CN107790429A - 太阳能电池硅片清洗装置 - Google Patents

太阳能电池硅片清洗装置 Download PDF

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CN107790429A
CN107790429A CN201710907765.7A CN201710907765A CN107790429A CN 107790429 A CN107790429 A CN 107790429A CN 201710907765 A CN201710907765 A CN 201710907765A CN 107790429 A CN107790429 A CN 107790429A
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谷香梅
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/045—Cleaning involving contact with liquid using perforated containers, e.g. baskets, or racks immersed and agitated in a liquid bath
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/007—Heating the liquid

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Abstract

本发明涉及一种太阳能电池硅片清洗装置，包括支架、清洗槽、表面开有孔洞的转筒，清洗槽设置在支架上，清洗槽内设有转筒，清洗槽下方设有电机，电机输出端连接转轴，转轴延伸至清洗槽内，转轴与转筒连接，所述转筒内设有若干层隔网，所述清洗槽内设有温度传感器、加热装置、超声波发生器，清洗槽外侧设有控制器，温度传感器、加热装置分别与控制器连接，所述清洗槽外壁下端设有出水管，出水管与排水管连接，出水管与排水管之间设有给水管，给水管的出水端延伸至清洗槽上方，所述出水管上设有第一阀门，排水管上设有第二阀门，给水管上设有水泵，隔网上表面设有刷毛，隔网下表面设有电动马达，本发明解决了清洗效果和清洗后甩干操作不方便的问题。

Description

太阳能电池硅片清洗装置
技术领域
本发明涉及一种清洗装置，尤其涉及一种太阳能电池硅片清洗装置。
背景技术
随着科学技术的发展，硅片的应用越来越广，在各种领域中都得到了应用。
半导体器件生产中硅片须经严格清洗。微量污染也会导致器件失效。清洗的目的在于清除表面污染杂质，包括有机物和无机物。这些杂质有的以原子状态或离子状态，有的以薄膜形式或颗粒形式存在于硅片表面。有机污染包括光刻胶、有机溶剂残留物、合成蜡和人接触器件、工具、器皿带来的油脂或纤维。无机污染包括重金属金、铜、铁、铬等，严重影响少数载流子寿命和表面电导；碱金属如钠等，引起严重漏电；颗粒污染包括硅渣、尘埃、细菌、微生物、有机胶体纤维等，会导致各种缺陷。清除污染的方法有物理清洗和化学清洗两种。
硅片清洗时需要用到清洗装置，但是一般的清洗装置清洗效果比较差，而且硅片清洗后还要取出进行甩干，操作起来比较麻烦。
发明内容
本发明的目的是提供一种太阳能电池硅片清洗装置，该太阳能电池硅片清洗装置解决了清洗装置清洗效果不好和清洗后甩干操作不方便的问题。
为了实现上述发明目的，本发明的太阳能电池硅片清洗装置包括支架、清洗槽、表面开有孔洞的转筒，清洗槽设置在支架上，清洗槽内设有转筒，清洗槽下方设有电机，电机输出端连接转轴，转轴延伸至清洗槽内，转轴与转筒连接，所述转筒内设有若干层隔网，所述清洗槽内设有温度传感器、加热装置、超声波发生器，清洗槽外侧设有控制器，温度传感器、加热装置分别与控制器连接，所述清洗槽外壁下端设有出水管，出水管与排水管连接，出水管与排水管之间设有给水管，给水管的出水端延伸至清洗槽上方，所述出水管上设有第一阀门，排水管上设有第二阀门，给水管上设有水泵，隔网上表面设有刷毛，隔网下表面设有电动马达。
所述加热装置为加热管。
所述电机为防震电机。
所述第一阀门、第二阀门均为电磁阀。
采用这种太阳能电池硅片清洗装置，具有以下优点：
1、由于清洗槽内设有转筒，清洗槽下方设有电机，电机输出端连接转轴，转轴延伸至清洗槽内，转轴与转筒连接，这样在硅片清洗时，可以提高清洗效果，而且清洗完后，可以利用转筒进行甩干，操作起来非常方便；
2、由于清洗槽内设有温度传感器、加热装置，温度传感器、加热装置分别与控制器连接，当清洗槽内的清洗液温度高于或低于设定值范围时，由控制器控制加热装置是否工作，这样就能保证清洗液始终保持在最适宜的清洗温度，提高了清洗效果；而且使用了超声波发生器，进一步提高了清洗效果；
3、由于清洗槽外壁下端设有出水管，出水管与排水管连接，出水管与排水管之间设有给水管，这样可以使清洗液进行循环流动，进一步提高了清洗效果。
4、由于隔网上表面设有刷毛，隔网下表面设有电动马达，这样进一步提高了清洗效果。
附图说明
下面结合附图和具体实施方式对本发明作进一步详细的说明。
图1是本发明太阳能电池硅片清洗装置的结构示意图。
其中有：1. 支架； 2. 清洗槽；3. 转筒；4. 电机； 5. 转轴；6. 隔网；7. 超声波发生器；8. 温度传感器；9. 加热装置；10. 控制器； 11. 出水管；12. 排水管；13. 给水管；14. 第一阀门；15. 水泵；16. 第二阀门；17. 刷毛；18. 电动马达。
具体实施方式
图1所示太阳能电池硅片清洗装置，包括支架、清洗槽、表面开有孔洞的转筒，清洗槽设置在支架上，清洗槽内设有转筒，清洗槽下方设有电机，电机输出端连接转轴，转轴延伸至清洗槽内，转轴与转筒连接，所述转筒内设有若干层隔网，所述清洗槽内设有温度传感器、加热装置、超声波发生器，清洗槽外侧设有控制器，温度传感器、加热装置分别与控制器连接，所述清洗槽外壁下端设有出水管，出水管与排水管连接，出水管与排水管之间设有给水管，给水管的出水端延伸至清洗槽上方，所述出水管上设有第一阀门，排水管上设有第二阀门，给水管上设有水泵，隔网上表面设有刷毛，隔网下表面设有电动马达。
所述加热装置为加热管。
所述电机为防震电机。
所述第一阀门、第二阀门均为电磁阀。
当需要清洗时，将硅片放置在转筒内的隔网上，然后启动电机，使转筒转动，同时打开第一阀门和水泵，关闭第二阀门，这样清洗液就能始终处于循环状态；当清洗液温度超过或低于设定温度时，温度传感器将温度信号传给控制器，由控制器控制是否启动或关闭加热装置，使清洗液始终保持在最适宜的温度；当硅片清洗完之后，关闭水泵，打开第二阀门，清洗液通过排水管排出，然后通过转筒将硅片甩干。由于隔网上表面设有刷毛，隔网下表面设有电动马达，这样进一步提高了清洗效果
本申请中没有详细说明的技术特征为现有技术。上述实施例仅例示性说明本申请的原理及其功效，而非用于限制本申请。任何熟悉此技术的人士皆可在不违背本申请的精神及范畴下，对上述实施例进行修饰或改变。因此，所属技术领域中具有通常知识者在未脱离本申请所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本申请的权利要求所涵盖。

Claims (4)

1.一种太阳能电池硅片清洗装置，其特征在于：包括支架、清洗槽、表面开有孔洞的转筒，清洗槽设置在支架上，清洗槽内设有转筒，清洗槽下方设有电机，电机输出端连接转轴，转轴延伸至清洗槽内，转轴与转筒连接，所述转筒内设有若干层隔网，所述清洗槽内设有温度传感器、加热装置、超声波发生器，清洗槽外侧设有控制器，温度传感器、加热装置分别与控制器连接，所述清洗槽外壁下端设有出水管，出水管与排水管连接，出水管与排水管之间设有给水管，给水管的出水端延伸至清洗槽上方，所述出水管上设有第一阀门，排水管上设有第二阀门，给水管上设有水泵，隔网上表面设有刷毛，隔网下表面设有电动马达。
2.按照权利要求1所述的太阳能电池硅片清洗装置，其特征在于：所述加热装置为加热管。
3.按照权利要求1所述的太阳能电池硅片清洗装置，其特征在于：所述电机为防震电机。
4.按照权利要求1所述的太阳能电池硅片清洗装置，其特征在于：所述第一阀门、第二阀门均为电磁阀。
CN201710907765.7A 2017-09-29 2017-09-29 太阳能电池硅片清洗装置 Pending CN107790429A (zh)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108746035A (zh) * 2018-04-12 2018-11-06 陈玉海 一种清洗灌晶海绵的装置
CN110314878A (zh) * 2019-07-03 2019-10-11 石连娥 一种光伏数据采集器用清理装置
CN110369393A (zh) * 2019-08-13 2019-10-25 安徽晶天新能源科技有限责任公司 一种硅片生产用超声波清洗机
CN110479695A (zh) * 2019-08-28 2019-11-22 深圳市净都科技有限公司 一种单槽多功能超声波清洗装置及方法
CN110544649A (zh) * 2018-05-29 2019-12-06 政汉电子科技有限公司 批次式湿法蚀刻清洗装置及批次式湿法蚀刻清洗方法
CN111659665A (zh) * 2020-05-29 2020-09-15 徐州鑫晶半导体科技有限公司 硅片的清洗方法及硅片的清洗设备
CN114725240A (zh) * 2022-04-02 2022-07-08 广东高景太阳能科技有限公司 一种硅晶体材料的厚片处理装置及处理方法
CN116581068A (zh) * 2023-07-13 2023-08-11 北京紫光华天热能动力技术有限公司 一种硅基材料高效脱除纳米颗粒物装置及方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108746035A (zh) * 2018-04-12 2018-11-06 陈玉海 一种清洗灌晶海绵的装置
CN110544649A (zh) * 2018-05-29 2019-12-06 政汉电子科技有限公司 批次式湿法蚀刻清洗装置及批次式湿法蚀刻清洗方法
CN110544649B (zh) * 2018-05-29 2024-06-07 政汉电子科技有限公司 批次式湿法蚀刻清洗装置及批次式湿法蚀刻清洗方法
CN110314878A (zh) * 2019-07-03 2019-10-11 石连娥 一种光伏数据采集器用清理装置
CN110369393A (zh) * 2019-08-13 2019-10-25 安徽晶天新能源科技有限责任公司 一种硅片生产用超声波清洗机
CN110369393B (zh) * 2019-08-13 2021-04-06 安徽晶天新能源科技有限责任公司 一种硅片生产用超声波清洗机
CN110479695A (zh) * 2019-08-28 2019-11-22 深圳市净都科技有限公司 一种单槽多功能超声波清洗装置及方法
CN111659665A (zh) * 2020-05-29 2020-09-15 徐州鑫晶半导体科技有限公司 硅片的清洗方法及硅片的清洗设备
CN114725240A (zh) * 2022-04-02 2022-07-08 广东高景太阳能科技有限公司 一种硅晶体材料的厚片处理装置及处理方法
CN116581068A (zh) * 2023-07-13 2023-08-11 北京紫光华天热能动力技术有限公司 一种硅基材料高效脱除纳米颗粒物装置及方法
CN116581068B (zh) * 2023-07-13 2023-12-19 北京紫光华天热能动力技术有限公司 一种硅基材料高效脱除纳米颗粒物装置及方法

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