CN114695221B - Chip loading and storing device - Google Patents
Chip loading and storing device Download PDFInfo
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- CN114695221B CN114695221B CN202210603711.2A CN202210603711A CN114695221B CN 114695221 B CN114695221 B CN 114695221B CN 202210603711 A CN202210603711 A CN 202210603711A CN 114695221 B CN114695221 B CN 114695221B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Abstract
The invention belongs to the technical field of chip production, and discloses a chip loading and storing device which comprises a material pipe loading and unloading mechanism, a transferring mechanism and a storing mechanism, wherein the material pipe loading and unloading mechanism comprises a pushing assembly and a first bearing plate, the first bearing plate bears a material pipe, the pushing assembly pushes the material pipe to move along a first direction to be butted with a conveying pipeline, a chip moves into the material pipe, the pushing assembly can also reset the material pipe, the storing mechanism comprises a pair of first groove plates arranged at intervals along the first direction, the transferring mechanism can enable the reset material pipe to move between the pair of first groove plates along a second direction, the storing mechanism also comprises a first limiting assembly, the transferring mechanism can also push the material pipe to rise along a vertical direction, and the first limiting assembly can bear the material pipe, the chip loading and the transferring device can replace manual loading and carrying through a mechanical storing mode, so that the chip is prevented from being damaged in the loading process, meanwhile, the loading speed is increased, and labor cost can be saved by storing the chip through a mechanical structure.
Description
Technical Field
The invention relates to the technical field of chip production, in particular to a chip storage device.
Background
Semiconductor chips are required to be loaded into a long-strip material pipe for loading and unloading during production and inspection. The existing semiconductor chip is generally loaded into the material pipe in a manual loading mode, pins of the semiconductor chip are easily damaged in the manual loading process, meanwhile, the manual loading speed is low, the production requirement cannot be met, and the labor cost is high. After loading, the prior art generally transfers the material tube fully loaded with the semiconductor chips to the rack by manual handling, so as to complete storage of the chips.
Therefore, the above problems need to be solved.
Disclosure of Invention
The invention aims to provide a chip loading and storing device, which aims to solve the problems that pins of a semiconductor chip are easy to damage in the manual loading process, the manual loading speed is low, the production requirement cannot be met, the labor cost is high, and the cost is high when a material pipe fully loaded with the semiconductor chip is manually transported.
In order to achieve the purpose, the invention adopts the following technical scheme:
a chip loading storage device comprising:
the material pipe loading and unloading mechanism comprises a pushing assembly and a first bearing plate, wherein a material pipe is loaded on the first bearing plate, the pushing assembly can push the material pipe loaded on the first bearing plate to move along a first direction to be in butt joint with a conveying pipeline, so that chips conveyed along the conveying pipeline can move into the material pipe, and the pushing assembly can also reset the material pipe fully loaded with the chips;
the storage mechanism comprises a pair of first groove plates arranged at intervals along the first direction, gaps are formed between the pair of first groove plates and the first bearing plate along the vertical direction, the height of the gap between the pair of first groove plates and the first bearing plate is larger than or equal to that of the material pipe, and first grooves are formed in the opposite sides of the pair of first groove plates; and
the material pipe storage mechanism comprises a first groove plate, a second groove plate and a shifting mechanism, wherein the first groove plate is arranged on the upper portion of the first groove plate, the second groove plate is arranged on the lower portion of the first groove plate, the shifting mechanism can enable the reset material pipe to move to a position between the first groove plate and the second groove plate along a second direction perpendicular to the first direction, the first groove plate is arranged below the second groove plate, the second groove plate is arranged below the first groove plate, and the shifting mechanism can push the material pipe below the first groove plate to ascend along the vertical direction.
Preferably, the material pipe loading and unloading mechanism further includes a pair of second slot plates arranged at intervals along a first direction, a second groove is formed in one side of each of the pair of second slot plates opposite to the first direction, a plurality of material pipes are stacked between the pair of second slot plates, two ends of each of the material pipes are respectively accommodated in the second grooves of the pair of second slot plates, the lowermost one of the plurality of material pipes can fall onto the first bearing plate, a gap is formed between each of the pair of second slot plates and the first bearing plate along a vertical direction, the height of the gap between each of the pair of second slot plates and the first bearing plate is greater than or equal to the height of the material pipe, the first limiting assemblies are arranged below the first grooves of the pair of first slot plates, and the first limiting assemblies are configured to avoid the end portions of the material pipes when the material pipes rise, and the end part of the material pipe is supported when the material pipe rises to the end part of the material pipe and is accommodated in the first groove.
Preferably, the first limiting component comprises:
the mounting block is fixedly connected to the first bearing plate;
the limiting block is provided with a first inclined surface, the limiting block is hinged to the mounting block through a first hinged shaft, the first hinged shaft extends along the second direction, when the material pipe is positioned below the first groove, the first inclined surface is positioned above the end part of the material pipe, and when the transfer mechanism pushes the material pipe positioned below the first groove to ascend along the vertical direction, the end part of the material pipe can gradually ascend along the first inclined surface and push the limiting block to rotate around the first hinged shaft; and
the first spring is connected or abutted between the limiting block and the mounting block and can elastically deform when the limiting block rotates around the first hinge shaft so as to have elastic potential energy for resetting the limiting block when the end part of the material pipe is accommodated in the first groove, and when the limiting block resets, one side of the limiting block, which is far away from the first spring, is abutted against the first bearing plate.
Preferably, each pair of first slot plates includes more than two first plate portions arranged at intervals along the second direction, the first groove is formed between any two adjacent first plate portions, and the first limiting assembly is arranged between any two adjacent first plate portions.
Preferably, the transfer mechanism includes:
the material pipe falling onto the first bearing plate can be borne on the second bearing plate;
the first driving piece is configured to drive the second bearing plate to lift along the vertical direction; and
the first driving member is connected to the transfer module, and the transfer module is configured to drive the first driving member and the second bearing plate to move along the second direction.
Preferably, the second carrying plate is provided with a first pushing block, the first pushing block is hinged to the second carrying plate through a second hinge shaft, the second hinge shaft extends along the first direction, when the material pipe falls onto the first carrying plate, one end of the first pushing block, which is far away from the second hinge shaft, can be abutted against one side, which is far away from the first groove plate, of the material pipe, one side, which is far away from the second hinge shaft, of the first pushing block is provided with a second inclined surface, when the second carrying plate moves from the first groove plate to the second groove plate along the second direction, the material pipe, which is located below the second groove, can gradually climb along the second inclined surface and push the first pushing block to rotate around the second hinge shaft, a second spring is connected or abutted between the first pushing block and the second carrying plate, and the second spring can elastically deform when the first pushing block rotates around the second hinge shaft, when the first pushing block is reset, one end of the first pushing block, which is close to the second hinge shaft, is abutted against the second bearing plate.
Preferably, the first bearing plate includes a second plate portion and a third plate portion, the second plate portion, the third plate portion and the conveying pipeline are sequentially disposed along the first direction, the pair of second slot plates is respectively and fixedly connected to the second plate portion and the third plate portion, the pushing assembly includes a second driving member and a second pushing block, the second driving member is fixedly connected to the second plate portion, and the second driving member is configured to drive the second pushing block to move toward the third plate portion along the first direction, so that the second pushing block can push one end of the material pipe away from the third plate portion.
Preferably, the bottom of one side of the conveying pipeline close to the third plate part is provided with a first through hole, and the pushing assembly further comprises:
a movable end of the third driving piece is connected with a third pushing block, and the third driving piece is configured to drive the third pushing block to lift along the vertical direction, so that the third pushing block can penetrate through the first through hole along the vertical direction and extend into the conveying pipeline; and
a fourth driving member connected to a movable end of the fourth driving member, the fourth driving member being configured to drive the third driving member to move toward the second plate portion along the first direction.
Preferably, the chip loading and storing device further comprises a first pressing block and a fifth driving member, wherein the fifth driving member is configured to drive the first pressing block to move up and down, so that the first pressing block presses one end of the material pipe away from the second plate part when the material pipe is butted with the conveying pipeline.
Preferably, a second through hole is formed in the top of one side of the conveying pipe close to the third plate portion, and the chip loading and storing device further comprises a second pressing block and a sixth driving member, wherein the sixth driving member is configured to drive the second pressing block to move up and down, so that the second pressing block can vertically pass through the second through hole and extend into the conveying pipe.
The invention has the beneficial effects that: according to the invention, the pushing assembly can push the unloaded material pipe to move along the first direction to be in butt joint with the conveying pipeline, the chips can flow through the conveying pipeline and then move into the material pipe, when the material pipe is full of chips, the pushing assembly resets the material pipe, the reset material pipe is pushed to be positioned below the first groove by the transfer mechanism, the transfer mechanism can enable the material pipe to ascend, and meanwhile, the first limiting assembly can support the material pipe, so that the material pipe full of chips is stored between the pair of first groove plates. According to the invention, manual loading and carrying are replaced by a mechanical loading and storing mode, so that pins of the chip are prevented from being damaged in the loading process, the loading speed is increased to meet the production requirement, and the labor cost can be saved by loading and storing the chip through a mechanical structure.
Drawings
FIG. 1 is a schematic view of a chip loading reservoir in an embodiment of the invention from one perspective except for one of two fourth plate portions connected to a third plate portion;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is an enlarged view of a portion of FIG. 1 at B;
FIG. 4 is an enlarged view of a portion of FIG. 1 at C;
FIG. 5 is a schematic view of a chip loading reservoir in an embodiment of the invention from another perspective, except one of two fourth plate portions attached to a third plate portion;
FIG. 6 is an enlarged view of a portion of FIG. 5 at D;
FIG. 7 is a front view of the second carrier plate in the embodiment of the present invention;
FIG. 8 is a cross-sectional view taken along line E-E of FIG. 7;
fig. 9 is a plan view of the chip loading storage device in fig. 1 with the transfer mechanism removed;
FIG. 10 is a cross-sectional view taken along line F-F of FIG. 9;
fig. 11 is a partial enlarged view at G in fig. 10.
In the figure:
100. a material pipe;
200. a delivery conduit; 210. a feeding line body; 211. a first through hole; 220. a housing; 221. a second through hole;
3111. a second driving member; 3112. a second push block; 3113. a third driving member; 3114. a third push block; 3115. a fourth drive; 312. a first bearing plate; 3121. a second plate portion; 31211. mounting grooves; 3122. a third plate portion; 313. a second slot plate; 3131. a second groove; 3132. a fourth plate portion; 321. a first slot plate; 3211. a first groove; 3212. a first plate portion; 322. a first limit component; 3221. mounting blocks; 3222. a limiting block; 32221. a first inclined plane; 3223. a first hinge shaft; 3224. a first spring; 330. a transfer mechanism; 331. a second carrier plate; 3311. a first push block; 33111. a second inclined plane; 3312. a second hinge shaft; 3313. a second spring; 332. a first driving member; 333. a transfer module; 340. a first pressing block; 350. a fifth driving member; 360. a second pressing block; 370. and a sixth driving member.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
Referring to fig. 1 to 9, the chip loading and storing apparatus of the present embodiment includes a material tube loading and unloading mechanism, a transferring mechanism 330 and a storing mechanism, the material tube loading and unloading mechanism includes a pushing assembly and a first carrier plate 312, the first carrier plate 312 carries a material tube 100, the pushing assembly can push the material tube 100 carried on the first carrier plate 312 to move along a first direction to be abutted to the conveying pipeline 200, so that the chip conveyed along the conveying pipeline 200 can move into the material tube 100, the pushing assembly can also reset the material tube 100 fully carrying the chip, the storing mechanism includes a pair of first slot plates 321 arranged at intervals along the first direction, a gap is formed between the pair of first slot plates 321 and the first carrier plate 312 along a vertical direction, and the height of the gap between the pair of first slot plates 321 and the first carrier plate 312 is greater than or equal to the height of the material tube 100, the first grooves 3211 are formed in opposite sides of the first groove plates 321, the transfer mechanism 330 can move the reset material pipe 100 between the first groove plates 321 along a second direction perpendicular to the first direction and is located below the first grooves 3211, the storage mechanism further includes a first limiting assembly 322, the transfer mechanism 330 can also push the material pipe 100 located below the first grooves 3211 to ascend along a vertical direction, and when the material pipe 100 ascends to the positions where two ends of the material pipe are respectively accommodated in the first grooves 3211 of the first groove plates 321, the first limiting assembly 322 can support the material pipe 100.
In this embodiment, the pushing assembly can push the empty tube 100 to move along the first direction to abut against the conveying pipeline 200, the chips can flow through the conveying pipeline 200 and then move into the tube 100, when the tube 100 is full of chips, the pushing assembly resets the tube 100, the reset tube 100 is pushed by the transferring mechanism 330 to be located below the first groove 3211, the transferring mechanism 330 can also lift the tube 100, and meanwhile, the first limiting assembly 322 can support the tube 100, so that the tube 100 full of chips is stored between the pair of first groove plates 321. This embodiment replaces artifical loading and transport through mechanical loading and the mode of storing to avoid damaging the stitch of chip at the in-process of loading, improve loading speed simultaneously, in order to satisfy the production demand, and load and store the chip through mechanical structure and can save the cost of labor.
Specifically, the conveying pipeline 200 in this embodiment includes a feeding line body 210 and a housing 220 covering the feeding line body 210, so as to form a feeding channel, the manufactured and inspected chips can be conveyed along the feeding channel, and the pushing assembly pushes the material pipe 100 on the first bearing plate 312 to be abutted to the conveying pipeline 200, so that the material pipe 100 can receive the chips conveyed along the feeding channel. Because the pair of first slot plates 321 and the first carrier 312 have a gap therebetween, and the height of the gap between the pair of first slot plates 321 and the first carrier 312 is greater than or equal to the height of the material tube 100, the material tube 100 can move between the pair of first slot plates 321 along the second direction, after the material tube 100 fully loaded with chips on the first carrier 312 is reset, the transferring mechanism 330 pushes the material tube 100 fully loaded with chips to move between the pair of first slot plates 321 along the second direction, when the material tube 100 fully loaded with chips moves to a position below the first groove 3211, the transferring mechanism 330 makes the material tube 100 fully loaded with chips rise to the first groove 3211 along the vertical direction, and the first limiting assembly 322 supports the material tube 100 fully loaded with chips.
It is understood that the structure for conveying the chip in the conveying pipeline 200 is the prior art, and the present embodiment will not be described in detail herein.
Further, as shown in fig. 1, 2, 5 and 6, the material tube loading and unloading mechanism in this embodiment further includes a pair of second slot plates 313 arranged at intervals along the first direction, a second groove 3131 is formed on each of opposite sides of the pair of second slot plates 313, a plurality of material tubes 100 are stacked between the pair of second slot plates 313, two ends of the material tubes 100 are respectively received in the second grooves 3131 of the pair of second slot plates 313, a lowermost material tube of the plurality of material tubes 100 can fall onto the first carrier plate 312, specifically, the pair of second slot plates 313 each include two fourth plate 3132 arranged at intervals along the second direction, a second groove 3131 is formed between the two fourth plate 3132, since the lowermost material tube of the plurality of material tubes 100 stacked between the second slot plates 313 is not supported by any structure, the lowermost material tube of the plurality of material tubes 100 stacked between the second slot plates 313 can fall onto the first carrier plate 312, gaps are formed between the pair of second slot plates 313 and the first bearing plate 312 along the vertical direction, the height of the gap between the pair of second slot plates 313 and the first bearing plate 312 is greater than or equal to the height of the material pipe 100, that is, gaps are formed between all the fourth plate portions 3132 and the first bearing plate 312, and the height of the gap between all the fourth plate portions 3132 and the first bearing plate 312 is greater than or equal to the height of the material pipe 100, so that the material pipe 100 can be moved out from between the pair of second slot plates 313 along the second direction.
Based on the foregoing, in the embodiment, the plurality of material tubes 100 stacked between the pair of second slot plates 313 can be butted with the conveying pipeline 200 one by one, accordingly, after the transferring mechanism 330 conveys one material tube 100 full of chips to be stored between the pair of first slot plates 321, it is further required to reset and move the next material tube 100 full of chips to be between the pair of first slot plates 321 along the second direction, in order to facilitate the transferring mechanism 330 to enable the next material tube 100 full of chips to be supported above the first limiting assemblies 322, please refer to fig. 1 and 9, in the embodiment, the first limiting assemblies 322 are disposed below the first grooves 3211 of the pair of first slot plates 321, the first limiting assemblies 322 are configured to avoid the end portions of the material tubes 100 when the material tubes 100 are lifted to the end portions of the first grooves 3211, and to support the end portions of the material tubes 100 when the material tubes 100 are lifted to the end portions of the first grooves 3211, as described above, the first position-limiting assembly 322 can support the material tube 100 below the material tube 100 after the material tube 100 rises to the position where both ends of the material tube 100 are respectively accommodated in the first grooves 3211 of the pair of first groove plates 321, that is, a gap is formed between the material tube 100 supported above the first position-limiting assembly 322 and the first carrier plate 312 along the vertical direction, and the height of the gap is greater than or equal to the height of the material tube 100, so that the transferring mechanism 330 can push the material tube 100 fully loaded with chips to the position below the first grooves 3211, and the first position-limiting assembly 322 does not influence the transferring mechanism 330 to push the material tube 100 positioned below the first grooves 3211 to rise along the vertical direction, so that the plurality of material tubes 100 stacked between the second groove plates 313 in this embodiment can load the chips one by one and stack the chips one by one between the first groove plates 321.
Further, in this embodiment, each of the pair of first slot plates 321 includes two or more first plate portions 3212 arranged at intervals along the second direction, a first groove 3211 is formed between any two adjacent first plate portions 3212, and two or more first grooves 3211 arranged at intervals along the second direction are formed between the pair of first slot plates 321, that is, two or more storage positions are formed between the first pair of first slot plates 321, and the first position-limiting assembly 322 is arranged between any two adjacent first plate portions 3212, based on the above, the material tube 100 supported above the first position-limiting assembly 322 and the first supporting plate 312 have a gap along the vertical direction, and the height of the gap is greater than or equal to the height of the material tube 100, so that the transfer mechanism 330 can store the material tube 100 fully loaded with chips to any one of the storage positions.
As shown in fig. 9 to 11, the first position-limiting assembly 322 in this embodiment includes an installation block 3221, a position-limiting block 3222 and a first spring 3224, the installation block 3221 is fixedly connected to the first supporting plate 312, the position-limiting block 3222 is provided with a first inclined surface 32221, the position-limiting block 3222 is hinged to the installation block 3221 through a first hinge shaft 3223, the first hinge shaft 3223 extends along the second direction, when the feeding tube 100 is located below the first groove 3211, the first inclined surface 32221 is located above the end portion of the feeding tube 100, when the transfer mechanism 330 pushes the feeding tube 100 located below the first groove 3211 to move in the vertical direction, the end portion of the feeding tube 100 can gradually climb along the first inclined surface 32221 and push the position-limiting block 3222 to rotate around the first hinge shaft 3223, the first spring 3224 is connected or abutted between the position-limiting block 3222 and the installation block 3221, and can elastically deform when the position-limiting block 3222 rotates around the first hinge shaft 3223, so as to have elastic potential energy of repositioning position of the end portion of the feeding tube 100 accommodated in the first groove 3211, when the limiting block 3222 is reset, one side of the limiting block 3222, which is away from the first spring 3224, abuts against the first bearing plate 312, specifically, the first bearing plate 312 in this embodiment includes a second plate portion 3121 and a third plate portion 3122, each of the second plate portion 3121 and the third plate portion 3122 is provided with a mounting groove 31211, the first hinge shaft 3223 is mounted in the mounting groove 31211, when the end of the material pipe 100 is received in the first groove 3211, the end of the material pipe 100 is separated from the first inclined surface 32221, the limiting block 3222 is reset and supported below the end of the material pipe 100, the limiting block 3222 hinged in the mounting groove 31211 of the second plate portion 3121 abuts against a groove wall of one side of the mounting groove 31211 of the second plate portion 3121, and the limiting block 3222 hinged in the mounting groove 31211 of the third plate portion 3122 abuts against a groove wall of one side of the mounting groove 31211 of the second plate portion 3121, which is close to the second plate portion 3121.
Further, as shown in fig. 1, 2 and 9, the second plate portion 3121, the third plate portion 3122 and the conveying pipe 200 in the present embodiment are sequentially disposed along the first direction, the pair of second slot plates 313 are fixedly connected to the second plate portion 3121 and the third plate portion 3122, the push assembly includes a second driving part 3111 and a second push block 3112, the second driving part 3111 is fixedly connected to the second plate portion 3121, and the second driving part 3111 is configured to drive the second push block 3112 to move towards the third plate portion 3122 along the first direction, so that the second push block 3112 can push the end of the material pipe 100 away from the third plate portion 3122.
Referring to fig. 3 and 6, the chip loading and storing device in this embodiment further includes a first pressing block 340 and a fifth driving member 350, the fifth driving member 350 is connected to the third plate portion 3122 through a first connecting plate (not shown), and the fifth driving member 350 is configured to drive the first pressing block 340 to move up and down, so that the first pressing block 340 presses one end of the tube 100 away from the second plate portion 3121 when the tube 100 is butted with the conveying pipeline 200, thereby preventing the chip from being damaged due to movement of the tube 100 in the process of receiving the chip.
Further, the bottom of the side of the feeding line body 210 of the conveying pipeline 200 close to the third plate portion 3122 is provided with a first through hole 211, the pushing assembly further includes a third driving part 3113 and a fourth driving part 3115, a movable end of the third driving part 3113 is connected with a third push block 3114, the third driving part 3113 is configured to drive the third push block 3114 to move up and down along the vertical direction, so that the third push block 3114 can pass through the first through hole 211 and extend into the conveying pipeline 200 along the vertical direction, since the width of the first through hole 211 along the width direction of the feeding line body is smaller, the third push block 3114 in this embodiment is suitable for passing through the first through hole 211 and extending into the conveying pipeline 200 along the vertical direction, the third push block 3114 includes a push head (not shown in the figure), the push head is located at the side far from the third driving part 3113, the diameter of the push head is smaller, so as to pass through the first through hole 211 and extend into the conveying pipeline 200, the third driving member 3113 is connected to a movable end of the fourth driving member 3115, the fourth driving member 3115 is connected to the third plate portion 3122 through a second connecting plate (not shown in the figure), the fourth driving member 3115 is configured to drive the third driving member 3113 to move toward the second plate portion 3121 along the first direction, when the tube 100 butted with the conveying pipe 200 is full of chips, the third driving member 3113 drives the pushing head of the third pushing block 3114 to extend into the conveying pipe 200, the fourth driving member 3115 drives the third driving member 3113 to move toward the second plate portion 3121 along the first direction, and simultaneously the third driving member 3113 drives the pushing head of the third pushing block 3114 to move toward the second plate portion 3121 along the first direction, so as to push the tube 100 full of chips to reset.
As shown in fig. 1, 4 and 5, the transferring mechanism 330 in this embodiment includes a second carrier 331, a first driving member 332 and a transferring module 333, the material tube 100 dropped onto the first carrier 312 can be carried on the second carrier 331, the first driving member 332 is configured to drive the second carrier 331 to move up and down along a vertical direction, the first driving member 332 is connected to the transferring module 333, the transferring module 333 is configured to drive the first driving member 332 and the second carrier 331 to move along a second direction, when the material tube 100 full of chips is reset, the second carrier 331 drives the material tube 100 full of chips to move along the transferring module 333 from between the pair of second channel 313 to between the pair of first channel 321, and then the first driving member 332 drives the second carrier 331 to move up, so as to store the material tube 100 full of chips between the pair of first channel 321.
In order to facilitate the transferring mechanism 330 to move the tube 100 after being reset to the position between the pair of first slot plates 321 along the second direction, the first pushing block 3311 is installed on the second carrier plate 331 in this embodiment, when the tube 100 falls onto the first carrier plate 312, the first pushing block 3311 can abut against one side of the tube 100 away from the first slot plate 321, in combination with the above, after the second carrier plate 331 of the transferring mechanism 330 transports a tube 100 full of chips to be stored between the pair of first slot plates 321, it is necessary to reset and move the next tube 100 full of chips to the position between the pair of first slot plates 321 along the second direction, but when the transferring mechanism 330 moves the tube 100 full of chips away from the position between the pair of second slot plates 313, the other empty tube 100 falls onto the first carrier plate 312, if the first pushing block 3311 is fixedly connected to the second carrier plate 331, in order to solve the above problem, referring to fig. 4, 7 and 8, when the second carrier plate 331 is repositioned, another tube 100 dropped onto the first carrier plate 312 interferes with the movement of the second carrier plate 331, that is, the second carrier plate 331 is abutted against one side of another tube 100 dropped onto the first carrier plate 312 close to the first slot plate 321 in the repositioning process, so that the second carrier plate 331 cannot be repositioned, in the present embodiment, the first pushing block 3311 is hinged to the second carrier plate 331 through the second hinge axis 3312, the second hinge axis 3312 extends along the first direction, when the tube 100 is dropped onto the first carrier plate 312, one end of the first pushing block 3311 far away from the second hinge axis 2 can be abutted against one side of the tube 100 far away from the first slot plate 321, the side of the first pushing block 3311 far away from the second slot plate 3312 is provided with the second inclined plane 33111, when the second carrier plate 331 moves from the first slot plate 321 to the second slot plate 313 along the second direction, the material tube 100 located below the second groove 3131 can gradually climb along the second inclined plane 33111 and push the first pushing block 3311 to rotate around the second hinge axis 3312, so as to avoid interference of another material tube 100 falling onto the first bearing plate 312 with the movement of the second bearing plate 331, a second spring 3313 is connected or abutted between the first pushing block 3311 and the second bearing plate 331, the second spring 3313 can elastically deform when the first pushing block 3311 rotates around the second hinge axis 3312 so as to have elastic potential energy for resetting the first pushing block 3311, when the first pushing block 3311 resets, one end of the first pushing block 3311 close to the second hinge axis 3312 abuts against the second bearing plate 331, so that the first pushing block 3311 can push the material tube 100 to move from the first channel plate 321 to the second channel plate 313 along the second direction without overturning around the second hinge axis 3312.
Further, as shown in fig. 3 and 6, the top of the side of the housing 220 of the conveying pipe 200 close to the third plate portion 3122 in the present embodiment is provided with a second through hole 221, the chip loading and storing device further includes a second pressing block 360 and a sixth driving member 370, the second pressing block 360 is located on the side of the third pushing block 3114 away from the second slot plate 313, the chip loading and storing device further includes a frame (not shown), the sixth driving member 370 is connected to the frame through a third connecting plate (not shown), the sixth driving member 370 is configured to drive the second pressing block 360 to move up and down, so that the second pressing block 360 can pass through the second through hole 221 in the vertical direction and extend into the conveying pipe 200, when the pipe 100 abutting against the conveying pipe 200 is full of chips, the second pressing block 360 can extend into the conveying pipe 200, so as to press the most downstream chip in the conveying pipe 200 onto the feeder line body 210, so as to prevent the chip from sliding out of the conveying pipeline 200 when the conveying pipeline 200 is not butted with the material pipe 100, and further avoid damaging the chip.
It is understood that all the first and second slot plates 321 and 313 in this embodiment are connected to the first loading plate 312 by a fourth connecting plate (not shown) and a fifth connecting plate (not shown), respectively.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, adaptations and substitutions will occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A chip loading and storing apparatus, comprising:
the material pipe loading and unloading mechanism comprises a pushing assembly and a first bearing plate (312), wherein a material pipe (100) is loaded on the first bearing plate (312), the pushing assembly can push the material pipe (100) loaded on the first bearing plate (312) to move along a first direction to be butted with a conveying pipeline (200), so that chips conveyed along the conveying pipeline (200) can move into the material pipe (100), and the pushing assembly can also reset the material pipe (100) fully loaded with the chips;
the storage mechanism comprises a pair of first groove plates (321) arranged at intervals along the first direction, gaps are formed between the pair of first groove plates (321) and the first bearing plate (312) along the vertical direction, the height of the gap between the pair of first groove plates (321) and the first bearing plate (312) is larger than or equal to the height of the material pipe (100), and first grooves (3211) are formed in one opposite side of the pair of first groove plates (321); and
the transfer mechanism (330) can enable the reset material pipe (100) to move to a position between the pair of first groove plates (321) along a second direction perpendicular to the first direction and located below the first groove (3211), the storage mechanism further comprises a first limiting assembly (322), the transfer mechanism (330) can also push the material pipe (100) located below the first groove (3211) to ascend along the vertical direction, and when the material pipe (100) ascends to the position where two ends of the material pipe are respectively accommodated in the first grooves (3211) of the pair of first groove plates (321), the first limiting assembly (322) can support the material pipe (100).
2. The chip loading and storing device according to claim 1, wherein the tube loading and unloading mechanism further comprises a pair of second slot plates (313) spaced apart from each other along the first direction, each of opposite sides of the pair of second slot plates (313) has a second groove (3131), a plurality of tubes (100) are stacked between the pair of second slot plates (313), two ends of the tubes (100) are respectively received in the second grooves (3131) of the pair of second slot plates (313), a lowermost tube of the plurality of tubes (100) can fall onto the first carrier plate (312), a gap is formed between the pair of second slot plates (313) and the first carrier plate (312) along the vertical direction, and the height of the gap between the pair of second slot plates (313) and the first carrier plate (312) is greater than or equal to the height of the tubes (100), the first limiting assemblies (322) are arranged below the first grooves (3211) of the pair of first groove plates (321), and the first limiting assemblies (322) are configured to avoid the end of the material pipe (100) when the material pipe (100) ascends and support the end of the material pipe (100) when the material pipe (100) ascends to the position where the end is accommodated in the first groove (3211).
3. The chip loading storage device according to claim 2, wherein the first stop assembly (322) comprises:
the mounting block (3221) is fixedly connected to the first bearing plate (312);
a limiting block (3222) provided with a first inclined surface (32221), wherein the limiting block (3222) is hinged to the mounting block (3221) through a first hinge shaft (3223), the first hinge shaft (3223) extends along the second direction, when the material pipe (100) is located below the first groove (3211), the first inclined surface (32221) is located above an end portion of the material pipe (100), and when the transfer mechanism (330) pushes the material pipe (100) located below the first groove (3211) to rise along the vertical direction, the end portion of the material pipe (100) can gradually climb along the first inclined surface (32221), and the limiting block (3222) is pushed to rotate around the first hinge shaft (3223); and
the first spring (3224) is connected or abutted between the limiting block (3222) and the mounting block (3221), and can be elastically deformed when the limiting block (3222) rotates around the first hinge shaft (3223) so as to have elastic potential energy for resetting the limiting block (3222) when the end of the material pipe (100) is accommodated in the first groove (3211), and when the limiting block (3222) is reset, one side of the limiting block (3222) far away from the first spring (3224) is abutted against the first bearing plate (312).
4. The chip loading storage device according to claim 3, wherein each pair of first slot plates (321) includes two or more first plate portions (3212) spaced apart along the second direction, the first groove (3211) is formed between any two adjacent first plate portions (3212), and the first limiting member (322) is disposed between any two adjacent first plate portions (3212).
5. The chip loading storage device according to claim 2, wherein the transfer mechanism (330) comprises:
the material pipe (100) falling onto the first bearing plate (312) can be borne on the second bearing plate (331);
a first driving member (332) configured to drive the second loading plate (331) to ascend and descend in a vertical direction; and
the first driving piece (332) is connected to the transferring module (333), and the transferring module (333) is configured to drive the first driving piece (332) and the second bearing plate (331) to move along the second direction.
6. The chip loading and storing apparatus of claim 5, wherein a first pushing block (3311) is installed on the second carrier plate (331), the first pushing block (3311) is hinged to the second carrier plate (331) by a second hinge shaft (3312), the second hinge shaft (3312) extends along the first direction, when the material tube (100) falls onto the first carrier plate (312), one end of the first pushing block (3311) far away from the second hinge shaft (3312) can abut against one side of the material tube (100) far away from the first slot plate (321), one side of the first pushing block (3311) far away from the second hinge shaft (3312) is provided with a second inclined surface (33111), and when the second carrier plate (331) moves from the first slot plate (321) to the second slot plate (313) along the second inclined surface (33111), the material tube (100) under the second groove (3131) can gradually move along the second inclined surface (33111) Climbing and pushing the first pushing block (3311) to rotate around the second hinge shaft (3312), wherein a second spring (3313) is connected or abutted between the first pushing block (3311) and the second bearing plate (331), the second spring (3313) can elastically deform when the first pushing block (3311) rotates around the second hinge shaft (3312) to have elastic potential energy for resetting the first pushing block (3311), and when the first pushing block (3311) resets, one end of the first pushing block (3311) close to the second hinge shaft (3312) is abutted against the second bearing plate (331).
7. Chip loading storage device according to claim 2, wherein the first carrier plate (312) comprises a second plate portion (3121) and a third plate portion (3122), the second plate portion (3121), the third plate portion (3122) and the conveying pipeline (200) are sequentially arranged along the first direction, a pair of second slot plates (313) are respectively fixedly connected to the second plate portion (3121) and the third plate portion (3122), the pushing assembly comprises a second driving piece (3111) and a second pushing block (3112), the second driving member (3111) is fixedly connected to the second plate portion (3121), the second driving piece (3111) is configured to drive the second push block (3112) to move in the first direction toward the third plate portion (3122), so that the second push block (3112) can push the end of the material pipe (100) away from the third plate portion (3122).
8. The chip loading storage device according to claim 7, wherein a bottom of a side of the transfer duct (200) close to the third plate portion (3122) is provided with a first through hole (211), and the push assembly further comprises:
a third driving member (3113), a movable end of which is connected with a third push block (3114), wherein the third driving member (3113) is configured to drive the third push block (3114) to move up and down along a vertical direction, so that the third push block (3114) can pass through the first through hole (211) along the vertical direction and extend into the conveying pipeline (200); and
a fourth driving part (3115), the third driving part (3113) being connected to a movable end of the fourth driving part (3115), the fourth driving part (3115) being configured to drive the third driving part (3113) to move toward the second plate part (3121) along the first direction.
9. The chip loading storage device according to claim 7, further comprising a first pressing block (340) and a fifth driving member (350), wherein the fifth driving member (350) is configured to drive the first pressing block (340) to move up and down, so that the first pressing block (340) presses one end of the material pipe (100) far away from the second plate portion (3121) when the material pipe (100) is butted with the conveying pipe (200).
10. The chip loading storage device according to claim 7, wherein a second through hole (221) is provided at a top of a side of the conveying pipe (200) close to the third plate portion (3122), the chip loading storage device further comprising a second pressing block (360) and a sixth driving member (370), the sixth driving member (370) being configured to drive the second pressing block (360) to ascend and descend so that the second pressing block (360) can pass through the second through hole (221) in a vertical direction and protrude into the conveying pipe (200).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210603711.2A CN114695221B (en) | 2022-05-31 | 2022-05-31 | Chip loading and storing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210603711.2A CN114695221B (en) | 2022-05-31 | 2022-05-31 | Chip loading and storing device |
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| CN114695221A CN114695221A (en) | 2022-07-01 |
| CN114695221B true CN114695221B (en) | 2022-08-09 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001158506A (en) * | 1999-12-06 | 2001-06-12 | Daifuku Co Ltd | Load storing facility |
| CN106185138A (en) * | 2015-07-20 | 2016-12-07 | 亚洲硅业（青海）有限公司 | A kind of closed silicon core automatic access device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211970952U (en) * | 2019-12-04 | 2020-11-20 | 东莞道元自动化技术有限公司 | Pipe material storage device |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001158506A (en) * | 1999-12-06 | 2001-06-12 | Daifuku Co Ltd | Load storing facility |
| CN106185138A (en) * | 2015-07-20 | 2016-12-07 | 亚洲硅业（青海）有限公司 | A kind of closed silicon core automatic access device |
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| CN114695221A (en) | 2022-07-01 |
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