CN114641931A - 弹性波装置 - Google Patents

弹性波装置 Download PDF

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Publication number
CN114641931A
CN114641931A CN202080076647.6A CN202080076647A CN114641931A CN 114641931 A CN114641931 A CN 114641931A CN 202080076647 A CN202080076647 A CN 202080076647A CN 114641931 A CN114641931 A CN 114641931A
Authority
CN
China
Prior art keywords
silicon carbide
elastic wave
wave device
carbide substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080076647.6A
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English (en)
Chinese (zh)
Inventor
岩本英树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN114641931A publication Critical patent/CN114641931A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02047—Treatment of substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H03H9/14541—Multilayer finger or busbar electrode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
CN202080076647.6A 2019-11-06 2020-11-05 弹性波装置 Pending CN114641931A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019201522 2019-11-06
JP2019201524 2019-11-06
JP2019-201522 2019-11-06
JP2019-201524 2019-11-06
PCT/JP2020/041292 WO2021090861A1 (ja) 2019-11-06 2020-11-05 弾性波装置

Publications (1)

Publication Number Publication Date
CN114641931A true CN114641931A (zh) 2022-06-17

Family

ID=75849943

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080076647.6A Pending CN114641931A (zh) 2019-11-06 2020-11-05 弹性波装置

Country Status (5)

Country Link
US (1) US12587162B2 (https=)
JP (1) JP7380703B2 (https=)
KR (1) KR102709465B1 (https=)
CN (1) CN114641931A (https=)
WO (1) WO2021090861A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102844652B1 (ko) * 2023-07-14 2025-08-11 (주)와이솔 스퓨리어스의 여진이 억제된 표면탄성파 소자
CN117013984B (zh) * 2023-08-21 2024-05-28 天通瑞宏科技有限公司 一种键合晶圆及薄膜声表面波器件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070090898A1 (en) * 2003-12-16 2007-04-26 Murata Manufacturing Co., Ltd. Boundary acoustic wave device
US20080169474A1 (en) * 2003-03-03 2008-07-17 Cree, Inc. Integrated Nitride and Silicon Carbide-Based Devices and Methods of Fabricating Integrated Nitride-Based Devices
JP2013101018A (ja) * 2011-11-08 2013-05-23 Seiko Epson Corp センサー素子、力検出装置およびロボット
US20140225684A1 (en) * 2011-10-24 2014-08-14 Murata Manufacturing Co., Ltd. Surface acoustic wave device
US20180205361A1 (en) * 2015-10-23 2018-07-19 Murata Manufacturing Co., Ltd. Elastic wave device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08310900A (ja) * 1995-05-10 1996-11-26 Sumitomo Electric Ind Ltd 窒化物薄膜単結晶及びその製造方法
JP2007182335A (ja) 2006-01-05 2007-07-19 Toshiba Ceramics Co Ltd 単結晶薄膜およびその形成方法
JP2007228225A (ja) 2006-02-23 2007-09-06 Seiko Epson Corp 弾性表面波デバイス
KR101082201B1 (ko) 2009-01-09 2011-11-09 울산대학교 산학협력단 표면탄성파 소자
JP5354020B2 (ja) 2009-10-13 2013-11-27 株式会社村田製作所 弾性表面波装置
CN106209007B (zh) 2010-12-24 2019-07-05 株式会社村田制作所 弹性波装置
JP2019114986A (ja) 2017-12-25 2019-07-11 株式会社村田製作所 弾性波装置
JP2019146143A (ja) 2018-02-21 2019-08-29 住友金属鉱山株式会社 表面弾性波素子用複合基板とその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080169474A1 (en) * 2003-03-03 2008-07-17 Cree, Inc. Integrated Nitride and Silicon Carbide-Based Devices and Methods of Fabricating Integrated Nitride-Based Devices
US20070090898A1 (en) * 2003-12-16 2007-04-26 Murata Manufacturing Co., Ltd. Boundary acoustic wave device
US20140225684A1 (en) * 2011-10-24 2014-08-14 Murata Manufacturing Co., Ltd. Surface acoustic wave device
JP2013101018A (ja) * 2011-11-08 2013-05-23 Seiko Epson Corp センサー素子、力検出装置およびロボット
US20180205361A1 (en) * 2015-10-23 2018-07-19 Murata Manufacturing Co., Ltd. Elastic wave device

Also Published As

Publication number Publication date
US20220255527A1 (en) 2022-08-11
JP7380703B2 (ja) 2023-11-15
WO2021090861A1 (ja) 2021-05-14
JPWO2021090861A1 (https=) 2021-05-14
KR102709465B1 (ko) 2024-09-24
US12587162B2 (en) 2026-03-24
KR20220075403A (ko) 2022-06-08

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