CN114438475B - 密封件镀膜方法及密封件制备方法 - Google Patents
密封件镀膜方法及密封件制备方法 Download PDFInfo
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- CN114438475B CN114438475B CN202210105144.8A CN202210105144A CN114438475B CN 114438475 B CN114438475 B CN 114438475B CN 202210105144 A CN202210105144 A CN 202210105144A CN 114438475 B CN114438475 B CN 114438475B
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- Prior art keywords
- coating
- chamber
- sealing element
- cleaning
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
- C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210105144.8A CN114438475B (zh) | 2022-01-27 | 2022-01-27 | 密封件镀膜方法及密封件制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210105144.8A CN114438475B (zh) | 2022-01-27 | 2022-01-27 | 密封件镀膜方法及密封件制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN114438475A CN114438475A (zh) | 2022-05-06 |
CN114438475B true CN114438475B (zh) | 2023-04-07 |
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CN202210105144.8A Active CN114438475B (zh) | 2022-01-27 | 2022-01-27 | 密封件镀膜方法及密封件制备方法 |
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CN (1) | CN114438475B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116479392A (zh) * | 2023-03-24 | 2023-07-25 | 江苏博生医用新材料股份有限公司 | 一种药用橡胶塞镀膜装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN200961147Y (zh) * | 2006-09-30 | 2007-10-17 | 徐志淮 | 橡胶瓶塞镀膜用反应室 |
CN201620190U (zh) * | 2009-12-31 | 2010-11-03 | 山东省药用玻璃股份有限公司 | 胶塞半镀膜卡板 |
TW201125996A (en) * | 2010-01-28 | 2011-08-01 | Hon Hai Prec Ind Co Ltd | Sputter coating device |
JP6560923B2 (ja) * | 2015-07-27 | 2019-08-14 | 東レエンジニアリング株式会社 | 封止膜形成装置および封止膜形成方法 |
CN212034459U (zh) * | 2019-12-14 | 2020-11-27 | 深圳市爱科纳智能科技有限公司 | 模块化电路板生产设备 |
CN111050475A (zh) * | 2019-12-14 | 2020-04-21 | 深圳市爱科纳智能科技有限公司 | 模块化电路板生产设备 |
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- 2022-01-27 CN CN202210105144.8A patent/CN114438475B/zh active Active
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CN114438475A (zh) | 2022-05-06 |
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CB03 | Change of inventor or designer information |
Inventor after: Zhu Kun Inventor after: Li Dongna Inventor after: Liu Xiaolan Inventor after: Yan Xueqing Inventor after: Cao Jianhui Inventor after: Liu Wei Inventor after: Ma Wei Inventor after: Yang Rui Inventor after: Cao Zhenye Inventor after: Chen Huijun Inventor after: Du Hanxiang Inventor before: Zhu Kun Inventor before: Li Dongna Inventor before: Liu Xiaolan Inventor before: Yan Xueqing Inventor before: Cao Jianhui Inventor before: Liu Wei Inventor before: Ma Wei Inventor before: Yang Rui Inventor before: Cao Zhenye Inventor before: Chen Huijun Inventor before: Du Hanxiang |
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