CN114725240A - 一种硅晶体材料的厚片处理装置及处理方法 - Google Patents
一种硅晶体材料的厚片处理装置及处理方法 Download PDFInfo
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- CN114725240A CN114725240A CN202210344738.4A CN202210344738A CN114725240A CN 114725240 A CN114725240 A CN 114725240A CN 202210344738 A CN202210344738 A CN 202210344738A CN 114725240 A CN114725240 A CN 114725240A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 43
- 239000010703 silicon Substances 0.000 title claims abstract description 43
- 239000013078 crystal Substances 0.000 title claims abstract description 42
- 239000000463 material Substances 0.000 title claims abstract description 41
- 238000003672 processing method Methods 0.000 title claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 98
- 238000003860 storage Methods 0.000 claims abstract description 66
- 238000010438 heat treatment Methods 0.000 claims abstract description 51
- 238000003756 stirring Methods 0.000 claims abstract description 40
- 238000004140 cleaning Methods 0.000 claims description 8
- 238000005192 partition Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000009835 boiling Methods 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 7
- 239000002994 raw material Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 1
- 235000011194 food seasoning agent Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Silicon Compounds (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
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Priority Applications (1)
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CN202210344738.4A CN114725240B (zh) | 2022-04-02 | 2022-04-02 | 一种硅晶体材料的厚片处理装置及处理方法 |
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CN202210344738.4A CN114725240B (zh) | 2022-04-02 | 2022-04-02 | 一种硅晶体材料的厚片处理装置及处理方法 |
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CN114725240A true CN114725240A (zh) | 2022-07-08 |
CN114725240B CN114725240B (zh) | 2023-04-28 |
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Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1199368A (ja) * | 1997-09-29 | 1999-04-13 | Suzuki Motor Corp | 超音波洗浄機 |
CN201848403U (zh) * | 2010-11-03 | 2011-06-01 | 温州电力局 | 电力充油设备取样器全自动超声波一体化处理机 |
CN202151624U (zh) * | 2011-07-11 | 2012-02-29 | 苏州赤诚洗净科技有限公司 | 隔离式传导超声波清洗装置 |
CN202162176U (zh) * | 2011-07-28 | 2012-03-14 | 江苏兆晶光电科技发展有限公司 | 多晶或单晶硅原料清洗用超声波溢流清洗装置 |
US20120171807A1 (en) * | 2010-12-29 | 2012-07-05 | Berger Alexander J | Method and apparatus for masking substrates for deposition |
DE202012103633U1 (de) * | 2012-09-21 | 2012-10-11 | Rena Gmbh | Vorrichtung zum nasschemischen Behandeln flacher Substrate |
CN105817447A (zh) * | 2016-05-11 | 2016-08-03 | 江苏峰谷源储能技术研究院有限公司 | 一种太阳能板加工用硅片清洗机 |
WO2018036193A1 (zh) * | 2016-08-25 | 2018-03-01 | 杭州纤纳光电科技有限公司 | 钙钛矿薄膜的低压化学沉积的设备及其使用方法和应用 |
CN107790429A (zh) * | 2017-09-29 | 2018-03-13 | 谷香梅 | 太阳能电池硅片清洗装置 |
CN207641361U (zh) * | 2017-11-02 | 2018-07-24 | 保洁丽日用品(深圳)有限公司 | 一种自动加热清洗搅拌装置 |
CN208513217U (zh) * | 2018-05-04 | 2019-02-19 | 江苏迪昊特电子科技有限公司 | 一种电子加工用的超声波清洗干燥装置 |
CN110880460A (zh) * | 2018-09-05 | 2020-03-13 | 北京铂阳顶荣光伏科技有限公司 | 太阳能电池的制备方法及其制备装置 |
CN113745374A (zh) * | 2021-09-07 | 2021-12-03 | 徐州金琳光电材料产业研究院有限公司 | 硅基光伏器件面电极材料用辅助沉淀装置 |
CN215680623U (zh) * | 2021-07-29 | 2022-01-28 | 上海芯莘科技有限公司 | 一种半导体供液设备 |
-
2022
- 2022-04-02 CN CN202210344738.4A patent/CN114725240B/zh active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1199368A (ja) * | 1997-09-29 | 1999-04-13 | Suzuki Motor Corp | 超音波洗浄機 |
CN201848403U (zh) * | 2010-11-03 | 2011-06-01 | 温州电力局 | 电力充油设备取样器全自动超声波一体化处理机 |
US20120171807A1 (en) * | 2010-12-29 | 2012-07-05 | Berger Alexander J | Method and apparatus for masking substrates for deposition |
CN202151624U (zh) * | 2011-07-11 | 2012-02-29 | 苏州赤诚洗净科技有限公司 | 隔离式传导超声波清洗装置 |
CN202162176U (zh) * | 2011-07-28 | 2012-03-14 | 江苏兆晶光电科技发展有限公司 | 多晶或单晶硅原料清洗用超声波溢流清洗装置 |
DE202012103633U1 (de) * | 2012-09-21 | 2012-10-11 | Rena Gmbh | Vorrichtung zum nasschemischen Behandeln flacher Substrate |
CN105817447A (zh) * | 2016-05-11 | 2016-08-03 | 江苏峰谷源储能技术研究院有限公司 | 一种太阳能板加工用硅片清洗机 |
WO2018036193A1 (zh) * | 2016-08-25 | 2018-03-01 | 杭州纤纳光电科技有限公司 | 钙钛矿薄膜的低压化学沉积的设备及其使用方法和应用 |
CN107790429A (zh) * | 2017-09-29 | 2018-03-13 | 谷香梅 | 太阳能电池硅片清洗装置 |
CN207641361U (zh) * | 2017-11-02 | 2018-07-24 | 保洁丽日用品(深圳)有限公司 | 一种自动加热清洗搅拌装置 |
CN208513217U (zh) * | 2018-05-04 | 2019-02-19 | 江苏迪昊特电子科技有限公司 | 一种电子加工用的超声波清洗干燥装置 |
CN110880460A (zh) * | 2018-09-05 | 2020-03-13 | 北京铂阳顶荣光伏科技有限公司 | 太阳能电池的制备方法及其制备装置 |
CN215680623U (zh) * | 2021-07-29 | 2022-01-28 | 上海芯莘科技有限公司 | 一种半导体供液设备 |
CN113745374A (zh) * | 2021-09-07 | 2021-12-03 | 徐州金琳光电材料产业研究院有限公司 | 硅基光伏器件面电极材料用辅助沉淀装置 |
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