CN219999690U - Ball planting clamp capable of splicing plates - Google Patents
Ball planting clamp capable of splicing plates Download PDFInfo
- Publication number
- CN219999690U CN219999690U CN202320329936.3U CN202320329936U CN219999690U CN 219999690 U CN219999690 U CN 219999690U CN 202320329936 U CN202320329936 U CN 202320329936U CN 219999690 U CN219999690 U CN 219999690U
- Authority
- CN
- China
- Prior art keywords
- ball
- planting
- jig
- jointed board
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 34
- 239000010959 steel Substances 0.000 claims abstract description 34
- 238000005476 soldering Methods 0.000 claims abstract description 22
- 230000004907 flux Effects 0.000 claims abstract description 16
- 230000001680 brushing effect Effects 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a ball planting clamp capable of splicing plates, which comprises: the jig comprises a machine table, a jacking mechanism, a jig base plate, a jig bearing base plate, a PCB jointed board, soldering flux steel sheets and ball-planting steel sheets, wherein positioning blocks are respectively arranged on four corners of the jig base plate, the four positioning blocks surround to form a positioning area for placing the jig bearing base plate, the middle part of the jig bearing base plate is downwards sunken to form a cavity for placing the PCB jointed board, a plurality of first through holes for soldering paste to pass through the PCB jointed board are formed in a soldering paste brushing area of the soldering flux steel sheets, a plurality of ball-planting plates in one-to-one correspondence to the positions of the first through holes are arranged in the ball-planting area on the ball-planting steel sheets, and a plurality of second through holes for tin balls to pass through and slide onto a soldering paste brushing area on the PCB jointed board are formed in the ball-planting plates.
Description
Technical Field
The utility model relates to the technical field of PCB (printed circuit board) clamps, in particular to a ball planting clamp capable of splicing plates.
Background
When the element to be planted with balls is produced in a mode of jigsaw design, the ball planting operation is required to be carried out according to jigsaw, in the prior art, a fixed single-board PCB is usually put into a bottom die of a jig, then a small steel sheet is covered with flux paste, then a ball planting cover plate is covered with tin balls to be brushed onto the PCB, and the traditional ball planting clamp has the limitation in the use process that only one PCB can be planted at a time, so that the efficiency is low.
Disclosure of Invention
The utility model mainly solves the technical problem of providing the ball planting clamp capable of splicing plates, which not only greatly improves the production efficiency, but also is convenient for staff to use and safe to operate.
In order to solve the technical problems, the utility model adopts a technical scheme that: the utility model provides a but ball anchor clamps are planted to makeup includes: the jig comprises a machine table, a jacking mechanism arranged in the machine table, a jig bottom plate arranged on the machine table, a clamp bearing substrate, a PCB jointed board, soldering flux steel sheets and ball planting steel sheets, wherein positioning blocks are respectively arranged on four corners of the jig bottom plate, a positioning area for placing the clamp bearing substrate is formed by surrounding the four positioning blocks, a cavity for placing the PCB jointed board is formed by downwards sinking the middle part of the clamp bearing substrate, a plurality of first through holes for soldering paste to pass through the PCB jointed board are formed in a soldering paste brushing area of the soldering flux steel sheets above the PCB jointed board, a plurality of ball planting plates corresponding to the first through holes in one-to-one mode are arranged in a ball planting area above the PCB jointed board on the ball planting steel sheets, and a plurality of second through holes for solder balls to pass through and slide onto the PCB jointed board.
In a preferred embodiment of the present utility model, the dimensions of the ball mounting plate and the first through hole are the same.
In a preferred embodiment of the present utility model, a plurality of second through holes for the solder balls to pass through are arranged on each ball-planting plate in an array manner.
In a preferred embodiment of the present utility model, the diameter of the second through hole is slightly larger than the diameter of the solder ball.
In a preferred embodiment of the present utility model, the jacking mechanism adopts a jacking cylinder, a jacking plate is disposed on an extending end of the jacking cylinder, and four jacking posts are disposed on the jacking plate.
In a preferred embodiment of the present utility model, the upper end of the top post penetrates through the bottom plate of the jig and the substrate bearing fixture and then contacts with the flux paste steel sheet or the ball-implanting steel sheet.
In a preferred embodiment of the present utility model, the positioning block has an "L" shaped structure.
In a preferred embodiment of the present utility model, the jig bottom plate is fixed on the machine by bolts.
In a preferred embodiment of the present utility model, the flux paste steel sheet has the same size as the ball mounting steel sheet.
In a preferred embodiment of the present utility model, the ball placement area corresponds to the solder paste area and has the same size.
The beneficial effects of the utility model are as follows: the ball planting efficiency is greatly improved, and meanwhile, the ball planting precision of the jointed board is ensured to be the same as that of the single board; the operation is simple, the ball planting efficiency can be improved by several times, the production efficiency can be greatly improved, and the production cost is reduced for companies.
Drawings
For a clearer description of the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the description below are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:
FIG. 1 is a side view of a jig for ball placement of a jigsaw according to the present utility model;
FIG. 2 is a top view of a jig for ball placement with jig plates according to the present utility model;
FIG. 3 is a top view of a steel sheet for ball placement in a ball placement fixture for a jigsaw according to the present utility model.
Description of the embodiments
The following description of the technical solutions in the embodiments of the present utility model will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, an embodiment of the present utility model includes: a ball-planting clamp capable of splicing plates, comprising: the soldering flux ball jig comprises a machine table 1, a jacking mechanism arranged in the machine table, a jig base plate 3 arranged on the machine table, a jig bearing base plate 4, a PCB jointed board 5, soldering flux ball steel sheets 6 and a ball-planting steel sheet 7, wherein the four corners of the jig base plate are respectively provided with a positioning block 8, the L-shaped structure of the positioning blocks is surrounded by four positioning blocks to form a positioning area for placing the jig bearing base plate, the middle of the jig bearing base plate is downwards sunken to form a cavity for placing the PCB jointed board, a plurality of first through holes 9 for soldering paste to pass through the PCB jointed board are formed in a soldering paste brushing area above the PCB jointed board, a plurality of ball-planting plates 10 which are in one-to-one correspondence with the positions of the first through holes are arranged in a ball-planting area above the PCB jointed board, a plurality of solder balls are arranged on the ball-planting plates to pass through and slide down to the second through holes 13 on the PCB jointed board, the plurality of second through holes are arranged in an array arrangement mode, the soldering flux ball steel sheets are identical to the size specification of the ball-planting steel sheets, the ball-planting area corresponds to the position of the solder paste area and the size of the solder paste area is identical to the size of the first through holes, the solder paste balls are slightly arranged in the ball-planting area, and then the solder balls are slid down to the solder ball-planting area when the solder balls are placed on the solder balls through the first through holes and the solder ball-planting plate is slightly corresponding to the solder ball-planting steel sheets, and the solder balls are placed on the solder ball steel sheet.
Specifically, the jacking mechanism adopts a jacking air cylinder 11, a jacking plate 12 is arranged at the extending end of the jacking air cylinder, four jacking columns 2 are arranged on the jacking plate, the upper ends of the jacking columns penetrate through a bottom plate of a jig and a bearing substrate of a clamp and then are contacted with a soldering flux steel sheet or a ball-planting steel sheet, the distance between the soldering flux steel sheet brushing the surface of a PCB jointed board and the surface of the PCB jointed board can be controlled within +/-0.03mm through the jacking columns, the consistency of the soldering flux is ensured, the distance between the ball-planting steel sheet and the surface of the PCB is controlled within 0.25+/-0.03mm, the solder balls can be accurately slid into a solder paste area of the PCB jointed board and cannot be tilted, redundant solder balls are poured out, and a starting key of the jacking mechanism is pressed down, so that the solder balls are prevented from being carried by the steel sheet in the separation process of the ball-planting steel sheet and the bearing substrate of the clamp by adopting pneumatic design, and the accuracy of ball-planting is ensured.
In summary, the ball-planting clamp capable of splicing plates greatly improves the ball-planting efficiency and ensures that the precision of ball-planting of the spliced plates is the same as that of single-plate balls; the operation is simple, the ball planting efficiency can be improved by several times, the production efficiency can be greatly improved, and the production cost is reduced for companies.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related arts are included in the scope of the present utility model.
Claims (10)
1. Ball-planting clamp capable of splicing plates is characterized by comprising: the jig comprises a machine table, a jacking mechanism arranged in the machine table, a jig bottom plate arranged on the machine table, a clamp bearing substrate, a PCB jointed board, soldering flux steel sheets and ball planting steel sheets, wherein positioning blocks are respectively arranged on four corners of the jig bottom plate, a positioning area for placing the clamp bearing substrate is formed by surrounding the four positioning blocks, a cavity for placing the PCB jointed board is formed by downwards sinking the middle part of the clamp bearing substrate, a plurality of first through holes for soldering paste to pass through the PCB jointed board are formed in a soldering paste brushing area of the soldering flux steel sheets above the PCB jointed board, a plurality of ball planting plates corresponding to the first through holes in one-to-one mode are arranged in a ball planting area above the PCB jointed board on the ball planting steel sheets, and a plurality of second through holes for solder balls to pass through and slide onto the PCB jointed board.
2. The ball mounting fixture for a jigsaw according to claim 1, wherein said ball mounting plate has the same dimensions as said first through hole.
3. The ball planting clamp capable of being spliced according to claim 2, wherein a plurality of second through holes for the solder balls to pass through are arranged on each ball planting plate in an array manner.
4. A jig for a ball attachment for a jigsaw according to claim 3, wherein the diameter of the second through hole is slightly larger than the diameter of the solder ball.
5. The ball planting clamp capable of being spliced according to claim 1, wherein the jacking mechanism adopts a jacking cylinder, a jacking plate is arranged at the extending end of the jacking cylinder, and four jacking posts are arranged on the jacking plate.
6. The ball mounting fixture for the jigsaw according to claim 5, wherein the upper end of the top post is contacted with the soldering paste steel sheet or the ball mounting steel sheet after penetrating through the fixture bottom plate and the fixture bearing substrate.
7. The jig for ball placement of a jigsaw according to claim 1, wherein said locating block has an "L" configuration.
8. The ball mounting fixture for the jigsaw of claim 1, wherein the fixture base plate is secured to the machine by bolts.
9. The jig for ball placement of a jigsaw according to claim 1, wherein the flux paste steel sheet is the same size as the ball placement steel sheet.
10. The jig for placement of a jigsaw according to claim 1, wherein the placement area corresponds to the solder paste area and has the same dimensions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320329936.3U CN219999690U (en) | 2023-02-28 | 2023-02-28 | Ball planting clamp capable of splicing plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320329936.3U CN219999690U (en) | 2023-02-28 | 2023-02-28 | Ball planting clamp capable of splicing plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219999690U true CN219999690U (en) | 2023-11-10 |
Family
ID=88610784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320329936.3U Active CN219999690U (en) | 2023-02-28 | 2023-02-28 | Ball planting clamp capable of splicing plates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219999690U (en) |
-
2023
- 2023-02-28 CN CN202320329936.3U patent/CN219999690U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN219999690U (en) | Ball planting clamp capable of splicing plates | |
| CN103635034A (en) | BGA (ball grid array) chip bonding pad printing solder paste positioning jig | |
| KR101321190B1 (en) | Folded frame carrier for mosfet bga | |
| CN116249268A (en) | Ball planting clamp capable of splicing plates | |
| CN1259268A (en) | Fine pitch component placement method and apparatus | |
| CN212161854U (en) | Reflow soldering jig device for flexible transparent display screen | |
| CN114698265A (en) | Method and device for controlling verticality between micro-reed plates | |
| CN209766298U (en) | Pressing-down assembling device for automatic keyboard assembling equipment | |
| CN213026054U (en) | High-speed transmission line positioning jig | |
| CN210210098U (en) | Auxiliary material tool is pasted to five metals cell-phone center | |
| CN210413567U (en) | Clamp for drilling of nut gasket of supporting plate | |
| CN210225899U (en) | FPC board laminating tool | |
| CN216387112U (en) | High-speed transmission line positioning jig | |
| CN217224180U (en) | High-speed transmission line positioning jig | |
| CN214481507U (en) | Material crimping tool | |
| CN217849798U (en) | Manual PIN pressing machine | |
| CN213497033U (en) | Whole board pencil welding frock of PCB | |
| CN209420046U (en) | Flexible circuit board pad load mould device | |
| CN219837361U (en) | Positioning welding device for lifting lug of standard section | |
| CN215601571U (en) | Positioning jig for welding circuit board | |
| CN219485469U (en) | Central positioning device for producing and processing circular soft magnetic material | |
| CN218983494U (en) | Module once welding tool | |
| CN220313554U (en) | Rigid-flex PCB circuit board drilling device | |
| CN219917096U (en) | Frock for bonding machine | |
| CN220439452U (en) | Terminal pressing jig for membrane switch |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |