CN114602873A - 一种半导体晶圆槽式清洗机 - Google Patents
一种半导体晶圆槽式清洗机 Download PDFInfo
- Publication number
- CN114602873A CN114602873A CN202210293518.3A CN202210293518A CN114602873A CN 114602873 A CN114602873 A CN 114602873A CN 202210293518 A CN202210293518 A CN 202210293518A CN 114602873 A CN114602873 A CN 114602873A
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- Prior art keywords
- cleaning
- tank
- manipulator
- cylinder
- semiconductor wafer
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- 238000004140 cleaning Methods 0.000 title claims abstract description 127
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 230000007246 mechanism Effects 0.000 claims abstract description 43
- 230000001360 synchronised effect Effects 0.000 claims abstract description 26
- 230000008859 change Effects 0.000 claims abstract description 16
- 210000000078 claw Anatomy 0.000 claims abstract description 13
- 235000012431 wafers Nutrition 0.000 claims description 48
- 238000005406 washing Methods 0.000 claims description 39
- 230000009471 action Effects 0.000 claims description 27
- 230000005540 biological transmission Effects 0.000 claims description 20
- 230000009977 dual effect Effects 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 244000309464 bull Species 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 230000007306 turnover Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 230000033001 locomotion Effects 0.000 abstract description 20
- 230000000694 effects Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000126 substance Substances 0.000 description 6
- 230000005012 migration Effects 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/045—Cleaning involving contact with liquid using perforated containers, e.g. baskets, or racks immersed and agitated in a liquid bath
- B08B3/047—Containers specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/087—Cleaning containers, e.g. tanks by methods involving the use of tools, e.g. brushes, scrapers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210293518.3A CN114602873B (zh) | 2022-03-24 | 2022-03-24 | 一种半导体晶圆槽式清洗机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210293518.3A CN114602873B (zh) | 2022-03-24 | 2022-03-24 | 一种半导体晶圆槽式清洗机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114602873A true CN114602873A (zh) | 2022-06-10 |
CN114602873B CN114602873B (zh) | 2022-12-30 |
Family
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Family Applications (1)
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CN202210293518.3A Active CN114602873B (zh) | 2022-03-24 | 2022-03-24 | 一种半导体晶圆槽式清洗机 |
Country Status (1)
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CN (1) | CN114602873B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115121568A (zh) * | 2022-06-28 | 2022-09-30 | 智程半导体设备科技(昆山)有限公司 | 一种晶圆生产用槽式清洗机 |
CN116936395A (zh) * | 2023-08-31 | 2023-10-24 | 苏州智程半导体科技股份有限公司 | 一种晶圆花篮上料移动平衡检测机构及检测方法 |
CN118039541A (zh) * | 2024-04-10 | 2024-05-14 | 苏州智程半导体科技股份有限公司 | 一种晶圆清洗用上下料机械手 |
CN118162426A (zh) * | 2024-05-14 | 2024-06-11 | 山东知林新材料有限公司 | 一种提取贵金属的电解质槽的清洁设备 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2861699A (en) * | 1950-10-16 | 1958-11-25 | Gen Mills Inc | Method and apparatus for performing operations at a remote point |
CN2112727U (zh) * | 1992-01-10 | 1992-08-12 | 山东省煤炭科学研究所 | 变速三角胶带轮 |
WO2015129997A1 (ko) * | 2014-02-28 | 2015-09-03 | 송인희 | 브러시 세척장치 |
CN207364206U (zh) * | 2017-10-09 | 2018-05-15 | 福州市晋安区技智企业管理咨询有限公司 | 一种可变轮距无级变速器 |
CN208679978U (zh) * | 2018-08-11 | 2019-04-02 | 山东联盛电子设备有限公司 | 一种晶片清洗机的抓取机械手 |
CN111016026A (zh) * | 2019-11-26 | 2020-04-17 | 杨春萌 | 一种高分子材料生产用的自清洁冷却槽 |
CN212136398U (zh) * | 2020-06-29 | 2020-12-11 | 乐山嘉洋科技发展有限公司 | 晶圆自动清洗机 |
-
2022
- 2022-03-24 CN CN202210293518.3A patent/CN114602873B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2861699A (en) * | 1950-10-16 | 1958-11-25 | Gen Mills Inc | Method and apparatus for performing operations at a remote point |
CN2112727U (zh) * | 1992-01-10 | 1992-08-12 | 山东省煤炭科学研究所 | 变速三角胶带轮 |
WO2015129997A1 (ko) * | 2014-02-28 | 2015-09-03 | 송인희 | 브러시 세척장치 |
CN207364206U (zh) * | 2017-10-09 | 2018-05-15 | 福州市晋安区技智企业管理咨询有限公司 | 一种可变轮距无级变速器 |
CN208679978U (zh) * | 2018-08-11 | 2019-04-02 | 山东联盛电子设备有限公司 | 一种晶片清洗机的抓取机械手 |
CN111016026A (zh) * | 2019-11-26 | 2020-04-17 | 杨春萌 | 一种高分子材料生产用的自清洁冷却槽 |
CN212136398U (zh) * | 2020-06-29 | 2020-12-11 | 乐山嘉洋科技发展有限公司 | 晶圆自动清洗机 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115121568A (zh) * | 2022-06-28 | 2022-09-30 | 智程半导体设备科技(昆山)有限公司 | 一种晶圆生产用槽式清洗机 |
CN115121568B (zh) * | 2022-06-28 | 2023-03-28 | 苏州智程半导体科技股份有限公司 | 一种晶圆生产用槽式清洗机 |
CN116936395A (zh) * | 2023-08-31 | 2023-10-24 | 苏州智程半导体科技股份有限公司 | 一种晶圆花篮上料移动平衡检测机构及检测方法 |
CN116936395B (zh) * | 2023-08-31 | 2023-11-24 | 苏州智程半导体科技股份有限公司 | 一种晶圆花篮上料移动平衡检测机构及检测方法 |
CN118039541A (zh) * | 2024-04-10 | 2024-05-14 | 苏州智程半导体科技股份有限公司 | 一种晶圆清洗用上下料机械手 |
CN118162426A (zh) * | 2024-05-14 | 2024-06-11 | 山东知林新材料有限公司 | 一种提取贵金属的电解质槽的清洁设备 |
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CN114602873B (zh) | 2022-12-30 |
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Address after: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
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CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 215000, No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |