CN114556602A - 热电转换装置、热电转换装置的控制方法、使用热电转换装置冷却和/或加热对象物的方法及电子装置 - Google Patents

热电转换装置、热电转换装置的控制方法、使用热电转换装置冷却和/或加热对象物的方法及电子装置 Download PDF

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CN114556602A
CN114556602A CN202080071850.4A CN202080071850A CN114556602A CN 114556602 A CN114556602 A CN 114556602A CN 202080071850 A CN202080071850 A CN 202080071850A CN 114556602 A CN114556602 A CN 114556602A
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thermoelectric conversion
electrode
conversion device
module
conversion module
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Chinese (zh)
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藤金正树
高桥宏平
反保尚基
中村邦彦
内藤康幸
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Interconnections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H10N19/101—Multiple thermocouples connected in a cascade arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202080071850.4A 2019-10-25 2020-10-06 热电转换装置、热电转换装置的控制方法、使用热电转换装置冷却和/或加热对象物的方法及电子装置 Pending CN114556602A (zh)

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JP2019194771 2019-10-25
JP2019-194771 2019-10-25
PCT/JP2020/037790 WO2021079732A1 (ja) 2019-10-25 2020-10-06 熱電変換装置、熱電変換装置の制御方法、熱電変換装置を用いて対象物を冷却及び／又は加熱する方法及び電子デバイス

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CN114556602A true CN114556602A (zh) 2022-05-27

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US (1) US12167691B2 (https=)
EP (1) EP4050671A4 (https=)
JP (1) JP7656866B2 (https=)
CN (1) CN114556602A (https=)
WO (1) WO2021079732A1 (https=)

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EP3933945A4 (en) * 2019-02-28 2022-05-18 Panasonic Intellectual Property Management Co., Ltd. THERMOELECTRIC CONVERSION ELEMENT AND THERMOELECTRIC CONVERSION DEVICE
JP2022102827A (ja) * 2020-12-25 2022-07-07 パナソニックＩｐマネジメント株式会社 赤外線センサ
EP4339567A4 (en) * 2021-05-11 2024-10-09 Panasonic Intellectual Property Management Co., Ltd. THERMOPILE TYPE SENSOR AND SENSOR NETWORK
WO2022239611A1 (ja) * 2021-05-11 2022-11-17 パナソニックＩｐマネジメント株式会社 赤外線センサ及び赤外線センサの製造方法

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JPH10313134A (ja) * 1997-05-14 1998-11-24 Kubota Corp 熱電モジュールの製造方法
JP2003078177A (ja) * 2001-08-31 2003-03-14 Yamaha Corp 熱電装置
JP2004221409A (ja) * 2003-01-16 2004-08-05 Okano Electric Wire Co Ltd ペルチェモジュール装置
US20060021646A1 (en) * 2004-03-01 2006-02-02 Matsushita Electric Industrial Co., Ltd. Thermoelectric conversion device, and cooling method and power generating method using the device
JP2007115812A (ja) * 2005-10-19 2007-05-10 Seiko Epson Corp ペルチェモジュール及び電子機器
US8508370B1 (en) * 2009-02-27 2013-08-13 Sandia Corporation Synthetic thermoelectric materials comprising phononic crystals
US20130019918A1 (en) * 2011-07-18 2013-01-24 The Regents Of The University Of Michigan Thermoelectric devices, systems and methods
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CN107078203A (zh) * 2014-12-10 2017-08-18 日本恒温装置株式会社 热电转换模块
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US20220216387A1 (en) 2022-07-07
WO2021079732A1 (ja) 2021-04-29
US12167691B2 (en) 2024-12-10
EP4050671A1 (en) 2022-08-31
JP7656866B2 (ja) 2025-04-04
JPWO2021079732A1 (https=) 2021-04-29

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