CN114566340B - Device for automatically trimming annular substrate resistance and operation method - Google Patents
Device for automatically trimming annular substrate resistance and operation method Download PDFInfo
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- CN114566340B CN114566340B CN202210163688.XA CN202210163688A CN114566340B CN 114566340 B CN114566340 B CN 114566340B CN 202210163688 A CN202210163688 A CN 202210163688A CN 114566340 B CN114566340 B CN 114566340B
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- 238000009966 trimming Methods 0.000 title claims abstract description 172
- 239000000758 substrate Substances 0.000 title claims abstract description 155
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000000523 sample Substances 0.000 claims abstract description 41
- 239000002390 adhesive tape Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 5
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 150000003303 ruthenium Chemical class 0.000 claims description 3
- 230000008569 process Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 8
- 230000001276 controlling effect Effects 0.000 description 4
- 230000008439 repair process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a device and an operation method for automatically trimming annular substrate resistor, wherein an annular substrate is loaded on a sheet bearing plate, the annular substrate is conveyed to a working position under the drive of an original sheet bearing table of a trimming machine, a probe card is pressed down to a first group of resistors, the probe card is mounted on the first group of resistors after trimming, the probe card is lifted up by the first group of resistors, a signal lamp is turned off, a graduation signal sensor sends a signal of turning off as a rotating signal of the rotating sheet bearing table to a CPU, the CPU controls a second group of resistors of the annular substrate to rotate to a trimming first group of resistor position, the signal lamp is turned on, the probe card is pressed down to the second group of resistors, the second group of resistors are trimmed until the trimming 15 groups of resistors are completed, the original sheet bearing table of the trimming machine drives the annular substrate to withdraw, a photoelectric diffuse reflection sensor sends the collected signal to the CPU as a reset signal of the rotating sheet bearing table, and the CPU controls the rotating sheet bearing table to restore to the initial position, so that the automatic trimming of the annular substrate resistor is realized.
Description
Technical Field
The invention belongs to the technical field of semiconductor hybrid integrated circuits, and relates to a device for automatically trimming and adjusting annular substrate resistance and an operation method thereof.
Background
A hybrid integrated circuit is an assembled circuit in which IC chips having various functions are electrically interconnected on an insulating substrate on which a combination pattern of a conductor, a resistor, an inductor, a capacitor, and the like is previously formed. One of the main roles of insulating substrates in hybrid integrated circuits is the base of the resistor. With the development of the field of hybrid integrated circuit application toward diversification, more complex requirements are put on the shapes of the substrate and the resistor, especially the circuits such as the sensor, the potentiometer and the like, and the resistor is required to be formed on the annular substrate.
The conventional hybrid integrated circuit substrate is in rectangular or pseudo rectangular connected sheet distribution, the units of the connected sheet substrate are uniformly distributed in the horizontal or vertical direction, the resistors on the unit substrate are also distributed on the substrate in the horizontal or vertical direction, and the connected sheet trimming is adopted when the resistor of the conventional hybrid integrated circuit substrate is trimmed. The automatic trimming and adjusting of the resistance of the connecting piece substrate has two characteristics: the trimming machine wafer bearing table has the function of equal step movement in the horizontal or vertical direction, and can finish automatic trimming operation in the horizontal or vertical direction; trimming cuts are provided in the horizontal or vertical direction.
The substrate is an annular substrate, 150 resistors are distributed on the annular substrate in a certain centripetal included angle, and as the number of the resistors is large, the trimming machine cannot finish trimming all the resistors on one substrate at one time, so that 150 resistors are required to be trimmed in 15 groups, and the difficulty is that: the trimming machine wafer bearing table has no rotation function in the trimming process, and the group 2 to 15 resistors cannot be continuously and automatically trimmed after the group 1 resistor is trimmed; the existing horizontal or vertical trimming cut cannot meet the trimming of the resistor on the annular substrate.
Disclosure of Invention
The invention aims to solve the problems in the prior art, provides a device for automatically trimming annular substrate resistance and an operation method thereof, and aims to solve the technical problems that a trimming machine wafer bearing table in the prior art has no rotation function in the trimming process, the group 2 to the group 15 resistors cannot be continuously and automatically trimmed after the group 1 resistors are trimmed, and the defects of trimming the resistors on the annular substrate cannot be met by the existing horizontal or vertical trimming marks.
In order to achieve the purpose, the invention is realized by adopting the following technical scheme:
the invention provides a device for automatically trimming annular substrate resistance, which comprises a rotary wafer bearing table and a CPU, wherein the rotary wafer bearing table comprises a fixed plate, a rotary motor and a wafer bearing plate;
the fixing plate consists of a horizontal plate and a vertical plate, the horizontal plate and the vertical plate are vertically arranged, and the vertical plate is arranged on the outer side wall of the original wafer carrying table of the repairing and adjusting machine; the rotating motor is fixed above the horizontal plate, the bearing plate is arranged above the rotating motor, a joint plate is arranged between the rotating motor and the bearing plate, and an annular substrate is loaded above the bearing plate; 150 resistors are uniformly arranged on the annular substrate, and every ten adjacent resistors are in a group;
a photoelectric diffuse reflection sensor is arranged at the top of a laser bin above the initial position of the original wafer carrying table of the trimming machine, and a black adhesive tape for assisting the photoelectric diffuse reflection sensor to acquire signals is stuck at any position of the horizontal plate; the original wafer carrying table of the repairing and adjusting machine is provided with a signal lamp for displaying the working state of the rotary wafer carrying table and an indexing signal sensor for receiving the signal of the signal lamp; the probe card assembly calibration table positioned on the trimming machine is used for sequentially trimming fifteen groups of resistors, the photoelectric diffuse reflection sensor, the graduation signal sensor and the rotating motor are electrically connected with the CPU, and the CPU is used for receiving signals of the photoelectric diffuse reflection sensor and the graduation signal sensor and controlling the rotating piece bearing table to rotate.
Preferably, each resistor of the annular substrate has a trapezoidal shape.
Preferably, the first resistance of the annular substrate is inclined at an angle of 8 ° in the vertical direction.
Preferably, the centripetal angle between each resistor of the annular substrate is 2.25 °.
Preferably, the indexing angle of the rotating electrical machine is 22.5 °.
Preferably, the carrier plate is provided with a positioning pin, the annular substrate is provided with a through hole, and the through hole on the annular substrate is sleeved on the positioning pin of the carrier plate.
Preferably, the rotary wafer carrying platform is in a static state when the signal lamp is on, and the rotary wafer carrying platform is in a rotary state when the signal lamp is off.
Preferably, the resistor on the annular substrate is made of ruthenium series materials, and electrodes at two ends of the resistor are palladium-silver conductors.
Preferably, the black tape has dimensions of 3cm×3cm.
The invention provides an operation method of a device for automatically trimming annular substrate resistance, which comprises the following steps:
the vertical plate is fixed on the outer side wall of an original sheet bearing table of the trimming machine, the original sheet bearing table of the trimming machine drives a fixed plate to move, a rotating motor above a horizontal plate drives the sheet bearing plate to rotate, the sheet bearing plate drives the annular base plate to rotate, the original sheet bearing table of the trimming machine conveys the annular base plate to a trimming working position, a probe card mounting and correcting table of the trimming machine presses down a probe card to a first group of resistors of the annular base plate, after the first group of resistors are trimmed, the probe card mounting and correcting table lifts the probe card, a signal lamp is turned off, an index signal sensor sends a signal of the signal lamp to be turned off as a rotating signal of the rotating motor to a CPU, the rotating motor drives the sheet bearing plate to rotate, a second group of resistors of the annular base plate are driven to a position of trimming the first group of resistors, the signal lamp is turned on, the probe card mounting and correcting table presses down the probe card to the second group of resistors, the second group of resistors are trimmed, until the 15 groups of resistors are trimmed, the original sheet bearing table of the trimming machine drives the annular base plate to withdraw, a diffuse reflection sensor collects a signal of the black motor on the horizontal plate, and sends the signal of the signal to the rotating motor as a reset signal of the rotating motor to the rotating plate to the CPU to the position of the annular base plate, and the CPU is matched with the rotating motor to be reset to the position of the rotating plate to wait for the rotating signal to be restored.
Compared with the prior art, the invention has the following beneficial effects:
according to the device for automatically trimming the annular substrate resistor, the rotary wafer bearing table is arranged on the outer side wall of the original wafer bearing table of the trimming machine, the annular substrate is loaded on the wafer bearing plate, the original wafer bearing table of the trimming machine can drive the rotary wafer bearing table to move, the original wafer bearing table of the trimming machine conveys the annular substrate to the working position of the trimming machine, the probe card mounting and trimming table of the trimming machine presses down the probe card to the first group of resistors, after trimming the first group of resistors, the probe card mounting and trimming table lifts the probe card, the signal lamp is turned off, the indexing signal sensor sends the signal acquired by the signal lamp turned off as a rotating signal of the rotary wafer bearing table to the CPU, the CPU controls the rotary wafer bearing table to rotate the second group of resistors of the annular substrate to the position for trimming the first group of resistors under the action of the rotary motor, the signal lamp is turned on, the probe card mounting and trimming table presses down the probe card to the second group of resistors until the first group of resistors are trimmed, and the first wafer bearing table of the trimming machine drives the annular substrate to withdraw from the first group of resistors, and the problem that all the annular substrate cannot be automatically trimmed in the process of the prior art is solved. The black adhesive tape used for assisting the photoelectric diffuse reflection sensor to collect signals is stuck on the horizontal plate, so that the photoelectric diffuse reflection sensor can receive the signals of the black adhesive tape when the original wafer carrying table of the trimming machine is at the initial position. The invention not only meets the circuit requirements of the sensor, the oil volume potentiometer and the like, but also establishes a good process platform for developing other circuits such as the potentiometer and the like, expands the application field of the hybrid integrated circuit, and has important social benefit and economic value.
Furthermore, the electrodes at the two ends of the resistor are palladium-silver conductors, so that the resistor has good weldability, can be thermally press-welded with aluminum wires and gold wires, and the welding resistance is increased along with the increase of the content.
The invention provides an operation method of a device for automatically trimming an annular substrate resistor, which comprises the steps of collecting signals of a signal lamp through an indexing signal sensor, and sending the signals to a CPU (central processing unit) for controlling a rotary wafer carrying platform to rotate in the process of trimming the resistor; the photoelectric diffuse reflection sensor sends the acquired signals to the CPU as reset signals of the rotary wafer bearing table, the CPU is matched with the rotary wafer bearing table to control the rotary wafer bearing table to recover to the initial position, and trimming of the annular substrate resistor is achieved.
Drawings
For a clearer description of the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a conventional hybrid integrated circuit substrate according to the prior art.
Fig. 2 is a diagram showing the structure of a ring substrate of the device for automatically trimming the resistance of the ring substrate according to the present invention.
FIG. 3 is a block diagram of a rotary wafer stage of the apparatus for automatically trimming annular substrate resistance of the present invention.
FIG. 4 is a schematic view of the device for automatically trimming the resistance of an annular substrate according to the present invention, wherein a rotary wafer carrier is fixed on the front side of the original wafer carrier of the trimming machine.
FIG. 5 is a schematic diagram of a signal source of a rotary wafer stage of the apparatus for automatically trimming annular substrate resistance according to the present invention.
Fig. 6 is a schematic diagram of the cooperation between a rotary wafer carrier and an original wafer carrier of a trimming machine of the device for automatically trimming the resistance of an annular substrate.
Wherein: 1-a fixing plate; 2-a rotating electrical machine; 3-a splice plate; 4-a sheet bearing plate; a 5-ring-shaped substrate; 6-repairing and adjusting the original wafer bearing table of the machine.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the embodiments of the present invention, it should be noted that, if the terms "upper," "lower," "horizontal," "inner," and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or the azimuth or the positional relationship in which the inventive product is conventionally put in use, it is merely for convenience of describing the present invention and simplifying the description, and does not indicate or imply that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the term "horizontal" if present does not mean that the component is required to be absolutely horizontal, but may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the embodiments of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "loaded," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The invention is described in further detail below with reference to the attached drawing figures:
the invention provides a device for automatically trimming annular substrate resistance based on an automatic trimming hybrid integrated circuit connecting substrate resistance process, which is used for automatically trimming circuit annular substrate resistance such as a sensor, an oil mass potentiometer and the like.
The invention analyzes the characteristics of the annular substrate and the resistor, and establishes a foundation for researching the device for automatically trimming the resistor of the annular substrate: developing a rotatable wafer bearing platform, comprising a fixed plate 1, a rotating motor 2, a connecting plate 3, a wafer bearing plate 4 and an annular substrate 5, wherein the rotatable wafer bearing platform is fixed on an original wafer bearing platform 6 of a trimming machine, and is used as a wafer bearing platform of the substrate in the process of trimming the annular substrate 5; developing a signal source of the rotary wafer bearing table, which is used for controlling the rotary wafer bearing table to rotate and the like to realize the functions of automatic rotation and the like of the rotary wafer bearing table during trimming;
developing control instructions of the on-off state of a signal lamp at the working position of the repairing and adjusting machine in a repairing and adjusting program, wherein the control instructions are used for collecting signals of a signal source of a rotary wafer bearing table; developing a delay module instruction in the trimming program to provide a probe card lifting waiting time signal for the rotation of the rotary wafer bearing table;
developing an inclination angle trimming method in a trimming program to realize the setting of each resistor trimming cut mark on the annular substrate; according to the invention, the automatic trimming technology of the annular substrate resistor is realized.
1) Annular substrate and resistance characterization
The substrate used in the conventional hybrid integrated circuit is rectangular or pseudo-rectangular, the units of the integrated substrate are uniformly distributed in the horizontal or vertical direction, and the resistors are also distributed in the horizontal or vertical direction, and the schematic diagram is shown in fig. 1. In fig. 1, 3 rows and 3 columns of unit substrates are uniformly distributed on a connecting substrate, and each unit substrate is provided with 1 resistor in the horizontal direction. The original chip supporting table 6 of the trimming machine has the function of moving the equal step distance in the horizontal or vertical direction, after trimming the resistors on the 1 st unit substrate, the original chip supporting table 6 of the trimming machine automatically moves to the 2 nd unit substrate to trim the resistors on the 2 nd unit substrate in the horizontal direction at equal step distance, 3 unit substrate resistors on the 1 st row are trimmed in sequence, the original chip supporting table 6 of the trimming machine automatically moves to the 4 th unit substrate in the vertical direction at equal step distance, the resistors on the 4 th unit substrate are trimmed, and so on until trimming of all the resistors on the whole continuous substrate is finished, the chip supporting table is withdrawn, and automatic trimming of 9 unit substrate resistors on the 1 continuous substrate is completed. Trimming cuts are provided in the horizontal or vertical direction, such as the resistor cuts provided on the 3 rd unit substrate in fig. 1.
In the invention, the substrate is an annular substrate 5, as shown in fig. 2, 150 resistors are centripetally and uniformly distributed on the annular substrate 5, each 10 resistors are 1 group and 15 groups, the centripetally included angle between the resistors is 2.25 degrees, each resistor is trapezoid, the inclination angle of each resistor is different, the inclination angle of the 1 st resistor in the vertical direction is 8 degrees, the inclination angle of the 2 nd resistor in the vertical direction is 10.25 degrees, the inclination angle of the 3 rd resistor in the vertical direction is 12.5 degrees, and the like … …, and the inclination angle of the 150 th resistor in the vertical direction is 343.25 degrees.
The number of the resistors on the annular substrate 5 is large, the original chip supporting table 6 of the trimming machine does not have the capability of finishing trimming all the resistors on the annular substrate 5 at one time, so that 150 resistors are required to be trimmed in 15 groups, and the original chip supporting table 6 of the trimming machine on the hybrid integrated circuit production line has no rotating function, so that the automatic trimming of the resistors on the annular substrate 5 can not be finished. If the original piece bearing table 6 of the trimming machine is added with a rotating function, the difficulty is that: after the original wafer bearing table 6 of the trimming machine trims the 1 group of resistors, the annular substrate 5 cannot continuously and automatically rotate, and the 2 nd group to the 15 th group of resistors are trimmed; the existing horizontal or vertical trimming cut cannot meet the trimming of the resistance on the annular substrate 5.
Through the above analysis of the characteristics of the annular substrate 5 and the resistance, the problems to be solved in a urgent need are defined: developing a rotary wafer bearing table; developing a signal source for controlling the rotation of the rotary wafer bearing table; developing the setting of the inclination angle of the resistor cutting mark in the existing continuous resistor trimming program; the rotary wafer bearing table is abutted in the trimming procedure.
2) Rotary wafer bearing table
The structure of the rotary wafer bearing table is shown in fig. 3, and the rotary wafer bearing table in fig. 3 comprises a fixed plate 1, a rotary motor 2, a connecting plate 3, a wafer bearing plate 4 and an annular base plate 5.
The fixed plate 1 comprises horizontal plate and perpendicular board, and horizontal plate and perpendicular board are installed perpendicularly, and the perpendicular board is installed at the lateral wall of repairing and adjusting original piece platform 6, and fixed plate 1 is used for fixing rotatory piece platform at repairing and adjusting the front side of original piece platform 6. The length and the width of the front side surface of the original piece bearing table 6 of the trimming machine and the base of the rotating motor 2 should be fully considered when the fixing plate 1 is developed.
The rotating motor 2 is fixed above the horizontal plate, and the rotating motor 2 drives the newly developed carrier plate 4 to rotate, so that the annular substrate 5 is rotated when the resistor is repaired and regulated. The performance required for satisfying the power and the like required for rotating the substrate should be sufficiently considered when purchasing the rotating electric machine 2.
The carrier plate 4 is arranged above the rotating motor 2, and the carrier plate 4 is used for loading the annular substrate 5 when trimming the resistance of the annular substrate 5. When developing the carrier plate 4, a locating pin corresponding to the annular substrate 5 to be repaired and adjusted and a notch for conveniently loading and unloading the substrate are designed. The annular base plate 5 is provided with a through hole, and the through hole on the annular base plate 5 is sleeved on the locating pin on the wafer bearing plate 4 for locating when the annular base plate 5 is loaded.
A connecting plate 3 for fixing the rotary motor 2 and the sheet bearing plate 4 is arranged between the rotary motor 2 and the sheet bearing plate 4, and the connecting plate 3 connects the sheet bearing plate 4 of the rotary sheet bearing table with the rotary motor 2.
An annular substrate 5 is loaded above the chip carrier plate 4, the resistor on the annular substrate 5 is made of ruthenium series materials, and electrodes at two ends of the resistor are palladium-silver conductors; as shown in fig. 4, the rotary wafer stage is fixed to the front side of the original wafer stage 6 of the trimming machine.
By developing the rotary substrate support, the substrate rotation during trimming the annular substrate resistance is realized.
3) Working principle of signal source of rotary wafer bearing table
The schematic diagram of a rotating signal source of the rotating wafer bearing table is shown in fig. 5, a black adhesive tape for assisting the photoelectric diffuse reflection sensor to collect signals is stuck on a horizontal plate right below the photoelectric diffuse reflection sensor, and the size of the black adhesive tape is 3cm multiplied by 3cm; the original wafer carrying table 6 of the trimming machine is provided with a signal lamp for displaying the working state of the rotary wafer carrying table and an indexing signal sensor for receiving the signal of the signal lamp, wherein the indexing signal sensor can sense the signal of the signal lamp; the probe card assembling and correcting table positioned on the trimming machine is used for sequentially trimming fifteen groups of resistors, pressing down and lifting up the probe card, and the photoelectric diffuse reflection sensor, the graduation signal sensor and the rotating motor 2 are all electrically connected with the CPU.
In fig. 5, there are two rotation signal sources of the rotation support table, firstly, after finishing trimming of each group of resistors, the trimming machine signal lamp is turned off, and the signal is used as an indexing angle input signal of the rotation support table; secondly, a photoelectric diffuse reflection sensor is arranged at the top of a laser bin above the initial position of the original wafer carrying platform 6 of the trimming machine, the original wafer carrying platform 6 of the trimming machine is withdrawn after 15 groups of resistors are trimmed, a black adhesive tape signal is collected by the photoelectric diffuse reflection sensor at the withdrawn position, the signal is used as a reset signal for rotating the wafer carrying plate 4 of the rotating motor 2 and is sent to a CPU, and the CPU controls the wafer carrying plate 4 to recover to the initial position and waits for loading of the next annular substrate 5. The zero point offset of the rotary piece table, the indexing angle of the rotary motor 2 and the like are set according to the distribution characteristics of the resistors on the annular substrate 5. As shown in fig. 2, the 1 st resistor on the ring-shaped substrate 5 has an inclination angle of 8 ° in the vertical direction, so the zero-point offset of the first group should be 8 °. The centripetal included angle between the resistors is 2.25 degrees, and the inclined angle of the 10 resistors is 22.5 degrees, so the indexing angle of the motor is 22.5 degrees.
The rotary wafer bearing table is fixedly connected with the original wafer bearing table 6 of the repairing and adjusting machine, and is perfectly combined with the repairing and adjusting machine, so that the rotary wafer bearing table can move along with the original wafer bearing table 6 of the repairing and adjusting machine and can acquire signals from the original wafer bearing table 6 of the repairing and adjusting machine to independently move as a part of the repairing and adjusting machine. The principle of the cooperation of the rotary wafer bearing table and the original wafer bearing table 6 of the trimming machine is shown in fig. 6.
Firstly, the annular substrate 5 is loaded on a piece bearing plate 4 of a rotary piece bearing table, an original piece bearing table 6 of a trimming machine is started, the rotary piece bearing table enters a working position along with the original piece bearing table 6 of the trimming machine, a probe card for measuring a resistance value and trimming a resistance is arranged at the trimming working position, the probe card is pressed down, the resistance value measurement and trimming are started, and a signal lamp is on. After finishing trimming, the probe card is lifted up, the signal lamp is turned off, the signal is used as an indexing signal of the rotary wafer carrying platform, the rotary wafer carrying platform is required to rotate for 14 times because of trimming 15 groups of resistors, so the rotary wafer carrying platform judges whether the indexing is satisfied for 14 groups, if the indexing is less than 14 groups, the rotary wafer carrying platform rotates for 22.5 degrees, a trimming machine judges that several groups are trimmed while rotating, a waiting program is entered under the condition of less than 15 groups, and after the rotary wafer carrying platform finishes rotating, the probe card is pressed down to continue trimming. After 15 groups are circulated in sequence, the rotary wafer carrying platform is withdrawn from the repairing and adjusting machine working position along with the original wafer carrying platform 6 of the repairing and adjusting machine, the resistor repairing and adjusting on one annular substrate 5 is completed, and the annular substrate 5 is waited for being taken out and the next wafer is loaded.
4) Butt-joint rotary wafer bearing table in repairing and adjusting procedure
When the resistance of the annular substrate 5 is modified, 150 resistors are divided into 15 groups, each group of 15 groups of resistors can be regarded as 15 unit substrates which are distributed into 3 rows and 5 columns by a conventional connecting substrate, 3 rows and 5 columns are respectively arranged in a "% Row_no" and "% Lie_no" dialog box of a Set dis XY module of a resistance program of the modifying connecting substrate, and thus, the 15 groups of resistors are circularly modified and perfectly matched with the 15 groups of circular modification in FIG. 6 although the substrate is not distributed into 3 rows and 5 columns.
In the processes of rotating the wafer bearing table and trimming resistors in fig. 5 and 6, signals of two states of on-state and off-state of a signal lamp of a trimming machine are required to be collected, the signal lamp is on when the wafer bearing table is stopped and the trimming resistors are required to be turned on, and the signal lamp is off when the wafer bearing table is rotated or the wafer bearing table is withdrawn, so that a White LED1 module and a White LED2 module are required to be added in a trimming and connecting substrate resistor program before each 1 group of resistors is trimmed and after the trimming and adjusting of the group of resistors are completed, a proper brightness of the signal lamp is set in an il-brightness dialog box in the White LED1 module, the signal lamp of the trimming machine is on when the trimming and adjusting program is operated to the module, and the wafer bearing table is stopped and the trimming resistor of the trimming and adjusting machine is required to be carried out; the brightness of the signal lamp is set to be zero in an 'illumination' dialog box in the White LED2 module, the signal lamp of the repair and adjustment machine works to be turned off when the repair and adjustment program runs to the module, and the rotary wafer bearing table rotates or the original wafer bearing table 6 of the repair and adjustment machine is followed to exit from the repair and adjustment machine working position. Thus, the control of the working signal lamp of the trimming machine is completed on the resistor program on the trimming rotary substrate, and the required signals are transmitted for the actions such as rotation, stop, withdrawal and the like of the rotary wafer bearing platform.
In fig. 6, the probe card is lifted when the rotary wafer carrier rotates after finishing trimming 1 group of resistors each time, and at this time, the rotary wafer carrier rotates for 22.5 ° for about 2s, and the state of the probe carrier lifting is required to wait for more than 2s, so that a "Delay" module is added after a "White LED2" module in the trimming procedure, and a "Please insert the time" dialog box in the "Delay" module sets for 3s. Thus, the time 3s for the probe card to be lifted is sufficient for a time 2s for the rotating blade table to be rotated 22.5 °.
By the development of the trimming program, the problems of cyclic trimming of the trimming annular substrate resistor, signal acquisition of the trimming work signal lamp signal of the signal source, the lifting waiting time of the probe card and the like are solved, and the butt joint of the rotary wafer bearing table in the trimming program is perfectly completed.
5) Inclination angle setting of resistor notch
The conventional continuous substrate resistors are distributed in a horizontal or vertical direction, trimming cut marks are arranged in the horizontal or vertical direction in a trimming process, as shown in fig. 1, and the inclination angles of each resistor on the annular substrate 5 are different, as shown in fig. 2, and the trimming method for arranging the trimming cut marks of the resistors in the trimming continuous substrate resistor process cannot meet the trimming of the resistors on the annular substrate 5, so that the setting function of the trimming cut mark angles of the resistors on the annular substrate needs to be developed in the trimming continuous substrate resistor process.
The 150 resistors on the annular substrate 5 are divided into 15 groups for trimming, namely, the 1 st resistor to the 10 th resistor are the 1 st group, the 11 th resistor to the 20 th resistor are the 2 nd group, the 21 st resistor to the 30 th resistor are the 3 rd group, and the like … …, the 141 th resistor to the 150 th resistor are the 15 th group. Because the rotary chip carrier is developed and used, when the annular substrate resistor is trimmed, the trimming machine automatically rotates the resistor of the 2 nd group to the corresponding position of the resistor of the 1 st group after trimming the resistor of the 1 st group, namely, the 11 th resistor rotates to the 1 st resistor position, the 12 th resistor rotates to the 2 nd resistor position, the 13 th resistor rotates to the 3 rd resistor position, the like … …, the 20 th resistor rotates to the 10 th resistor position, then the trimming machine trims the resistor of the 2 nd group, the rotary chip carrier automatically rotates the resistor of the 3 rd group to the corresponding position of the resistor of the 1 st group after trimming the resistor of the 2 nd group, and the trimming machine trims the resistor of the 15 th group on the annular substrate, namely, all the resistors, and exits the substrate, thereby completing trimming work of one substrate. Since the trimming procedure of group 1 is cyclically used for the group 2 to group 15 resistors in the trimming process of the resistor of the annular substrate 5, only the setting of the trimming cut angle of the group 1 resistor on the annular substrate 5 needs to be developed.
In fig. 2, the 1 st resistor, i.e. the 1 st group 1 st, has an inclination angle of 8 ° in the vertical direction, and the centripetal angle between the resistors is 2.25 °, so that the 1 st group 1 resistor, the 1 st group 2 resistor, the 1 st group 3 rd resistor … … and the 1 st group 10 th resistor have inclination angles of 8 °, 10.25 ° and 12.5 ° … … 28.25.25 ° in the vertical direction, respectively.
Developing a ' radius for round comer ' function in a Trim chip substrate resistor program ' Trim Rm ' module by taking a vertical trimming cut mark in a trimming program as a reference, and respectively setting an inclination angle of 8 DEG for a 1 st resistor of a 1 st group, an inclination angle of 10.25 DEG for a 2 nd resistor of a 1 st group, an inclination angle of 12.5 DEG … … for a 3 rd resistor of a 1 st group and an inclination angle of 28.25 DEG for a 10 th resistor of a 1 st group at ' Trim R 1 ”、“Trim R 2 ”、“Trim R 3 ”……、“Trim R 10 In the "radius for round comer" dialog, the tilt angle setting of the resistive kerf is thus completed.
The trimming of the inclination angle resistor on the annular substrate is realized through the arrangement of the resistor inclination angle notch.
6) Trimming the resistance of the annular substrate 5 and conclusion
According to the above-mentioned rotary wafer carrier, as shown in fig. 4, the rotary wafer carrier is fixed on the front side of the original wafer carrier 6 of the trimming machine, and a signal source is developed according to the schematic diagrams of fig. 5 and 6, so that the rotary wafer carrier can operate signal instructions of various actions. In the conventional continuous sheet trimming program, the functions of cyclic trimming, signal source acquisition and trimming machine work signal lamp signal, probe card lifting waiting time and the like are developed, and the butt joint rotating sheet bearing table in the trimming program is perfectly completed. The setting of the inclination angle cut marks of the resistors is developed in the conventional continuous trimming procedure, and trimming of the resistors with inclination angles on the annular substrate 5 is realized. Thus, as shown in fig. 6, the whole process of automatically trimming the resistance on the annular substrate 5 is completed.
The invention provides an operation method of a device for automatically trimming annular substrate resistance, which comprises the following steps:
the vertical plate is fixed on the outer side wall of an original wafer carrying table 6 of the repairing and adjusting machine, the original wafer carrying table 6 of the repairing and adjusting machine drives a fixed plate 1 to move, a rotating motor 2 above a horizontal plate drives a wafer carrying plate 4 to rotate, the wafer carrying plate 4 drives an annular substrate 5 to rotate, the annular substrate is conveyed to a working position of the repairing and adjusting machine under the drive of the original wafer carrying table of the repairing and adjusting machine, a probe card mounting and correcting table of the repairing and adjusting machine presses down a probe card to a first group of resistors of the annular substrate 5, after the first group of resistors are repaired and adjusted, the probe card mounting and correcting table lifts the probe card, a signal lamp module in a repairing and adjusting program instructs a signal lamp to be turned off, an index signal sensor sends a signal acquired by the signal lamp to a CPU as a rotating signal of the rotating wafer carrying table, the CPU is matched with the rotating motor 2 to control the rotating, the rotating motor 2 drives the wafer carrying plate 4 to rotate a second group of the annular substrate 5 to a first group of resistors to be repaired and adjusted, the signal lamp module instructs the signal lamp to press down the probe card to the second group of resistors, the repairing and the second group of resistors … … are pressed down, and the repairing and adjusting machine is adjusted, and the repairing and adjusting machine is carried out on the first group of resistors, and the wafer is restored to the original wafer is automatically restored to the wafer carrying table, and the wafer is restored to the original wafer carrying table, and the wafer is automatically restored to the wafer carrying and the wafer is restored to the original wafer after the wafer is subjected to the first set to the first group, and the first group has the resistance and the first resistance and the wafer has the resistance and to the wafer and to a resistance and the wafer.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The device for automatically trimming the annular substrate resistor is characterized by comprising a rotary wafer bearing table and a CPU, wherein the rotary wafer bearing table comprises a fixed plate (1), a rotary motor (2) and a wafer bearing plate (4);
the fixing plate (1) consists of a horizontal plate and a vertical plate, wherein the horizontal plate and the vertical plate are vertically arranged, and the vertical plate is arranged on the outer side wall of the original piece bearing table (6) of the repairing and adjusting machine; the rotating motor (2) is fixed above the horizontal plate, the carrying plate (4) is arranged above the rotating motor (2), a connecting plate (3) is arranged between the rotating motor (2) and the carrying plate (4), and an annular substrate (5) is loaded above the carrying plate (4); 150 resistors are uniformly arranged on the annular substrate (5), and every ten adjacent resistors are in a group;
a photoelectric diffuse reflection sensor is arranged at the top of a laser bin above the initial position of an original wafer carrying table (6) of the trimming machine, and a black adhesive tape for assisting the photoelectric diffuse reflection sensor to acquire signals is stuck at any position of the horizontal plate; the original wafer carrying table (6) of the repairing and adjusting machine is provided with a signal lamp for displaying the working state of the rotary wafer carrying table and an indexing signal sensor for receiving the signal of the signal lamp; the probe card assembling calibration table positioned on the trimming machine is used for sequentially trimming fifteen groups of resistors, the photoelectric diffuse reflection sensor, the graduation signal sensor and the rotating motor (2) are electrically connected with the CPU, and the CPU is used for receiving signals of the photoelectric diffuse reflection sensor and the graduation signal sensor and controlling the rotating wafer bearing table to rotate.
2. Device for automatically trimming the resistances of annular substrates according to claim 1, characterized in that the centripetal angle between each resistance of the annular substrate (5) is 2.25 °.
3. Device for automatically trimming an annular substrate resistance according to claim 1, characterized in that the indexing angle of the rotating electrical machine (2) is 22.5 °.
4. The device for automatically trimming the resistance of the annular substrate according to claim 1, wherein the carrier plate (4) is provided with a positioning pin, the annular substrate (5) is provided with a through hole, and the through hole on the annular substrate (5) is sleeved on the positioning pin of the carrier plate (4).
5. The apparatus for automatically trimming an annular substrate resistor according to claim 1, wherein the rotary wafer carrier is in a stationary state when the signal lamp is on and in a rotary state when the signal lamp is off.
6. The device for automatically trimming the resistance of the annular substrate according to claim 1, wherein the resistance on the annular substrate (5) is made of ruthenium series materials, and electrodes at two ends of the resistance are palladium-silver conductors.
7. The apparatus for automatically trimming an annular substrate resistor according to claim 1, wherein the black tape has a size of 3cm x 3cm.
8. An operation method of the device for automatically trimming the resistance of the annular substrate according to any one of claims 1 to 7, comprising the steps of:
fixing a vertical plate on the outer side wall of an original sheet bearing table (6) of a trimming machine, driving a fixed plate (1) to move by the original sheet bearing table (6) of the trimming machine, driving a sheet bearing plate (4) to rotate by a rotating motor (2) above a horizontal plate, driving an annular substrate (5) to rotate by the sheet bearing plate (4), conveying the annular substrate (5) to a trimming machine working position by the original sheet bearing table (6) of the trimming machine, pressing a probe card to a first group of resistors of the annular substrate (5) by the probe card mounting and trimming table of the trimming machine, lifting the probe card by the probe card mounting and trimming table after trimming the first group of resistors, turning off a signal lamp, using a signal sensor for sending a signal acquired by the signal lamp as a rotating signal of a rotating motor (2), controlling the rotating motor (2) to rotate by the CPU in a matched mode, driving a second group of resistors of the annular substrate (5) to a position of the trimming first group of resistors by the rotating motor (4), turning on the signal lamp, driving the second group of resistors of the annular substrate (5) to exit from the second group of the probe card mounting and pressing the probe card to the second group of resistors (5) until the signal is restored to the original sheet bearing plate (4) and the signal is restored to the original position by the CPU (4), waiting for loading of the next annular substrate (5).
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| CN207458698U (en) * | 2017-11-28 | 2018-06-05 | 苏州市东科电子有限公司 | The full-automatic material-feeding and material collecting device of laser resistance adjuster |
| CN209216680U (en) * | 2018-12-29 | 2019-08-06 | 深圳市杰普特光电股份有限公司 | A kind of laser resistance adjuster |
| CN111091942A (en) * | 2019-12-16 | 2020-05-01 | 武汉驰电科技有限公司 | Online laser resistance trimming machine and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030172527A1 (en) * | 2002-03-15 | 2003-09-18 | Anton Kitai | Automated trim processing system |
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| DE3616217A1 (en) * | 1985-10-17 | 1987-04-23 | Ant Nachrichtentech | Resistance trimming device |
| CN107680758A (en) * | 2011-09-29 | 2018-02-09 | 罗姆股份有限公司 | Patch resistor and the electronic equipment with resistance circuit network |
| CN104091664A (en) * | 2014-06-12 | 2014-10-08 | 北京锋速精密设备有限公司 | Novel function curve following resistor trimming method |
| WO2016175016A1 (en) * | 2015-04-28 | 2016-11-03 | サンコール株式会社 | Shunt resistor and method for manufacturing same |
| CN107808727A (en) * | 2017-11-28 | 2018-03-16 | 苏州市东科电子有限公司 | The full-automatic material-feeding and material collecting device of laser resistance adjuster |
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| CN111091942A (en) * | 2019-12-16 | 2020-05-01 | 武汉驰电科技有限公司 | Online laser resistance trimming machine and method |
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| CN114566340A (en) | 2022-05-31 |
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