CN114487766A - Tool is surveyed to general type electricity - Google Patents

Tool is surveyed to general type electricity Download PDF

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Publication number
CN114487766A
CN114487766A CN202111381944.4A CN202111381944A CN114487766A CN 114487766 A CN114487766 A CN 114487766A CN 202111381944 A CN202111381944 A CN 202111381944A CN 114487766 A CN114487766 A CN 114487766A
Authority
CN
China
Prior art keywords
metal
adapter plate
type adapter
metal bump
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111381944.4A
Other languages
Chinese (zh)
Inventor
韩少华
戚胜利
杨媚莲
王健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Shangda Semiconductor Co ltd
Original Assignee
Leader-Tech Electronics (shenzhen) Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leader-Tech Electronics (shenzhen) Inc filed Critical Leader-Tech Electronics (shenzhen) Inc
Priority to CN202111381944.4A priority Critical patent/CN114487766A/en
Publication of CN114487766A publication Critical patent/CN114487766A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The invention belongs to the technical field of electric measurement jigs of printed circuit boards, and particularly relates to a universal electric measurement jig which mainly comprises a jig with pins and a metal convex point type adapter plate, wherein one end of the metal convex point type adapter plate is a metal bonding pad in electrical contact connection with the pins of the jig with the pins, the other end of the metal convex point type adapter plate is a metal bump in electrical contact connection with a test bonding pad of a product to be tested, and the metal bonding pad is connected with the metal bump circuit. The invention improves the universality of the jig with the needle, does not need to manufacture a special electrical measuring jig for the product, and shortens the production period of the product. Compared with the traditional electrical measurement jig, the metal convex point type adapter plate is low in price, and the cost of the product can be greatly reduced. The wire needle with the needle jig can be designed with a relatively large wire center distance and a relatively thick wire needle diameter, the price of the wire needle jig is reduced, the processing technology of the wire needle is not limited any more, and a more precise line can be measured.

Description

Tool is surveyed to general type electricity
Technical Field
The invention belongs to the technical field of printed circuit board electrical measurement jigs, and particularly relates to a universal electrical measurement jig.
Background
With the rapid development of the electronic industry, the demand of the society for printed circuit boards is rapidly increased, and strict requirements on the electrical performance, the cost and the like of the printed circuit boards are required. At present, the electrical inspection of the printed circuit board in the industry is mainly carried out by adopting an electrical measurement jig method, a special electrical measurement jig matched with a product to be detected is designed, and a probe of the electrical measurement jig is electrically contacted and connected with a metal pad of the product to be detected, so that the electrical performance inspection of the product is completed. This kind of detection mode need open the many money electricity and survey the tool, can make cost and product production cycle greatly increased, and the main shortcoming is as follows:
1. because the specifications of circuit board products are different, the positions of the electrical measuring bonding pads are different, the positions of the wire needles on the electrical measuring jig and the positions of the electrical measuring bonding pads need to be in one-to-one correspondence, and therefore the electrical measuring jig needs to be arranged aiming at the products with different specifications, and the universality of the arrangement mode of the wire needle plate of the existing electrical measuring jig is poor.
2. The cost of the electrical measuring jig is limited by the processing technology and the price of the wire needle, so the cost of the electrical measuring jig seriously affects the cost control of the circuit board product.
3. The time for drilling and processing the electrical measurement jig and assembling the wire needle is long, so the lead cycle is long, and the production cycle of a circuit board product is prolonged.
4. When a circuit board product of one specification is finished, the original electrical measurement jig is discarded, so that serious resource waste is caused.
5. The processing technology of the wire needle of the electrical measuring jig influences the influence, and a more precise line cannot be measured.
Disclosure of Invention
Aiming at the problems, the invention provides a universal electrical measurement jig, which is used for realizing electrical measurement jigs of various types of products.
In order to achieve the purpose, the invention adopts the following technical scheme:
a universal electrical measurement jig mainly comprises a jig with a pin and a metal convex point type adapter plate, wherein one end of the metal convex point type adapter plate is a metal bonding pad in electrical contact connection with a wire pin of the jig with the pin, the other end of the metal convex point type adapter plate is a metal convex point in electrical contact connection with a test bonding pad of a product to be tested, and the metal bonding pad is connected with a metal convex point circuit.
Furthermore, the metal bump type adapter plate is of a single-panel structure, and the metal pad and the metal bump are located on the same surface.
Furthermore, the metal bump type adapter plate with the single-panel structure is a flexible circuit board.
Furthermore, a reinforcing plate is arranged on the back surface of the flexible circuit board at the metal convex point.
Furthermore, the metal convex point type adapter plate with the single-panel structure is a rigid-flexible board, the rigid-flexible board is made of a combination of flexible circuit boards and rigid circuit boards, the rigid circuit boards are arranged at two ends of the metal convex point type adapter plate, and the flexible circuit board is arranged in the middle of the metal convex point type adapter plate.
Furthermore, the metal bump type adapter plate is of a double-sided plate structure, the metal pads and the metal bumps are respectively located on two sides of the metal bump type adapter plate and are connected with each other on the surface of the metal bump type adapter plate through a circuit or in the metal bump type adapter plate.
Furthermore, a through hole is formed in the metal bump type adapter plate, and the metal pad is connected with the metal bump through a through hole circuit.
Furthermore, the double-panel structure metal bump adapter plate is a flexible circuit board or a rigid-flex board.
Further, the height of metal bump is 50 ~ 500 um.
Further, one of the jig with the needle is matched with at least one metal bump type adapter plate.
The invention provides an applicable electrical measurement jig, which uses a metal convex point type adapter plate to correspond to different product specifications, and the adapter plate is electrically contacted and connected with a jig with a needle to carry out electrical inspection on a product, so that the universality of the jig with the needle is greatly improved, a special electrical measurement jig for the product is not required to be manufactured, and the production period of the product is shortened. Compared with the traditional electrical measurement jig, the metal convex point type adapter plate is low in price, and the cost of the product can be greatly reduced. The wire needle with the needle jig can be designed with a relatively large wire center distance and a relatively thick wire needle diameter, the price of the wire needle jig is reduced, the processing technology of the wire needle is not limited any more, and a more precise line can be measured.
Drawings
FIG. 1: the invention has a schematic structure;
FIG. 2: the invention discloses a schematic diagram of an adapter plate with a single-panel structure;
FIG. 3: the invention is a schematic diagram of an adapter plate with a single-panel structure;
FIG. 4: the invention is a schematic diagram of an adapter plate of a double-panel structure;
FIG. 5: the implementation mode of the invention is shown schematically.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in FIG. 1, the present invention provides an electrical testing fixture for electrical inspection in printed circuit board industry. The metal bump type adapter plate 2 is designed according to the product characteristics of the printed circuit board, and one end of the metal bump type adapter plate 2 is a metal pad 21 matched with the wire 11 of the needle jig 1, so that the metal bump type adapter plate can be electrically contacted and connected with the universal needle jig 1. The other end of the metal bump type adapter plate 2 is a metal bump 22 which is electrically contacted and connected with a test pad 31 of a product 3 to be tested, wherein the height of the metal bump is 50-500 um.
Since the number and the set points of the wire pins 11 of the jig with pins 1 are fixed values, the metal pads 21 of the metal bump interposer 2 are set to have a fixed number and a fixed center distance. The metal bumps 22 of the metal bump type adapter plate 2 are connected with the metal pads 21 through circuits, the circuit distance is gradually enlarged, the cost of the metal bump type adapter plate 2 is reduced, and the manufacturing yield of the metal bump type adapter plate 2 is improved.
The jig with needles 1 is a universal jig with fixed quantity of the needles 11 and fixed needle-to-needle thread center distance. Aiming at products with different models, a plurality of universal needle-carrying jigs 1 are designed, the number of the needles 11 of the needle-carrying jigs 1 is different (for example, 1000, 2000, 3000, etc.), different needle thread center distances are designed according to the different number of the needles 11, and the needle-carrying jigs 1 with less needles 11 can be designed with relatively larger needle thread center distances and relatively thicker needle diameters, so that more cost is saved.
The manufacturing process of the metal bump type adapter plate 2 is a conventional circuit forming mode, a finer circuit can be manufactured, and compared with the traditional electrical testing jig which is electrically contacted and connected with a testing pad of a product to be tested for electrical inspection, the invention can realize the electrical inspection of the finer circuit product.
As shown in fig. 2, the metal bump interposer 2 of the present invention is a single-sided board structure in which the metal pads 21 and the metal bumps 22 are located on the same surface, and a flexible circuit board is used. The metal bumps 22 of the metal bump adapter plate 2 are connected with the test pads 31 of the product 3 to be tested, and the metal bump adapter plate 2 is turned over to connect the metal pads 21 with the wire pins 11. In order to enhance the toughness of the flexible metal bump type adapter plate 2, a reinforcing plate is additionally arranged on the back of the metal bump 22 of the adapter plate 2.
Fig. 3 shows another embodiment of a single-sided board structure of the metal bump interposer 2 according to the present invention, which is made of a rigid and flexible circuit boards, and the rigid circuit boards are disposed at two ends of the metal bump interposer 2, and the flexible circuit board is disposed in the middle of the metal bump interposer 2. The metal pad 21 of the metal bump adapter plate 2 is connected to the wire pin 11, and the metal bump adapter plate 2 is turned over to connect the metal bump 22 to the test pad 31 of the product 3 to be tested.
As shown in fig. 4, the metal bump interposer 2 of the present invention may also be a double-sided board structure in which the metal pads 21 and the metal bumps 22 are respectively located on two sides of the metal bump interposer 2. The metal bump type adapter plate 2 is internally provided with a through hole 23, and the metal pad 21 and the metal bump 22 are in circuit connection through the through hole 23. In this embodiment, the connection lines between the metal pads 21 and the metal bumps 22 may also be disposed on the surface of the metal bump interposer 2.
The metal bump type adapter plate 2 with a double-sided plate structure is a flexible circuit board, can also be a rigid circuit board, and can also be a rigid-flex board.
As shown in fig. 5, the present invention can implement electrical inspection by using one pin jig 1 corresponding to one metal bump interposer 2, or by using one pin jig 1 corresponding to a plurality of metal bump interposers 2.
The invention is suitable for printed circuit board and packaging industry, is suitable for products such as PCB, COF, TCP, FPC and the like, and can be used for roll-type production or sheet-type production products.

Claims (10)

1. The utility model provides a tool is surveyed to general type electricity, mainly includes takes needle tool (1) and metal bump formula keysets (2), its characterized in that: one end of the metal bump type adapter plate (2) is a metal pad (21) electrically contacted and connected with a wire needle (11) of the jig (1) with a needle, the other end of the metal bump type adapter plate is a metal bump (22) electrically contacted and connected with a test pad (31) of a product to be tested (3), and the metal pad (21) is in line connection with the metal bump (22).
2. The universal electrical measuring tool of claim 1, wherein: the metal bump type adapter plate (2) is of a single-panel structure, and the metal pad (21) and the metal bump (22) are located on the same surface.
3. The universal electrical measuring tool of claim 2, wherein: the metal bump type adapter plate (2) with the single-panel structure is a flexible circuit board.
4. A universal electrical measurement tool according to claim 3, wherein: and a reinforcing plate (23) is arranged on the back surface of the flexible circuit board at the metal salient point (22).
5. The universal electrical measuring tool of claim 2, wherein: the metal convex point type adapter plate (2) with the single-panel structure is a flexible-rigid board, the flexible-rigid board is formed by combining a flexible circuit board and a rigid circuit board, the rigid circuit board is arranged at two ends of the metal convex point type adapter plate (2), and the flexible circuit board is arranged in the middle of the metal convex point type adapter plate.
6. The universal electrical measuring tool of claim 1, wherein: the metal bump type adapter plate (2) is of a double-sided plate structure, the metal pads (21) and the metal bumps (22) are respectively positioned on two sides of the metal bump type adapter plate (2) and are connected with each other on the surface of the metal bump type adapter plate (2) through a circuit or in the metal bump type adapter plate (2).
7. The universal electrical measuring tool of claim 6, wherein: the metal bump type adapter plate (2) is internally provided with a through hole (23), and the metal pad (21) is in line connection with the metal bump (22) through the through hole (23).
8. The universal electrical measuring tool of claim 7, wherein: the double-panel structure metal bump type adapter plate (2) is a flexible circuit board or a rigid-flex board.
9. A universal electrical measurement tool according to any of claims 1 to 8 wherein: the height of the metal salient point (22) is 50-500 um.
10. A universal electrical measurement tool according to any of claims 1 to 8 wherein: one of the jig with the needle (1) is matched with at least one metal bump type adapter plate (2).
CN202111381944.4A 2021-11-22 2021-11-22 Tool is surveyed to general type electricity Pending CN114487766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111381944.4A CN114487766A (en) 2021-11-22 2021-11-22 Tool is surveyed to general type electricity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111381944.4A CN114487766A (en) 2021-11-22 2021-11-22 Tool is surveyed to general type electricity

Publications (1)

Publication Number Publication Date
CN114487766A true CN114487766A (en) 2022-05-13

Family

ID=81493046

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111381944.4A Pending CN114487766A (en) 2021-11-22 2021-11-22 Tool is surveyed to general type electricity

Country Status (1)

Country Link
CN (1) CN114487766A (en)

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PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20240228

Address after: 221300 north of Liaohe Road and west of Huashan Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province

Applicant after: Jiangsu SHANGDA Semiconductor Co.,Ltd.

Country or region after: China

Address before: 518100 floors 1-4, 2-3, building a, Huangpu Runhe Industrial Park, South Ring Road, Huangpu Community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province

Applicant before: LEADER-TECH ELECTRONICS (SHENZHEN) Inc.

Country or region before: China