CN114451074A - 中介板、中介板的制作方法及电路板组件 - Google Patents

中介板、中介板的制作方法及电路板组件 Download PDF

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Publication number
CN114451074A
CN114451074A CN201980100868.XA CN201980100868A CN114451074A CN 114451074 A CN114451074 A CN 114451074A CN 201980100868 A CN201980100868 A CN 201980100868A CN 114451074 A CN114451074 A CN 114451074A
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China
Prior art keywords
circuit
layer
interposer
base layer
base
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CN201980100868.XA
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English (en)
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CN114451074B (zh
Inventor
彭满芝
刘瑞武
熊思
高琳洁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
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Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
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Publication of CN114451074A publication Critical patent/CN114451074A/zh
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Publication of CN114451074B publication Critical patent/CN114451074B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/431—Pre-treatment of the preform connector
    • H01L2224/4312—Applying permanent coating, e.g. in-situ coating
    • H01L2224/43125—Plating, e.g. electroplating, electroless plating

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种中介板，用于连接两电路板，包括：内层(10)、外层(20)及防护层(50)，内层(10)包括一第一基层(11)及形成于第一基层(11)表面上的第一线路层(131)，外层(20)包括第二基层(21)及形成于第二基层(21)一表面上的第二线路层(231)，第二基层(21)覆盖于第一线路层(131)上，第一线路层(131)与第二线路层(231)的线路中至少有一条线路的一端延伸至中介板(100)的侧面，另一条线路的一端延伸至中介板(100)的另一侧面，第一线路层(131)与第二线路层(231)通过导电盲孔(41)电连接，形成从中介板(100)的一侧面至另一侧面的通路以连接两电路板，防护层(50)覆盖于第二线路层(231)外。

Description

PCT国内申请，说明书已公开。

Claims (13)

  1. PCT国内申请，权利要求书已公开。
CN201980100868.XA 2019-09-27 2019-09-27 中介板、中介板的制作方法及电路板组件 Active CN114451074B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/108587 WO2021056427A1 (zh) 2019-09-27 2019-09-27 中介板、中介板的制作方法及电路板组件

Publications (2)

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CN114451074A true CN114451074A (zh) 2022-05-06
CN114451074B CN114451074B (zh) 2023-07-21

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US (1) US20220336230A1 (zh)
CN (1) CN114451074B (zh)
WO (1) WO2021056427A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114900949B (zh) * 2022-05-18 2023-03-21 深圳市八达通电路科技有限公司 电路板、以及电路板短路修复方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102202463A (zh) * 2010-03-24 2011-09-28 南亚电路板股份有限公司 侧边封装型印刷电路板
CN102573289A (zh) * 2010-12-15 2012-07-11 相互股份有限公司 侧边具有导电接触件的积层印刷电路板模组及其制造方法
JP2015115514A (ja) * 2013-12-13 2015-06-22 日本特殊陶業株式会社 配線基板およびその製造方法
US20150257261A1 (en) * 2014-03-07 2015-09-10 Ibiden Co., Ltd. Printed wiring board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102202463A (zh) * 2010-03-24 2011-09-28 南亚电路板股份有限公司 侧边封装型印刷电路板
CN102573289A (zh) * 2010-12-15 2012-07-11 相互股份有限公司 侧边具有导电接触件的积层印刷电路板模组及其制造方法
JP2015115514A (ja) * 2013-12-13 2015-06-22 日本特殊陶業株式会社 配線基板およびその製造方法
US20150257261A1 (en) * 2014-03-07 2015-09-10 Ibiden Co., Ltd. Printed wiring board

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Publication number Publication date
CN114451074B (zh) 2023-07-21
WO2021056427A1 (zh) 2021-04-01
US20220336230A1 (en) 2022-10-20

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