CN114631226B - 高频线路连接结构 - Google Patents

高频线路连接结构 Download PDF

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Publication number
CN114631226B
CN114631226B CN201980101823.4A CN201980101823A CN114631226B CN 114631226 B CN114631226 B CN 114631226B CN 201980101823 A CN201980101823 A CN 201980101823A CN 114631226 B CN114631226 B CN 114631226B
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CN
China
Prior art keywords
line
signal
ground
frequency
substrate
Prior art date
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Active
Application number
CN201980101823.4A
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English (en)
Chinese (zh)
Other versions
CN114631226A (zh
Inventor
田野边博正
尾崎常祐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entiti Corp
Original Assignee
Nippon Telegraph and Telephone Corp
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Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Publication of CN114631226A publication Critical patent/CN114631226A/zh
Application granted granted Critical
Publication of CN114631226B publication Critical patent/CN114631226B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/003—Coplanar lines
    • H01P3/006—Conductor backed coplanar waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/2007—Filtering devices for biasing networks or DC returns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Waveguide Connection Structure (AREA)
CN201980101823.4A 2019-10-29 2019-10-29 高频线路连接结构 Active CN114631226B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/042293 WO2021084601A1 (ja) 2019-10-29 2019-10-29 高周波線路接続構造

Publications (2)

Publication Number Publication Date
CN114631226A CN114631226A (zh) 2022-06-14
CN114631226B true CN114631226B (zh) 2024-01-16

Family

ID=75715879

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980101823.4A Active CN114631226B (zh) 2019-10-29 2019-10-29 高频线路连接结构

Country Status (6)

Country Link
US (1) US12278413B2 (https=)
EP (1) EP4053992B1 (https=)
JP (1) JP7255702B2 (https=)
CN (1) CN114631226B (https=)
CA (1) CA3158938C (https=)
WO (1) WO2021084601A1 (https=)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61259467A (ja) * 1985-05-13 1986-11-17 富士通株式会社 ジヤンパ−チツプ
JPS6337082U (https=) * 1986-08-27 1988-03-10
JPH02165510A (ja) * 1988-12-19 1990-06-26 Mitsubishi Electric Corp マイクロ波集積回路装置
US5270673A (en) * 1992-07-24 1993-12-14 Hewlett-Packard Company Surface mount microcircuit hybrid
US5426399A (en) * 1993-02-04 1995-06-20 Mitsubishi Electric Corp Film carrier signal transmission line having separating grooves
CN1317829A (zh) * 2000-04-04 2001-10-17 株式会社东金 高频电流抑制型电子元件及其接合线
CN1591852A (zh) * 2003-08-25 2005-03-09 威盛电子股份有限公司 一种高频集成电路多排线打线结构及方法
CN1595648A (zh) * 2003-10-09 2005-03-16 威盛电子股份有限公司 一种高频集成电路多排线打线结构
CN102196657A (zh) * 2010-03-09 2011-09-21 凌阳科技股份有限公司 线路基板
WO2012099837A1 (en) * 2011-01-20 2012-07-26 3M Innovative Properties Company Substrate and electronic component including same
WO2013001705A1 (ja) * 2011-06-30 2013-01-03 株式会社日立製作所 プリント基板伝送系
CN105742263A (zh) * 2014-12-30 2016-07-06 美国亚德诺半导体公司 高频集成电路及其封装
CN107078441A (zh) * 2014-09-30 2017-08-18 光电缆公司 用于串扰控制的非连续层高频rj45插头

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI360912B (en) * 2008-04-25 2012-03-21 Univ Nat Chiao Tung Vertical transition structure
US9013891B2 (en) * 2012-03-09 2015-04-21 Finisar Corporation 3-D integrated package
US9627736B1 (en) * 2013-10-23 2017-04-18 Mark W. Ingalls Multi-layer microwave crossover connected by vertical vias having partial arc shapes
WO2018003332A1 (ja) * 2016-06-27 2018-01-04 Ｎｇｋエレクトロデバイス株式会社 高周波用セラミックス基板および高周波用半導体素子収納パッケージ

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61259467A (ja) * 1985-05-13 1986-11-17 富士通株式会社 ジヤンパ−チツプ
JPS6337082U (https=) * 1986-08-27 1988-03-10
JPH02165510A (ja) * 1988-12-19 1990-06-26 Mitsubishi Electric Corp マイクロ波集積回路装置
US5270673A (en) * 1992-07-24 1993-12-14 Hewlett-Packard Company Surface mount microcircuit hybrid
US5426399A (en) * 1993-02-04 1995-06-20 Mitsubishi Electric Corp Film carrier signal transmission line having separating grooves
CN1317829A (zh) * 2000-04-04 2001-10-17 株式会社东金 高频电流抑制型电子元件及其接合线
CN1591852A (zh) * 2003-08-25 2005-03-09 威盛电子股份有限公司 一种高频集成电路多排线打线结构及方法
CN1595648A (zh) * 2003-10-09 2005-03-16 威盛电子股份有限公司 一种高频集成电路多排线打线结构
CN102196657A (zh) * 2010-03-09 2011-09-21 凌阳科技股份有限公司 线路基板
WO2012099837A1 (en) * 2011-01-20 2012-07-26 3M Innovative Properties Company Substrate and electronic component including same
WO2013001705A1 (ja) * 2011-06-30 2013-01-03 株式会社日立製作所 プリント基板伝送系
CN107078441A (zh) * 2014-09-30 2017-08-18 光电缆公司 用于串扰控制的非连续层高频rj45插头
CN105742263A (zh) * 2014-12-30 2016-07-06 美国亚德诺半导体公司 高频集成电路及其封装

Also Published As

Publication number Publication date
EP4053992B1 (en) 2024-10-09
US12278413B2 (en) 2025-04-15
CA3158938A1 (en) 2021-05-06
EP4053992A4 (en) 2023-08-02
JP7255702B2 (ja) 2023-04-11
EP4053992A1 (en) 2022-09-07
CA3158938C (en) 2023-08-29
WO2021084601A1 (ja) 2021-05-06
US20220384928A1 (en) 2022-12-01
JPWO2021084601A1 (https=) 2021-05-06
CN114631226A (zh) 2022-06-14

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Address after: Tokyo, Japan

Patentee after: Entiti Corp.

Country or region after: Japan

Address before: Tokyo, Japan

Patentee before: NIPPON TELEGRAPH AND TELEPHONE Corp.

Country or region before: Japan