CN114698265A - Method and device for controlling verticality between micro-reed plates - Google Patents

Method and device for controlling verticality between micro-reed plates Download PDF

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Publication number
CN114698265A
CN114698265A CN202210319645.6A CN202210319645A CN114698265A CN 114698265 A CN114698265 A CN 114698265A CN 202210319645 A CN202210319645 A CN 202210319645A CN 114698265 A CN114698265 A CN 114698265A
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CN
China
Prior art keywords
micro
positioning
spring
pcb
supporting plate
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CN202210319645.6A
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Chinese (zh)
Inventor
黄兆岭
汤鸿宇
林奈
王玉斌
李春泉
黄红艳
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Guilin University of Electronic Technology
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Guilin University of Electronic Technology
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Application filed by Guilin University of Electronic Technology filed Critical Guilin University of Electronic Technology
Priority to CN202210319645.6A priority Critical patent/CN114698265A/en
Publication of CN114698265A publication Critical patent/CN114698265A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses a method and a device for controlling verticality between micro-spring plates, wherein the method comprises the following steps: fixedly placing the PCB coated with the solder and placed with the micro-spring; all the micro springs are compressed at the same time and then are subjected to residual welding with the PCB; and fixedly placing the other PCB coated with the solder, turning over the PCB welded with the micro spring to enable the micro spring to move downwards in alignment with the other PCB welding point, and enabling the micro spring to be compressed and then remain welded with the PCB. The device comprises a positioning plate, a first supporting plate and a second supporting plate, wherein a guide column is vertically arranged in the center of the bottom surface of the positioning plate, a PCB groove is formed in the centers of the first supporting plate and the second supporting plate, positioning grooves are symmetrically formed in two sides of the first supporting plate, a second positioning block and a first positioning block are respectively arranged on two sides of the positioning plate and the second supporting plate, and the second supporting plate and the positioning plate are respectively connected with the first supporting plate through the first positioning block and the second positioning block which are inserted into the positioning grooves. The invention solves the problems of micro-spring deflection, deformation, low flatness and the like in CCGA welding, thereby improving the realizability and reliability of vertical interconnection between plates.

Description

Method and device for controlling verticality between micro-reed plates
Technical Field
The invention belongs to the technical field of electronic packaging, and particularly relates to a method and a device for controlling verticality between micro-reed plates.
Background
In general, a CCGA (ceramic column grid array) packaged device has three types of interconnection pin types, namely a cast solder column, a copper strip winding solder column and a micro-spring solder column. The CCGA packaging device using the cast welding column or the copper strip winding welding column as the interconnection pin has good horizontal vibration impact resistance, but poor Z-direction mechanical vibration resistance and low mechanical strength. The spring contacts of the micro-spring welding columns have the characteristics of better impact resistance, vibration resistance, flexibility and the like, particularly the Z-direction large deformation resistance, and better flexibility in high-temperature and severe environments is provided for interconnection of the interlayer spring contact arrays under the condition that the strip of the interconnection electrical property of the contacts is guaranteed.
However, the micro spring has small mass and poor stability, is easy to deflect under the influence of external force, and is more difficult to realize vertical interconnection than a welding column. When CCGA adopts the interconnection of little spring pin, little spring array is many, and little spring pin material heat transfer capacity is strong, and is not high with materials such as base plate, pad hot matching nature, and especially little spring conversion frock's centre gripping can lead to the temperature homogeneity of little spring solder joint in the welding process poor, temperature gradient is big, the thermal stress problem is outstanding, and is poor at the welding process controllability, can appear coplanarity, gradient scheduling problem that little spring skew leads to. In addition, in the process of implanting the micro-spring pins of the CCGA device, the alignment matching condition of the pins and the PCB (printed circuit board) pads in the process of assembling the CCGA device can be directly influenced by the coaxiality of the micro-spring pins and the pads of the device substrate, and the welding quality and reliability of the pins of the device are further influenced. The defects of non-coaxial pins, non-coplanar deformation of the pins and the like easily occur in the process of assembling the micro-spring pins, so that the micro-spring pins of the CCGA device deviate from a welding pad when being assembled with a PCB, the micro-spring pins are not completely wrapped by soldering tin, or part of the micro-spring pins are desoldered or partially welded with soldering paste, so that the reliability of welding points is poor, and therefore, the micro-spring assembling precision control technology is very important.
Disclosure of Invention
Based on the problems, the invention provides a method and a device for controlling the verticality between micro-spring plates, which are used for positioning and clamping welding through a fixing clamp, controlling the deflection of the micro-spring in the welding process, realizing the accurate positioning and reliable welding of the micro-spring based on the vertical interconnection between the micro-spring plates, solving the problems of deflection, deformation, low flatness and the like of the micro-spring in CCGA welding, and further improving the realizability and reliability of the vertical interconnection between the micro-spring plates.
The invention adopts the technical scheme that the method for controlling the verticality between the micro-spring plates comprises the following steps:
step one, fixedly placing the PCB which is coated with the solder and placed with the micro spring with the right side facing upwards;
step two, compressing all the micro springs to a preset length at the same time, keeping all the micro springs on the same horizontal plane and keeping the micro springs stable;
step three, performing welding leaving on the bottom end of the micro spring and the PCB, and checking whether a welding result reaches the standard;
and step four, fixedly placing the other PCB coated with the solder with the right side facing upwards, turning over the PCB welded with the micro spring to enable the micro spring to move downwards in alignment with the welding point of the other PCB, compressing the micro spring by a preset length and keeping stable, performing residual welding on the bottom end of the micro spring and the PCB, and checking whether the welding result reaches the standard.
An apparatus for controlling the verticality between micro-reed plates, which is used for the method for controlling the verticality between micro-reed plates, the apparatus for controlling the verticality between micro-reed plates comprises: the first support plate, the second support plate and the positioning plate;
a PCB groove is formed in the center of the first support plate and the second support plate, positioning grooves are symmetrically formed in two opposite sides of the first support plate, and positioning blocks I are arranged on two sides of the second support plate in a matching mode with the positioning grooves; a plurality of guide columns are vertically arranged in the center of the bottom surface of the positioning plate at intervals of a preset distance, the guide columns correspond to the micro springs one by one, and positioning blocks II are arranged on two sides of the positioning plate corresponding to the positioning grooves; the second supporting plate and the first positioning plate are respectively connected with the first supporting plate through the first positioning block and the second positioning block, and the lower parts of the first positioning block and the second positioning block are embedded into the positioning grooves.
Preferably, when the positioning plate and the first support plate or the first support plate and the second support plate are connected and fixed, the micro spring is compressed by 0.1-0.2 mm.
Preferably, the guide post is a cylinder, the outer diameter of the guide post is matched with the inner diameter of the micro spring, and the length of the guide post is 0.4-0.6 mm.
Preferably, the PCB groove is a rectangle matched with the PCB, and positioning columns are vertically and upwards arranged in the PCB groove close to four corners respectively.
Preferably, the outer side of the positioning groove penetrates through the first support plate and is respectively provided with a through hole, the lower end of the positioning block is provided with a first connecting hole corresponding to the through hole, and the positioning pin penetrates through the through hole and the first connecting hole to fix the first positioning block and the first support plate.
Preferably, the lower end of the second positioning block is provided with a second connecting hole corresponding to the through hole, and a positioning pin penetrates through the through hole and the second connecting hole to fix the second positioning block and the first supporting plate.
The guide column is prepared by adopting the following process:
s1 pretreatment: cleaning the substrate by respectively adopting acetone, alcohol and deionized water, and drying by adopting a drier after cleaning; finally, bombarding and activating the surface by adopting an ion beam;
s2 gluing: dropping AZ5214 photoresist on the surface of a substrate, then vacuum-absorbing the substrate and rotating at a high speed to make the photoresist thin and uniformly cover the surface of the substrate;
s3 pre-baking: pre-baking the substrate at a preset temperature;
s4 exposure development: exposing the substrate subjected to the pre-baking, developing by using AZ300MIF developing solution, and drying by using nitrogen;
s5 cleaning: cleaning with an AZ5214 developing solution, and removing the positive AZ5214 glue of the unexposed part to obtain a hole groove;
s6 casting and forming: adopting SU-8 and pyrolytic graphite in a mass ratio of 2: 8, pouring into the empty groove after mixing in proportion to obtain the guide post;
s7 cleaning: and cleaning with an acetone solution to remove the AZ5214 positive glue.
Preferably, the pre-bake temperature of the substrate is 100 ℃ for 1 minute.
Preferably, the exposure dose is 40mJ/cm2, the exposure time is 40S, and the development time is 60S.
Compared with the prior art, the invention has the beneficial effects that:
1) the invention utilizes the plane to slightly compress the micro spring, plays a role in positioning and clamping the micro spring, avoids the micro spring from shifting in the welding process, realizes the precise positioning and reliable welding of the micro spring based on the vertical interconnection between the plates, solves the problems of the micro spring shifting, deformation and the like in the CCGA welding, and simultaneously keeps the flatness of the micro spring, thereby improving the realizability and reliability of the vertical interconnection between the plates; the operation method is simple, and the welding quality and efficiency are improved;
2) the clamp for welding the micro-spring is formed by the support plate I, the support plate II and the positioning plate, wherein the positioning plate is provided with the guide post which is inserted into the micro-spring to guide and position the micro-spring, so that the micro-spring is prevented from deviating in the compression process, the verticality of the micro-spring is kept, and the connection between the positioning plate and the support plate I can effectively stabilize the compression state of the micro-spring and never play a role in uniformly clamping and positioning the micro-spring;
3) the outer diameter of the guide post is matched with the inner diameter of the micro spring, so that the guide post is ensured to be smoothly inserted into the micro spring and has a limiting effect on the micro spring, the micro spring is ensured to be vertically compressed, and deformation is avoided, wherein the length of the micro spring is 1mm in a normal state, the length of the guide post is 0.4-0.6mm, and the micro spring is effectively guided and positioned;
4) through the PCB groove and the positioning column, the PCB is more stable, alignment of the micro spring and a welding point is facilitated, and deviation in the welding process is avoided;
5) this design utilizes locating pin male mode fixed positioning piece one or locating piece two and backup pad one, and effective fixed supporting board one and backup pad two take place the skew when avoiding welding and lead to little spring to warp, and in addition, when little spring pin conversion equipment process, the solution easily takes place pin disalignment, pin warp not coplane scheduling problem, connects swiftly, reliably, and device simple structure is compact, the practicality.
Drawings
FIG. 1 is a first assembly view of the present invention;
FIG. 2 is a second assembly view of the present invention;
FIG. 3 is a schematic view of the present invention in assembled form;
FIG. 4 is a schematic view of a support plate according to the present invention;
FIG. 5 is a schematic structural view of a second supporting plate according to the present invention;
FIG. 6 is a schematic view of a positioning plate according to the present invention;
the labels in the figure are: 1. the PCB positioning device comprises a first supporting plate, a second supporting plate, a third supporting plate, a fourth supporting plate, a fifth supporting plate, a sixth supporting plate, a fifth supporting plate, a sixth supporting plate, a fifth supporting plate, a sixth supporting plate, a fourth supporting plate, a sixth supporting plate, a locating, a fourth supporting plate, a sixth supporting plate, a fourth supporting plate, a fifth supporting plate, a fourth supporting plate, a sixth positioning, a fifth positioning, a sixth supporting plate, a sixth positioning, a fifth positioning hole, a fourth supporting plate, a sixth positioning, a fourth supporting plate, a fourth positioning, a fourth.
Detailed Description
The invention will be further explained in the following with reference to the drawings attached to the specification in order to facilitate better understanding by those skilled in the art.
Example 1
Because when CCGA adopts the interconnection of little spring pin, little spring array is many, little spring self quality is little, poor stability, receive external force influence easy skew, and at welding process controllability poor, the pin disalignment, pin deformation defects such as coplane not easily take place, and then skew pad when leading to CCGA device little spring pin and PCB board equipment, soldering tin is incomplete to little spring pin parcel, or some little spring pin and tin cream desolder or partial welding, lead to solder joint reliability subalternation problem. The invention provides a method for controlling verticality between micro-spring plates, which comprises the following steps:
step one, fixedly placing the PCB which is coated with the solder and placed with the micro spring with the right side facing upwards;
step two, compressing all the micro springs to a preset length at the same time, keeping all the micro springs on the same horizontal plane and keeping the micro springs stable;
step three, performing welding leaving on the bottom end of the micro spring and the PCB, and checking whether a welding result reaches the standard;
and step four, fixedly placing the other PCB coated with the solder with the right side facing upwards, turning over the PCB welded with the micro spring to enable the micro spring to move downwards in alignment with the welding point of the other PCB, compressing the micro spring by a preset length and keeping stable, performing residual welding on the bottom end of the micro spring and the PCB, and checking whether the welding result reaches the standard.
According to the method for controlling the verticality between the micro-spring plates, the micro-springs are slightly compressed by the plane, so that the positioning and clamping effects on the micro-springs are achieved, the micro-spring deflection in the welding process is avoided, the accurate positioning and reliable welding of the micro-springs based on the vertical interconnection between the micro-springs are realized, the problems of micro-spring deflection, deformation and the like in the CCGA welding are solved, and meanwhile, the flatness of the micro-springs is also maintained, so that the realizability and the reliability of the vertical interconnection between the micro-springs are improved; the operation method is simple, and the welding quality and efficiency are improved.
Example 2
An apparatus for controlling the verticality between micro-spring plates, as shown in fig. 1-6, which is used for the method for controlling the verticality between micro-spring plates, and comprises: a first supporting plate 1, a second supporting plate 2 and a positioning plate 3.
The supporting plate I1 and the supporting plate II 2 are rectangular plates with preset thicknesses, and a PCB groove 4 is formed in the centers of the supporting plate I1 and the supporting plate II 2 and used for placing a PCB9 to prevent the PCB9 from deviating; positioning grooves 5 are symmetrically formed in two opposite sides of the first supporting plate 1, and positioning blocks 6 are arranged on two sides of the second supporting plate 2 and matched with the positioning grooves 5; a plurality of guide posts 7 are vertically arranged in the center of the bottom surface of the positioning plate 3 at intervals of a preset distance, the guide posts 7 correspond to the micro springs one by one, and positioning blocks II 8 are arranged on two sides of the positioning plate 3 corresponding to the positioning grooves 5; the second supporting plate 2 and the positioning plate 3 are respectively connected with the first supporting plate 1 through a first positioning block 6 and a second positioning block 8, and the lower parts of the positioning blocks are embedded into the positioning grooves 5.
According to the invention, the supporting plate I1, the supporting plate II 2 and the positioning plate 3 form the clamp for welding the micro-springs, when the clamp is used, the guide posts 7 are inserted into the positioning grooves 5 in a one-to-one correspondence manner, and the positioning blocks II 8 are inserted into the micro-springs, so that the micro-springs are slightly compressed. The guide post 7 can avoid the bias of the micro spring in the compression process and keep the verticality of the micro spring; and the connection of the positioning plate 3 and the supporting plate I1 can effectively stabilize the compression state of the micro spring, thereby playing a role in uniformly clamping and positioning the micro spring.
When the positioning plate 3 and the supporting plate I1 or the supporting plate I1 and the supporting plate II 2 are connected and fixed, the micro spring is compressed by 0.1-0.2mm, so that the micro spring is not excessively compressed to lose effectiveness, and the clamping effect of the device on the micro spring is ensured.
The guide post 7 is a cylinder, the outer diameter of the guide post is matched with the inner diameter of the micro spring, the guide post 7 is ensured to be smoothly inserted into the micro spring and has a limiting effect on the micro spring, the micro spring is ensured to be vertically compressed, and deformation is avoided; and the length of the guide post 7 is 0.4-0.6mm, and the length of the guide post 7 is 0.4-0.6mm under the normal state, so that the micro spring is effectively guided and positioned.
PCB groove 4 is the rectangle that matches with PCB9, is close to the vertical reference column 10 that upwards is equipped with respectively in four corners department in the PCB groove 4, corresponds the reference column on the PCB9 and punches a hole, and reference column 10 can be temporarily fixed PCB9 in the PCB groove 4 of backup pad one 1 and backup pad two 2, is favorable to backup pad one 1 and the accurate location of backup pad two 2, and makes things convenient for little spring pin conversion equipment.
The outer sides of the positioning grooves 5 penetrate through the supporting plates I1 and are respectively provided with through holes 11, the lower ends of the positioning blocks I6 are provided with connecting holes I12 corresponding to the through holes 11, and the positioning blocks I6 and the supporting plates I1 are fixed by adopting positioning pins 13 to penetrate through the through holes 11 and the connecting holes I12; this simple structure, installation and dismantlement convenient operation strengthen the backup pad 1 and the steadiness of being connected of backup pad two 2.
A second connecting hole 14 is formed in the lower end of the second positioning block 8 corresponding to the through hole 11, and a positioning pin 13 penetrates through the through hole 11 and the second connecting hole 14 to fix the second positioning block 8 and the first support plate 1; effective fixed location board 3 and backup pad 1 take place the skew when avoiding welding and lead to little spring to warp, in addition, when little spring pin conversion equipment process, solve and easily take place pin disalignment, pin warp not coplane scheduling problem, the practicality is strong.
In this embodiment, the method for preparing the guide post 7 includes the following steps:
s1 pretreatment: cleaning the substrate by respectively adopting acetone, alcohol and deionized water, and drying by adopting a drier after cleaning; finally, bombarding and activating the surface by adopting an ion beam;
s2 gluing: dropping AZ5214 photoresist on the surface of a substrate, then vacuum-absorbing the substrate and rotating at a high speed to make the photoresist thin and uniformly cover the surface of the substrate;
s3 pre-baking: pre-baking the substrate at a preset temperature; specifically, the temperature is 100 ℃ and the time is 1 minute;
s4 exposure development: exposing the substrate to light at a dose of 40mJ/cm2Exposing for 40S, developing for 60S by using AZ300MIF developing solution, and drying by nitrogen;
s5 cleaning: cleaning with an AZ5214 developing solution, and removing the positive AZ5214 glue of the unexposed part to obtain a hole groove;
s6 casting and forming: adopting SU-8 and pyrolytic graphite in a mass ratio of 2: 8, pouring into the empty groove after mixing in proportion to obtain the guide column;
s7 cleaning: and cleaning with an acetone solution to remove the AZ5214 positive glue.
The specific using method comprises the following steps:
the PCB9 coated with solder and placed with the micro springs is placed in the PCB groove 4 of the first support plate 1, the guide posts 7 are inserted downwards in a one-to-one correspondence mode, the positioning blocks II 8 are inserted into the positioning grooves 5 in a corresponding mode, the positioning pins 13 are inserted into the through holes 11 from the outer side of the first support plate 1 to fix the positioning blocks II 8 and the first support plate 1, at the moment, the micro springs are slightly compressed, the first support plate 1, the positioning plates 3 and the guide posts 7 have the clamping and positioning effects on the micro springs, and the first part is welded through reflow soldering. And taking down the positioning plate 3, and checking whether the welding result reaches the standard. And placing the other PCB9 in the PCB groove 4 of the second support plate 2, overturning the first support plate 1 and moving downwards and slowly corresponding to the second support plate 2, so that the second positioning block 8 is correspondingly inserted into the positioning groove 5 and fixed by adopting the positioning pin 13, wherein at the moment, the non-welded end of the micro spring is accurately butted with the PCB4 welding point on the second support plate 2, and the welding of the second part is completed by reflow welding. And separating the support plate I1, the support plate II 2 and the PCB 9.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention, and therefore, the scope of the present invention should be determined by the scope of the claims.

Claims (10)

1. A method for controlling verticality between micro spring plates is characterized by comprising the following steps:
step one, fixedly placing the PCB which is coated with the solder and placed with the micro spring with the right side facing upwards;
step two, compressing all the micro springs to a preset length at the same time, keeping all the micro springs on the same horizontal plane and keeping the micro springs stable;
step three, performing welding leaving on the bottom end of the micro spring and the PCB, and checking whether a welding result reaches the standard;
and step four, fixedly placing the other PCB coated with the solder with the right side facing upwards, turning over the PCB welded with the micro spring, then aligning the micro spring with the welding point of the other PCB to move downwards, compressing the micro spring by a preset length and keeping the micro spring stable, performing residual welding on the bottom end of the micro spring and the PCB, and checking whether the welding result reaches the standard or not.
2. An apparatus for controlling the verticality between micro-spring plates, which is used in the method for controlling the verticality between micro-spring plates of claim 1, and comprises: the device comprises a first supporting plate (1), a second supporting plate (2) and a positioning plate (3);
a PCB groove (4) is formed in the centers of the first supporting plate (1) and the second supporting plate (2), positioning grooves (5) are symmetrically formed in two opposite sides of the first supporting plate (1), and positioning blocks (6) are arranged on two sides of the second supporting plate (2) and matched with the positioning grooves (5); a plurality of guide posts (7) are vertically arranged in the center of the bottom surface of the positioning plate (3) at intervals of a preset distance, the guide posts (7) correspond to the micro springs one by one, and positioning blocks II (8) are arranged on two sides of the positioning plate (3) corresponding to the positioning grooves (5); the second support plate (2) and the positioning plate (3) are respectively connected with the first support plate (1) through a first positioning block (6) and a second positioning block (8) with the lower part embedded into the positioning groove (5).
3. The device for controlling the verticality between the micro-spring plates as claimed in claim 2, wherein the micro-spring is compressed by 0.1-0.2mm when the positioning plate (3) and the supporting plate one (1) or the supporting plate one (1) and the supporting plate two (2) are connected and fixed.
4. The device for controlling the verticality between the micro-spring plates as claimed in claim 2, wherein the guide post (7) is a cylinder with an outer diameter matched with the inner diameter of the micro-spring, and the length of the guide post (7) is 0.4-0.6 mm.
5. The device for controlling the verticality between the micro-spring plates as claimed in claim 2, wherein the PCB slot (4) is rectangular and matched with the PCB (9), and positioning posts (10) are respectively vertically and upwardly arranged in the PCB slot (4) near four corners.
6. The device for controlling the verticality between the micro spring plates according to claim 2, wherein the through holes (11) are respectively formed in the outer sides of the positioning grooves (5) through the first support plate (1), the connecting holes (12) are formed in the lower ends of the first positioning blocks (6) corresponding to the through holes (11), and the first positioning blocks (6) and the first support plates (1) are fixed by positioning pins (13) penetrating through the through holes (11) and the connecting holes (12).
7. The device for controlling the verticality between the micro spring plates according to claim 2, wherein the lower end of the second positioning block (2) is provided with a second connecting hole (14) corresponding to the through hole (11), and the second positioning block (8) and the first support plate (1) are fixed by a positioning pin (13) penetrating through the through hole (11) and the second connecting hole (14).
8. The device for controlling the verticality between the micro spring plates as claimed in claim 2, wherein the guide posts are prepared by the following process:
s1 pretreatment: cleaning the substrate by respectively adopting acetone, alcohol and deionized water, and drying by adopting a drier after cleaning; finally, bombarding and activating the surface by adopting an ion beam;
s2 gluing: dropping AZ5214 photoresist on the surface of a substrate, then vacuum-absorbing the substrate and rotating at a high speed to make the photoresist thin and uniformly cover the surface of the substrate;
s3 pre-baking: pre-baking the substrate at a preset temperature;
s4 exposure development: exposing the substrate subjected to the pre-baking, developing by using an AZ300MIF developing solution, and drying by using nitrogen;
s5 cleaning: cleaning with an AZ5214 developing solution, and removing the positive AZ5214 glue of the unexposed part to obtain a hole groove;
s6 casting and forming: adopting SU-8 and pyrolytic graphite in a mass ratio of 2: 8, pouring into the empty groove after mixing in proportion to obtain the guide column;
s7 cleaning: and cleaning with an acetone solution to remove the AZ5214 positive glue.
9. The apparatus of claim 8, wherein the substrate is pre-baked at 100 ℃ for 1 minute.
10. The apparatus as claimed in claim 8, wherein the exposure dose is 40mJ/cm2Exposure time 40S, development time 60S.
CN202210319645.6A 2022-03-29 2022-03-29 Method and device for controlling verticality between micro-reed plates Pending CN114698265A (en)

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Application Number Priority Date Filing Date Title
CN202210319645.6A CN114698265A (en) 2022-03-29 2022-03-29 Method and device for controlling verticality between micro-reed plates

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Application Number Priority Date Filing Date Title
CN202210319645.6A CN114698265A (en) 2022-03-29 2022-03-29 Method and device for controlling verticality between micro-reed plates

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CN114698265A true CN114698265A (en) 2022-07-01

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Application Number Title Priority Date Filing Date
CN202210319645.6A Pending CN114698265A (en) 2022-03-29 2022-03-29 Method and device for controlling verticality between micro-reed plates

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116600469A (en) * 2023-07-17 2023-08-15 北京三重华星电子科技有限公司 Printed circuit board with soldered electronic components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116600469A (en) * 2023-07-17 2023-08-15 北京三重华星电子科技有限公司 Printed circuit board with soldered electronic components
CN116600469B (en) * 2023-07-17 2023-09-22 北京三重华星电子科技有限公司 Printed circuit board with soldered electronic components

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