CN114660442B - Multi-probe testing device for chip - Google Patents
Multi-probe testing device for chip Download PDFInfo
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- CN114660442B CN114660442B CN202210567113.4A CN202210567113A CN114660442B CN 114660442 B CN114660442 B CN 114660442B CN 202210567113 A CN202210567113 A CN 202210567113A CN 114660442 B CN114660442 B CN 114660442B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a multi-probe testing device for chips, wherein a testing component comprises a photoelectric detector which is arranged on a driving bracket through a support, a light receiving surface of the photoelectric detector which is positioned outside a testing platform faces the testing platform, a prism is also arranged between the light receiving surface of the photoelectric detector and the testing platform, and the probe component comprises: the upper surface of one end of the base body is provided with a through hole, the upper end of the obliquely arranged through hole is positioned between the lower end of the through hole and the other end of the base body, the connecting part of a reed is fixedly connected with the upper surface of the other end of the base body, and the main part of the reed extending to the upper part of the through hole is provided with an installation through hole positioned between the connecting part and the through hole. The invention ensures the stability and consistency of the acting force between the probe and the chip when the probe is tested, and also ensures the light receiving efficiency of the photoelectric detector to the chip to be tested.
Description
Technical Field
The invention relates to a multi-probe testing device for a chip, and belongs to the technical field of chip testing.
Background
Chip size is continuously decreasing, but one chip can still package millions to 1 billion transistors, and the number of test patterns has increased to an unprecedented level. In the production test link of the Laser in the optical communication industry, before the COC aging process, the photoelectric performance test of a single Laser chip (LD) is required, so that the performance of the Laser chip (LD) is screened once before aging, the Laser with the problem performance is selected in advance, and the overall yield of the aged COC is improved.
In the testing process of a single optical communication laser chip (LD), the stability of a probe plays a very important role, the pressure change of the probe acting on the chip can cause the change of contact resistance, thereby influencing the consistency of test data, and in the long-time testing process, if the pressure change is overlarge, the change of a test result can not be distinguished because the chip or a machine brings, thereby causing the loss of the comparability of the test result, therefore, the stability of the acting force between the probe and the chip is of great importance to the precision of the test data.
Disclosure of Invention
The invention aims to provide a multi-probe testing device for a chip, which can shield and protect a through hole when a probe is not installed, is convenient for the installation and accurate and unidirectional adjustment of the probe, and can ensure the stable pressing force of a reed on the probe.
In order to achieve the purpose, the invention adopts the technical scheme that: a multi-probe test apparatus for a chip, comprising: the testing device comprises a substrate, a testing platform arranged on the upper surface of the substrate, a driving support arranged on the outer side of the substrate, at least three probe assemblies and a testing assembly, wherein the at least three probe assemblies and the testing assembly are arranged on the driving support and are positioned above the testing platform;
the probe assembly includes: the upper surface of one end of the base body is provided with a through hole, the upper end of the through hole which is obliquely arranged is positioned between the lower end of the through hole and the other end of the base body, the connecting part of a reed is fixedly connected with the upper surface of the other end of the base body, and the main body part of the reed extending above the through hole is provided with an installation through hole positioned between the connecting part and the through hole;
when the main body part of the reed is bent upwards, one end of the mounting through hole, which is far away from the connecting part, is collinear with the inclined through hole, and the upper end of the probe, the lower end of which penetrates out of the through hole, penetrates into the mounting through hole.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the drive support further includes two parallel arrangement's pole setting, connects the mounting panel between two pole setting upper ends and connects the connecting plate between two pole setting lower extremes, test assembly installs in the upper surface of mounting panel, 4 the probe subassembly is installed in the upper surface of mounting panel and evenly distributed in the test assembly both sides in proper order.
2. In the scheme, a fixing plate installed on the base plate is vertically arranged between the vertical rod of the driving support and the base plate, a motor is installed on the lower portion of the fixing plate, a lead screw arranged in the vertical direction is installed on an output shaft of the motor, and a lead screw nut sleeved on the lead screw is connected with a connecting plate of the driving support.
3. In the above scheme, the two sides of the screw rod and the position between the vertical rod and the fixed plate are respectively provided with a sliding rail, and the vertical rod is movably connected with the sliding rails through at least two sliding blocks.
4. In the above aspect, the mounting through hole is a strip-shaped through hole extending in the length direction of the reed main body.
5. In the above scheme, the connecting part of the reed is fixedly connected with the base body through at least two bolts.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the invention relates to a multi-probe testing device for chips, which is characterized in that a photoelectric detector is arranged on a driving support, the light receiving surface of the photoelectric detector positioned outside a testing platform faces the testing platform, a prism is also arranged between the light receiving surface of the photoelectric detector and the testing platform and used for collecting divergent light emitted from a chip to be tested on the testing platform into the light receiving area of the photoelectric detector, and on the basis of realizing high-efficiency testing by adopting a plurality of probes, the distance between the photoelectric detector with larger volume in a testing component and the testing platform can be enlarged to provide mounting positions for more probe components, the light receiving efficiency of the photoelectric detector to the chip to be tested can be ensured, and the precision and the stability of testing results in a multi-probe testing process can be ensured.
2. The invention relates to a multi-probe testing device for chips, wherein the upper end of a through hole which is obliquely arranged on a base body of a probe component is positioned between the lower end of the through hole and the other end of the base body, a connecting part of a reed is fixedly connected with the upper surface of the other end of the base body, a main body part of the reed which extends to the upper part of the through hole is provided with an installation through hole which is positioned between the connecting part and the through hole, the probe is installed by adopting a smaller structure, the probe is convenient to be assembled and disassembled without occupying external space in a compact space provided with a plurality of probe components, a stable triangular supporting structure can be formed among the connecting part of the reed and the base body, the contact part of the probe and the installation through hole and the contact part of the probe and the through hole, the main body part of the reed is ensured to apply continuous and stable pressure holding force to the probe and carry out accurate unidirectional adjustment to the probe, and further the stability and consistency of the acting force between the probe and the chip during testing are ensured, the precision, consistency, comparability and repeatability of the test result are improved.
Drawings
FIG. 1 is a front view of the overall structure of a multi-probe test apparatus for chips according to the present invention;
FIG. 2 is a schematic diagram of a partial structure of a multi-probe testing apparatus for a chip according to the present invention;
FIG. 3 is a schematic diagram of a partial structure of a multi-probe testing apparatus for a chip according to the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3;
FIG. 5 is a schematic structural view of a probe assembly according to the present invention in an unassembled state;
FIG. 6 is a schematic structural view showing a state in which a probe assembly is assembled with a probe according to the present invention;
FIG. 7 is a sectional view showing a structure of a probe assembly in a state where a probe is assembled according to the present invention;
FIG. 8 is a schematic structural diagram of a test assembly in the multi-probe test apparatus for chips according to the present invention.
In the above drawings: 1. a substrate; 2. a test bench; 3. a drive bracket; 301. erecting a rod; 302. mounting a plate; 303. a connecting plate; 4. a probe assembly; 5. testing the component; 501. a support; 502. a photodetector; 503. a prism; 6. a base body; 7. a probe; 8. a through hole; 9. a reed; 901. a connecting portion; 902. a main body portion; 10. mounting a through hole; 11. mounting blocks; 12. a fixing plate; 13. a motor; 14. a screw rod; 15. a feed screw nut; 16. a slide rail; 17. a slider; 18. and (4) supporting the base.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be understood in a concrete sense to those of ordinary skill in the art.
Example 1: a multi-probe test apparatus for a chip, comprising: the testing device comprises a substrate 1, a testing platform 2 arranged on the upper surface of the substrate 1, a driving bracket 3 arranged on the outer side of the substrate 1, and at least three probe assemblies 4 and testing assemblies 5 which are arranged on the driving bracket 3 and positioned above the testing platform 2, wherein each testing assembly 5 comprises a photoelectric detector 502 arranged on the driving bracket 3 through a support 501, the light receiving surface of the photoelectric detector 502 positioned on the outer side of the testing platform 2 faces the testing platform 2, a prism 503 is also arranged between the light receiving surface of the photoelectric detector 502 and the testing platform 2, and the prism 503 is used for collecting divergent light emitted from a chip to be tested on the testing platform 2 into the light receiving area of the photoelectric detector 502;
the probe assembly 4 includes: a seat body 6 connected with the driving bracket 3 and a probe 7 installed on the seat body 6, wherein the upper surface of one end of the seat body 6 is provided with a through hole 8, the upper end of the through hole 8 which is obliquely arranged is positioned between the lower end of the through hole 8 and the other end of the seat body 6, a connecting part 901 of a reed 9 is fixedly connected with the upper surface of the other end of the seat body 6, and a main body part 902 of the reed 9 which extends to the upper part of the through hole 8 is provided with an installation through hole 10 positioned between the connecting part 901 and the through hole 8;
when the main body 902 of the spring 9 is bent upward, one end of the mounting through hole 10 away from the connecting portion 901 is collinear with the inclined through hole 8, and the upper end of the probe 7, the lower end of which penetrates out of the through hole 8, penetrates into the mounting through hole 10.
The driving bracket 3 further includes two vertical rods 301 disposed in parallel, a mounting plate 302 connected between the upper ends of the two vertical rods 301, and a connecting plate 303 connected between the lower ends of the two vertical rods 301, the testing component 5 is mounted on the upper surface of the mounting plate 302, and 4 of the probe assemblies 4 are sequentially mounted on the upper surface of the mounting plate 302 and evenly distributed on both sides of the testing component 5.
A fixing plate 12 installed on the base plate 1 is vertically arranged between the upright 301 of the driving bracket 3 and the base plate 1, a motor 13 is installed on the lower portion of the fixing plate 12, a screw rod 14 arranged along the vertical direction is installed on an output shaft of the motor 13, and a screw rod nut 15 sleeved on the screw rod 14 is connected with a connecting plate 303 of the driving bracket 3.
A slide rail 16 is respectively arranged on two sides of the screw rod 14 and between the upright 301 and the fixing plate 12, and the upright 301 is movably connected with the slide rail 16 through at least two slide blocks 17.
The end of the seat 6 far away from the probe 7 is mounted on one end of the adjusting bracket through a mounting block 11, and the other end of the adjusting bracket is mounted on the mounting plate 302 of the driving bracket 3.
The attachment through-hole 10 is a strip-shaped through-hole extending in the longitudinal direction of the body 902 of the reed 9.
The prism 503 is mounted on the support 501 of the test module 5 via a support 18.
Example 2: a multi-probe test apparatus for a chip, comprising: the testing device comprises a substrate 1, a testing platform 2 arranged on the upper surface of the substrate 1, a driving bracket 3 arranged on the outer side of the substrate 1, and at least three probe assemblies 4 and testing assemblies 5 which are arranged on the driving bracket 3 and positioned above the testing platform 2, wherein each testing assembly 5 comprises a photoelectric detector 502 arranged on the driving bracket 3 through a support 501, the light receiving surface of the photoelectric detector 502 positioned on the outer side of the testing platform 2 faces the testing platform 2, a prism 503 is also arranged between the light receiving surface of the photoelectric detector 502 and the testing platform 2, and the prism 503 is used for collecting divergent light emitted from a chip to be tested on the testing platform 2 into the light receiving area of the photoelectric detector 502;
the probe assembly 4 includes: a seat body 6 connected with the driving bracket 3 and a probe 7 installed on the seat body 6, wherein the upper surface of one end of the seat body 6 is provided with a through hole 8, the upper end of the through hole 8 which is obliquely arranged is positioned between the lower end of the through hole 8 and the other end of the seat body 6, a connecting part 901 of a reed 9 is fixedly connected with the upper surface of the other end of the seat body 6, and a main body part 902 of the reed 9 which extends to the upper part of the through hole 8 is provided with an installation through hole 10 positioned between the connecting part 901 and the through hole 8;
when the main body 902 of the reed 9 is bent upwards, one end of the installation through hole 10, which is far away from the connecting part 901, is collinear with the inclined through hole 8, and the upper end of the probe 7, the lower end of which penetrates out of the through hole 8, penetrates into the installation through hole 10, when the probe 7 is not installed, the reed 9 is in an initial state of horizontal arrangement, and at the moment, one end of the reed 9 covers above the through hole 8, when the probe 7 needs to be installed, one end of the reed 9, which is provided with the installation through hole 10, is pulled upwards, the upper end of the probe 7 penetrates out of the upper end of the through hole 8 upwards from the lower end of the through hole 8 and continues to penetrate into the installation through hole 10 on the reed 9 upwards, then the reed 9 is loosened, and the reed 9 is pressed against the upper end of the probe 7 while being reset downwards; when the probes 7 are pre-loaded, the probes 7 are generally mounted upward so that the positions of the pre-loaded probes 7 are higher than the positions of the probes 7 in the test state, thereby facilitating the subsequent unidirectional downward adjustment of the positions of the probes 7 according to the requirements of the force between the probes 7 and the chip.
The attachment through-hole 10 is a strip-shaped through-hole extending in the longitudinal direction of the body 902 of the reed 9.
The connecting part 901 of the reed 9 is fixedly connected with the base body 6 through two bolts.
When the multi-probe testing device for the chips is adopted, the multi-probe testing device is arranged on the photoelectric detector on the driving support, the light receiving surface of the photoelectric detector positioned on the outer side of the testing platform faces the testing platform, a prism is also arranged between the light receiving surface of the photoelectric detector and the testing platform and used for collecting divergent light emitted by the chip to be tested on the testing platform into the light receiving area of the photoelectric detector, and on the basis of realizing high-efficiency testing by adopting a plurality of probes, the distance between the photoelectric detector with larger volume in the testing component and the testing platform can be enlarged to provide mounting positions for more probe components, the light receiving efficiency of the photoelectric detector for the chip to be tested can be ensured, and the precision and the stability of testing results in the multi-probe testing process can be ensured;
furthermore, the upper end of a through hole which is obliquely arranged on a base body of the probe component is positioned between the lower end of the through hole and the other end of the base body, a connecting part of a reed is fixedly connected with the upper surface of the other end of the base body, a mounting through hole which is positioned between the connecting part and the through hole is arranged on a main body part of the reed which extends to the upper part of the through hole, the mounting of the probe is realized by adopting a smaller structure, the probe is convenient to be mounted and dismounted without occupying external space in a compact space provided with a plurality of probe components, and a stable triangular supporting structure can be formed among three points of the connecting part of the reed and the base body, the contact part of the probe and the mounting through hole and the contact part of the probe and the through hole, so that the main body part of the reed can apply continuous and stable pressing force to the probe and carry out accurate unidirectional adjustment on the probe, and further ensure the stability and consistency of the acting force between the probe and the chip during testing, the precision, consistency, comparability and repeatability of the test result are improved.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (6)
1. A multi-probe test apparatus for a chip, comprising: base plate (1), install in testboard (2) of base plate (1) upper surface, install in drive support (3) in base plate (1) outside, install on drive support (3) and be located testboard (2) top at least three probe assembly (4) and test component (5), its characterized in that: the testing component (5) comprises a photoelectric detector (502) which is arranged on the driving support (3) through a support (501), the light receiving surface of the photoelectric detector (502) positioned on the outer side of the testing platform (2) faces the testing platform (2), a prism (503) is further arranged between the light receiving surface of the photoelectric detector (502) and the testing platform (2), and the prism (503) is used for collecting divergent light emitted from a chip to be tested on the testing platform (2) into the light receiving area of the photoelectric detector (502);
the probe assembly (4) comprises: the device comprises a base body (6) connected with a driving support (3) and a probe (7) arranged on the base body (6), wherein a through hole (8) is formed in the upper surface of one end of the base body (6), the upper end of the through hole (8) which is obliquely arranged is positioned between the lower end of the through hole (8) and the other end of the base body (6), a connecting part (901) of a reed (9) is fixedly connected with the upper surface of the other end of the base body (6), and a mounting through hole (10) which is positioned between the connecting part (901) and the through hole (8) in the base body (6) is formed in a main body part (902) of the reed (9) which extends to the upper part of the through hole (8);
when the main body part (902) of the reed (9) is bent upwards, one end of the mounting through hole (10) far away from the connecting part (901) is collinear with the inclined through hole (8), and the upper end of the probe (7) with the lower end penetrating out of the through hole (8) penetrates into the mounting through hole (10).
2. The multi-probe test apparatus for chips of claim 1, wherein: the drive bracket (3) further comprises: two parallel arrangement's pole setting (301), connect mounting panel (302) between two pole setting (301) upper ends and connect connecting plate (303) between two pole setting (301) lower extremes, install in the upper surface of mounting panel (302), 4 test component (5) probe subassembly (4) are installed in the upper surface and evenly distributed in test component (5) both sides of mounting panel (302) in proper order.
3. The multi-probe test apparatus for chips of claim 2, wherein: a fixing plate (12) installed on the base plate (1) is vertically arranged between the vertical rod (301) of the driving support (3) and the base plate (1), a motor (13) is installed on the lower portion of the fixing plate (12), a lead screw (14) arranged in the vertical direction is installed on an output shaft of the motor (13), and a lead screw nut (15) sleeved on the lead screw (14) is connected with a connecting plate (303) of the driving support (3).
4. The multi-probe test apparatus for chips of claim 3, wherein: two sides of the screw rod (14) are respectively provided with a sliding rail (16) between the vertical rod (301) and the fixing plate (12), and each vertical rod (301) is movably connected with the corresponding sliding rail (16) through at least two sliding blocks (17).
5. The multi-probe test apparatus for chips of claim 1, wherein: the mounting through hole (10) is a strip-shaped through hole extending along the length direction of the main body part (902) of the reed (9).
6. The multi-probe test apparatus for chips of claim 1, wherein: the connecting part (901) of the reed (9) is fixedly connected with the base body (6) through at least two bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210567113.4A CN114660442B (en) | 2022-05-24 | 2022-05-24 | Multi-probe testing device for chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210567113.4A CN114660442B (en) | 2022-05-24 | 2022-05-24 | Multi-probe testing device for chip |
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| CN114660442A CN114660442A (en) | 2022-06-24 |
| CN114660442B true CN114660442B (en) | 2022-08-05 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN207541218U (en) * | 2017-11-07 | 2018-06-26 | 江苏凯尔生物识别科技有限公司 | For the elastic parts of pcb board testing impedance |
| CN208334440U (en) * | 2018-06-15 | 2019-01-04 | 苏州联讯仪器有限公司 | A kind of chip of laser test spring probe component and the test device using it |
| KR102062471B1 (en) * | 2018-12-26 | 2020-01-03 | 고기돈 | Film type probe card with vertical probe for RF chip test |
| CN111442835A (en) * | 2020-05-22 | 2020-07-24 | 镭神技术（深圳）有限公司 | Laser chip test platform |
| CN215641645U (en) * | 2021-04-25 | 2022-01-25 | 广州得尔塔影像技术有限公司 | Chip test module and chip test system |
| CN113237517A (en) * | 2021-06-07 | 2021-08-10 | 英铂科学仪器(上海)有限公司 | System and device for comprehensively detecting photoelectric characteristics of two sides of chip |
| CN114324988B (en) * | 2021-07-28 | 2024-03-01 | 苏州联讯仪器股份有限公司 | Probe seat |
| CN215833555U (en) * | 2021-07-28 | 2022-02-15 | 苏州联讯仪器有限公司 | Testing mechanism of optical communication chip |
| CN114325295A (en) * | 2021-08-09 | 2022-04-12 | 苏州联讯仪器有限公司 | Test method for laser chip |
| CN216117737U (en) * | 2021-08-27 | 2022-03-22 | 镭神技术（深圳）有限公司 | Pressure-adjustable chip power-on probe mechanism with trigger function |
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Address after: Building 5, No. 1508, Xiangjiang Road, Suzhou High-tech Zone, Suzhou City, Jiangsu Province 215129 Patentee after: Suzhou Lianxun Instrument Co.,Ltd. Address before: 215011 Building 5, no.1508 Xiangjiang Road, high tech Zone, Suzhou City, Jiangsu Province Patentee before: STELIGHT INSTRUMENT Inc. |