CN116600469A - Printed circuit board with soldered electronic components - Google Patents
Printed circuit board with soldered electronic components Download PDFInfo
- Publication number
- CN116600469A CN116600469A CN202310871496.9A CN202310871496A CN116600469A CN 116600469 A CN116600469 A CN 116600469A CN 202310871496 A CN202310871496 A CN 202310871496A CN 116600469 A CN116600469 A CN 116600469A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- hole
- welding
- columnar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 claims abstract description 69
- 230000005489 elastic deformation Effects 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000005452 bending Methods 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims description 104
- 210000000078 claw Anatomy 0.000 claims description 61
- 238000005476 soldering Methods 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 15
- 239000000463 material Substances 0.000 description 10
- 239000013013 elastic material Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a printed circuit board welded with electronic components, comprising: the printed circuit board comprises a printed circuit board body, wherein mounting holes which are arranged in an array manner are processed on the printed circuit board body, and terminal components with inner holes are constructed at each mounting hole; a columnar connecting member having a first welded joint, a second welded joint, and an elastic deformation portion interposed between the first welded joint and the second welded joint and capable of expanding and contracting in the axial direction and bending in the horizontal direction; the columnar connecting parts are in one-to-one correspondence with the terminal parts, each columnar connecting part extends to the inner hole, the first welding joint part is welded to the terminal part, and the second welding joint part protrudes out of the upper surface of the printed circuit board body; the electronic element comprises a functional unit and a packaging part coated outside the functional unit, wherein the packaging part is provided with a substrate plane, and the substrate plane is provided with bonding pads arranged in an array; the bonding pads are correspondingly welded to the second welding joints.
Description
Technical Field
The invention relates to the technical field of electronic component installation, in particular to a printed circuit board welded with an electronic component.
Background
As is well known, ball Grid Array (BGA) packaging technology is a surface mount technology applied to an integrated circuit, specifically, an Array of pads (which serve as terminals for electrical connection) is disposed on a substrate plane of an electronic component having a functional unit (e.g., a processor chip, a memory chip) packaged therein, and a corresponding Array of pads is also disposed on a printed circuit board body, such that, when the electronic component is mounted on the printed circuit board body, solder balls are disposed between each pad on the substrate plane and each pad on the printed circuit board body, and the solder balls are easily arranged in an Array, and the electronic component in this state is melted by heating the electronic component and the printed circuit board body, and finally soldered on the printed circuit board body by subsequent cooling (i.e., the electronic component and the printed circuit board body are soldered by solder balls using a reflow process). Because the ball grid array packaging technology utilizes the whole substrate plane of the electronic component to be electrically connected with the printed circuit board body, compared with the traditional electrical connection mode utilizing the edge of the electronic component and the printed circuit board body, the substrate plane of the electronic component has more area capable of being electrically connected, so that more electrical connection points (such as bonding pads and pins) can be arranged.
It is inevitable that the printed circuit board on which the electronic component is soldered exists in an alternate cold and hot running environment, and because the electronic component is different from the printed circuit board body in material, structure and size, the amount and direction of elastic deformation in response to temperature change are inconsistent, and thus, the solder joint (the position where the solder ball is located) between the electronic component and the printed circuit board body is easily broken, thereby causing electrical disconnection. Specifically, when the temperature is changed, the electronic element and the printed circuit board body have different elastic deformation amounts in the horizontal direction, so that the solder of the welding spot is easily broken due to the shearing force; and because of the different deflection of the electronic component and the printed circuit board body, certain solder joints are subjected to large tensile forces which tend to cause solder to separate from the solder pads of the electronic component or from the solder pads of the base plane of the electronic component.
For the operation environment with a large temperature variation range and/or a high temperature variation frequency, in order to reduce the probability of breaking a welding spot between an electronic element and a printed circuit board body, a structure for welding the electronic element on the printed circuit board body is provided in the prior art, specifically, a wire configured in a bent shape is utilized to be connected between each welding disc of a base plane of the electronic element and a corresponding welding disc of the printed circuit board body, so that the electronic element and the printed circuit board body are electrically connected, specifically, the lower end of the wire is welded on the welding disc of the printed circuit board body, and the upper end of the wire is welded on the welding disc of the base plane of the electronic element, thereby realizing the electrical connection. Further, the periphery of each wire is coated with an elastic material (such as a resin material with a certain elastic deformation characteristic) for supporting the electronic component, so that the shearing force and the tensile force at the welding position can be effectively reduced through the compliant transverse deformation and the vertical deformation of the elastic material, and the fracture probability of the welding point can be reduced to a certain extent.
However, the structure for soldering electronic components to a printed circuit board body provided in the prior art has the following drawbacks:
1. since the linear wires (which are elongated) are soldered to the pads through their end points, after the first end points (e.g., lower ends) of all the wires are soldered to the pads, respectively, the wires are likely to fail to attain a uniform posture, for example, for the helical wires, after the first end is soldered, some of the wires can be in a state where their axes are perpendicular to the pads, while other wires can fail to be in a state where their axes are perpendicular to the pads, and further, since after the first end points of the wires are soldered, it is then necessary to perform a process of wrapping an elastic material around the wires and curing for positioning the wires, so that the second end points (e.g., upper ends) of the wires may be misaligned with the pads in the axial direction, which is very unfavorable for attaining a uniform soldering strength of the pads of the electronic component and the second end points of the wires, even resulting in some of the lower height may not be soldered effectively, and those end points that are misaligned may be soldered to the edges of the pads.
2. After the first ends of all the wires are spot-welded, a paste-like curable material is required to be provided to all the wires, then the curable material is required to be cured to obtain an elastic material for supporting, and the second ends of the wires are required to extend out of the cured elastic material for welding, and the second ends are required to be extended out as much as possible to ensure uniform welding strength, and the form of the elastic material is required to be uniform for ensuring uniform supporting strength and compliance as much as possible, which results in excessively complex process flow, and uniformity of the welding effect of electronic components on the printed circuit board after welding is difficult to be ensured.
3. The elastic material is interposed between the pads of the electronic component and the pads of the printed circuit board body, and in order to be able to provide a sufficient compliance in the vertical direction, limited by the maximum deformation amount of the material, the elastic material needs to have a large size in the vertical direction, which results in the possibility of an excessive mounting distance between the electronic component and the printed circuit board body.
Disclosure of Invention
In view of the above technical problems in the prior art, embodiments of the present invention provide a printed circuit board with soldered electronic components.
In order to solve the technical problems, the technical scheme adopted by the embodiment of the invention is as follows:
a printed circuit board having electronic components soldered thereto, comprising:
the printed circuit board comprises a printed circuit board body, wherein the printed circuit board body is provided with mounting holes which are arranged in an array, and each mounting hole is provided with a terminal part which is adapted to the mounting hole and at least provided with an inner hole;
a columnar connecting member having a first welded joint portion located at a lower end, a second welded joint portion located at an upper end, and an elastic deformation portion interposed between the first welded joint portion and the second welded joint portion, the elastic deformation portion being capable of expanding and contracting in an axial direction and bending in a horizontal direction; the columnar connecting parts are in one-to-one correspondence with the terminal parts, each columnar connecting part extends to the inner hole, the first welding joint part is welded to the terminal part, and the second welding joint part protrudes out of the upper surface of the printed circuit board body;
the electronic element comprises a functional unit and a packaging part coated outside the functional unit, wherein the packaging part is provided with a substrate plane, and bonding pads which are arranged in an array mode and are in one-to-one correspondence with the columnar connecting parts are arranged on the substrate plane; the pads are correspondingly welded to the second welding joints.
Preferably, the inner bore comprises a cylindrical bore at a lower portion and a tapered bore at an upper portion; the elastic deformation part comprises a vertical movement elastic compliance section positioned at the lower part and a horizontal swing elastic compliance section positioned at the upper part; the vertical movement elastic compliance section corresponds to the cylindrical hole, and the horizontal movement elastic compliance section corresponds to the conical hole.
Preferably, the vertically movable elastic compliant section is a spirally extending spring structure formed by engraving spiral grooves on a columnar body; the yaw elastic compliance section comprises at least two pairs of radial grooves which are axially arranged, and each pair of radial grooves is formed by symmetrically engraving radially inwards on a columnar entity; every two adjacent pairs of radial slots are circumferentially offset.
Preferably, the terminal part includes an upper ring plate located at an upper surface of the printed circuit board body and a lower ring plate located at a lower surface of the printed circuit board body; the inner hole of the terminal part is a through hole, and the hole wall of the inner hole is connected to the upper ring plate and the lower ring plate; wherein:
the columnar connecting part penetrates through the inner hole, and the first welding joint part is positioned below the lower annular plate;
the first welding joint part comprises a plurality of welding legs which are circumferentially arranged at intervals, each welding leg is provided with an upward stepped surface, and the stepped surfaces of the welding legs are flush and are used for being abutted against the plate surface of the lower annular plate;
the solder fillets are enveloped into a containing cavity which is positioned in the middle area and used for containing soldering paste;
after the printed circuit board body and the columnar connection member are placed in an inverted state, at least part of the solder paste in the receiving chamber is caused to flow toward a space between each adjacent two of the fillets by heating to solder the fillets to the lower ring plate upon cooling.
Preferably, a columnar matching part for matching with the inner hole is arranged between the elastic deformation part and the first welding joint part; conical surfaces are formed on the surfaces of the columnar matching parts corresponding to the gaps between every two adjacent welding legs; the conical surface and the hole wall of the inner hole enclose a wedge-shaped gap, and when heating, part of solder paste in the containing cavity flows to the wedge-shaped gap so that the lower part of the columnar matching part is welded to the hole wall of the inner hole.
Preferably, the second welding joint is a first claw portion; the first claw part comprises a plurality of first welding claws which are circumferentially arranged; the plurality of first welding claws enclose a first cavity positioned at the inner side in the axial direction and a first concave part positioned at the outer side in the axial direction; wherein:
the first concave part is used for receiving a solder ball, after a bonding pad on the substrate plane of the electronic element is lapped on the solder ball, the solder ball is melted and deformed by heating to partially enter the first cavity so as to cover the first bonding claw, and the first bonding claw is bonded to the bonding pad by cooling.
Preferably, the mounting hole is a blind hole, and the inner hole of the terminal part is a blind hole matched with the mounting hole; the terminal component comprises an upper ring plate positioned on the upper surface of the printed circuit board body, and the hole wall of the inner hole is connected to the upper ring plate; wherein:
the first welding joint part is a second claw part; the second claw part comprises a plurality of second welding claws which are circumferentially arranged; the plurality of second welding claws enclose a second cavity positioned at the inner side in the axial direction and a second concave part positioned at the outer side in the axial direction;
after the solder balls are put into the inner holes and the second claw portions are inserted into the hole bottoms of the inner holes, the solder balls are melted by heating and partially enter the second cavities to cover the second solder claws, and the second solder claws are welded to the hole bottoms of the inner holes by cooling.
Preferably, the cavity bottom of the accommodating cavity is provided with a raised part with a low middle high edge.
Preferably, the center of the elastic deformation portion of the columnar connection member is provided with a core hole.
Preferably, the columnar connecting part is integrally formed by a copper metal columnar blank.
Compared with the prior art, the printed circuit board welded with the electronic element has the beneficial effects that:
1. the invention welds the electronic element on the printed circuit board body by utilizing the columnar connecting parts which are arranged in a matrix, and the columnar connecting parts not only realize the electric connection between the electronic element and the integrated circuit in the printed circuit board, but also can carry out the compliance support on the electronic element so as to avoid the occurrence of solder fracture.
2. The columnar connecting parts are used as mechanical and electric connecting parts, so that the process of welding the electronic element on the printed circuit board body becomes simple, and the welding strength of the welding spots arranged in an array tends to be consistent.
3. The technical scheme disclosed by the invention enables the electronic element to be mounted with a smaller distance from the printed circuit board body.
Drawings
Fig. 1 is a schematic perspective view of a printed circuit board body equipped with a columnar connection member according to the present invention.
Fig. 2 is an enlarged view of a portion a of fig. 1.
Fig. 3 is a schematic perspective view of a columnar connection member according to a preferred embodiment of the present invention.
Fig. 4 is a schematic perspective view showing another view of the columnar connection member according to a preferred embodiment of the present invention.
Fig. 5 is a front cross-sectional view of an electronic component and a printed circuit board body in a soldered state according to a preferred embodiment of the present invention.
Fig. 6 is a state view showing a soldering process of an electronic component and a printed circuit board body according to a preferred embodiment of the present invention.
Fig. 7 is another state view of the soldering process of the electronic component and the printed circuit board body according to a preferred embodiment of the present invention.
Fig. 8 is a further state view of a soldering process of an electronic component with a printed circuit board body according to a preferred embodiment of the present invention.
Fig. 9 is a schematic perspective view showing a view angle of a columnar connection member according to another preferred embodiment of the present invention.
Fig. 10 is a schematic perspective view showing another view of a columnar connection member according to another preferred embodiment of the present invention.
Fig. 11 is a front cross-sectional view of an electronic component and a printed circuit board body in a soldered state according to another preferred embodiment of the present invention.
Fig. 12 is a state view showing a soldering process of an electronic component and a printed circuit board body according to another preferred embodiment of the present invention.
In the figure:
100-columnar connection members; 10-a first welded joint; 11-welding feet; 111-step surface; 12-void; 13-a receiving cavity; 131-bump; 14-conical surface; 141-wedge shaped slits; 15-a second jaw portion; 151-second welding claws; 152-a second cavity; 153-second inner recess; 20-a second welded joint; 21-a first jaw portion; 211-a first welding claw; 212-a first cavity; 213-a first recess; 30-an elastic deformation portion; 31-vertically moving the resilient compliant segment; 311-spiral groove; 32-yaw resilient compliant segment; 321-radial slots; 40-columnar fitting portions; 50-core holes; 200-an electronic component; 201-a functional unit; 202-packaging the component; 203-a substrate plane; 204-bonding pads; 300-a printed circuit board body; 301-mounting holes; 400-terminal parts; 401-inner hole; 4011-cylindrical holes; 4012-tapered holes; 402-upper ring plate; 403-lower ring plate; 500-solder balls; 600-solder; 700-soldering paste.
Detailed Description
The present invention will be described in detail below with reference to the drawings and detailed description to enable those skilled in the art to better understand the technical scheme of the present invention.
The embodiment of the invention discloses a printed circuit board with electronic components 200 soldered thereon, which is particularly suitable for operation in an environment with a large temperature variation range and a high temperature variation frequency, and in the operating environment, the printed circuit board provided by the invention has lower probability of solder joint fracture.
As shown in fig. 5 and 11, the printed circuit board includes a printed circuit board body 300, an electronic component 200, a columnar connection member 100, and materials required for soldering.
The printed circuit board body 300 is processed with mounting holes 301 arranged in an array, and the mounting holes 301 penetrate at least through the upper surface of the printed circuit board body 300, terminal members 400 are arranged at each mounting hole 301, the terminal members 400 are adapted to the mounting holes 301 to form inner holes 401, and the terminal members 400 are electrically connected in an integrated circuit of the printed circuit board body 300 for electrical connection with the electronic component 200, preferably, copper materials are plated at the mounting holes 301 by an electroplating process to form the terminal members 400. Thus, as shown in fig. 2 in combination with fig. 1, the terminal members 400 arranged in an array are formed on the printed circuit board body 300 for making electrical connection with the electronic components 200 in an array arrangement.
The electronic component 200 specifically includes a functional unit 201 and a packaging member 202 (material) wrapped around the periphery of the functional unit 201 for packaging the functional unit 201, the functional unit 201 may be a semiconductor member such as a processor chip, a memory chip, or the like, the functional unit 201 generally has a plate-like outline structure, the outline of the packaging member 202 is adapted to the outline of the functional unit 201, and the bottom of the packaging member 202 is configured as a flat base plane 203.
A plurality of pads 204 arranged in an array are disposed on the base plane 203, the pads 204 are electrically connected with the functional units 201, the pads 204 arranged in an array are in one-to-one correspondence with the terminal members 400 arranged in an array on the printed circuit board body 300, and the functional units 201 are electrically connected to the integrated circuits of the printed circuit board body 300 by covering the electronic components 200 above the printed circuit board body 300 and electrically connecting the pads 204 in one-to-one correspondence with the terminal members 400, so as to be used for realizing functions of the functional units 201, such as for processing data and for storing data.
In the present invention, a columnar connection member 100 is provided between each of the terminal members 400 and the pads 204, and the columnar connection member 100 is used to electrically connect the pads 204 and the terminal members 400 and also to support the electronic component 200.
As shown in fig. 5 and 11, in combination with fig. 1 and 2, the columnar connection member 100 includes a first welded joint 10 at a lower end in an axial direction, a second welded joint 20 at an upper end in the axial direction, and an elastic deformation portion 30 interposed between the first welded joint 10 and the second welded joint 20. In soldering the electronic component 200 to the printed circuit board body 300, the elastic deformation portion 30 of the columnar connection member 100 is made to be substantially located in the inner hole 401, the first solder joint 10 is soldered to the terminal member 400 by a soldering process, and the second solder joint 20 is made to protrude from the upper surface of the printed circuit board body 300, and the second solder joint 20 is made to be soldered to the land 204 of the base plane 203 of the electronic component 200 by a soldering process, so that the columnar connection member 100 makes the land 204 electrically connected to the terminal member 400 and supports the electronic component 200.
In the present invention, the elastic deformation portion 30 of the columnar connection member 100 is configured to be elastically deformable in both of the axial direction and the horizontal direction, specifically, the elastic deformation portion 30 includes a vertically movable elastic compliant section 31 at the lower portion and a horizontally movable elastic compliant section 32 at the upper portion, so that the vertically movable elastic compliant section 31 is characterized by being axially elastically deformable and the horizontally movable elastic compliant section 32 is characterized by being elastically deformable, and thus, the axial expansion and contraction of the columnar connection member 100 is mainly provided by the vertically movable elastic compliant section 31 and the bending deformation of the columnar connection member 100 is mainly provided by the horizontally movable elastic compliant section 32.
In the present invention, as shown in fig. 5 and 11, the inner hole 401 of the terminal member 400 is constructed as the following structural features: such that the inner bore 401 includes a cylindrical bore 4011 at a lower portion and a tapered bore 4012 at an upper portion; the yaw resilient compliant section 32 of the columnar connection member 100 is substantially located in the tapered hole 4012, and the lower portion of the vertical movement resilient compliant section 31 of the columnar connection member 100 is located at least in the cylindrical hole 4011, and the tapered hole 4012 is used for avoiding restriction of the yaw resilient compliant section 32 by the terminal member 400 when undergoing bending deformation, and the cylindrical hole 4011 is used for positioning the vertical movement resilient compliant section 31 of the columnar connection member 100, thereby realizing positioning of the columnar connection member 100, facilitating that the columnar connection portion is kept in a vertical state after being welded with the terminal member 400 of the printed circuit board body 300, and further enabling that the columnar connection member 100 obtains a uniform spatial posture, thereby facilitating that a uniform welding strength of the array-arranged pads 204 of the electronic component 200 and the second welding joint 20 of the columnar connection member 100 is obtained. Preferably, a cylindrical fitting portion 40 is formed between the elastic deformation portion 30 and the first solder joint portion 10, and the cylindrical fitting portion 40 is in a smaller clearance fit and interference fit with the cylindrical hole 4011 of the inner hole 401, thereby more advantageously maintaining the cylindrical connection portion in a more rigid vertical state after soldering with the terminal member 400 of the printed circuit board body 300.
After the first and second solder joints 10 and 20 of the columnar connection portions are correspondingly connected to the array-arranged terminal members 400 of the printed circuit board body 300 and the array-arranged pads 204 of the base plane 203 of the electronic component 200, the electronic component 200 is soldered to the printed circuit board body 300. If the temperature change causes the elastic deformation of the electronic component 200 and the printed circuit board body 300 in the horizontal direction to be different, the yaw elastic compliance section 32 of the columnar connection member 100 performs compliant bending deformation, so as to avoid the solder at the welding position from breaking due to the generation of excessive shearing force, and if the temperature change causes the different deflection deformation of the electronic component 200 and the printed circuit board body 300 to cause the increase of the distance between the electronic component 200 and the printed circuit board body 300 in a certain area, the vertical movement elastic compliance section 31 of the columnar connection member 100 performs compliant stretching deformation, so as to avoid the solder at the welding position from being separated from the electronic component 200 or the printed circuit board body 300 due to the excessive tensile force.
The advantage of the columnar connection member 100 is also, inter alia:
1. the columnar connection member 100 has both an electrical connection and a mechanical support function.
2. The columnar connection member 100 facilitates the welding as compared to a linear wire and is advantageous in obtaining a consistent welding effect.
3. The elastic deformation portion 30 of the columnar connection member 100 for providing the expansion and contraction variation and the bending deformation is located in the inner hole 401 of the terminal member 400, so that a small mounting gap between the electronic component 200 and the printed circuit board body 300 can be obtained while providing a sufficient compliance
In some preferred embodiments, as shown in fig. 3, 4, 9, 10, and in combination with fig. 5 and 11, the erectable resilient compliant segment 31 and the yaw resilient compliant segment 32 of the columnar connecting member 100 are configured as follows:
the vertically movable resilient compliant segment 31 is configured as a helically extending spring structure such that the vertically movable resilient compliant segment 31 has the ability to axially expand and contract. The spring structure may be formed by engraving a spiral groove 311 in a columnar body using a laser cutting (engraving) machine.
The yaw resilient compliance section 32 includes two pairs of radial slots 321 arranged along the axial direction, each pair of radial slots 321 is symmetrically arranged, and the two pairs of radial slots 321 have a dislocation included angle of 90 degrees in the circumferential direction, so that the yaw resilient compliance section 32 has the capability of transverse bending. Each pair of radial slots 321 may be symmetrically engraved radially inward on the columnar body using a laser cutting (engraving) machine.
In some preferred embodiments, as shown in fig. 5 and 11, a core hole 50 is formed in the elastic deformation portion 30 of the cylindrical connecting member 100, and the core hole 50 is used to improve stress concentration in the elastic deformation portion 30 when deformed, and the core hole 50 is used to form a machining interface to facilitate machining of the spiral groove 311 and the radial groove 321. Preferably, the core hole 50 may be opened downward from the upper end of the column-shaped connection member 100.
In a preferred embodiment of the present invention, as shown in fig. 3 and 4, the first and second welding joints 10 and 20 of the columnar connection member 100 are configured as follows.
The first welding joint 10 comprises a plurality of welding legs 11 which are circumferentially arranged at intervals, each welding leg 11 is provided with an upward stepped surface 111, and the stepped surfaces 111 of the welding legs 11 are flush; a plurality of fillets 11 are enveloped into a receiving cavity 13 at a central region for receiving solder paste 700; further, the surface of the columnar matching portion 40 corresponding to the gap 12 between every two adjacent fillets 11 is provided with a conical surface 14, and the conical surface 14 and the gap 12 between the two corresponding fillets 11 can be integrally engraved by a laser engraving machine.
As shown in fig. 5, the structure of the mounting hole 301 of the printed circuit board body 300 and the terminal member 400 fitted to the mounting hole 301 is configured such that: the mounting hole 301 is processed into a through hole, the terminal member 400 includes an upper ring plate 402 on the upper surface of the printed circuit board body 300, a lower ring plate 403 on the lower surface of the printed circuit board body 300, which are obtained by plating, the inner hole 401 of the terminal member 400 is configured into a through hole adapted to the mounting hole 301, so that the walls of the inner hole 401 are connected to the upper ring plate 402 and the lower ring plate 403, respectively
The second welding joint 20 is configured in a claw-like structure, which may be referred to as a first claw portion 21, and the first claw portion 21 includes a plurality of welding claws arranged circumferentially, which may be referred to as a first welding claw 211; the plurality of first welding claws 211 define a cavity located at the inner side in the axial direction and an inner concave portion located at the outer side in the axial direction, and the cavity may be referred to as a first cavity 212 and the inner concave portion may be referred to as a first inner concave portion 213.
The specific process of soldering the electronic component 200 to the printed circuit board body 300 using the columnar connection member 100 having the first and second solder joints 10 and 20 of the above-described structure is as follows:
first, as shown in fig. 6, the printed circuit board body 300 is inverted, and then, the columnar connection members 100 are correspondingly inserted through the inner holes 401 of the terminal member 400 in an inverted manner, and the stepped surfaces 111 at the fillets 11 of the first solder joints 10 of each columnar connection member 100 are abutted against the lower ring plates 403 of the terminal member 400, so that the stepped surfaces 111 of all the columnar connection members 100 can be synchronously pressed against the first solder joints 10 of all the columnar connection members 100 by the plate-like members, thereby not only facilitating the achievement of a uniform protrusion amount of the second solder joints 20 of the columnar connection members 100 from the upper surface of the printed circuit board body 300, but also facilitating the soldering of the first solder joints, and in this case, the tapered surfaces 14 and the walls of the inner holes 401 enclose the wedge-shaped slits 141.
After the step surfaces 111 of the fillets 11 of the first bonding portions of all the columnar connection members 100 are bonded to the lower ring plate 403 of the terminal member 400, the receiving cavities 13 enveloped by the fillets 11 of each first solder bonding portion 10 are filled with the solder paste 700, and for example, the receiving cavities 13 of all the columnar connection members 100 may be simultaneously filled with the solder paste 700 using the nozzles arranged in an array.
After the solder paste 700 is filled, the above-described state of the component may be heated by a reflow process and cooled after heating, in which, as shown in fig. 7, the solder paste 700 is melted to flow to the gap 12 between the solder legs 11 and the wedge-shaped gap 141 defined by the tapered surface 14 and the wall of the inner hole 401, and solidified solder 600 is formed in these two regions by cooling, so that the solder legs 11 are welded to the lower ring plate 403 of the terminal component 400, and the lower portion of the columnar fitting portion 40 is welded to the wall of the inner hole 401 of the terminal component 400, thereby welding the first solder joint portion 10 to the terminal component 400. In some preferred structures, the cavity bottom of the receiving cavity 13 is higher than the stepped surface 111 and the wedge-shaped slit 141 in the inverted reference state, and the cavity bottom is configured with the raised portion 131 having the middle high edge low, so that, upon heating, the melted solder paste 700 automatically flows toward the gap 12 between the fillets 11 and the wedge-shaped slit 141, and the solder paste 700 does not substantially remain in the receiving cavity 13.
After the first solder joint portions 10 of the columnar connection members 100 are soldered to the terminal members 400, the printed circuit board body 300 is turned over so that the printed circuit board body 300 is placed in the normal position, and at this time, the first claw portions 21 (second solder joint portions 20) of all the columnar connection portions arranged in an array protrude uniformly from the upper surface of the printed circuit board body 300.
After the printed circuit board body 300 is set up, as shown in fig. 8, solder balls 500 are placed on the first concave portions 213 of the first claw portions 21 of all the columnar connection portions, for example, solder balls 500 may be placed on the first concave portions 213 of all the first claw portions 21 at the same time by a ball-throwing device arranged in an array.
After the solder balls 500 are placed on the first claw portions 21, the electronic component 200 is disposed above the printed circuit board body 300, the array-arranged pads 204 of the base plane 203 are made to correspond one-to-one to the array-arranged solder balls 500, and then the electronic component 200 is placed on the array-arranged solder balls 500, so that each solder ball 500 is located between a pad 204 and the second solder joint portion 20 as shown in fig. 8.
Then, the electronic component 200 and the printed circuit board body 300 in the above-described state are heated, specifically, the layered region where the solder pad 204 and the first claw portion 21 are located is heated, so that the solder ball 500 is melted, the solder ball 500 partially enters into the first cavity 212, and the solidified solder 600 is formed by subsequently cooling it, and at this time the first claw portion 211 is covered with the solder 600, so that the first claw portion 21 (i.e., the first solder joint portion 10) is soldered to the solder pad 204, thereby soldering the electronic component 200 to the printed circuit board body 300.
The columnar connection member 100 of the present embodiment having the first and second solder joints 10 and 20 of the above-described structure is particularly suitable for soldering the electronic component 200 to the printed circuit board body 300 having a small thickness.
The first solder joint 10 of the above-described structure is convenient for receiving the solder paste 700 by having the receiving cavity 13, and the solder paste 700 flows to the space 12 between the fillets 11 and solidifies by cooling after heating, thereby soldering the first joint to the lower ring plate 403 of the terminal member 400.
The second solder joint portion 20, i.e., the first claw portion 21, of the above-described structure facilitates uniform arrangement of the solder balls 500, and the post-heating cooling causes the solder balls 500 to be melted and then cooled to cover the first solder claws 211, thereby firmly soldering the upper ends of the columnar connection members 100 to the pads 204 of the base plane 203 of the electronic component 200.
In another preferred embodiment of the present invention, as shown in fig. 9 and 10, the second welded joint 20 of the columnar connecting member 100 is identical in structure and size to the second welded joint 20 of the columnar connecting member 100 in the above embodiment, the first welded joint 10 of the columnar connecting member 100 in the present embodiment is configured to be identical in structure to the second welded joint, and its radial size is required to be adapted to the inner hole 401 of the terminal member 400, that is, the first welded joint 10 of the columnar connecting member 100 in the present embodiment is also configured to be a claw-like structure, which may be referred to as a second claw portion 15, the second claw portion 15 including a plurality of second welded claws 151 arranged circumferentially; the plurality of second welding claws 151 enclose a second cavity 152 located at an inner side in the axial direction and a second concave portion 153 located at an outer side in the axial direction.
In the present embodiment, as shown in fig. 11, the mounting hole 301 of the printed circuit board body 300 is configured as a blind hole, that is, the mounting hole 301 is processed to a certain depth without penetrating to the lower surface of the printed circuit board body 300, and the inner hole 401 of the terminal member 400 is a blind hole adapted to the mounting hole 301, as appropriate; the terminal part 400 includes an upper ring plate 402 located on the upper surface of the printed circuit board body 300, and the hole wall of the inner hole 401 is connected to the upper ring plate 402.
The specific process of soldering the electronic component 200 to the printed circuit board body 300 using the columnar connection member 100 having the first and second solder joints 10 and 20 of the above-described structure is as follows:
as shown in fig. 12, solder balls 500 are put into the inner holes 401 of all the terminal members 400 of the printed circuit board body 300, for example, solder balls 500 may be put into the inner holes 401 of all the terminal members 400 simultaneously by a ball-throwing device arranged in an array. Then, the lower ends of all the columnar connection members 100 are inserted into the inner holes 401 of the terminal member 400, and the second claw portions 15 (the first solder joints 10) can be pressed against the solder balls 500 by pressing the plate-like members against the upper ends of all the columnar connection members 100 at the same time. At this time, the first claw portions 21 (the second solder joint portions 20) of the columnar connection members 100 protrude consistently from the upper surface of the printed circuit board body 300.
As shown in fig. 12, solder balls 500 are placed to the first claw portions 21 of the upper ends of all the columnar connection members 100, and then the electronic component 200 is placed on the columnar connection members 100, so that the solder balls 500 are provided between the first claw portions 21 and the bottoms of the inner holes 401 of the terminal members 400, and the solder balls 500 are provided between the pads 204 of the base plane 203 and the first claw portions 21.
The layered region where the second claw portion 15 and the hole bottom are located and the layered region where the first claw portion 21 and the land 204 are located are heated to melt the solder balls 500 so that the lower solder balls 500 partially enter the second cavity 152 of the second claw portion 15, the upper solder balls 500 partially enter the first cavity 212 of the first claw portion 21, and the solidified solder 600 is formed by subsequently cooling them, so that the second solder claws 151 of the second claw portion 15 and the first solder claws 211 of the first claw portion 21 are covered with the solder 600 of the corresponding solder balls 500, and thus the second claw portion 15 and the first claw portion 21 are simultaneously soldered to the hole bottom of the terminal member 400 and the land 204 of the base plane 203, respectively, so that the lower and upper ends of the columnar connection member 100 are soldered to the printed circuit board body 300 and the electronic component 200 at the same time.
The columnar connection member 100 of the present embodiment having the first and second solder joints 10 and 20 of the above-described structure is particularly suitable for soldering the electronic component 200 to the printed circuit board body 300 having a large thickness.
The columnar connection member 100 having the above-described structure can be soldered to the printed circuit board body 300 by one-time heat soldering, and the soldering process is simple.
The columnar connecting member 100 of the above structure provided by the present invention may be integrally formed by a columnar blank of copper metal using a laser cutting (engraving) machine, the copper material may be a copper-based high-conductivity elastic alloy such as CuNiSn-based alloy, cuNiA 1-based alloy, or the like, and the first welded joint 10, the second welded joint 20, and the elastic deformation 30 of the columnar connecting member 100 may be obtained by engraving the columnar blank to remove the material and applying bending.
The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, the scope of which is defined by the claims. Various modifications and equivalent arrangements of this invention will occur to those skilled in the art, and are intended to be within the spirit and scope of the invention.
Claims (10)
1. A printed circuit board having electronic components soldered thereto, comprising:
the printed circuit board comprises a printed circuit board body, wherein the printed circuit board body is provided with mounting holes which are arranged in an array, and each mounting hole is provided with a terminal part which is adapted to the mounting hole and at least provided with an inner hole;
a columnar connecting member having a first welded joint portion located at a lower end, a second welded joint portion located at an upper end, and an elastic deformation portion interposed between the first welded joint portion and the second welded joint portion, the elastic deformation portion being capable of expanding and contracting in an axial direction and bending in a horizontal direction; the columnar connecting parts are in one-to-one correspondence with the terminal parts, each columnar connecting part extends to the inner hole, the first welding joint part is welded to the terminal part, and the second welding joint part protrudes out of the upper surface of the printed circuit board body;
the electronic element comprises a functional unit and a packaging part coated outside the functional unit, wherein the packaging part is provided with a substrate plane, and bonding pads which are arranged in an array mode and are in one-to-one correspondence with the columnar connecting parts are arranged on the substrate plane; the pads are correspondingly welded to the second welding joints.
2. The printed circuit board on which electronic components are soldered according to claim 1, wherein said inner hole comprises a cylindrical hole at a lower portion and a tapered hole at an upper portion; the elastic deformation part comprises a vertical movement elastic compliance section positioned at the lower part and a horizontal swing elastic compliance section positioned at the upper part; the vertical movement elastic compliance section corresponds to the cylindrical hole, and the horizontal movement elastic compliance section corresponds to the conical hole.
3. The printed circuit board with soldered electronic components of claim 2, wherein said vertically movable resilient compliant section is a helically extending spring structure formed by engraving a helical groove in a columnar body; the yaw elastic compliance section comprises at least two pairs of radial grooves which are axially arranged, and each pair of radial grooves is formed by symmetrically engraving radially inwards on a columnar entity; every two adjacent pairs of radial slots are circumferentially offset.
4. The printed circuit board on which electronic components are soldered according to claim 1, wherein said terminal member comprises an upper ring plate located on an upper surface of the printed circuit board body and a lower ring plate located on a lower surface of the printed circuit board body; the inner hole of the terminal part is a through hole, and the hole wall of the inner hole is connected to the upper ring plate and the lower ring plate; wherein:
the columnar connecting part penetrates through the inner hole, and the first welding joint part is positioned below the lower annular plate;
the first welding joint part comprises a plurality of welding legs which are circumferentially arranged at intervals, each welding leg is provided with an upward stepped surface, and the stepped surfaces of the welding legs are flush and are used for being abutted against the plate surface of the lower annular plate;
the solder fillets are enveloped into a containing cavity which is positioned in the middle area and used for containing soldering paste;
after the printed circuit board body and the columnar connection member are placed in an inverted state, at least part of the solder paste in the receiving chamber is caused to flow toward a space between each adjacent two of the fillets by heating to solder the fillets to the lower ring plate upon cooling.
5. The printed circuit board on which electronic components are soldered according to claim 4, wherein a columnar fitting portion for fitting with the inner hole is provided between the elastically deforming portion and the first solder joint portion; conical surfaces are formed on the surfaces of the columnar matching parts corresponding to the gaps between every two adjacent welding legs; the conical surface and the hole wall of the inner hole enclose a wedge-shaped gap, and when heating, part of solder paste in the containing cavity flows to the wedge-shaped gap so that the lower part of the columnar matching part is welded to the hole wall of the inner hole.
6. The printed circuit board with soldered electronic components of claim 1, wherein said second solder joint is a first claw; the first claw part comprises a plurality of first welding claws which are circumferentially arranged; the plurality of first welding claws enclose a first cavity positioned at the inner side in the axial direction and a first concave part positioned at the outer side in the axial direction; wherein:
the first concave part is used for receiving a solder ball, after a bonding pad on the substrate plane of the electronic element is lapped on the solder ball, the solder ball is melted and deformed by heating to partially enter the first cavity so as to cover the first bonding claw, and the first bonding claw is bonded to the bonding pad by cooling.
7. The printed circuit board with electronic components soldered thereto according to claim 1, wherein said mounting hole is a blind hole and said inner hole of said terminal member is a blind hole adapted to said mounting hole; the terminal component comprises an upper ring plate positioned on the upper surface of the printed circuit board body, and the hole wall of the inner hole is connected to the upper ring plate; wherein:
the first welding joint part is a second claw part; the second claw part comprises a plurality of second welding claws which are circumferentially arranged; the plurality of second welding claws enclose a second cavity positioned at the inner side in the axial direction and a second concave part positioned at the outer side in the axial direction;
after the solder balls are put into the inner holes and the second claw portions are inserted into the hole bottoms of the inner holes, the solder balls are melted by heating and partially enter the second cavities to cover the second solder claws, and the second solder claws are welded to the hole bottoms of the inner holes by cooling.
8. The printed circuit board on which electronic components are soldered according to claim 4 or 5, wherein the cavity bottom of said receiving cavity is configured with a raised portion having a high middle edge.
9. A printed circuit board on which an electronic component is soldered according to claim 3, wherein a core hole is provided in the center of the elastically deformed portion of the columnar connection member.
10. The printed circuit board on which electronic components are soldered according to claim 1, wherein said columnar connection members are integrally formed from a copper metal columnar blank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310871496.9A CN116600469B (en) | 2023-07-17 | 2023-07-17 | Printed circuit board with soldered electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310871496.9A CN116600469B (en) | 2023-07-17 | 2023-07-17 | Printed circuit board with soldered electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116600469A true CN116600469A (en) | 2023-08-15 |
| CN116600469B CN116600469B (en) | 2023-09-22 |
Family
ID=87612049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310871496.9A Active CN116600469B (en) | 2023-07-17 | 2023-07-17 | Printed circuit board with soldered electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116600469B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5876221A (en) * | 1996-08-09 | 1999-03-02 | The Whitaker Corporation | Surface mount contact assembly for printed circuit board |
| US6247228B1 (en) * | 1996-08-12 | 2001-06-19 | Tessera, Inc. | Electrical connection with inwardly deformable contacts |
| US20020182900A1 (en) * | 2001-05-31 | 2002-12-05 | International Business Machines Corporation | Enhanced electrical/mechanical connection for electronic devices |
| US6969286B1 (en) * | 2004-06-28 | 2005-11-29 | Samtec, Inc. | Connector having improved contacts with fusible members |
| CN101472400A (en) * | 2007-12-28 | 2009-07-01 | 富士通株式会社 | Printed wiring board unit and method of making the same |
| US10122141B1 (en) * | 2017-06-16 | 2018-11-06 | Lotes Co., Ltd | Method for manufacturing electrical connector |
| CN209543319U (en) * | 2019-03-29 | 2019-10-25 | 温州长江汽车电子有限公司 | A kind of conduction connecting structure being connected with circuit board and capacitance touch screen |
| CN210840214U (en) * | 2019-11-22 | 2020-06-23 | 维沃移动通信有限公司 | Circuit board device and electronic equipment |
| CN112106260A (en) * | 2018-05-16 | 2020-12-18 | 哈廷电子有限公司及两合公司 | Plug-in connector for printed circuit board |
| CN114698265A (en) * | 2022-03-29 | 2022-07-01 | 桂林电子科技大学 | Method and device for controlling verticality between micro-reed plates |
-
2023
- 2023-07-17 CN CN202310871496.9A patent/CN116600469B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5876221A (en) * | 1996-08-09 | 1999-03-02 | The Whitaker Corporation | Surface mount contact assembly for printed circuit board |
| US6247228B1 (en) * | 1996-08-12 | 2001-06-19 | Tessera, Inc. | Electrical connection with inwardly deformable contacts |
| US20020182900A1 (en) * | 2001-05-31 | 2002-12-05 | International Business Machines Corporation | Enhanced electrical/mechanical connection for electronic devices |
| US6969286B1 (en) * | 2004-06-28 | 2005-11-29 | Samtec, Inc. | Connector having improved contacts with fusible members |
| CN101472400A (en) * | 2007-12-28 | 2009-07-01 | 富士通株式会社 | Printed wiring board unit and method of making the same |
| US10122141B1 (en) * | 2017-06-16 | 2018-11-06 | Lotes Co., Ltd | Method for manufacturing electrical connector |
| CN112106260A (en) * | 2018-05-16 | 2020-12-18 | 哈廷电子有限公司及两合公司 | Plug-in connector for printed circuit board |
| CN209543319U (en) * | 2019-03-29 | 2019-10-25 | 温州长江汽车电子有限公司 | A kind of conduction connecting structure being connected with circuit board and capacitance touch screen |
| CN210840214U (en) * | 2019-11-22 | 2020-06-23 | 维沃移动通信有限公司 | Circuit board device and electronic equipment |
| CN114698265A (en) * | 2022-03-29 | 2022-07-01 | 桂林电子科技大学 | Method and device for controlling verticality between micro-reed plates |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116600469B (en) | 2023-09-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6196871B1 (en) | Method for adjusting differential thermal expansion between an electrical socket and a circuit board | |
| US4827611A (en) | Compliant S-leads for chip carriers | |
| US7874880B2 (en) | Adapter apparatus with sleeve spring contacts | |
| JP4832479B2 (en) | Connector and electronic component provided with the connector | |
| JP2018174017A (en) | socket | |
| JP2009532912A (en) | Molded semiconductor package with integral through-hole heat dissipation pins | |
| US7402462B2 (en) | Folded frame carrier for MOSFET BGA | |
| CN116600469B (en) | Printed circuit board with soldered electronic components | |
| GB2325354A (en) | Electrical connector or connection with concave ball-receiving site | |
| JP3288654B2 (en) | Method of manufacturing electrical connector | |
| JP2001196141A (en) | Electric connector housing | |
| US6353191B1 (en) | Column grid array connector | |
| US20040183168A1 (en) | Lead frame and electronic component using same | |
| JP2010157701A (en) | Area array adapter | |
| JPH08274219A (en) | Semiconductor device and its manufacture | |
| JPH1074884A (en) | Manufacture of conductor pin for semiconductor mounting substrate | |
| JP2745218B2 (en) | Semiconductor mounting substrate | |
| JPS62283651A (en) | Conductor pin for substrate mounted with semiconductor and manufacture thereof | |
| JPH10242328A (en) | Circuit board, circuit module having the circuit board and electronic equipment having the circuit module | |
| JP3252253B2 (en) | Surface mount type connector | |
| CN114093837B (en) | QFN/LGA package structure with exposed lead led out from top and manufacturing method thereof | |
| CN221747221U (en) | Photoelectric chip welding structure | |
| JP2005019948A (en) | Lead frame and electronic component using it | |
| JP6352508B2 (en) | Lead frame and lead frame manufacturing method | |
| JP3242858B2 (en) | Connector and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |