201006572 九、發明說明： 【發明所屬之技術領域】 • 本發明涉及電路板製作技術領域，特別涉及一種清洗 - 裝置及清洗系統。 【先前技術】 印刷電路板（Printed Circuit Board，簡寫為PCB)係 電子產品中傳輸訊號之主要器件，特別係具有體積小，重 ®量輕，可做立體組裝及動態可撓曲等優點之軟性電路板， 被越來越廣泛之應用於各種便攜式電子產品中，參見文獻201006572 IX. Description of the Invention: [Technical Field] The present invention relates to the field of circuit board manufacturing technology, and in particular to a cleaning device and a cleaning system. [Previous Technology] Printed Circuit Board (PCB) is the main component of transmission signals in electronic products, especially the softness of small size, light weight and light weight, which can be used for three-dimensional assembly and dynamic flexibility. Circuit boards are increasingly used in a variety of portable electronic products, see literature
Takao Yamazaki, Yoshimichi Sogawa, Rieka Yoshino,Takao Yamazaki, Yoshimichi Sogawa, Rieka Yoshino,
Keiichiro Kata, Ichiro Hazeyama, and Sakae Kitajo，RealKeiichiro Kata, Ichiro Hazeyama, and Sakae Kitajo, Real
Chip Size Three-Dimensional Stacked Package, IEEEChip Size Three-Dimensional Stacked Package, IEEE
Transactions on Advanced Packaging, 2005, 28(3), 397-403 0 目前，為降低電路板之廢品率，對最外侧保護層品質 β不合格之電路板，採用超音波清洗之方法，將壓合於該電 ❹ 路板最外側之保護層（如防焊層等）從電路板上剝離，使 遮蓋於該保護層下之内層電路板可重新進行保護層製作， 從而獲得良品率較高之電路板。超音波清洗係藉由超音波 之振動引起清洗槽中液體（化學藥液、水等）振蕩，進而 由該振蕩後之液體與放置於清洗槽液體内之待清洗物體發 生化學反應及物理相互作用，從而獲得清洗效果。 通常採用化學藥液清洗電路板需要將電路板浸入被加 熱之化學藥液中，使電路板表面之污物與加熱之化學藥液 201006572 發生化：反應。惟，高溫下化學藥液反應速度快，而低溫 下化學藥液反應速度慢，如果電路板週圍之化學藥液受熱 不均勻’會出現電路板表面不同區域與化學藥液反應程度 不同從而無法疋全徹底之去除電路板表面各處之污物。 如果延長反應時間’雖然可達到較好之清洗效果，惟，降 低了清洗效率，不利於實際生產。 【發明内容】 有鑑於此，提供一種清洗裝置及清洗系統，以解決前 述問題，提高清洗效果實屬必要。 以下將以實施例說明一種清洗裝置及清洗系統。 種π洗裝置，其包括清洗槽、設置於清洗槽内之加 熱，置及授拌裝置。該加熱裝置用於加熱收容於清洗槽内 之α洗液。該攪拌裝置設置於清洗槽内，用於攪拌清洗槽 内之π洗液，以實現靠近加熱裝置之清洗液及遠離加熱裝 ❹置之清洗液之間之熱交換。 種β洗系統，其包括清洗裝置、掛架及與掛架相連 ，傳达裝置。該清洗裝置包括清洗槽、設置於清洗槽内之。 生c括加熱裝置及攪拌裝置。該加熱裝置用於加熱收容於 π $槽内之清洗液。該攪拌裝置設置於清洗槽内，用於攪 拌凊洗槽内之清洗液，以實現靠近加熱裝置之清洗液及遠 離加熱裝置之清洗液之間之熱交換。 與先前技術相比，該清洗裝置之攪拌裝置於加熱裝置 加熱或停止加熱之同時，攪拌收容於清洗槽内之清洗液， 201006572 使清洗液快速流動以實現靠近加熱裝置之清洗液及遠離加 熱裝置之清洗液之間之熱交換，從而使清洗槽内之清洗液 均勻升高或降低相同之溫度，保證清洗槽内各處清洗液之 ' 清洗能力相同，提高清洗效果。 【實施方式】 下面將結合附圖及複數實施例，對本技術方案提供之 清洗裝置及清洗系統作進一步之詳細說明。 ^ 請參閱圖1至圖2，本技術方案提供之清洗裝置10， 其包括清洗槽110、加熱裝置121及攪拌裝置122。 該清洗槽110為具有開口端之敞開槽體，用於收容化 學藥液、水或其他清洗液，以供清洗時使用。該清洗槽110 可為一槽體，亦可為複數槽體組合而成。本實施例中，清 洗槽110内設置有間隔板101，使清洗槽110内被間隔為第 一收容槽111與第二收容槽112。該第一收容槽111用於清 ❿洗時放置待清洗物體，該第二收容槽112用於設置加熱裝 置121及攪拌裝置122。優選地，第二收容槽112之尺寸小 於第一收容槽111尺寸。該清洗槽110内具有内側面113 及與内側面113相連之内底面114。該清洗槽110之内側面 113開設有第一固定槽115及第二固定槽（圖未示）。該第 一固定槽115與第二固定槽平行且相對設置，用於設置間 隔板101。第一固定槽115與第二固定槽之長度延伸方向可 根據實際設計需要而定。本實施例中，第一固定槽115與 第二固定槽自清洗槽110之開口端向内底面114延伸，並 201006572 與内底面114垂直。 本實施例中，間隔板101具有第一表面102、與第一表 面102相對之第二表面103及與第一表面102及第二表面 _ 103相連之側面104。該間隔板101開設有第一通孔105與 第二通孔106，以連通第一收容槽111與第二收容槽112， 以使收容於第一收容槽111與第二收容槽112之清洗液可 自第一通孔105與第二通孔106流入或流出，實現第一收 容槽111與第二收容槽112之清洗液之相對流動。當然， ®間隔板101還可設置一個或複數通孔，以供清洗液經過。 該第一通孔105與第二通孔106，分別位於間隔板101 之相對兩端，並貫通第一表面102與第二表面103。其中， 該第一通孔105還貫通側面104。該間隔板101之相對兩側 分別固定於第一固定槽115與第二固定槽114,侧面104與 内底面114相接觸。此時，第一通孔105靠近清洗槽110 之内底面114，而第二通孔106遠離清洗槽110之内底面 @ 114，用以形成第二收容槽112之清洗液與第一收容槽111 之清洗液循環流動之通道。 當然，間隔板101亦可藉由其他方式固定於清洗槽110 内，其設置方向亦可根據實際設計而定，不限於本實施例。 其中，第一收容槽111與第二收容槽112之分佈方式根據 間隔板101設置於清洗槽110之位置而定。 本實施例中，清洗槽110之槽壁内設置有相對之兩個 超音波發生器107。每個超音波發生器107被蓋板108封閉 於槽壁内，用於產生超音波使收容於清洗槽110内之液體 201006572 發生振蕩，從而使液體產生衝擊力將待清洗物體表面之污 物從該物體表面移去。當然，清洗槽110亦可於開口端設 4 置蓋子形成封閉體，以滿足不同待清洗物體之清洗需要。 該加熱裝置121位於清洗槽110之第二收容槽112,用 以與攪拌裝置122配合使收容於清洗槽110之清洗液均勻 受熱並同時升高或降低相同之溫度。本實施例中，加熱裝 置121為固定於清洗槽110之内側面113之電熱式加熱棒。 該攪拌裝置122為固定於清洗槽110之内側面113之旋轉 葉片。該攪拌裝置122位於第二收容槽112，靠近内底面 114，用以轉動葉片並驅使收容於第二收容槽112之清洗液 自第一通孔105或第二通孔106流出第二收容槽112,而收 容於第一收容槽111之清洗液自第一通孔105或第二通孔 106流入第二收容槽112，實現第一收容槽111内之清洗液 與第二收容槽112内之清洗液之相對流動，以實現靠近加 熱裝置之清洗液及遠離加熱裝置之清洗液之間之熱交換。 ❹該攪拌裝置122之旋轉葉片可根據所需清洗液於第一收容 槽111與第二收容槽112之間之流動方向，採用不同之設 計。 由於清洗時，位於加熱裝置121週圍之清洗液（即： 第二收容槽112之清洗液）升溫快溫度高，遠離加熱裝置 121之清洗液（即：第一收容槽111之清洗液）升溫慢溫度 低，即可藉由第一收容槽111内之清洗液與第二收容槽112 内之清洗液之相對流動實現清洗液之間之熱交換。具體 地，本實施例中採用之攪拌裝置122於順時針轉動時（如 201006572 圖2中R所示之方向），促進第二收容槽112中大部分清洗 液向下流動，使位於第二收容槽112溫度高之清洗液由第 ' 一通孔105流入第一收容槽111，將熱量傳送至第一收容槽 111之清洗液；同時位於第一收容槽111内升溫慢之清洗液 由第二通孔106流入補充到第二收容槽112,使升溫慢之清 洗液處於加熱裝置121週圍快速升溫，從而實現第二收容 槽112與第一收容槽111之清洗液之間之熱交換，使清洗 液均勻升溫。同理可知，當加熱裝置121停止加溫時，攪 ®拌裝置122之轉動驅使第二收容槽112之清洗液與第一收 容槽111之清洗液之間相互流動，同樣亦可使清洗液均勻 降溫。 優選地，該清洗裝置10還包括溫度感應裝置13。該溫 度感應裝置13設置於清洗槽110之内侧面113並位於第一 收容槽111中，靠近内底面114，用於感應第一收容槽111 清洗液之溫度變化情況。當然，清洗裝置10還包括中央控 @制器（圖未示）。該中央控制器可與加熱裝置121、攪拌裝 置122、溫度感應裝置13及超音波發生器107電氣連通， 用以根據需要及溫度感應裝置13之結果，控制加熱裝置 121、攪拌裝置122與超音波發生器107。 如果待清洗物體需要不同之清洗液對其進行複數次清 洗，可採用包括複數清洗裝置10之清洗系統20(圖3所示） 進行清洗。本實施例中，該清洗系統20包括兩個清洗裝置 10，即：第一清洗裝置10a與第二清洗裝置10b，以及掛架 201及傳送裝置202。該第一清洗裝置10a與第二清洗裝置 11 201006572 10b相鄰設置。該掛架201用於放置待清洗物體，該傳送裝 置202與掛架201相連，用以吊起掛架201並分別放置於 • 第一清洗裝置l〇a與第二清洗裝置10b之清洗液中進行清 _ 洗。當然，清洗系統20亦可不包括掛架201，只要傳送裝 置202直接吊起待清洗物體並放置於第一清洗裝置l〇a與 第二清洗裝置10b之清洗液中即可。 請參閱圖3，以下將以本技術方案提供之清洗系統20 清洗電路板為例，介紹清洗系統20之使用方法。 ® 由於需要去除電路板表面之防焊層，本實施例中，第 一清洗裝置l〇a之清洗槽110a内為鹼液（如氫氧化鉀溶 液），用以與電路板表面之防焊層發生化學反應，使防焊層 脫落。第二清洗裝置l〇b之清洗槽110b内為軟水，用以沖 洗去除附著於電路板表面之污物。具體步驟如下： 首先，根據需要分別設置第一清洗裝置l〇a之加熱裝 置121a與攪拌裝置（圖未示），及第二清洗裝置10b之加熱 @裝置121b與攪拌裝置（圖未示）所需升高之溫度與轉動速 度。優選地，加熱溫度於30至100攝氏度範圍以内。本實 施例中，第一清洗裝置10a之加熱裝置121a之加熱溫度為 80至90攝氏度之間。 其次，第一清洗裝置10a之加熱裝置121a加熱鹼液使 鹼液升溫至所需溫度，第一清洗裝置10a之攪拌裝置轉動 驅使第一清洗裝置l〇a之第一收容槽111a及第二收容槽 112a内之鹼液相互流動均勻升溫。傳送裝置202將放置待 清洗電路板之掛架201放置於該第一收容槽111a内，使電 12 201006572 路板完全浸入鹼液中。同時，第一清洗裝置l〇a之超音波 發生器振蕩鹼液，使加熱後之鹼液與電路板表面之防焊層 * 反應並衝擊電路板表面，從而將反應產物從電路板表面去 ' 除。 再次，傳送裝置202將放置待清洗電路板之掛架201 從第一清洗裝置10a之第一收容槽Ilia之鹼液中取出，並 放置於第二清洗裝置10b之第一收容槽111b内，使電路板 完全浸入軟水中。再重復前述加熱、攪拌及振蕩清洗液之 ®步驟，使加熱後之軟水衝擊電路板表面，從而將污物及前 一步反應產物從電路板表面剝離。 最後，經烘乾後即可得到乾淨之電路板。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 @應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案實施例提供之清洗裝置之分解圖。 圖2係本技術方案實施例提供之清洗裝置之局部剖視 圖。 圖3係本技術方案實施例提供之清洗系統之結構示意 圖。 【主要元件符號說明】 13 10 201006572 清洗裝置 清洗槽 '第一收容槽 •第二收容槽 内側面 内底面 第一固定槽 間隔板 ❹第一表面 第二表面 側面 第一通孔 第二通孔 超音波發生器 蓋板 &加熱裝置 攪拌裝置 溫度感應裝置 清洗系統 第一清洗裝置 第二清洗裝置 掛架 傳送裝置 110 ' 110a ' 110b 111 、 111a 、 111b 112 、 112a 113 114 115 101 102 103 104 105 106 107 108 121、121a、121b 122 13 20 10a 10b 201 202 14Transactions on Advanced Packaging, 2005, 28(3), 397-403 0 At present, in order to reduce the scrap rate of the board, the board with the outermost protective layer quality β is unqualified, and the method of ultrasonic cleaning is used to press The outermost protective layer (such as solder resist layer) of the electric circuit board is peeled off from the circuit board, so that the inner circuit board covering the protective layer can be re-made with a protective layer, thereby obtaining a circuit board with a high yield. . Ultrasonic cleaning causes the liquid (chemical liquid, water, etc.) in the cleaning tank to oscillate by the vibration of the ultrasonic wave, and then the chemical reaction and physical interaction between the oscillated liquid and the object to be cleaned placed in the cleaning tank liquid In order to obtain a cleaning effect. Usually, cleaning the circuit board with a chemical liquid requires immersing the circuit board in the heated chemical liquid to cause the dirt on the surface of the circuit board to be reacted with the heated chemical liquid 201006572. However, the reaction speed of the chemical liquid at high temperature is fast, and the reaction speed of the chemical liquid at a low temperature is slow. If the chemical liquid around the circuit board is unevenly heated, there will be a difference in the degree of reaction between the different areas of the circuit board and the chemical liquid. Thoroughly remove dirt from the surface of the board. If the reaction time is extended, although a better cleaning effect can be achieved, the cleaning efficiency is lowered, which is not conducive to actual production. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a cleaning device and a cleaning system to solve the aforementioned problems and to improve the cleaning effect. A cleaning device and a cleaning system will be described below by way of examples. The π washing device comprises a washing tank, heating provided in the washing tank, and a mixing device. The heating device is for heating the alpha lotion contained in the washing tank. The stirring device is disposed in the cleaning tank for agitating the π washing liquid in the washing tank to realize heat exchange between the cleaning liquid close to the heating device and the cleaning liquid away from the heating device. A beta washing system comprising a cleaning device, a pylon, and a communication device connected to the pylon. The cleaning device includes a cleaning tank and is disposed in the cleaning tank. The heating device includes a heating device and a stirring device. The heating device is for heating the cleaning liquid contained in the π $ tank. The stirring device is disposed in the washing tank for stirring the washing liquid in the washing tank to realize heat exchange between the washing liquid close to the heating device and the washing liquid remote from the heating device. Compared with the prior art, the stirring device of the cleaning device stirs the cleaning liquid contained in the cleaning tank while heating or stopping the heating, 201006572, so that the cleaning liquid flows quickly to realize the cleaning liquid close to the heating device and away from the heating device. The heat exchange between the cleaning liquids causes the cleaning liquid in the cleaning tank to rise uniformly or lower the same temperature, and the cleaning ability of the cleaning liquids in the cleaning tank is ensured to be the same, thereby improving the cleaning effect. [Embodiment] Hereinafter, a cleaning device and a cleaning system provided by the present technical solution will be further described in detail with reference to the accompanying drawings and the embodiments. Referring to FIG. 1 to FIG. 2 , the cleaning device 10 provided by the technical solution includes a cleaning tank 110 , a heating device 121 , and a stirring device 122 . The cleaning tank 110 is an open tank having an open end for containing chemical liquid, water or other cleaning liquid for use in cleaning. The cleaning tank 110 can be a tank body or a combination of a plurality of tank bodies. In the embodiment, the partitioning plate 101 is disposed in the cleaning tank 110, and the inside of the cleaning tank 110 is spaced apart by the first receiving groove 111 and the second receiving groove 112. The first receiving groove 111 is used for placing an object to be cleaned when cleaning, and the second receiving groove 112 is for setting the heating device 121 and the stirring device 122. Preferably, the size of the second receiving slot 112 is smaller than the size of the first receiving slot 111. The cleaning tank 110 has an inner side surface 113 and an inner bottom surface 114 connected to the inner side surface 113. The inner side surface 113 of the cleaning tank 110 is provided with a first fixing groove 115 and a second fixing groove (not shown). The first fixing groove 115 is disposed in parallel with and opposite to the second fixing groove for arranging the partition plate 101. The length extension direction of the first fixing groove 115 and the second fixing groove may be determined according to actual design requirements. In this embodiment, the first fixing groove 115 and the second fixing groove extend from the open end of the cleaning groove 110 toward the inner bottom surface 114, and the 201006572 is perpendicular to the inner bottom surface 114. In this embodiment, the spacer 101 has a first surface 102, a second surface 103 opposite the first surface 102, and a side surface 104 connected to the first surface 102 and the second surface _103. The first through hole 105 and the second through hole 106 are defined in the partitioning plate 101 to communicate with the first receiving slot 111 and the second receiving slot 112 to enable the cleaning liquid received in the first receiving slot 111 and the second receiving slot 112. The first through hole 105 and the second through hole 106 can flow in or out, and the relative flow of the cleaning liquid of the first receiving groove 111 and the second receiving groove 112 can be realized. Of course, the ® spacer 101 can also be provided with one or a plurality of through holes for the cleaning liquid to pass through. The first through hole 105 and the second through hole 106 are respectively located at opposite ends of the partition plate 101 and penetrate the first surface 102 and the second surface 103. The first through hole 105 also penetrates the side surface 104. The opposite sides of the spacer 101 are respectively fixed to the first fixing groove 115 and the second fixing groove 114, and the side surface 104 is in contact with the inner bottom surface 114. At this time, the first through hole 105 is adjacent to the inner bottom surface 114 of the cleaning tank 110, and the second through hole 106 is away from the inner bottom surface @114 of the cleaning tank 110 for forming the cleaning liquid of the second receiving groove 112 and the first receiving groove 111. The passage of the cleaning fluid circulating. Of course, the spacer 101 can be fixed in the cleaning tank 110 by other means, and the direction of the arrangement can also be determined according to the actual design, and is not limited to the embodiment. The distribution of the first receiving groove 111 and the second receiving groove 112 depends on the position at which the partitioning plate 101 is disposed in the cleaning tank 110. In this embodiment, two opposite ultrasonic generators 107 are disposed in the groove wall of the cleaning tank 110. Each of the ultrasonic generators 107 is enclosed in the wall of the tank by the cover plate 108 for generating ultrasonic waves to oscillate the liquid 201006572 contained in the washing tank 110, thereby causing the liquid to generate an impact force to remove the dirt on the surface of the object to be cleaned. The surface of the object is removed. Of course, the cleaning tank 110 can also be provided with a cover at the open end to form an enclosure to meet the cleaning needs of different objects to be cleaned. The heating device 121 is located in the second receiving groove 112 of the cleaning tank 110, and cooperates with the stirring device 122 to uniformly heat the cleaning liquid contained in the cleaning tank 110 while raising or lowering the same temperature. In the present embodiment, the heating device 121 is an electrothermal heating rod fixed to the inner side surface 113 of the cleaning tank 110. The stirring device 122 is a rotating blade fixed to the inner side surface 113 of the washing tank 110. The agitating device 122 is located in the second receiving slot 112 and is adjacent to the inner bottom surface 114 for rotating the blade and driving the cleaning liquid contained in the second receiving slot 112 to flow out of the second receiving slot 112 from the first through hole 105 or the second through hole 106. The cleaning liquid contained in the first receiving groove 111 flows into the second receiving groove 112 from the first through hole 105 or the second through hole 106, thereby cleaning the cleaning liquid in the first receiving groove 111 and the second receiving groove 112. The relative flow of the liquid is such that heat exchange between the cleaning liquid adjacent to the heating device and the cleaning liquid remote from the heating device is achieved. The rotating blades of the stirring device 122 may be of different design depending on the flow direction of the cleaning liquid between the first receiving groove 111 and the second receiving groove 112. During the cleaning, the cleaning liquid located around the heating device 121 (ie, the cleaning liquid in the second receiving tank 112) is heated up to a high temperature, and the cleaning liquid away from the heating device 121 (ie, the cleaning liquid in the first receiving tank 111) is heated slowly. The temperature is low, so that the heat exchange between the cleaning liquids can be achieved by the relative flow of the cleaning liquid in the first receiving tank 111 and the cleaning liquid in the second receiving tank 112. Specifically, when the stirring device 122 used in the embodiment rotates clockwise (such as the direction indicated by R in FIG. 2, 201006572), most of the cleaning liquid in the second receiving groove 112 is caused to flow downward, so as to be located in the second receiving. The cleaning liquid having a high temperature in the groove 112 flows into the first receiving groove 111 through the first through hole 105, and transfers the heat to the cleaning liquid in the first receiving groove 111. At the same time, the cleaning liquid in the first receiving groove 111 is slowly heated by the second pass. The hole 106 is replenished into the second receiving groove 112, so that the cleaning liquid with slow heating temperature is rapidly heated around the heating device 121, thereby achieving heat exchange between the second receiving groove 112 and the cleaning liquid of the first receiving groove 111, so that the cleaning liquid Warm up evenly. Similarly, when the heating device 121 stops heating, the rotation of the stirring device 122 drives the cleaning liquid of the second receiving groove 112 and the cleaning liquid of the first receiving groove 111 to flow with each other, and the cleaning liquid can also be evenly distributed. Cool down. Preferably, the cleaning device 10 further includes a temperature sensing device 13. The temperature sensing device 13 is disposed on the inner side surface 113 of the cleaning tank 110 and located in the first receiving groove 111, adjacent to the inner bottom surface 114 for sensing the temperature change of the cleaning liquid in the first receiving groove 111. Of course, the cleaning device 10 also includes a central control unit (not shown). The central controller can be in electrical communication with the heating device 121, the stirring device 122, the temperature sensing device 13, and the ultrasonic generator 107 for controlling the heating device 121, the stirring device 122, and the ultrasonic wave according to the result of the temperature sensing device 13. Generator 107. If the object to be cleaned requires a different cleaning solution to perform multiple cleanings, it may be cleaned by a cleaning system 20 (shown in Figure 3) including a plurality of cleaning devices 10. In the present embodiment, the cleaning system 20 includes two cleaning devices 10, namely a first cleaning device 10a and a second cleaning device 10b, and a pylon 201 and a conveying device 202. The first cleaning device 10a is disposed adjacent to the second cleaning device 11 201006572 10b. The pylon 201 is used for placing an object to be cleaned, and the conveying device 202 is connected to the pylon 201 for lifting the pylon 201 and respectively placed in the cleaning liquid of the first cleaning device 10a and the second cleaning device 10b. Clear _ wash. Of course, the cleaning system 20 may not include the hanger 201 as long as the conveying device 202 directly lifts the object to be cleaned and places it in the cleaning liquid of the first cleaning device 10a and the second cleaning device 10b. Referring to FIG. 3, the cleaning system 20 of the present invention is used as an example to describe the use of the cleaning system 20. ® In the embodiment, the cleaning tank 110a of the first cleaning device 10a is an alkali liquid (such as a potassium hydroxide solution) for preventing the soldering layer from the surface of the circuit board. A chemical reaction occurs to cause the solder resist to fall off. The inside of the cleaning tank 110b of the second cleaning device 10b is soft water for washing and removing dirt adhering to the surface of the circuit board. The specific steps are as follows: First, the heating device 121a and the stirring device (not shown) of the first cleaning device 10a, and the heating device 121b and the stirring device (not shown) of the second cleaning device 10b are separately provided as needed. The temperature and the speed of rotation that need to be raised. Preferably, the heating temperature is within the range of 30 to 100 degrees Celsius. In the present embodiment, the heating temperature of the heating device 121a of the first cleaning device 10a is between 80 and 90 degrees Celsius. Next, the heating device 121a of the first cleaning device 10a heats the alkali solution to raise the temperature of the alkali solution to a desired temperature, and the stirring device of the first cleaning device 10a rotates to drive the first receiving groove 111a and the second receiving portion of the first cleaning device 10a. The lye in the tank 112a flows uniformly to each other. The transport device 202 places the hanger 201 on which the circuit board to be cleaned is placed in the first receiving slot 111a, so that the circuit board is fully immersed in the lye. At the same time, the ultrasonic generator of the first cleaning device 10a oscillates the lye, reacts the heated lye with the solder resist layer* on the surface of the circuit board and strikes the surface of the circuit board, thereby removing the reaction product from the surface of the circuit board. except. The transport device 202 removes the pylon 201 from which the circuit board to be cleaned is placed from the lye of the first receiving slot Ilia of the first cleaning device 10a, and places it in the first receiving slot 111b of the second cleaning device 10b. The board is completely immersed in soft water. The above steps of heating, stirring, and oscillating the cleaning solution are repeated to cause the heated soft water to impinge on the surface of the board to peel off the dirt and the previous reaction product from the surface of the board. Finally, after drying, a clean circuit board can be obtained. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded view of a cleaning device provided by an embodiment of the present technical solution. Figure 2 is a partial cross-sectional view of the cleaning device provided by the embodiment of the present technical solution. FIG. 3 is a schematic structural view of a cleaning system provided by an embodiment of the present technical solution. [Main component symbol description] 13 10 201006572 Cleaning device cleaning tank 'first receiving groove ・2nd receiving groove inner side inner bottom surface first fixing groove partition plate ❹ first surface second surface side first through hole second through hole super Sound generator cover & heating device agitator temperature sensing device cleaning system first cleaning device second cleaning device pylon transfer device 110 ' 110a ' 110b 111 , 111a , 111b 112 , 112a 113 114 115 101 102 103 104 105 106 107 108 121, 121a, 121b 122 13 20 10a 10b 201 202 14