的沟槽内，通过过盈配合的方式实现密封，在智能柜内RFID交变电磁场作用下，当电磁场辐射传播达到电磁屏蔽胶条的铜皮时，会在电磁屏蔽胶条铜皮内产生感应电流，而这感应电流在铜皮外表产生了与柜内RFID设备辐射的电磁场方向相反的电磁场，从而抵消了柜内RFID辐射传播到屏蔽胶条的部分电磁场，因而产生了屏蔽效果。
实施例2
当本发明生成的电磁屏蔽胶条应用于各种形状的密封场景时，可以在胶体模塑时将形状塑型为“王”字形、“日”字形、“O”字形、“T”字形等非常规形状，以配合不同密封面形状的要求，在提高密封性和电磁屏蔽性能的同时，扩展产品使用的适配性。
综上，本发明给出了不同于现有电磁屏蔽胶条采用导电纤维布通过导电胶包裹阻燃PU泡棉的制造方式，创造性的采用了激光直接成型技术直接成型，成型后的电磁屏蔽胶条的胶体和导电铜皮为一体化结构，由于导电铜皮完全位于胶体表面，通过机械挤压，使得胶条与机械平面间的接触面更大，内阻更小，当应用于表面喷漆的设备时甚至无需大面积刮除表面喷漆也能够保证良好的导电形和电磁屏蔽效率，而且也不需要再采用胶水粘到密封面上，只需要嵌设在预先开设的沟槽内，通过过盈配合的方式实现密封和电磁屏蔽，同时相对于现有的导电泡棉也不怕物理挤压影响密封性能，具有良好的性能和广阔的应用前景。
Claims (10)
1.一种高性能电磁屏蔽胶条的成型方法，其特征在于，该方法通过激光直接成型技术在模塑成型的胶体外表面直接化镀形成金属导电层，进而成型电磁屏蔽胶条。
2.根据权利要求1所述的一种高性能电磁屏蔽胶条的成型方法，其特征在于，所述的胶体由橡胶或硅胶原材料混合设定比例的激光粉后发泡成型。
3.根据权利要求2所述的一种高性能电磁屏蔽胶条的成型方法，其特征在于，所述的激光粉为羟基磷酸铜。
4.根据权利要求2所述的一种高性能电磁屏蔽胶条的成型方法，其特征在于，所述的金属导电层具体为铜皮。
5.根据权利要求4所述的一种高性能电磁屏蔽胶条的成型方法，其特征在于，所述的胶体形状根据待电磁屏蔽密封件实际形状模塑成型后，通过计算机控制激光沿胶体轮廓在其外表面上镭射烧蚀铜皮覆着痕迹，活化出铜皮图案，再通过化镀和电镀在胶体外表面形成一层高导电率的金属导电层。
6.根据权利要求5所述的一种高性能电磁屏蔽胶条的成型方法，其特征在于，为防止作为金属导电层的铜皮被氧化，在胶体形成铜箔后进行电镀，以进一步提升金属层的导电率，即提升屏蔽效果。
7.根据权利要求6所述的一种高性能电磁屏蔽胶条的成型方法，其特征在于，所述的电镀包括镀银和镀金，在电镀后使电镀层氧化，以提升电磁屏蔽胶条的使用寿命。
8.根据权利要求1所述的一种高性能电磁屏蔽胶条的成型方法，其特征在于，该电磁屏蔽胶条通过过盈配合的方式安装在待电磁屏蔽密封件的密封面处，并通过挤压的方式贴合。
9.根据权利要求1所述的一种高性能电磁屏蔽胶条的成型方法，其特征在于，所述的电磁屏蔽胶条应用于高速信号和高密度互联电子产品、高精密机械配合与电磁屏蔽的场合以及高性能RFID智能柜。
10.根据权利要求1所述的一种高性能电磁屏蔽胶条的成型方法，其特征在于，该电磁屏蔽胶条的成型形状包括口字形、王字形、日字形、O字形和T字形。
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|---|---|---|---|---|
| US20160198569A1 (en) * | 2014-04-16 | 2016-07-07 | Lg Chem, Ltd. | Composition for forming conductive pattern, method for forming conductive pattern using the same, and resin components having conductive pattern thereon |
| CN106063395A (zh) * | 2015-02-15 | 2016-10-26 | 华为技术有限公司 | 电子设备外壳的加工方法、电子设备外壳及电子设备 |
| DE102017201634B3 (de) * | 2017-02-01 | 2018-06-14 | Leoni Kabel Gmbh | Strangförmiges Element sowie Verfahren zur Herstellung eines strangförmigen Elements |
| CN114207941A (zh) * | 2019-12-12 | 2022-03-18 | 株式会社Emw | 天线模块 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160198569A1 (en) * | 2014-04-16 | 2016-07-07 | Lg Chem, Ltd. | Composition for forming conductive pattern, method for forming conductive pattern using the same, and resin components having conductive pattern thereon |
| CN106063395A (zh) * | 2015-02-15 | 2016-10-26 | 华为技术有限公司 | 电子设备外壳的加工方法、电子设备外壳及电子设备 |
| DE102017201634B3 (de) * | 2017-02-01 | 2018-06-14 | Leoni Kabel Gmbh | Strangförmiges Element sowie Verfahren zur Herstellung eines strangförmigen Elements |
| CN114207941A (zh) * | 2019-12-12 | 2022-03-18 | 株式会社Emw | 天线模块 |
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