CN114566340A - Device for automatically trimming resistance of annular substrate and operation method - Google Patents
Device for automatically trimming resistance of annular substrate and operation method Download PDFInfo
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- CN114566340A CN114566340A CN202210163688.XA CN202210163688A CN114566340A CN 114566340 A CN114566340 A CN 114566340A CN 202210163688 A CN202210163688 A CN 202210163688A CN 114566340 A CN114566340 A CN 114566340A
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- 238000009966 trimming Methods 0.000 title claims abstract description 167
- 239000000758 substrate Substances 0.000 title claims abstract description 163
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000523 sample Substances 0.000 claims abstract description 39
- 230000008439 repair process Effects 0.000 claims description 13
- 239000002390 adhesive tape Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000005622 photoelectricity Effects 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- General Physics & Mathematics (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention discloses a device for automatically repairing and adjusting the resistance of an annular substrate and an operation method, the annular substrate is loaded on a bearing plate, the annular substrate is conveyed to a working position under the drive of an original bearing platform of a repairing and adjusting machine, a probe card is pressed down to a first group of resistors, a probe card adjusting platform lifts the probe card after the first group of resistors are repaired, a signal lamp is turned off, a signal lamp of a graduation signal sensor sends a signal of turning off the lamp to a CPU as a rotating signal of the rotating bearing platform, the CPU controls a second group of resistors of the annular substrate to be turned to the position of the first group of resistors to be repaired, the signal lamp is turned on, the probe card is pressed down to the second group of resistors, the second group of resistors are repaired until 15 groups of resistors are repaired, the original bearing platform of the repairing and adjusting machine drives the annular substrate to exit, a photoelectric diffuse reflection sensor sends the collected signal to the CPU as a reset signal of the rotating bearing platform, the CPU controls the rotating bearing platform to be restored to the initial position, the automatic trimming of the resistance of the annular substrate is realized, and the method has application prospect in the field of semiconductor hybrid integrated circuits.
Description
Technical Field
The invention belongs to the technical field of semiconductor hybrid integrated circuits, and relates to a device for automatically trimming annular substrate resistance and an operation method.
Background
A hybrid integrated circuit is an assembled circuit in which IC chips having various functions are electrically interconnected on an insulating substrate on which a combined pattern of a conductor, a resistor, an inductor, a capacitor, and the like is previously formed. One of the main functions of the insulating substrate in the hybrid integrated circuit is to serve as a base of the resistor. With the diversification of the field of use of hybrid integrated circuits, more complicated requirements are imposed on the shapes of substrates and resistors, and particularly, for circuits such as sensors and potentiometers, a resistor is required to be formed on an annular substrate.
The conventional hybrid integrated circuit substrate is distributed in a rectangular or suspected rectangular connected piece mode, units of the connected piece substrate are uniformly distributed in the horizontal or vertical direction, resistors on the unit substrate are also distributed on the substrate in the horizontal or vertical direction, and the connected piece trimming is adopted when the resistors of the conventional hybrid integrated circuit substrate are trimmed. The automatic trimming of the resistance of the connected substrate has two characteristics: the trimming machine wafer bearing platform has the function of moving at equal steps in the horizontal or vertical direction, and can finish automatic trimming operation in the horizontal or vertical direction; and setting trimming cut marks in the horizontal or vertical direction.
This base plate is annular substrate, and 150 resistances are certain entad contained angle and distribute on annular substrate, because the resistance number is many, repair the trimmer and can't once only accomplish the repair of all resistances on a base plate, so need divide 15 groups of 150 resistances into repair and debug, its difficult point: the trimming machine wafer bearing platform has no rotation function in the trimming process, and the resistors from the No. 2 group to the No. 15 group cannot be automatically trimmed continuously after the resistors from the No. 1 group are trimmed; the existing horizontal or vertical trimming cut mark can not meet the requirement of trimming the resistor on the annular substrate.
Disclosure of Invention
The invention aims to solve the problems in the prior art, provides a device for automatically trimming resistors of an annular substrate and an operation method thereof, and aims to solve the technical problems that in the prior art, a trimming machine wafer bearing table does not have a rotating function in the trimming process, the resistors from the No. 2 group to the No. 15 group cannot be continuously and automatically trimmed after 1 group of resistors are trimmed, and the existing horizontal or vertical trimming cut marks cannot meet the defect of resistor trimming on the annular substrate.
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:
the invention provides a device for automatically trimming the resistance of an annular substrate, which comprises a rotary wafer bearing table and a CPU (central processing unit), wherein the rotary wafer bearing table comprises a fixed plate, a rotary motor and a wafer bearing plate;
the fixing plate consists of a horizontal plate and a vertical plate, the horizontal plate and the vertical plate are vertically installed, and the vertical plate is installed on the outer side wall of the original wafer bearing platform of the trimming machine; the rotary motor is fixed above the horizontal plate, the sheet bearing plate is arranged above the rotary motor, a connecting plate is arranged between the rotary motor and the sheet bearing plate, and an annular substrate is loaded above the sheet bearing plate; 150 resistors are uniformly arranged on the annular substrate, and every ten adjacent resistors form a group;
a photoelectric diffuse reflection sensor is arranged at the top of a laser bin above the initial position of an original wafer bearing table of the trimming machine, and a black adhesive tape for assisting the photoelectric diffuse reflection sensor in acquiring signals is pasted at any position of the horizontal plate; the original wafer bearing table of the trimming machine is provided with a signal lamp for displaying the working state of the rotary wafer bearing table and an indexing signal sensor for receiving a signal of the signal lamp; and the CPU is used for receiving signals of the photoelectric diffuse reflection sensor and signals of the indexing signal sensor and controlling the rotation of the rotary wafer bearing table.
Preferably, each resistor of the annular substrate has a trapezoidal shape.
Preferably, the first resistor of the ring-shaped substrate is inclined at an angle of 8 ° in the vertical direction.
Preferably, each resistor of the annular substrate has a centripetal included angle of 2.25 °.
Preferably, the indexing angle of the rotating electrical machine is 22.5 °.
Preferably, the sheet bearing plate is provided with a positioning pin, the annular substrate is provided with a through hole, and the through hole on the annular substrate is sleeved on the positioning pin of the sheet bearing plate.
Preferably, the rotary wafer bearing table is in a static state when the signal lamp is on, and the rotary wafer bearing table is in a rotary state when the signal lamp is off.
Preferably, the resistor on the annular substrate is made of ruthenium material, and electrodes at two ends of the resistor are made of palladium-silver conductors.
Preferably, the size of the black tape is 3cm × 3 cm.
The invention provides an operation method of a device for automatically trimming annular substrate resistance, which comprises the following steps:
fixing a vertical plate on the outer side wall of an original sheet bearing table of a trimming machine, driving a fixing plate to move by the original sheet bearing table of the trimming machine, driving a sheet bearing plate to rotate by a rotating motor above a horizontal plate, driving an annular substrate to rotate by the sheet bearing plate, conveying the annular substrate to a working position of the trimming machine by the original sheet bearing table of the trimming machine, pressing a probe card to a first group of resistors of the annular substrate by a probe card calibration table of the trimming machine, lifting the probe card by the probe card calibration table after the first group of resistors are trimmed, extinguishing a signal lamp, sending a signal acquired by an index signal sensor as a rotating signal of the rotating motor to a CPU (central processing unit), controlling the rotating motor to rotate by the CPU in a matching way, driving the sheet bearing plate by the rotating motor to rotate a second group of resistors of the annular substrate to a position for trimming the first group of resistors, lighting the signal lamp, pressing the probe card calibration table to the second group of resistors, trimming the second group of resistors until 15 groups of resistors are trimmed, the original wafer bearing table of the trimming machine drives the annular substrate to exit, the photoelectric diffuse reflection sensor collects signals of the black adhesive tape on the horizontal plate, the collected signals are used as reset signals of the rotary wafer bearing plate of the rotary motor to be sent to the CPU, and the CPU controls the rotary motor to restore the wafer bearing plate to the initial position in a matched mode to wait for loading of the next annular substrate.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a device for automatically trimming annular substrate resistors, which is characterized in that a rotary sheet bearing table is arranged on the outer side wall of an original sheet bearing table of a trimming machine, an annular substrate is loaded on a sheet bearing plate, the original sheet bearing table of the trimming machine drives the rotary sheet bearing table to move, the original sheet bearing table of the trimming machine conveys the annular substrate to a working position of the trimming machine, a probe card adjusting table of the trimming machine downwards presses a probe card to a first group of resistors, after the first group of resistors are trimmed, the probe card adjusting table lifts the probe card, a signal lamp is turned off, an indexing signal sensor sends a signal which is collected to turn off the signal lamp to a CPU as a rotary signal of the rotary sheet bearing table, the CPU controls the rotary sheet bearing table to rotate a second group of resistors of the annular substrate to the position of the first group of resistors, the signal lamp is on, the probe card adjusting table downwards presses the probe card to the second group of resistors, and the second group of resistors are trimmed by repeating the steps of adjusting the second group of resistors … …, the original wafer bearing table of the trimming machine drives the annular substrate to withdraw until 15 groups of resistors are trimmed, and the problem that automatic trimming of all resistors on one annular substrate cannot be completed at one time due to the fact that the wafer bearing table of the trimming machine in the prior art does not have a rotating function in the trimming process is solved. Wherein, paste on the horizontal plate and be used for assisting the black adhesive tape of photoelectricity diffuse reflection sensor collection signal, can let photoelectricity diffuse reflection sensor can accept the signal of black adhesive tape when the original wafer bearing platform of trimming machine is in the initial position. The invention not only meets the requirements of the sensor, the oil volume potentiometer and other circuits, but also builds a good process platform for developing other potentiometers and other circuits, expands the use field of hybrid integrated circuits, and has important social benefits and economic values.
Furthermore, the electrodes at two ends of the resistor are palladium-silver conductors, have good weldability, can be welded with aluminum wires and gold wires in a hot-pressing mode, and the welding resistance is increased along with the increase of the content.
The invention provides an operation method of a device for automatically trimming an annular substrate resistor, which is characterized in that a signal lamp signal is acquired by an indexing signal sensor and sent to a CPU (central processing unit) for controlling a rotary wafer bearing table to rotate in the resistor trimming process; the photoelectric diffuse reflection sensor sends the collected signals to the CPU as reset signals of the rotary wafer bearing table, and the CPU controls the rotary wafer bearing table to restore to the initial position in a matching mode to achieve trimming of the resistance of the annular substrate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic diagram of a conventional hybrid integrated circuit substrate according to the prior art.
Fig. 2 is a structural diagram of the ring substrate of the apparatus for automatically trimming the resistance of the ring substrate according to the present invention.
FIG. 3 is a structural diagram of a rotary wafer-holding table of the apparatus for automatically trimming the resistance of the annular substrate according to the present invention.
FIG. 4 is a schematic diagram of the rotary stage of the apparatus for automatically trimming the resistance of the annular substrate of the present invention fixed to the front side of the original stage of the trimming machine.
FIG. 5 is a schematic diagram of a signal source of a rotary wafer stage of the apparatus for automatically trimming the resistance of the annular substrate according to the present invention.
FIG. 6 is a schematic diagram of the working of the rotary wafer-holding table of the device for automatically trimming the resistance of the annular substrate and the original wafer-holding table of the trimming machine.
Wherein: 1-fixing the plate; 2-a rotating electrical machine; 3-connecting the fishplate bar; 4-a sheet bearing plate; 5-a ring-shaped substrate; 6-trimming the original wafer bearing platform of the machine.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that if the terms "upper", "lower", "horizontal", "inner", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which is usually arranged when the product of the present invention is used, the description is merely for convenience and simplicity, and the indication or suggestion that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, cannot be understood as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
Furthermore, the term "horizontal", if present, does not mean that the component is required to be absolutely horizontal, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the embodiments of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "loaded," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The invention is described in further detail below with reference to the accompanying drawings:
the invention provides a device for automatically trimming the resistance of an annular substrate, which is used for automatically trimming the resistance of the annular substrate of circuits such as a sensor, an oil volume potentiometer and the like.
The invention analyzes the characteristics of the annular substrate and the resistor and establishes a foundation for researching the device for automatically trimming the resistor of the annular substrate: developing a rotatable wafer bearing platform, which comprises a fixed plate 1, a rotating motor 2, a connecting plate 3, a wafer bearing plate 4 and an annular substrate 5, wherein the rotating wafer bearing platform is fixed on an original wafer bearing platform 6 of a trimming machine, and is used as a wafer bearing platform of the substrate in the process of trimming the annular substrate 5; developing a rotary wafer bearing table signal source for controlling the rotary wafer bearing table to rotate and the like, and realizing the functions of automatic rotation and the like of the rotary wafer bearing table during repair and adjustment;
developing control instructions of two states of turning on and turning off of a signal lamp of a working position of the trimming machine in a trimming program, wherein the control instructions are used for acquiring signals of a signal source of a rotary wafer bearing table; developing a delay module instruction in a trimming program to provide a probe card lifting waiting time signal when the rotary wafer bearing table rotates;
developing an inclination angle trimming method in a trimming program to realize the setting of each resistance trimming shear mark on the annular substrate; the invention realizes the automatic trimming technology of the resistance of the annular substrate.
1) Annular substrate and resistance characteristic analysis
The substrate used in the conventional hybrid integrated circuit is rectangular or pseudo-rectangular, the cells of the connected substrate are uniformly distributed in the horizontal or vertical direction, and the resistors are also distributed in the horizontal or vertical direction, as shown in fig. 1. In fig. 1, 3 rows and 3 columns of unit substrates are uniformly distributed on the connected substrate, and each unit substrate is provided with 1 resistor in the horizontal direction. The original wafer bearing table 6 of the trimming machine has an equal-step moving function in the horizontal or vertical direction, after the resistance on the 1 st unit substrate is trimmed in the process of trimming the resistance of the continuous substrate, the original wafer bearing table 6 of the trimming machine automatically moves to the 2 nd unit substrate at equal steps in the horizontal direction, the resistance on the 2 nd unit substrate is trimmed, the resistance on the 3 unit substrates in the 1 st row is sequentially trimmed, the original wafer bearing table 6 of the trimming machine automatically moves to the 4 th unit substrate at equal steps in the vertical direction, the resistance on the 4 th unit substrate is trimmed, and the like, until the trimming of all the resistances on the whole continuous substrate is finished, the wafer bearing table exits, and the automatic trimming of the resistances of the 9 unit substrates on the 1 continuous substrate is finished. The trimming cut is provided in the horizontal or vertical direction, as in the case of the 3 rd unit substrate in fig. 1.
The substrate is a ring-shaped substrate 5, as shown in fig. 2, 150 resistors are centripetally and equidistantly distributed on the ring-shaped substrate 5, each 10 resistors are 1 group and are divided into 15 groups of resistors, the centripetal included angle between the resistors is 2.25 degrees, each resistor is trapezoidal, the inclination angle of each resistor is different, the inclination angle of the 1 st resistor in the vertical direction is 8 degrees, the inclination angle of the 2 nd resistor in the vertical direction is 10.25 degrees, the inclination angle of the 3 rd resistor in the vertical direction is 12.5 degrees, the same can be said for … … degrees, and the inclination angle of the 150 th resistor in the vertical direction is 343.25 degrees.
The number of the resistors on the annular substrate 5 is large, and the original wafer bearing table 6 of the trimming machine does not have the capability of trimming all the resistors on one annular substrate 5 at a time, so that 150 resistors need to be trimmed in 15 groups, and the original wafer bearing table 6 of the trimming machine on the hybrid integrated circuit production line does not have a rotating function, so that the automatic trimming of the resistors on the annular substrate 5 cannot be completed. If the original wafer bearing platform 6 of the trimming machine is added with a rotating function, the difficulty is as follows: after the original wafer bearing table 6 of the trimming machine trims 1 group of resistors, the annular substrate 5 cannot continuously and automatically rotate to trim the 2 nd to 15 th groups of resistors; the existing horizontal or vertical trimming cut cannot meet the trimming of the resistance on the annular substrate 5.
Through the above analysis of the characteristics of the annular substrate 5 and the resistor, the problems to be solved urgently are clarified: developing a rotary wafer bearing table; developing a signal source for controlling the rotation of the rotary wafer bearing table; the setting of the inclination angle of the resistance cutting mark is developed in the existing chip resistor trimming program; and butting the rotary wafer bearing table in the trimming procedure.
2) Rotary wafer-holding table
The structure of the rotary wafer bearing table is shown in fig. 3, and the rotary wafer bearing table in fig. 3 comprises a fixed plate 1, a rotary motor 2, a connecting plate 3, a wafer bearing plate 4 and an annular base plate 5.
The fixed plate 1 is composed of a horizontal plate and a vertical plate, the horizontal plate and the vertical plate are vertically installed, the vertical plate is installed on the outer side wall of the original wafer bearing platform 6 of the trimming machine, and the fixed plate 1 is used for fixing the rotary wafer bearing platform on the front side of the original wafer bearing platform 6 of the trimming machine. When the fixing plate 1 is researched, the length and the width of the front side surface of the original wafer bearing table 6 of the trimming machine and the base of the rotating motor 2 are fully considered.
The rotating motor 2 is fixed above the horizontal plate, and the rotating motor 2 drives the newly developed sheet bearing plate 4 to rotate, so that the annular substrate 5 is rotated when the resistor is repaired and adjusted. The rotary electric machine 2 should be purchased with sufficient consideration for satisfying the performance such as power required for rotating the substrate.
The sheet bearing plate 4 is arranged above the rotating motor 2, and the sheet bearing plate 4 is used for loading the annular substrate 5 when the resistance of the annular substrate 5 is trimmed. When the bearing plate 4 is developed, a positioning pin corresponding to the modified annular substrate 5 and a notch facilitating loading and unloading of the substrate are designed. A through hole is formed in the annular substrate 5, and the through hole in the annular substrate 5 is sleeved on the positioning pin on the sheet bearing plate 4 when the annular substrate 5 is loaded for positioning.
The middle of the rotating motor 2 and the sheet bearing plate 4 is provided with a connecting plate 3 for fixing the rotating motor 2 and the sheet bearing plate 4, and the sheet bearing plate 4 of the rotating sheet bearing platform is connected with the rotating motor 2 through the connecting plate 3.
An annular substrate 5 is loaded above the sheet bearing plate 4, the resistor on the annular substrate 5 is made of ruthenium material, and electrodes at two ends of the resistor are all palladium-silver conductors; as shown in fig. 4, the rotary stage is fixed to the front side of the original stage 6 of the trimming machine.
Through the development of the rotary wafer bearing table, the rotation of the substrate during the trimming of the resistance of the annular substrate is realized.
3) Signal source working principle of rotary wafer bearing table
A schematic diagram of a rotating signal source of the rotating wafer bearing table is shown in fig. 5, wherein a black adhesive tape for assisting the photoelectric diffuse reflection sensor in acquiring signals is adhered to a horizontal plate right below the photoelectric diffuse reflection sensor, and the size of the black adhesive tape is 3cm multiplied by 3 cm; the original wafer bearing table 6 of the trimming machine is provided with a signal lamp for displaying the working state of the rotary wafer bearing table and a dividing signal sensor for receiving a signal lamp signal, and the dividing signal sensor can sense the signal lamp signal; and the probe card calibration table on the trimming machine is used for pressing down and lifting up the probe card when the fifteen groups of resistors are trimmed in sequence, and the photoelectric diffuse reflection sensor, the indexing signal sensor and the rotating motor 2 are all electrically connected with the CPU.
In fig. 5, the number of the rotary signal sources of the rotary wafer bearing table is two, and one is that after trimming of each group of resistors is completed, signal lamps of the trimming machine are turned off, and the signals are used as index angle input signals of the rotary wafer bearing table; and secondly, installing a photoelectric diffuse reflection sensor at the top of the laser bin above the initial position of the original wafer bearing table 6 of the trimming machine, withdrawing the original wafer bearing table 6 of the trimming machine after finishing trimming of 15 groups of resistors, collecting a black adhesive tape signal at the withdrawn position, taking the signal as a reset signal of the rotary wafer bearing plate 4 of the rotary motor 2 and sending the signal to a CPU (central processing unit), and controlling the wafer bearing plate 4 to restore to the initial position by the CPU to wait for loading of the next annular substrate 5. Information such as the zero point offset of the rotary wafer stage and the division angle of the rotary motor 2 is set according to the distribution characteristics of the resistors on the annular substrate 5. As shown in fig. 2, the 1 st resistor on the annular substrate 5 is inclined at an angle of 8 ° in the vertical direction, so the zero-point offset of the operating bit of the first group should be 8 °. The centripetal included angle between the resistors is 2.25 degrees, the inclination angle of 10 resistors is 22.5 degrees, and therefore the indexing angle of the motor is 22.5 degrees.
The rotary wafer bearing table is fixedly connected with the original wafer bearing table 6 of the trimming machine, is perfectly combined with the trimming machine, and is used as a part of the trimming machine, not only can move along with the original wafer bearing table 6 of the trimming machine, but also can independently move by collecting signals from the original wafer bearing table 6 of the trimming machine. The working principle of the cooperation between the rotary wafer bearing platform and the original wafer bearing platform 6 of the trimming machine is shown in fig. 6.
Firstly, loading an annular substrate 5 on a bearing plate 4 of a rotary bearing table, starting an original bearing table 6 of a trimming machine, enabling the rotary bearing table to enter a working position along with the original bearing table 6 of the trimming machine, installing a probe card for measuring resistance and trimming resistance at the working position of the trimming machine, pressing the probe card downwards, starting measuring resistance and trimming, and lighting the signal lamp at the moment. After the trimming is finished, the probe card is lifted, the signal lamps are turned off, the signal is used as an indexing signal of the rotary wafer bearing table, the rotary wafer bearing table judges whether the indexing meets 14 groups or not because 15 groups of resistors are required to be trimmed and rotated for 14 times, if the indexing times are less than 14 groups, the rotary wafer bearing table rotates for 22.5 degrees, the trimming machine judges that several groups are trimmed while rotating, a waiting program is entered under the condition that the groups are less than 15 groups, and the probe card is pressed down to continue the trimming after the rotary wafer bearing table is rotated. And after 15 groups are circulated in sequence, the rotary wafer bearing table exits from the working position of the trimming machine along with the original wafer bearing table 6 of the trimming machine to finish the resistor trimming on one annular substrate 5, and the annular substrate 5 is waited to be taken out and the next wafer is loaded.
4) Butt-joint rotary wafer-bearing table in repairing and adjusting procedure
When the resistors of the annular substrate 5 are trimmed, 150 resistors are divided into 15 groups, each group of the 15 groups of resistors can be regarded as a conventional continuous substrate and distributed into 15 unit substrates of 3 rows and 5 columns, and the 3 rows and 5 columns are respectively arranged in dialog boxes of "% Row _ no" and "% Lie _ no" in a "Set dis XY" module of a trimming continuous substrate resistor program, so that although the substrate is not distributed in 3 rows and 5 columns, the cyclic trimming of the 15 groups of resistors is also realized, and the cyclic trimming is perfectly matched with the 15 groups of cyclic trimming in fig. 6.
Signals of two states of lighting and extinguishing of a signal lamp of a working position of the trimming machine are required to be acquired in the processes of rotating and trimming the resistor of the rotary sheet bearing table in the graphs shown in fig. 5 and 6, the law is that the signal lamp is on when the rotary sheet bearing table stops and trims the resistor, and the signal lamp is off when the rotary sheet bearing table rotates or the sheet bearing table exits, so that a 'White LED 1' module and a 'White LED 2' module are respectively added in a resistor trimming and trimming connecting sheet substrate resistor program before trimming each 1 group of resistors and after trimming the group of resistors, a 'illumination' dialog box in the 'White LED 1' module is used for setting the proper brightness of the signal lamp, the signal lamp of the working position of the trimming machine is on when the trimming program runs to the module, and the rotary sheet bearing table stops and trims the resistor; the brightness of a signal lamp is set to be zero in an 'animation' dialog box in a 'White LED 2' module, when a trimming program runs to the module, the signal lamp of a working position of the trimming machine is turned off, and the rotary sheet bearing table rotates or exits from the working position of the trimming machine along with the original sheet bearing table 6 of the trimming machine. Thus, the control of the signal lamp of the trimming machine working position is completed on the resistance program on the trimming rotary substrate, and required signals are transmitted for actions of rotation, stop, quit and the like of the rotary wafer bearing table.
In fig. 6, the probe card is lifted when the rotary stage rotates after 1 set of resistors is repaired, at this time, the rotary stage rotates 22.5 ° for about 2s, and the state of the probe stage being lifted is required to wait for more than 2s, so that a "Delay" module is added behind the "White LED 2" module in the repair procedure, and the "pulse insert the time" dialog box in the "Delay" module is set for 3 s. Thus, the time 3s for probe card lift is sufficient for the time 2s for the rotational stage to rotate 22.5 °.
Through the development of the trimming program, the problems of circular trimming of the resistor of the trimming annular substrate, signal lamp signals of a signal source acquisition trimming machine working position, lifting of a probe card, waiting time and the like are solved, and the butt joint of the rotary wafer bearing table in the trimming program is perfectly finished.
5) Inclination angle setting of resistance cutting mark
The resistors of the conventional continuous substrate are distributed in the horizontal or vertical direction, and the trimming cut marks are arranged in the trimming program along the horizontal or vertical direction, as shown in fig. 1, while the inclination angle of each resistor on the annular substrate 5 is different, as shown in fig. 2, the method for setting the trimming cut marks in the trimming program of the resistors of the continuous substrate cannot meet the requirement of trimming the resistors on the annular substrate 5, so the function of setting the angle of the trimming cut marks of the resistors on the annular substrate needs to be developed in the trimming program of the resistors of the continuous substrate.
The 150 resistors on the annular substrate 5 are trimmed into 15 groups, that is, the 1 st to 10 th resistors are the 1 st group, the 11 th to 20 th resistors are the 2 nd group, the 21 st to 30 th resistors are the 3 rd group, and so on … …, and the 141 th to 150 th resistors are the 15 th group. Because the rotary bearing platform is developed and used, when the resistance of the annular substrate is repaired, the rotary bearing platform automatically rotates the resistance of the 2 nd group to the corresponding position of the resistance of the 1 st group after the repair and adjustment machine finishes repairing and adjusting the resistance of the 1 st group, namely, the 11 th resistance rotates to the 1 st resistance position, the 12 th resistance rotates to the 2 nd resistance position, the 13 th resistance rotates to the 3 rd resistance position, and so on … …, the 20 th resistance rotates to the 10 th resistance position, then, the repair and adjustment machine repairs and adjusts the resistance of the 2 nd group, the rotary bearing platform automatically rotates the resistance of the 3 rd group to the corresponding position of the resistance of the 1 st group after the repair and adjustment of the 2 nd group, and so on, the repair and adjustment machine finishes repairing and adjusting 15 groups of resistances, namely all resistances on the annular substrate, and exits from the substrate, thereby completing the repair and adjustment work of one substrate. Because the 2 nd group to the 15 th group of resistors all cyclically use the 1 st group of trimming programs in the resistor trimming process of the annular substrate 5, only the 1 st group of resistors on the annular substrate 5 need to be developed for trimming the cutting mark angle.
In fig. 2, the 1 st resistor, i.e., the 1 st resistor in the 1 st group is inclined at an angle of 8 ° in the vertical direction, and the centripetal included angle between the resistors is 2.25 °, so that the 1 st resistor in the 1 st group, the 2 nd resistor in the 1 st group, the 3 rd resistor in the 1 st group … …, the 10 th resistor in the 1 st group are inclined at angles of 8 °, 10.25 ° and 12.5 ° … … 28.25.25 ° in the vertical direction, respectively.
A ' radius for round com ' function is developed in a trimming connecting sheet substrate resistance program ' Trim Rm ' module by taking a trimming cutting mark in the vertical direction in a trimming program as a reference, and the inclination angle of 8 degrees of a 1 st resistor of a 1 st group, the inclination angle of 10.25 degrees of a 2 nd resistor of the 1 st group and the inclination angle of 12.5 degrees of … … degrees of a 3 rd resistor of the 1 st group are respectively arranged at ' Trim R ', and the inclination angle of 28.25 degrees of a 10 th resistor of the 1 st group are respectively arranged at ' Trim R1”、“Trim R2”、“Trim R3”……、“Trim R10In the "radius for round com" dialog, the tilt angle setting of the resistance cut is thus completed.
The resistor with the inclination angle is trimmed on the annular substrate through the arrangement of the resistor inclination angle shear mark.
6) And adjusting the resistance and conclusion of the annular substrate 5
According to the above-mentioned rotary wafer-holding table, as shown in fig. 4, the rotary wafer-holding table is fixed on the front side of the original wafer-holding table 6 of the trimming machine, and a signal source is developed according to the schematic diagrams of fig. 5 and 6 for the rotary wafer-holding table to operate signal instructions of various actions. The functions of cyclic trimming, signal source acquisition of signal lamp signals of a working position of the trimming machine, probe card lifting waiting time and the like are developed in a conventional continuous trimming program, and the butt joint of the rotary wafer bearing table in the trimming program is perfectly finished. The setting of the dip angle cut mark of the resistance is opened in the conventional continuous trimming procedure, and the trimming of the resistance with the dip angle on the annular substrate 5 is realized. Thus, as shown in fig. 6, the entire process of automatically trimming the resistance on the ring substrate 5 is completed.
The invention provides an operation method of a device for automatically trimming the resistance of an annular substrate, which comprises the following steps:
fixing a vertical plate on the outer side wall of an original sheet bearing table 6 of a trimming machine, driving a fixing plate 1 to move by the original sheet bearing table 6 of the trimming machine, driving a sheet bearing plate 4 to rotate by a rotating motor 2 above a horizontal plate, driving an annular substrate 5 to rotate by the sheet bearing plate 4, driving the annular substrate to be conveyed to a working position of the trimming machine by the original sheet bearing table of the trimming machine, pressing a probe card to a first group of resistors of the annular substrate 5 by a probe card calibration table of the trimming machine, lifting the probe card by the probe card calibration table after the first group of resistors are trimmed, sending a signal lamp module instruction signal lamp out in a trimming program, sending a signal which is collected to the signal lamp out to a Central Processing Unit (CPU) as a rotating signal of the rotating sheet bearing table by a dividing signal sensor, controlling the rotating motor 2 to rotate by the cooperation of the CPU, driving the sheet bearing plate 4 by the rotating motor 2 to rotate a second group of resistors of the annular substrate 5 to a first group of resistor calibration position, sending the signal lamp instruction signal lamp module instruction signal lamp to be on, and the probe card calibration platform presses the probe card to a second group of resistors, the second group of resistors … … is trimmed until 15 groups of resistors are trimmed, the original wafer bearing platform 6 of the trimming machine exits, the photoelectric diffuse reflection sensor sends the acquired signals to the CPU as reset signals of the rotary wafer bearing platform, and the CPU controls the rotary wafer bearing platform to restore to the initial position in a matching manner, so that the automatic trimming of the resistors of the annular substrates is realized, and the next annular substrate 5 is waited to be loaded.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The device for automatically trimming the resistance of the annular substrate is characterized by comprising a rotary wafer bearing table and a CPU (central processing unit), wherein the rotary wafer bearing table comprises a fixed plate (1), a rotary motor (2) and a wafer bearing plate (4);
the fixed plate (1) is composed of a horizontal plate and a vertical plate, the horizontal plate and the vertical plate are vertically installed, and the vertical plate is installed on the outer side wall of an original wafer bearing table (6) of the trimming machine; the rotary motor (2) is fixed above the horizontal plate, the sheet bearing plate (4) is arranged above the rotary motor (2), a connecting plate (3) is arranged between the rotary motor (2) and the sheet bearing plate (4), and an annular substrate (5) is loaded above the sheet bearing plate (4); 150 resistors are uniformly arranged on the annular substrate (5), and every ten adjacent resistors form a group;
a photoelectric diffuse reflection sensor is arranged at the top of a laser bin above the initial position of an original wafer bearing table (6) of the trimming machine, and a black adhesive tape for assisting the photoelectric diffuse reflection sensor in acquiring signals is pasted at any position of the horizontal plate; the original wafer bearing table (6) of the trimming machine is provided with a signal lamp for displaying the working state of the rotary wafer bearing table and an indexing signal sensor for receiving a signal of the signal lamp; and the probe card calibration table on the trimming machine is used for sequentially trimming fifteen groups of resistors, the photoelectric diffuse reflection sensor, the indexing signal sensor and the rotating motor (2) are electrically connected with a CPU, and the CPU is used for receiving signals of the photoelectric diffuse reflection sensor and the indexing signal sensor and controlling the rotation of the rotary wafer bearing table.
2. The device for automatically trimming the resistance of an annular substrate according to claim 1, wherein each resistance of the annular substrate (5) is trapezoidal.
3. Device for automatically trimming the resistance of an annular substrate according to claim 1, characterized in that the first resistance of the annular substrate (5) is inclined by an angle of 8 ° in the vertical direction.
4. Device for automatically trimming the resistors of a ring-shaped substrate according to claim 3, characterized in that the included angle centripetal between each resistor of the ring-shaped substrate (5) is 2.25 °.
5. The device for automatically trimming the resistance of an annular substrate according to claim 1, characterized in that the indexing angle of the rotating electrical machine (2) is 22.5 °.
6. The device for automatically trimming the resistance of the annular substrate according to claim 1, wherein the sheet bearing plate (4) is provided with a positioning pin, the annular substrate (5) is provided with a through hole, and the through hole of the annular substrate (5) is sleeved on the positioning pin of the sheet bearing plate (4).
7. The apparatus of claim 1, wherein the rotary stage is stationary when the traffic light is on and rotatable when the traffic light is off.
8. The device for automatically trimming the resistance of the ring-shaped substrate according to claim 1, wherein the resistance on the ring-shaped substrate (5) is ruthenium-based material, and electrodes at two ends of the resistance are palladium-silver conductors.
9. The apparatus of claim 1, wherein the black tape has a size of 3cm x 3 cm.
10. The operation method of the device for automatically adjusting the resistance of the annular substrate according to any one of claims 1 to 9 is characterized by comprising the following steps:
fixing a vertical plate on the outer side wall of an original bearing table (6) of a trimming machine, driving a fixed plate (1) to move by the original bearing table (6) of the trimming machine, driving a bearing plate (4) to rotate by a rotating motor (2) above a horizontal plate, driving an annular substrate (5) to rotate by the bearing plate (4), conveying the annular substrate (5) to a working position of the trimming machine by the original bearing table (6) of the trimming machine, pressing a probe card to a first group of resistors of the annular substrate (5) by a probe card calibration table of the trimming machine, lifting the probe card calibration table after the first group of resistors are trimmed, turning off a signal lamp, sending the signal obtained by a dividing signal sensor as a rotating signal of the rotating motor (2) to a CPU (central processing unit), controlling the rotating motor (2) to rotate by the cooperation of the CPU, driving the bearing plate (4) by the rotating motor (2) to rotate a second group of resistors of the annular substrate (5) to a position for trimming the first group of resistors, the signal lamp is bright, the probe card is installed the school platform and is pushed down the probe card to second group resistance, repair second group resistance, until having repaired 15 groups resistance, repair original wafer bearing platform (6) of machine and drive annular base plate (5) and withdraw from, the signal of black adhesive tape on the horizontal plate is gathered to photoelectricity diffuse reflection sensor, and send CPU as the reset signal of rotating electrical machines (2) rotatory wafer bearing board (4) with the signal of gathering, CPU cooperation control rotating electrical machines (2) resume initial position with wafer bearing board (4), wait for the loading of next annular base plate (5).
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| DE3616217A1 (en) * | 1985-10-17 | 1987-04-23 | Ant Nachrichtentech | Resistance trimming device |
| US20030172527A1 (en) * | 2002-03-15 | 2003-09-18 | Anton Kitai | Automated trim processing system |
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| CN114566340B (en) | 2023-09-19 |
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