CN114600061A - 功能底座 - Google Patents
功能底座 Download PDFInfo
- Publication number
- CN114600061A CN114600061A CN202080040991.XA CN202080040991A CN114600061A CN 114600061 A CN114600061 A CN 114600061A CN 202080040991 A CN202080040991 A CN 202080040991A CN 114600061 A CN114600061 A CN 114600061A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- base
- data interface
- functional
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 51
- 239000010439 graphite Substances 0.000 claims abstract description 51
- 238000002791 soaking Methods 0.000 claims description 53
- 238000003825 pressing Methods 0.000 claims description 21
- 238000009434 installation Methods 0.000 claims 2
- 230000007704 transition Effects 0.000 claims 1
- 230000003993 interaction Effects 0.000 abstract description 8
- 238000009825 accumulation Methods 0.000 abstract description 3
- 238000009792 diffusion process Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005236 sound signal Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
提供一种功能底座,其与云台连接,用于扩展云台的功能,功能底座包括数据接口(10)、底座本体(20)和至少一个石墨片;数据接口与云台可拆卸地连接,数据接口与底座本体固定连接,石墨片与底座本体直接连接或间接连接。其中,数据接口与云台连接后,数据接口产生热量并传递至底座本体,石墨片用于将数据接口产生的热量扩散。石墨片的设置能够降低数据接口的位置热量堆积,提高云台和功能底座数据交互的稳定性。
Description
PCT国内申请,说明书已公开。
Claims (15)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2020/122286 WO2022082460A1 (zh) | 2020-10-20 | 2020-10-20 | 功能底座 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114600061A true CN114600061A (zh) | 2022-06-07 |
Family
ID=81291268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202080040991.XA Pending CN114600061A (zh) | 2020-10-20 | 2020-10-20 | 功能底座 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN114600061A (zh) |
WO (1) | WO2022082460A1 (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050013112A1 (en) * | 2003-07-18 | 2005-01-20 | Lin Chein Ming | Industry computer structure with two expansive forms |
CN204733489U (zh) * | 2015-07-20 | 2015-10-28 | 南安市腾龙专利应用服务有限公司 | 一种手持电子设备及其扩展座 |
CN109917857A (zh) * | 2019-03-12 | 2019-06-21 | 章丽蓉 | 一种便于拆装的多功能计算机扩充座 |
CN110737305A (zh) * | 2019-09-20 | 2020-01-31 | 环胜电子(深圳)有限公司 | 具无线充电的多功能扩充座 |
CN110891405A (zh) * | 2019-11-29 | 2020-03-17 | 洪泰智造(青岛)信息技术有限公司 | 具有工作站功能的手机、散热装置和工作状态的切换方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7768785B2 (en) * | 2004-09-29 | 2010-08-03 | Super Talent Electronics, Inc. | Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive |
CN204633854U (zh) * | 2015-05-19 | 2015-09-09 | 孟丽娟 | 多功能的手机支架装置 |
CN207096869U (zh) * | 2017-07-11 | 2018-03-13 | 梁亚博 | 一种信息管理使用的多媒体装置 |
-
2020
- 2020-10-20 WO PCT/CN2020/122286 patent/WO2022082460A1/zh active Application Filing
- 2020-10-20 CN CN202080040991.XA patent/CN114600061A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050013112A1 (en) * | 2003-07-18 | 2005-01-20 | Lin Chein Ming | Industry computer structure with two expansive forms |
CN204733489U (zh) * | 2015-07-20 | 2015-10-28 | 南安市腾龙专利应用服务有限公司 | 一种手持电子设备及其扩展座 |
CN109917857A (zh) * | 2019-03-12 | 2019-06-21 | 章丽蓉 | 一种便于拆装的多功能计算机扩充座 |
CN110737305A (zh) * | 2019-09-20 | 2020-01-31 | 环胜电子(深圳)有限公司 | 具无线充电的多功能扩充座 |
CN110891405A (zh) * | 2019-11-29 | 2020-03-17 | 洪泰智造(青岛)信息技术有限公司 | 具有工作站功能的手机、散热装置和工作状态的切换方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2022082460A1 (zh) | 2022-04-28 |
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