CN114641727B - 感光性组合物的制造方法及制备用预混液、感光性组合物、干膜及抗蚀剂膜的制造方法 - Google Patents

感光性组合物的制造方法及制备用预混液、感光性组合物、干膜及抗蚀剂膜的制造方法

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Publication number
CN114641727B
CN114641727B CN202080076631.5A CN202080076631A CN114641727B CN 114641727 B CN114641727 B CN 114641727B CN 202080076631 A CN202080076631 A CN 202080076631A CN 114641727 B CN114641727 B CN 114641727B
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group
carbon atoms
photosensitive composition
acid
sulfur
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CN114641727A (zh
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小岛大辅
海老泽和明
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN202080076631.5A 2019-11-12 2020-10-16 感光性组合物的制造方法及制备用预混液、感光性组合物、干膜及抗蚀剂膜的制造方法 Active CN114641727B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019205087A JP6999627B2 (ja) 2019-11-12 2019-11-12 化学増幅型感光性組成物の製造方法
JP2019-205087 2019-11-12
PCT/JP2020/039019 WO2021095437A1 (ja) 2019-11-12 2020-10-16 化学増幅型感光性組成物の製造方法、化学増幅型感光性組成物調製用プレミックス液、化学増幅型感光性組成物、感光性ドライフィルムの製造方法及びパターン化されたレジスト膜の製造方法

Publications (2)

Publication Number Publication Date
CN114641727A CN114641727A (zh) 2022-06-17
CN114641727B true CN114641727B (zh) 2026-04-17

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Country Status (6)

Country Link
US (1) US20230004085A1 (https=)
JP (2) JP6999627B2 (https=)
KR (1) KR102807204B1 (https=)
CN (1) CN114641727B (https=)
TW (1) TWI865638B (https=)
WO (1) WO2021095437A1 (https=)

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Publication number Priority date Publication date Assignee Title
TW202330663A (zh) * 2021-11-17 2023-08-01 德商馬克專利公司 正型超厚光阻組合物
JP7105021B1 (ja) 2022-03-10 2022-07-22 佐伯重工業株式会社 輸送機器
KR20250029198A (ko) * 2022-07-29 2025-03-04 후지필름 가부시키가이샤 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법 및 전자 디바이스의 제조 방법

Citations (2)

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CN106019830A (zh) * 2015-03-31 2016-10-12 住友化学株式会社 抗蚀剂组合物及抗蚀图案的制造方法
JP2019052142A (ja) * 2017-09-15 2019-04-04 住友化学株式会社 化合物、レジスト組成物及びレジストパターンの製造方法

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JP3921748B2 (ja) 1997-08-08 2007-05-30 住友化学株式会社 フォトレジスト組成物
KR101175080B1 (ko) * 2007-12-26 2012-10-26 아사히 가세이 이-매터리얼즈 가부시키가이샤 내열성 수지 전구체 및 그것을 사용한 감광성 수지 조성물
JP2009176112A (ja) 2008-01-25 2009-08-06 Mazda Motor Corp 乗員の視線検出装置
JP2009271146A (ja) * 2008-04-30 2009-11-19 Tokyo Ohka Kogyo Co Ltd レジスト組成物およびレジストパターン形成方法
TW201016651A (en) * 2008-07-28 2010-05-01 Sumitomo Chemical Co Oxime compound and resist composition containing the same
JP5593678B2 (ja) * 2009-11-10 2014-09-24 デクセリアルズ株式会社 キノンジアジド系感光剤溶液及びポジ型レジスト組成物
JP2012185482A (ja) * 2011-02-16 2012-09-27 Sumitomo Chemical Co Ltd レジスト組成物
US8841062B2 (en) 2012-12-04 2014-09-23 Az Electronic Materials (Luxembourg) S.A.R.L. Positive working photosensitive material
CN104460232B (zh) 2013-09-24 2019-11-15 住友化学株式会社 光致抗蚀剂组合物
TWI731961B (zh) 2016-04-19 2021-07-01 德商馬克專利公司 正向感光材料及形成正向凸紋影像之方法
JP7002966B2 (ja) * 2018-03-12 2022-01-20 東京応化工業株式会社 化学増幅型ポジ型感光性樹脂組成物、鋳型付き基板の製造方法、及びめっき造形物の製造方法
KR102922401B1 (ko) * 2018-12-12 2026-02-05 제이에스알 가부시키가이샤 도금 조형물의 제조 방법

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
CN106019830A (zh) * 2015-03-31 2016-10-12 住友化学株式会社 抗蚀剂组合物及抗蚀图案的制造方法
JP2019052142A (ja) * 2017-09-15 2019-04-04 住友化学株式会社 化合物、レジスト組成物及びレジストパターンの製造方法

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Publication number Publication date
JP7393408B2 (ja) 2023-12-06
KR20220101615A (ko) 2022-07-19
WO2021095437A1 (ja) 2021-05-20
CN114641727A (zh) 2022-06-17
JP2021076784A (ja) 2021-05-20
TWI865638B (zh) 2024-12-11
US20230004085A1 (en) 2023-01-05
KR102807204B1 (ko) 2025-05-13
TW202124592A (zh) 2021-07-01
JP6999627B2 (ja) 2022-01-18
JP2022037181A (ja) 2022-03-08

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