WO2020248744A1 - 壳体及电子设备 - Google Patents

壳体及电子设备 Download PDF

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Publication number
WO2020248744A1
WO2020248744A1 PCT/CN2020/088868 CN2020088868W WO2020248744A1 WO 2020248744 A1 WO2020248744 A1 WO 2020248744A1 CN 2020088868 W CN2020088868 W CN 2020088868W WO 2020248744 A1 WO2020248744 A1 WO 2020248744A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
electronic component
heat
middle frame
area
Prior art date
Application number
PCT/CN2020/088868
Other languages
English (en)
French (fr)
Inventor
贾玉虎
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to EP20822550.8A priority Critical patent/EP3965541A4/en
Publication of WO2020248744A1 publication Critical patent/WO2020248744A1/zh
Priority to US17/535,169 priority patent/US11641728B2/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/2099—Liquid coolant with phase change

Definitions

  • This application relates to the field of consumer electronic equipment, and in particular to a housing and electronic equipment.
  • the traditional way of heat dissipation of electronic equipment is mainly by adding graphite or copper foil inside the electronic equipment with good thermal conductivity heat dissipation materials.
  • the heat is transferred to the metal parts of the electronic equipment shell through the heat dissipation material, and finally radiated to the outside of the electronic equipment to make the electronic equipment The temperature drops.
  • heat dissipation materials such as graphite or copper foil, the heat concentrated at each point cannot be dissipated in time, and the heat dissipation effect of the electronic equipment is not good.
  • the present application provides a housing and an electronic device to solve the above-mentioned problems.
  • the present application provides a housing, which is applied to an electronic device.
  • the housing includes a middle frame, a heat-conducting member and a protective member.
  • the middle frame is provided with a first accommodating area, and the first accommodating area is used for installing electronic components of electronic equipment;
  • the middle frame is also provided with an accommodating groove, which penetrates the middle frame and is connected to the first accommodating area.
  • the heat-conducting element is accommodated in the accommodating groove
  • the protective part is at least partially accommodated in the accommodating groove and is arranged on a side of the heat-conducting element facing the first accommodating area.
  • the present application also provides an electronic device, which includes the above-mentioned housing, first electronic component and display panel.
  • the first electronic component is accommodated in the first accommodating area and opposite to the protective part.
  • the display panel is located on the side of the middle frame away from the first receiving area.
  • the application also provides an electronic device, which includes the above-mentioned housing, a first electronic component and a second electronic component.
  • the first electronic component is disposed in the first accommodating area of the middle frame, and the second electronic component is connected to the middle frame and spaced apart from the first electronic component.
  • the protective member includes a first section and a second section connected to the first section. The first section is disposed opposite to the first electronic component, and the second section is disposed opposite to the second electronic component.
  • the protective member is opposed to or in contact with the electronic component arranged in the first containing area, and further, the heat emitted by the first electronic component is transferred to other positions of the electronic device through the protective member and the heat conducting member. Dissipate to realize the uniform heat of the electronic equipment, avoid local overheating of the electronic equipment, and improve the heat dissipation efficiency of the electronic equipment. At the same time, by arranging the protective member, it is possible to prevent the heat-conducting member from damaging the battery when it moves, thereby improving the reliability of the electronic device.
  • FIG. 1 is a schematic diagram of a front projection of an electronic device provided by an embodiment of the application.
  • Fig. 2 is a schematic diagram of the disassembly of the electronic device shown in Fig. 1.
  • Fig. 3 is a schematic cross-sectional view of the electronic device shown in Fig. 1 along the line A-A.
  • FIG. 4 is an enlarged schematic diagram of the IV area of the electronic device shown in FIG. 3.
  • Fig. 5 is a schematic cross-sectional view of the electronic device shown in Fig. 1 along the line B-B.
  • FIG. 6 is an enlarged schematic diagram of an embodiment of the V area of the electronic device shown in FIG. 5.
  • FIG. 7 is an enlarged schematic diagram of another embodiment of the V area of the electronic device shown in FIG. 5.
  • FIG. 8 is a schematic cross-sectional view of the heat conducting member of the electronic device shown in FIG. 1.
  • the traditional way of heat dissipation of electronic equipment is mainly by adding graphite or copper foil inside the electronic equipment with good thermal conductivity heat dissipation materials.
  • the heat is transferred to the metal parts of the electronic equipment shell through the heat dissipation material, and finally radiated to the outside of the electronic equipment to make the electronic equipment The temperature drops.
  • heat dissipation materials such as graphite or copper foil, the heat concentrated at each point cannot be dissipated in time, and the heat dissipation effect of the electronic equipment is not good.
  • the inventor has conducted a lot of research on the heat dissipation structure of the electronic device.
  • the inventor found that a heat pipe can be used to guide the heat at the position of the heat source to the position of the battery compartment for uniform heating and heat dissipation, thereby avoiding local overheating of the electronic device.
  • the battery compartment can be partially broken.
  • the lower end of the heat pipe is likely to be partially misaligned, which may puncture the battery and bring safety hazards to electronic equipment.
  • the inventor continues to study how to prevent the misalignment of the heat pipe and protect the battery without changing the thickness of the electronic device, so as to realize the heat equalization and heat dissipation of the electronic device, thereby improving the heat dissipation performance of the electronic device.
  • the inventor's research includes: how to avoid misalignment of the heat pipe in the electronic device, how to make the position of the heat pipe and the battery relatively fixed, how to make the heat dissipation structure realize rapid heat dissipation in the electronic device, and so on. After a large number of repeated comparisons and researches, the inventor further conducted research on how to design a heat dissipation structure that can realize uniform heat in the electronic device, and thus proposed the solution of the embodiment of the present application.
  • an embodiment of the present application provides an electronic device 100.
  • the electronic device 100 may be, but is not limited to, electronic devices such as a mobile phone, a tablet computer, and a smart watch.
  • the electronic device 100 of this embodiment is described by taking a mobile phone as an example.
  • the electronic device 100 includes a housing 200, a display panel 130, a first electronic component 150, and a second electronic component 170.
  • the housing 200 and the display panel 130 jointly form a receiving cavity, and the first electronic component 150 and the second electronic component 170 are accommodated in the receiving cavity.
  • the housing 200 can provide protection for the first electronic component 150 and the second electronic component 170, and prevent the first electronic component 150 and the second electronic component 170 from being impacted by external forces and causing internal components to be displaced or damaged, thereby prolonging the use of the electronic device 100 life.
  • the display panel 130 is a screen with a display function to display related interfaces or information of the electronic device 100 for the user to watch or operate.
  • the first electronic component 150 is a battery, that is, the first electronic component 150 is an energy supply component of the electronic device 100 to provide the power required for the normal operation of the electronic device 100.
  • the second electronic component 170 includes any one or more of a central processing unit, a camera, a fingerprint recognition module, and a sensor. The second electronic component 170 is electrically connected to the display panel 130 and the first electronic component 150 to achieve Related functions of the electronic device 100. The specific structures of the first electronic element 150, the second electronic element 170 and the display panel 130 are not described here.
  • first electronic component 150 and the second electronic component 170 will emit heat during operation, and the heat emitted by the first electronic component 150 and the second electronic component 170 is an important source of heat generated by the electronic device 100. That is, the heat of the first electronic component 150 and the second electronic component 170 will cause the electronic device 100 to generate heat, which affects the experience and service life of the electronic device 100.
  • the housing 200 includes a middle frame 210, a heat conducting member 230 and a protective member 250.
  • the middle frame 210 is provided with a first receiving area 211, and the first receiving area 211 is used for installing the first electronic component 150.
  • the middle frame 210 is further provided with a receiving groove 213, which penetrates the middle frame 210 and communicates with the first receiving area 211.
  • the heat-conducting member 230 is accommodated in the accommodating groove 213, and the protective member 250 is at least partially accommodated in the accommodating groove 213 and is located on the side of the heat-conducting member 230 facing the first accommodating area 211.
  • the protective member 250 is opposed to or in contact with the first electronic component 150 disposed in the first receiving area 211, and further, the heat emitted by the first electronic component 150 is transferred to other positions of the electronic device 100 through the protective member 250 and the heat conducting member 230 Then, it is emitted to realize the uniform heat of the electronic device 100, avoid local overheating of the electronic device 100, and improve the heat dissipation efficiency of the electronic device 100.
  • the thermal conductive member 230 can be prevented from damaging the first electronic component 150 when it is misaligned (for example, when it is impacted by an external force, or the structure is loose), thereby improving the reliability of the electronic device 100.
  • the middle frame 210 is used to mount or carry the first electronic component 150 and the second electronic component 170, so as to limit the positions of the first electronic component 150 and the second electronic component 170, thereby ensuring that the The displacement of 150 and the second electronic component 170 causes the electronic device 100 to malfunction.
  • the middle frame 210 is further provided with a second accommodating area 215, and the second accommodating area 215 is used to install the second electronic component 170 to limit the position of the second electronic component 170.
  • the second receiving area 215 and the first receiving area 211 are located on the same side of the middle frame 210, and the second receiving area 215 is arranged adjacent to the first receiving area 211.
  • the first electronic component 150 and the second electronic component 170 are located on the same side of the middle frame 210.
  • the volume of the second electronic component 170 is smaller than the volume of the first electronic component 150. Therefore, the area where the middle frame 210 forms the second receiving area 215 may be smaller than the area where the middle frame 210 forms the first receiving area 211.
  • the middle frame 210 includes a first surface 212 and a second surface 214 that are away from each other.
  • the first receiving area 211 and the second receiving area 215 are both provided on the first surface 212.
  • both the first accommodating area 211 and the second accommodating area 215 protrude from the first surface 212 to form a frame-like structure to limit the first electronic component 150 and the second electronic component 170.
  • the first surface 212 can be used as the bottom wall of the first accommodating area 211 and the second accommodating area 215 to support The first electronic component 150 in the area 211 and the second electronic component 170 in the second receiving area 215 are further restricted.
  • the first receiving area 211 and the second receiving area 215 may be located on opposite sides of the middle frame 210.
  • the first receiving area 211 is provided on the first surface 212 and the second receiving area 215 is provided on the second surface 214.
  • first storage area 211 and the second storage area 215 are to distinguish the area where the first electronic component 150 is accommodated from the area where the second electronic component 170 is accommodated in the electronic device 100 for ease of description. It does not form a specific limit.
  • the display panel 130 is disposed on the side of the middle frame 210 away from the first receiving area 211, that is, the display panel 130 is substantially opposite to the second surface 214.
  • the display panel 130 and the first electronic component 150 and the second electronic component 170 are respectively arranged on both sides of the middle frame 210, so that the internal structure of the electronic device 100 is more reasonable.
  • the middle frame 210 further includes an inner wall 217, and the inner wall 217 surrounds and forms the aforementioned receiving groove 213.
  • the receiving groove 213 penetrates the first surface 212 and the second surface 214 and communicates with the first receiving area 211 and the second receiving area 215. That is, the receiving groove 213 penetrates through the bottom walls of the first receiving area 211 and the second receiving area 215.
  • the accommodating groove 213 is approximately a rectangular groove, and the first accommodating area 211 and the second accommodating area 215 are respectively provided at two ends of the accommodating groove 213.
  • the two ends of the accommodating groove 213 refer to the positions where the two sides of the accommodating groove 213 are relatively short in size. Accordingly, the two sides of the accommodating groove 213 refer to the two relatively long sides of the accommodating groove 213. The location of the edge.
  • the accommodating groove 213 may span and connect the first accommodating area 211 and the second accommodating area 215.
  • both ends of the accommodating groove 213 may be connected to the first accommodating area 211 and the second accommodating area 215, respectively.
  • the protective member 250 is disposed in the accommodating groove 213 and is connected across the first accommodating area 211 and the second accommodating area 215.
  • the two opposite ends of the protective member 250 are located in the first receiving area 211 and the second receiving area 215 respectively, and the first receiving area 211 and the second receiving area 215 are formed by covering the receiving groove 213.
  • the guard 250 can cover the opening formed by the accommodating groove 213 in the first accommodating area 211.
  • the guard 250 can cover the side of the accommodating groove 213 communicating with the first accommodating area 211.
  • the protective member 250 includes a main body 251 and a bending part 253 connected to the main body 251.
  • the main body 251 is substantially in the shape of a sheet, and it substantially covers the side where the accommodating groove 213 communicates with the first accommodating area 211.
  • the bending portion 253 is connected to the main body 251 and is bent relative to the main body 241, and the bending portion 253 is overlapped with the inner wall 217.
  • the main body 251 is used to separate the heat conducting member 230 from the first electronic component 150 to prevent the heat conducting member 230 from directly contacting the first electronic component 150 and causing the heat conducting member 230 to be stabbed to the first electronic component 150 when it is misaligned.
  • the main body 251 is flush with the first surface 212 and faces or directly contacts the first electronic component 150.
  • the side of the main body 251 away from the receiving groove 213 is flush with the second surface 212. It should be noted that when the main body 251 is flush with the first surface 212, the functions of the protective member 250 and the heat-conducting member 230 can be achieved while maintaining the thickness of the middle frame 210, thereby keeping the electronic device 100 thin and light.
  • the protective member 250 is connected across the first accommodating area 211 and the second accommodating area 215, and is opposite to the first electronic component 150 and the second electronic component 170. Therefore, the protective member 250 also connects the second The electronic component 170 is separated from the heat-conducting element 230 to prevent the heat-conducting element 230 from causing damage to the first electronic element 150 and the second electronic element 170.
  • the bending portion 253 is connected to the edge of the main body 251 and has a one-time bending structure relative to the edge of the main body 251 (as shown in FIG. 6). At this time, the bending portion 253 faces away from the first surface 212. Extending, the bending portion 253 is substantially perpendicular to the main body 251 and is disposed opposite to the inner wall 217, so that the bending portion 253 and the main body 521 jointly define a receiving space.
  • the accommodating space can be used for accommodating the heat-conducting element 230 to facilitate installation and positioning of the heat-conducting element 230.
  • the bending portion 253 is connected to the edge of the main body 251 and has a double bending structure relative to the edge of the main body 251.
  • the housing 200 may further include a mounting portion 219 for receiving the double-bending structure, so as to limit the position of the double-bending structure.
  • the mounting portion 219 is connected to the inner wall 217.
  • the mounting portion 219 is a protrusion formed by protruding from the inner wall 217 toward the receiving groove 213.
  • the bending portion 253 may be stacked on the mounting portion 219.
  • the mounting portion 219 includes an end surface 2191 that is away from the inner wall 217 and a side surface 2193 connected to the end surface 2191 and the inner wall 217. Wherein, the side surface 2193 faces away from the first surface 212.
  • the mounting portion 219 also includes a connecting surface (not shown in the figure) away from the side surface 2193, and the connecting surface is flush with the first surface 212.
  • the surface of the mounting portion 219 facing away from the first receiving area 211 is recessed relative to the second surface 214 of the middle frame 210 to form a step structure. That is, the distance between the connecting surface and the side surface 2193 is smaller than the distance between the first surface 212 and the second surface 214.
  • the bending portion 253 includes a first bending portion 2531 and a second bending portion 2533, the first bending portion 2531 is connected between the main body 251 and the second bending portion 2533, and the first bending portion 2531 and the end surface 2191 is overlapped, and the second bending portion 2533 is overlapped with the side surface 2193.
  • the main body 251 is approximately sheet-shaped and flush with the first surface 212.
  • the first bending portion 2531 is connected to the edge of the main body 251, and is bent relative to the main body 251, and faces away from the first electronic device.
  • the element 150 extends in the direction, and the angle between the first bending portion 2531 and the main body 251 is approximately 90°, so that the first bending portion 2531 and the end surface 2191 are opposite. It can be understood that the included angle between the first bent portion 2531 and the main body 251 can be at any angle, so as to limit the heat-conducting member 230 and improve the protection of the heat-conducting member 230.
  • the plane where the second bending portion 2533 is located is substantially parallel to the plane where the main body 251 is located.
  • the second bending portion 2533 is connected to an end of the first bending portion 2531 away from the main body 251, is bent relative to the first bending portion 2531, and extends toward the inner wall 217.
  • the second bending portion 2533 and the The angle between the one bending portion 2531 is also approximately 90°, so that the second bending portion 2533 is opposite to the side surface 2193.
  • the included angle between the second bending portion 2533 and the first bending portion 2531 may be at any angle to match the step structure formed by the mounting portion 219 and the second surface 214, so that the guard 250 and the mounting portion
  • the connection of the 219 is relatively stable, so as to prevent the protective member 250 from falling off and affecting the isolation between the protective member 250 and the thermal conductive member 230 and the first electronic component 150.
  • the two mounting parts 219 there are two mounting parts 219, and the two mounting parts 219 are arranged opposite to each other to further limit the position where the guard 250 is accommodated in the receiving groove 213.
  • there are two bending portions 253, and the two bending portions 253 are respectively connected to opposite sides of the main body 251, and are respectively superimposed on the two mounting portions 219 one by one, thereby improving the protection of the heat conducting member 230 strength.
  • the position of the guard 250 is defined by the two end surfaces 2191 of the two mounting parts 219, which can prevent the guard 250 from shaking when being accommodated in the accommodating groove 213.
  • the protective member 250 is a metal sheet, such as a copper sheet, an iron sheet, and other metal sheets with good thermal conductivity, so as to play a protective role without affecting the thermal conductivity of the thermal conductive member 230.
  • the main body 251, the first bending portion 2531, and the second bending portion 2533 may be an integrally formed structure, such as formed by die casting, stamping and other processes.
  • the heat conducting member 230 is accommodated in the accommodating groove 213 and disposed on the side of the protective member 250 away from the first electronic component 150.
  • the heat-conducting element 230 is opposite to the main body 251, and the bending part 253 forms a limit to the heat-conducting element 230.
  • the opposite ends of the heat-conducting member 230 are respectively opposite to the first accommodating area 211 and the second accommodating area 215, so that the heat-conducting member 230 can separate the heat of the first accommodating area 211 and the heat of the second accommodating area 215. Soaked.
  • the two bending portions 253 are respectively connected to opposite sides of the main body 251, and form two opposite ends of the guard 250.
  • the two opposite ends of the protective member 250 correspond to the opposite ends of the heat-conducting member 230 one by one, and form a limit to the heat-conducting member 230, thereby restricting the left-right shaking of the heat-conducting member 230. It should be noted that, because the protective member 250 is fixed in the accommodating groove 213, it will not be displaced due to shaking. Furthermore, even if the thermal conductive member 230 is distorted, it will not poke the first electronic component 150, which improves The reliability of the electronic device 100.
  • the heat conducting member 230 is tubular, and the heat conducting member 230 is provided with an inner cavity.
  • the heat conducting member 230 includes a capillary layer 231 and a working medium 233, and the capillary layer 231 and the working medium 233 are both arranged in the inner cavity.
  • the working medium 233 is a medium capable of generating a gas-liquid phase change in the sealed space, such as water, alcohols, CFC substitutes, and the like.
  • the working medium 233 needs to absorb a lot of heat when it transforms from the liquid phase to the gas phase, the working medium 233 in the gas phase transfers heat from one location to another during the process of spreading toward the surroundings, so as to realize the heat conduction in the electronic device 100.
  • the uniform heat and heat dissipation of the electronic device 100 are realized.
  • the soaking of the electronic device 100 refers to the conduction and diffusion of local heat in the electronic device 100 to prevent the heat from being concentrated in a part of the electronic device 100.
  • the capillary layer 231 is a microstructure with pores, grooves, protrusions and other concavities and convexities to increase the surface area of the capillary layer 231 to facilitate the adhesion of the working medium 233 in the gas phase to the capillary layer 231, thereby improving the condensation of the working medium 233 in the gas phase.
  • the speed of the working medium 233 into the liquid phase improves the heat dissipation performance of the electronic device 100.
  • the specific structure of the capillary layer 231 may include one or a combination of a porous structure, a fiber structure, a groove structure, and a network structure.
  • the capillary layer 231 may be an independent element, for example, the capillary layer 231 is a metal woven mesh, which is connected to the inner surface of the heat conducting member 230 by sintering or the like. Also optionally, the capillary layer 231 may be a tiny structure formed on the inner surface of the heat conducting member 230 by etching or the like.
  • the working process of the heat-conducting element 230 is described by taking the end of the heat-conducting element 230 close to the second electronic element 170 as the evaporating end and the end close to the first electronic element 150 as the condensing end.
  • One end of the heat conducting member 230 close to the second electronic component 170 is heated, and the working medium 233 in the liquid phase absorbs heat and evaporates at the evaporating end, and becomes the working medium 233 in the gas phase and moves and diffuses toward the condensation end.
  • the working medium 233 in the gas phase when it moves to the condensing end, it can dissipate heat and condense into the working medium 233 in the liquid phase to dissipate the heat carried by the working medium 233 in the gas phase from the middle frame 210 through the first containment area 211 to realize electronic Soaking of equipment 100.
  • the working medium 233 in the gas phase moves and diffuses toward the condensing end. It can also be partially condensed into the working medium 233 in the liquid phase, and then flows back to the evaporating end to repeat the above working steps to realize the working medium 233.
  • the cyclical movement of the heating element accelerates the process of heat transfer from the evaporation end to the condensation end.
  • the second electronic component 170 is likely to cause local overheating of the electronic device 100 when the second electronic component 170 generates heat.
  • the heat of the second electronic component 170 is conducted to the position where the first electronic component 150 is located, thereby realizing the uniform heat of the electronic device 100.
  • the heat is conducted to the first electronic component 150 through the heat conducting member 230, which actually conducts the heat to the area where the first housing area 211 is located, so as to realize the uniform heat of the electronic device 100, and then pass through the first housing area 211 to the center.
  • the frame 210 realizes heat dissipation.
  • the housing 200 may further include an adhesive layer 220, and the adhesive layer 220 is sandwiched between the protective member 250 and the heat conducting member 230.
  • the adhesive layer 220 may be an adhesive such as glue, or a bonded body such as a double-sided tape.
  • the bonding force of the adhesive layer 220 stabilizes the connection between the protective member 250 and the heat-conducting member 230, thereby avoiding the separation of the protective member 250 and the heat-conducting member 230 under the action of external force, and ensuring that the protective member 250 can isolate the heat-conducting member 230 and the first An electronic component 150 prevents the first electronic component 150 from being punctured due to the misalignment of the thermal conductive member 230.
  • the housing 200 further includes a heat dissipation member 240, and the heat dissipation member 240 is laid on a side of the heat conduction member 230 away from the protection member 250 and connected to the middle frame 210.
  • the heat dissipation member 240 is overlapped on the second surface 214 and covers the side of the receiving groove 213 away from the first receiving area 211.
  • the heat sink 240 includes at least one of a graphite sheet and a thermally conductive gel.
  • the heat dissipation member 240 is stacked on the surface of the heat conduction member 230 and the middle frame 210 to dissipate the heat conducted by the heat conduction member 230 to improve the heat dissipation performance of the electronic device 100.
  • the heat sink 240 is in the shape of a sheet, and the sheet heat sink 240 can be laid on the second surface 214, the second bending portion 2533 and the heat conducting member 230 in sequence, so that the second bending portion 2533 and the heat conducting member 230 are not easy to calmly The recess 213 falls off to further strengthen the structure of the middle frame 210.
  • the sheet-shaped heat sink 240 can increase the heat dissipation area, thereby increasing the heat dissipation rate.
  • the protective member 250 is opposed to or in contact with the first electronic component 150 provided in the first receiving area 211 to transfer the heat of the first receiving area 211 to the electronic device 100 The heat from other locations or other locations is transferred to the first receiving area 211, thereby realizing uniform heating of the electronic device 100, avoiding local overheating of the electronic device 100, and improving the heat dissipation efficiency of the electronic device 100.
  • the thermal conductive member 230 can be prevented from damaging the first electronic component 150 when it is misaligned (for example, when it is impacted by an external force, or the structure is loose), thereby improving the reliability of the electronic device 100.
  • the present application also provides an electronic device.
  • the electronic device includes the housing, the first electronic component and the second electronic component in the above embodiments.
  • the first electronic element is accommodated in the first accommodating area, and the second electronic element is connected to the middle frame and is spaced apart from the first electronic element.
  • the protective member includes a first section and a second section connected to the first section. The first section is disposed opposite to the first electronic component, and the second section is disposed opposite to the second electronic component.
  • the first electronic component may be a battery to provide power required for the normal operation of the electronic device.
  • the second electronic component may include any one or more of a chip, a central processing unit, a camera, a fingerprint recognition module, and a sensor, so as to realize related functions of the electronic device.
  • the chip may be a driving chip, a detection chip, etc., which are not described here.
  • the first electronic component and the second electronic component may be arranged on the same side of the middle frame, or may be arranged on opposite sides of the middle frame.
  • the first electronic component and the second electronic component can be opposite to the protective member, so as to prevent the misalignment of the heat-conducting member from causing damage to the first electronic component and the second electronic component to extend The service life of electronic equipment.
  • the “electronic device” used in the embodiments of this application includes, but is not limited to, it is set to be connected via a wired line (such as via the Public Switched Telephone Network (PSTN), Digital Subscriber Line, DSL ), digital cable, direct cable connection, and/or another data connection/network) and/or via (for example, for cellular networks, wireless local area networks (WLAN), digital TV networks such as DVB-H networks) , Satellite network, AM-FM broadcast transmitter, and/or another communication terminal's wireless interface to receive/transmit communication signals.
  • a communication terminal set to communicate through a wireless interface may be referred to as a "wireless communication terminal", a “wireless terminal” and/or an “electronic device”.
  • Examples of electronic devices include, but are not limited to, satellite or cellular phones; Personal Communications Service (PCS) terminals that can combine cellular radio phones with data processing, fax, and data communication capabilities; can include radio phones, pagers, and the Internet/ PDA with intranet access, web browser, memo pad, calendar, and/or Global Positioning System (GPS) receiver; and conventional laptop and/or palm-type receiver or including radio telephone transceiver Other electronic devices.
  • PCS Personal Communications Service
  • GPS Global Positioning System

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请提供一种壳体及电子设备，壳体包括中框、导热件和防护件。其中，中框设有第一收容区，第一收容区用于安装电子设备的电子元件；中框还设有容置槽，容置槽贯穿中框，并连通第一收容区。导热件容置于容置槽，防护件至少部分地容置于容置槽内，并设置于导热件朝向第一收容区的一侧。本申请中，防护件与设置于第一收容区的电子元件相对或相接触，进而，第一电子元件散发的热量经由防护件和导热件传递到电子设备的其他位置再散发出去，以实现电子设备的均热，避免电子设备局部过热，提高电子设备的散热效率。同时，通过设置防护件，可以避免导热件在发生错动时对电池造成损害，进而提高了电子设备的可靠性。

Description

壳体及电子设备 技术领域
本申请涉及消费性电子设备领域，尤其涉及一种壳体及电子设备。
背景技术
随着现有的电子设备技术的发展，越来越多的电子设备走进人们的日常生活。随着手机、平板等电子设备的性能越来越高、功能越来越强，这些电子设备的发热问题也越来越严重。
传统的电子设备的散热方式主要通过在电子设备内部增加石墨或铜箔等导热性能良好的散热材料，热量通过散热材料传递到电子设备外壳的金属部件，最终散发到电子设备外部，以使电子设备温度降低。但是，由于不同的电子元件位于不同部位，容易引起电子设备的热量集中，通过布置石墨或铜箔等散热材料仍无法及时散出集中在各点的热量，电子设备的散热效果不佳。
发明内容
有鉴于此，本申请提供一种壳体及电子设备，用于解决上述问题。
本申请提供一种壳体，应用于电子设备，壳体包括中框、导热件和防护件。其中，中框设有第一收容区，第一收容区用于安装电子设备的电子元件；中框还设有容置槽，容置槽贯穿中框，并连通第一收容区。导热件容置于容置槽，防护件至少部分地容置于容置槽内，并设置于导热件朝向第一收容区的一侧。
本申请还提供一种电子设备，电子设备包括上述的壳体、第一电子元件和显示面板。其中，第一电子元件容置于第一收容区，并与防护件相对。显示面板位于中框背离第一收容区的一侧。
本申请还提供一种电子设备，电子设备包括上述的壳体、第一电子元件和第二电子元件。其中，第一电子元件设置于中框的第一收容区，第二电子元件连接于中框，并与第一电子元件相间隔。防护件包括第一段和与第一段连接的第二段，第一段与第一电子元件相对设置，第二段与第二电子元件相对设置。
本申请提供的壳体和电子设备，防护件与设置于第一收容区的电子元件相对或相接触，进而，第一电子元件散发的热量经由防护件和导热件传递到电子设备的其他位置再散发出去，以实现电子设备的均热，避免电子设备局部过热，提高电子设备的散热效率。同时，通过设置防护件，可以避免导热件在发生错动时对电池造成损害，进而提高了电子设备的可靠性。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的电子设备的正面投影示意图。
图2为图1所示电子设备的拆分示意图。
图3为图1所示电子设备沿A-A线的剖面示意图。
图4为图3所示电子设备的IV区域的放大示意图。
图5为图1所示电子设备沿B-B线的剖面示意图。
图6为图5所示电子设备的V区域的一种实施方式的放大示意图。
图7为图5所示电子设备的V区域的另一实施方式的放大示意图。
图8为图1所示电子设备的导热件的剖切示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。
传统的电子设备的散热方式主要通过在电子设备内部增加石墨或铜箔等导热性能良好的散热材料，热量通过散热材料传递到电子设备外壳的金属部件，最终散发到电子设备外部，以使电子设备温度降低。但是，由于不同的电子元件位于不同部位，容易引起电子设备的热量集中，通过布置石墨或铜箔等散热材料仍无法及时散出集中在各点的热量，电子设备的散热效果不佳。
基于此，发明人对电子设备的散热结构进行了大量的研究。发明人发现，可以使用热管将热源位置的热量引导到电池仓位置进行均热和散热，进而避免电子设备的局部过热。同时，为了不增加手机厚度，可以对电池仓进行局部破孔。但是，由于电池仓破孔，在整机的可靠性测试和使用过程中，热管下端很可能局部错动，进而戳破电池，给电子设备带来安全隐患。
为此，发明人继续研究如何在不改变电子设备的厚度的情况下如何防止热管的错动，并保护电池，以便于实现电子设备的均热和散热，进而提升电子设 备的散热性能。其中，发明人的研究包括：如何避免热管在电子设备中的错动，如何使热管与电池的位置相对固定，如何使散热结构在电子设备中实现快速散热等等。经过大量、反复的比对和研究，发明人进一步就如何设计一种可以实现电子设备内的均热的散热结构进行了研究，并由此提出了本申请实施例的方案。
请参阅图1和图2，本申请实施例提供一种电子设备100，电子设备100可以为但不限于手机、平板电脑、智能手表等电子装置。本实施方式的电子设备100以手机为例进行说明。
电子设备100包括壳体200、显示面板130、第一电子元件150和第二电子元件170。壳体200与显示面板130共同形成收容腔，第一电子元件150和第二电子元件170容置于收容腔。壳体200能够对第一电子元件150和第二电子元件170提供防护作用，避免第一电子元件150和第二电子元件170受外力撞击而导致内部元件错位或损坏，从而延长电子设备100的使用寿命。
在本申请实施例中，显示面板130为具有显示作用的屏幕，以显示电子设备100的相关界面或信息，以供用户观看或操作。在本实施例中，第一电子元件150为电池，也即，第一电子元件150为电子设备100的供能部件，以提供电子设备100的正常工作所需的电量。第二电子元件170包括中央处理器、摄像头、指纹识别模组、传感器中的任一种或多种，其中，第二电子元件170与显示面板130、第一电子元件150电性连接，以实现电子设备100的相关功能。第一电子元件150、第二电子元件170与显示面板130的具体结构，在此不作赘述。
需要说明的是，第一电子元件150和第二电子元件170在工作的过程中会散发热量，第一电子元件150和第二电子元件170散发的热量是电子设备100 发热的重要来源。也即，第一电子元件150和第二电子元件170的热量会导致电子设备100发热，影响电子设备100的使用体验和使用寿命。
请参阅图3，壳体200包括中框210、导热件230和防护件250。其中，中框210设有第一收容区211，第一收容区211用于安装第一电子元件150。中框210还设有容置槽213，容置槽213贯穿中框210，并连通第一收容区211。导热件230容置于容置槽213，防护件250至少部分地容置于容置槽213内，并位于导热件230朝向第一收容区211的一侧。
其中，防护件250与设置于第一收容区211的第一电子元件150相对或相接触，进而，第一电子元件150散发的热量经由防护件250和导热件230传递到电子设备100的其他位置再散发出去，以实现电子设备100的均热，避免电子设备100局部过热，提高电子设备100的散热效率。同时，通过设置防护件250，可以避免导热件230在发生错动(例如受到外力撞击时的晃动，或结构松动)时对第一电子元件150造成损害，进而提高了电子设备100的可靠性。
具体地，中框210用于安装或承载第一电子元件150和第二电子元件170，以对第一电子元件150和第二电子元件170的位置进行限制，进而确保不会因第一电子元件150和第二电子元件170发生位移而导致电子设备100发生故障。
在本实施例中，中框210还设有第二收容区215，第二收容区215用于安装第二电子元件170，以对第二电子元件170限位。进一步地，第二收容区215与第一收容区211位于中框210的同一侧，第二收容区215与第一收容区211相邻设置。相应地，第一电子元件150与第二电子元件170位于中框210的同一侧。可选地，第二电子元件170的体积小于第一电子元件150的体积，因此，中框210形成第二收容区215的区域可以小于中框210形成第一收容区 211的区域。
请参阅图4，在本申请实施例中，中框210包括相互背离的第一表面212和第二表面214，其中，第一收容区211和第二收容区215均设于第一表面212。可选地，第一收容区211和第二收容区215均相对第一表面212凸出形成框状结构，以对第一电子元件150和第二电子元件170进行限位。可以理解的是，第一收容区211和第二收容区215为框状结构时，第一表面212可以作为第一收容区211和第二收容区215的底壁，以对收容于第一收容区211的第一电子元件150和收容于第二收容区215的第二电子元件170作进一步限位。
在一些实施方式中，第一收容区211可以与第二收容区215位于中框210的相对两侧。例如，第一收容区211设于第一表面212，第二收容区215设于第二表面214。
需要说明的是，第一收容区211和第二收容区215的划分，是为了将电子设备100中收容第一电子元件150的区域和收容第二电子元件170的区域进行区分，以便于叙述，并不形成具体限定。
请参阅图5，在本申请实施例中，显示面板130设于中框210背离第一收容区211的一侧，也即，显示面板130与第二表面214大致相对。其中，通过这样的设置，显示面板130与第一电子元件150、第二电子元件170分别设于中框210的两侧，以使电子设备100的内部结构较为合理。
进一步地，请参阅图6，中框210还包括内壁217，内壁217环绕形成上述的容置槽213。容置槽213贯穿第一表面212和第二表面214，并连通第一收容区211和第二收容区215。也即，容置槽213贯穿第一收容区211和第二收容区215的底壁。
在本申请实施例中，容置槽213大致为长方形槽，第一收容区211和第二 收容区215分别设于容置槽213的两端。其中，容置槽213的两端是指容置槽213尺寸相对较短的两条边所在的位置，相应地，容置槽213的两侧是指容置槽213尺寸相对较长的两条边所在的位置。可选地，若第一收容区211和第二收容区215并列间隔或者相邻设置，容置槽213可以跨设并连通第一收容区211和第二收容区215。在一些实施方式中，第一收容区211和第二收容区215位于中框210的相对两侧时，容置槽213的两端可以分别与第一收容区211和第二收容区215连通。
请继续参阅图6，防护件250设置于容置槽213内，并跨设连接第一收容区211和第二收容区215。换而言之，防护件250相对的两个端部分别位于第一收容区211和第二收容区215，以封盖容置槽213在第一收容区211和第二收容区215形成开口。
在本实施方式中，防护件250能够封盖容置槽213在第一收容区211形成的开口，例如，防护件250能够封盖容置槽213与第一收容区211连通一侧。其中，通过设置防护件250封盖容置槽213形成的开口，可以使导热件230不易从容置槽213中脱落，从而提高壳体200的散热稳定性。
防护件250包括主体251和连接于主体251的弯折部253。在本实施例中，主体251大致呈片状，其大致封盖容置槽213与第一收容区211连通的一侧。弯折部253连接于主体251并相对主体241弯折，弯折部253叠合于内壁217。其中，主体251用于将导热件230与第一电子元件150隔开，以避免导热件230直接与第一电子元件150接触而导致导热件230发生错动时戳到第一电子元件150。
可选地，主体251与第一表面212相平齐，并与第一电子元件150相对或直接接触。换而言之，主体251背离容置槽213的一侧与第二表面212相平 齐。需要说明的是，设置主体251与第一表面212相平齐时，可以在维持中框210的厚度不变的情况下实现防护件250和导热件230的功能，进而保持电子设备100的轻薄。
在本申请实施例中，防护件250跨设连接第一收容区211和第二收容区215，并与第一电子元件150和第二电子元件170均相对，因此，防护件250也将第二电子元件170与导热件230隔开，避免导热件230对第一电子元件150和第二电子元件170造成损害。
可选地，弯折部253连接于主体251的边缘，并相对于主体251的边缘呈一次弯折结构(如图6所示)，此时，弯折部253朝向背离第一表面212的方向延伸，弯折部253与主体251大致垂直，并与内壁217相对设置，使弯折部253与主体521共同限定出一个收容空间。该收容空间可以用于收容导热件230，以便于安装并定位导热件230。
可选地，请参阅图7，弯折部253连接于主体251的边缘，并相对于主体251的边缘呈二次弯折结构。此时，壳体200还包括还可以包括用于承接该二次弯折结构的安装部219，以便于对该二次弯折结构进行限位。具体而言，安装部219连接于内壁217。其中，安装部219为相对内壁217朝向容置槽213凸伸形成的凸起。
在本申请实施例中，弯折部253可以叠置于安装部219。具体地，安装部219包括与内壁217相背离的端面2191，以及连接于端面2191和内壁217的侧面2193。其中，侧面2193背离第一表面212。安装部219还包括与侧面2193背离的连接面(图中未标出)，连接面与第一表面212平齐。进一步地，安装部219背离第一收容区211的一侧的表面相对中框210的第二表面214凹陷形成台阶结构。也即，连接面与侧面2193之间的距离小于第一表面212和第 二表面214之间的距离。
进一步地，弯折部253包括第一弯折部2531和第二弯折部2533，第一弯折部2531连接于主体251和第二弯折部2533之间，第一弯折部2531与端面2191叠合，第二弯折部2533与侧面2193叠合。在本申请实施例中，主体251大致为片状，并与第一表面212相平齐，第一弯折部2531连接于主体251的边缘，并相对主体251弯折，并朝向背离第一电子元件150的方向延伸，第一弯折部2531与主体251之间的角度大致呈90°，以使第一弯折部2531与端面2191相对。可以理解的是，第一弯折部2531与主体251之间可以呈任意角度的夹角，以对导热件230形成限位，进而提高对导热件230的防护。
进一步地，第二弯折部2533所在的平面与主体251所在的平面大致平行。例如，第二弯折部2533连接于第一弯折部2531远离主体251的一端，并相对第一弯折部2531弯折，并朝向靠近内壁217的方向延伸，第二弯折部2533与第一弯折部2531之间的角度也大致呈90°，以使第二弯折部2533与侧面2193相对。可以理解的是，第二弯折部2533与第一弯折部2531之间可以呈任意角度的夹角，以配合安装部219与第二表面214形成的台阶结构，使防护件250与安装部219的连接较为稳固，进而使避免因防护件250脱落而影响防护件250对导热件230和第一电子元件150之间的隔离。
可选地，安装部219为两个，两个安装部219相对设置，以进一步限制防护件250容置于容置槽213的位置。相应地，弯折部253为两个，两个弯折部253分别连接于主体251的相对两侧，并分别一一对应地叠合于两个安装部219，进而提高对导热件230的防护强度。进一步地，通过两个安装部219的两个端面2191对防护件250的位置进行限定，能够避免防护件250容置于容置槽213时晃动。
在本申请实施例中，防护件250为金属片，如铜片、铁片等导热性能较好的金属片，以在起到防护作用的同时，也不会影响导热件230的导热效果。其中，主体251、第一弯折部2531和第二弯折部2533可以为一体成型结构，如通过压铸、冲压等工艺成型。
请继续参阅图7，导热件230容置于容置槽213内，并设于防护件250背离第一电子元件150的一侧。其中，导热件230与主体251相对，弯折部253对导热件230形成限位。在本实施方式中，导热件230相对的两端分别与第一收容区211和第二收容区215相对，以便导热件230可以将第一收容区211的热量与第二收容区215的热量进行均热。可选地，若弯折部253为两个时，两个弯折部253分别连接于主体251的相对两侧，并形成防护件250相对的两个端部。防护件250相对的两个端部与导热件230相对的两端一一对应，并形成对到导热件230的限位，进而限制导热件230的左右晃动。需要说明的是，由于防护件250在容置槽213中位置固定，并不会因晃动而发生位移，进而，即使导热件230发生错动时也不会戳到第一电子元件150，提高了电子设备100的可靠性。
请参阅图8，在本申请实施例中，导热件230为管状，导热件230设有内腔。导热件230包括毛细层231和工作介质233，毛细层231和工作介质233均设于内腔。其中，工作介质233为能够在密封空间内产生气相-液相的相变变化的介质，例如水、酒精类、氟氯化碳替代品等。由于工作介质233由液相转化为气相时需要吸收大量的热量，气相的工作介质233在朝向周围扩散的过程中，将热量从一个位置传递到另一个位置，实现电子设备100内的热量传导，进而实现了电子设备100的均热和散热。其中，电子设备100的均热是指将电子设备100内局部的热量进行传导和扩散，避免热量集中于电子设备100的局 部。
进一步地，毛细层231为具有细孔、槽、突起等凹凸的微小构造，以增加毛细层231的表面面积，便于气相的工作介质233附着于毛细层231，进而能够提高气相的工作介质233冷凝成液相的工作介质233的速率，提高电子设备100的散热性能。其中，毛细层231的具体构造可以包括多孔构造、纤维构造、槽构造、网络构造等中的一种或多种相结合。可选地，毛细层231可以为独立的元件，例如毛细层231为金属编织网，通过烧结等方式连接于导热件230的内表面。同样可选地，毛细层231可以为通过蚀刻等方式形成于导热件230内表面的微小结构。
具体地，以导热件230靠近第二电子元件170的一端为蒸发端，靠近第一电子元件150的一端为冷凝端对导热件230的工作过程进行阐述。导热件230靠近第二电子元件170的一端受热，液相的工作介质233在蒸发端吸热蒸发，成为气相的工作介质233并向冷凝端移动扩散。其中，当气相的工作介质233移动到冷凝端时，可以散热冷凝成液相的工作介质233，以将气相的工作介质233携带的热量经由第一收容区211自中框210散出，实现电子设备100的均热。同时，由于设置毛细层231，气相的工作介质233在朝向冷凝端移动扩散的过程，也可以部分冷凝成液相的工作介质233，进而回流到蒸发端以重复上述工作步骤，以实现工作介质233的循环移动，进而加快热量自蒸发端向冷凝端传导的过程。
需要说明的是，因为与第一电子元件150相比，第二电子元件170的体积相对较小，因此第二电子元件170发热时容易造成电子设备100的局部过热，而通过导热件230可以将第二电子元件170的热量导到第一电子元件150所在的位置，进而实现电子设备100的均热。其中，通过导热件230将热量传导 到第一电子元件150，实际上是将热量传导到第一收容区211所在的区域，以实现电子设备100的均热，再通过第一收容区211向中框210实现散热。
请再次参阅图6，壳体200还可以包括胶黏层220，胶黏层220夹设于防护件250和导热件230之间。胶黏层220可以为胶水等黏着剂，也可以为双面胶等粘结体。通过胶黏层220的粘接力使防护件250和导热件230之间的连接稳固，进而避免在外力作用下使防护件250和导热件230分离，确保防护件250能够隔离导热件230和第一电子元件150，避免因导热件230错位而戳破第一电子元件150。
请继续参阅图6，壳体200还包括散热件240，散热件240铺设于导热件230背离防护件250的一侧，并与中框210连接。在本申请实施例中，散热件240叠合于第二表面214，并封盖容置槽213背离第一收容区211的一侧。进一步地，散热件240包括石墨片、导热凝胶中的至少一种。其中，散热件240叠置于导热件230以及中框210的表面，以用于对导热件230传导的热量进行散热，以提高电子设备100的散热性能。可选地，散热件240为片状，片状的散热件240可以依次铺设于第二表面214、第二弯折部2533以及导热件230，使得第二弯折部2533以及导热件230不易从容置槽213中脱落，以进一步加固中框210的结构。同时，片状的散热件240可以增大散热的面积，进而提高散热速率。本申请提供的壳体200和电子设备100中，防护件250与设置于第一收容区211的第一电子元件150相对或相接触，以将第一收容区211的热量进行传递到电子设备100的其他位置或将其他位置的热量传递到第一收容区211，进而实现电子设备100的均热，避免电子设备100局部过热，提高电子设备100的散热效率。同时，通过设置防护件250，可以避免导热件230在发生错动(例如受到外力撞击时的晃动，或结构松动)时对第一电子元件150造 成损害，进而提高了电子设备100的可靠性。
在另一些实施方式中，本申请还提供一种电子设备，电子设备包括上述实施例中的壳体，第一电子元件和第二电子元件。其中，第一电子元件容置于第一收容区，第二电子元件连接于中框，并与第一电子元件相间隔。防护件包括第一段和与第一段连接的第二段，第一段与第一电子元件相对设置，第二段与第二电子元件相对设置。
在一些实施方式中，第一电子元件可以为电池，以提供电子设备的正常工作所需的电量。第二电子元件可以包括芯片、中央处理器、摄像头、指纹识别模组、传感器中的任一种或多种，以实现电子设备的相关功能。其中，芯片可以为驱动芯片、检测芯片等，在此不做赘述。
作为一种实施方式，第一电子元件和第二电子元件可以设于中框的同一侧，也可以设于中框的相对两侧。通过防护件的第一段和第二段可使第一电子元件和第二电子元件均与防护件相对，从而防止导热件发生错动对第一电子元件和第二电子元件造成损害，以延长电子设备的使用寿命。
作为在本申请实施例中使用的“电子设备”包括，但不限于被设置成经由有线线路连接(如经由公共交换电话网络(Public Switched Telephone Network，PSTN)、数字用户线路(Digital Subscriber Line，DSL)、数字电缆、直接电缆连接，以及/或另一数据连接/网络)和/或经由(例如，针对蜂窝网络、无线局域网(Wireless Local Area Networks，WLAN)、诸如DVB-H网络的数字电视网络、卫星网络、AM-FM广播发送器，以及/或另一通信终端的)无线接口接收/发送通信信号的装置。被设置成通过无线接口通信的通信终端可以被称为“无线通信终端”、“无线终端”以及/或“电子设备”。电子设备的示例包括，但不限于卫星或蜂窝电话；可以组合蜂窝无线电电话与数据处理、传真以及数据通 信能力的个人通信系统(Personal Communications Service，PCS)终端；可以包括无线电电话、寻呼机、因特网/内联网接入、Web浏览器、记事簿、日历以及/或全球定位系统(Global Positioning System，GPS)接收器的PDA；以及常规膝上型和/或掌上型接收器或包括无线电电话收发器的其它电子装置。
以上所述仅为本申请的优选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (20)

  1. 一种壳体，其特征在于，应用于电子设备，所述壳体包括：
    中框，所述中框设有第一收容区，所述第一收容区用于安装电子设备的电子元件；所述中框还设有容置槽，所述容置槽贯穿所述中框，并连通所述第一收容区；
    导热件，所述导热件容置于所述容置槽；以及
    防护件，所述防护件至少部分地容置于所述容置槽内，并设置于所述导热件朝向所述第一收容区的一侧。
  2. 如权利要求1所述的壳体，其特征在于，所述第一收容区用于安装所述电子设备的电池；所述中框还设有用于安装所述电子设备的其他电子元件的第二收容区，所述第二收容区与所述第一收容区位于所述中框的同一侧，所述容置槽跨设并连通所述第一收容区和所述第二收容区。
  3. 如权利要求2所述的壳体，其特征在于，所述防护件跨设连接所述第一收容区和所述第二收容区；所述导热件相对的两端分别与所述第一收容区和所述第二收容区相对。
  4. 如权利要求1～3中任一项所述的壳体，其特征在于所述导热件设有内腔；所述导热件包括毛细层和工作介质，所述毛细层和所述工作介质均设于所述内腔。
  5. 如权利要求4所述的壳体，其特征在于，所述毛细层具体构造包括以下 构造中的至少一种：多孔构造、纤维构造、槽构造、网络构造。
  6. 如权利要求1～5中任一项所述的壳体，其特征在于，所述壳体还包括胶黏层，所述胶黏层夹设于所述防护件和所述导热件之间。
  7. 如权利要求1～6中任一项所述的壳体，其特征在于，所述中框具有内壁，所述内壁环绕形成所述容置槽；所述防护件包括主体和弯折部，所述弯折部连接于所述主体并相对所述主体弯折，所述主体封盖所述容置槽与所述第一收容区连通一侧，所述弯折部与所述内壁相对设置。
  8. 如权利要求7所述的壳体，其特征在于，所述壳体还包括安装部，所述安装部连接于所述内壁，所述弯折部叠置于所述安装部。
  9. 如权利要求8所述的壳体，其特征在于，所述安装部背离所述第一收容区的一侧的表面相对所述中框的表面凹陷形成台阶结构，所述防护件部分叠置于所述安装部背离所述第一收容区的一侧。
  10. 如权利要求8～9中任一项所述的壳体，其特征在于，所述安装部还包括与所述内壁相背离的端面，以及连接于所述端面和所述内壁之间的侧面；所述弯折部包括第一弯折部和第二弯折部，所述第一弯折部连接于所述主体和所述第二弯折部之间，所述第一弯折部与所述端面叠合，所述第二弯折部与所述侧面叠合。
  11. 如权利要求8～10中任一项所述的壳体，其特征在于，所述主体背离所述容置槽的一侧与所述中框的表面相平齐。
  12. 如权利要求8～11中任一项所述的壳体，其特征在于，所述弯折部为两个，两个所述弯折部分别连接于所述主体的相对两侧；所述安装部为两个，两个所述安装部相对设置，两个弯折部分别一一对应地叠合于两个所述安装部。
  13. 如权利要求1～12中任一项所述的壳体，其特征在于，所述防护件为金属片。
  14. 如权利要求1～13中任一项所述的壳体，其特征在于，所述壳体还包括散热件，所述散热件铺设于所述导热件背离所述防护件的一侧，并与所述中框连接。
  15. 如权利要求14所述的壳体，其特征在于，所述散热件包括石墨片、导热凝胶中的至少一种，所述散热件叠置于所述导热件以及所述中框的表面。
  16. 一种电子设备，其特征在于，所述电子设备包括：
    如权利要求1～15中任一项所述的壳体；
    第一电子元件，容置于所述第一收容区，并与所述防护件相对；以及
    显示面板；位于所述中框背离所述第一收容区的一侧。
  17. 如权利要求16所述的电子设备，其特征在于，所述电子设备还包括第 二电子元件，所述第二电子元件连接于所述中框，且所述第二电子元件与所述第一电子元件位于所述中框的同一侧；所述第一电子元件与所述第二电子元件均与所述防护件相对。
  18. 如权利要求16或17所述的电子设备，其特征在于，所述第一电子元件为电池，所述第二电子元件包括中央处理器、摄像头、指纹识别模组、传感器中的任一种或多种。
  19. 一种电子设备，其特征在于，包括：
    如权利要求1～15中任一项所述的壳体；
    第一电子元件，设置于所述中框的所述第一收容区；以及
    第二电子元件，连接于所述中框，并与所述第一电子元件相间隔；所述防护件包括第一段以及和所述第一段连接的第二段，所述第一段与所述第一电子元件相对设置，所述第二段与所述第二电子元件相对设置。
  20. 如权利要求19所述的电子设备，其特征在于，所述第一电子元件为电池，所述第二电子元件包括芯片、中央处理器、摄像头、指纹识别模组、传感器中的任一种或多种。
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