CN114433444B - Material containing and transferring device for coating glass powder on wafer - Google Patents
Material containing and transferring device for coating glass powder on wafer Download PDFInfo
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- CN114433444B CN114433444B CN202210372842.4A CN202210372842A CN114433444B CN 114433444 B CN114433444 B CN 114433444B CN 202210372842 A CN202210372842 A CN 202210372842A CN 114433444 B CN114433444 B CN 114433444B
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- material frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Abstract
The application provides a material containing and transferring device for coating glass powder on a wafer, and belongs to the field of equipment for manufacturing semiconductors. The device comprises: solution pond, material frame and get material part. The material frame includes the bracing piece that horizontal interval set up, and the top surface of bracing piece has seted up many places arc wall along length direction, and the both sides of material frame all are equipped with the side pin, and the side pin is equipped with spacing round along length direction, and the middle section of spacing round circumference all is circular arc sunk structure, and the arc wall uses with spacing round combination. Get the material part and locate material frame top, get the material part and be equipped with multiunit centre gripping subassembly, the centre gripping subassembly all includes a pair of jack catch, and the jack catch hypomere is towards the middle part bending, and the lower extreme of jack catch all is equipped with the gyro wheel, and when the jack catch moved down, can promote the outer wall downstream of side pin along the wafer, and the interval between the jack catch can be adjusted by oneself. The device can prevent the local glass powder on the surface of the wafer from being unevenly coated, can completely take out the wafer, and avoids damaging the glass powder coating in the taking-out process.
Description
Technical Field
The invention belongs to the technical field of equipment for manufacturing semiconductors, and particularly relates to a material containing and transferring device for coating glass powder on a wafer.
Background
The wafer production mainly comprises the processes of etching, developing, groove etching, glass passivation, metallization, cleaning, scribing and the like. The glass passivation process requires coating and filling glass powder in the grooves on the surface of the wafer. There are two main types of coating methods available. One of the methods adopts a manual blade coating method to fill the grooves with glass powder, and the other method adopts an automatic device to coat the glass powder on the surface of the wafer.
The material frame of the existing automatic equipment is fixed to the edge of the wafer through the clamping groove structure, so that the local area on the periphery of the surface of the wafer is blocked, glass powder cannot be filled in the groove, and the local area cannot finally form a perfect chip, so that material waste can be caused, defective chips formed in the local area are required to be removed in post-process production, and the workload of chip screening is increased. On the other hand, the existing automation equipment usually takes out the wafer manually, which inevitably causes wiping and abrasion to the glass powder coating formed on the surface of the wafer and in the groove, and affects the subsequent glass passivation effect.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides the material containing and transferring device for coating the glass powder on the wafer, which can prevent the local glass powder on the surface of the wafer from being unevenly coated, can take out the wafer perfectly and avoid damaging the glass powder coating in the taking-out process.
In order to realize the purpose of the invention, the following scheme is adopted:
a material containing and transferring device for coating glass powder on a wafer comprises: material frame and get material part.
The material frame includes the bracing piece that horizontal interval set up, and many places arc wall has been seted up along length direction to the top surface of bracing piece, and the both sides of material frame all are equipped with the side pin, and the side pin can be followed the outside of wafer and slided from top to bottom, and the side pin is equipped with spacing round along length direction, and the side pin is located in the rotation of spacing round, and the middle section of spacing round circumference all is circular arc sunk structure, and the arc wall uses with spacing round combination, all is used for contacting with the circumference side of wafer.
The material taking component is arranged above the material frame and is provided with a plurality of groups of clamping assemblies, the clamping assemblies are correspondingly arranged above the arc-shaped groove and respectively comprise a pair of clamping jaws, the lower sections of the clamping jaws are bent towards the middle part, the lower ends of the clamping jaws are respectively provided with a roller for rolling contact with the outer wall of the wafer, when the clamping jaws move downwards, the side blocking rods can be pushed to move downwards along the outer wall of the wafer, and the distance between the clamping jaws can be automatically adjusted according to the contact part of the clamping jaws and the wafer.
Further, the bracing piece is equipped with the circular baffle that the polylith metal was made along the length direction interval, and the diameter of baffle is greater than the diameter of wafer, and when the wafer was placed in the material frame, the wafer was coaxial with the baffle, and arc wall and spacing wheel all are located between the baffle, and the outer wall hypomere of two piece at least baffle both sides is equipped with the spout of circular arc structure along the arc surface, and in the spout was worn to locate by the side fender pole, the side fender pole reciprocated along the orbit of spout.
Furthermore, the outer wall of the partition plate at the two ends of the material frame is provided with a spring piece, the middle section of the spring piece is connected to the partition plate, the two ends of the spring piece are respectively arranged below the side blocking rods at the two sides, when the spring piece is in a natural state, the side blocking rods are arranged at the waist part of the partition plate, and the side wall of the wafer is just in contact with the concave part of the middle section of the limiting wheel at the moment.
Furthermore, the inner wall of the clamping jaw is provided with a groove, the width of the groove is larger than the thickness of the wafer, and the cross section of the groove is of an arc structure.
Furthermore, the middle sections of the circumferences of the rollers are of arc-shaped concave structures, and the width of the concave parts is larger than the thickness of the wafer.
Furthermore, the outer diameter of the roller is smaller than that of the middle section of the limiting wheel.
Furthermore, an elastic belt with elasticity is arranged between the clamping jaws, two ends of the elastic belt are respectively connected to the middle sections of the clamping jaws on two sides, the width of the elastic belt is larger than the thickness of the wafer, when the wafer is positioned in the clamping assembly, the middle section of the elastic belt is in contact with the arc outer wall of the top of the wafer, the elastic belt is in a tightening state, the clamping jaws are folded towards the middle, and the downward force applied to the wafer by the elastic belt is smaller than the pulling force applied to the clamping jaws by the elastic belt.
Further, the centre gripping subassembly still includes the guide rail, and the guide rail is located in the equal slip in upper end of jack catch, all is equipped with the spring between the both ends of guide rail and the jack catch that corresponds, and when the spring was natural state, the jack catch moved to the middle part of guide rail.
Furthermore, get on material part locates a elevating gear's telescopic link, get material part through elevating gear control and rise and descend, elevating gear locates a sharp transport module to shift the wafer.
The invention has the beneficial effects that: the material frame is contacted with the side wall of the wafer through the arc-shaped groove structure on the supporting rod and the arc-shaped concave structure in the middle section of the limiting wheel, so that the surface of the wafer is prevented from being shielded by any part of the material frame, the whole surface of the wafer is coated with glass powder, and a defective area is prevented from being generated at the edge of the wafer. The material taking component is contacted with the outer wall of the wafer through the roller and the groove with the arc-shaped cross section, so that the glass powder on the surface of the wafer can be prevented from being rubbed off in the material taking process, and the integrity of the glass powder on the surface of the wafer is well ensured. And utilize the elastic webbing to drive the jack catch and carry out the centre gripping to the wafer, have more gentle clamping-force, can effectively prevent to crush the wafer to can guarantee the stationarity of wafer in the transfer chart.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Fig. 1 shows a preferred embodiment of the present application.
Fig. 2 shows an enlarged view at a in fig. 1.
Fig. 3 shows the configuration of the material frame.
Fig. 4 shows an enlarged view at B in fig. 3.
Fig. 5 is a schematic view showing a state where the pickup unit picks up a wafer in the material frame.
Fig. 6 shows an enlarged view at C in fig. 5.
Fig. 7 shows a side view of the take off assembly gripping a wafer in a frame.
Fig. 8 shows a cross-sectional view of fig. 7 in the direction E-E.
Fig. 9 shows an enlarged view at D in fig. 8.
Fig. 10 is a schematic view showing a state where the take-out member takes out the wafer in the material frame.
The labels in the figure are: the device comprises a solution pool-10, a lifting cylinder-11, a material frame-20, a support rod-21, an arc-shaped groove-211, a side stop rod-22, a limiting wheel-221, a partition plate-23, a chute-231, a spring leaf-24, a material taking component-30, a clamping component-31, a clamping jaw-32, a groove-321, a roller-33, a guide rail-34, a spring-35, an elastic belt-36, a lifting device-37 and a linear conveying module-38.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "middle", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or orientations or positional relationships that the products of the present invention are usually placed when in use, and are only for convenience of describing the present invention and simplifying the description.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; either directly or indirectly through intervening media, or through both elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1, a material containing and transferring device for coating glass powder on a wafer comprises: a frame 20 and a take-out member 30.
Specifically, the material frame 20 is arranged above the solution tank 10 in a liftable manner, and the solution mixed with the glass powder is filled in the solution tank 10. The material frame 20 is used as a material containing device for placing the wafer, and the wafer is immersed in the glass powder solution through the movement of the material frame 20, so that the surface and the groove of the wafer are coated to form a glass powder coating. As shown in FIG. 1, the solution tank 10 is provided with a lifting cylinder 11 for driving the material frame 20 to lift.
More specifically, as shown in fig. 3 and 4, the material frame 20 includes support rods 21 horizontally arranged at intervals, and a plurality of arc-shaped grooves 211 are formed on the top surface of the support rods 21 along the length direction. The arc grooves of the two support rods 21 are used in pairs for supporting two side walls of the arc of the lower section of the wafer. The supporting rods 21 are arranged at intervals, so that the redundant glass powder solution on the surface of the wafer can smoothly fall into the solution tank 10.
More specifically, as shown in fig. 3 to 6 and 10, side bars 22 are provided on both sides of the material frame 20. The side stop lever 22 is provided with a limiting wheel 221 along the length direction, and the limiting wheel 221 is rotatably arranged on the side stop lever 22 to realize rolling contact with the side edge of the wafer and prevent the wafer from being damaged. The middle section of the circumference of the limiting wheel 221 is of an arc concave structure, and the surface and the groove of the wafer are prevented from being shielded. The arc-shaped groove 211 and the limiting wheel 221 are combined to limit the bottom and two sides of a wafer by using one limiting wheel 221 of two side stop rods 22 in the same section and one arc-shaped groove 211 of two support rods 21 in the same section, and the arc-shaped groove 211 and the limiting wheel 221 are both contacted with the circumferential side surface of the wafer to avoid blocking the surface and the groove of the wafer. The side bars 22 can slide up and down along the outer side of the wafer to facilitate the loading and unloading of the wafer into and out of the frame 20.
Specifically, as shown in fig. 1, the material taking member 30 is disposed above the material frame 20. The material taking component 30 is arranged on a telescopic rod of a lifting device 37, the lifting device 37 is used for controlling the material taking component 30 to ascend and descend, the lifting device 37 is arranged on a linear conveying module 38, and the material taking component 30 is used as a transfer device for transferring wafers.
More specifically, get material part 30 and be equipped with multiunit clamping component 31, clamping component 31 corresponds the top of locating arc wall 211, and clamping component 31's quantity is the same with the quantity of arc wall 211 on the same root bracing piece 21, and the position one-to-one.
More specifically, as shown in fig. 2, 5 and 7 to 10, each of the clamping assemblies 31 includes a pair of jaws 32, the lower sections of the jaws 32 are bent toward the middle, and when clamping a wafer, the distance between the lower ends of the jaws 32 is smaller than the diameter of the wafer.
Preferably, as shown in fig. 2, the lower ends of the jaws 32 are provided with rollers 33 for rolling contact with the outer wall of the wafer to prevent damage to the wafer. When the claws 32 move downwards, the side blocking rods 22 can be pushed to move downwards along the outer walls of the wafers, and the limiting wheels 221 are in rolling contact with the rollers 33, so that the side blocking rods 22 can slide downwards smoothly, the resistance of the side blocking rods 22 during movement is reduced, and the distance between the claws 32 can be automatically adjusted according to the contact parts of the rollers 33 and the wafers. When the roller 33 contacts with the outer wall of the wafer at the maximum diameter position in the middle of the wafer, the claws 32 are in an open state, and when the roller 33 passes over the diameter position of the wafer, the distance between the claws 32 is gradually reduced, and the roller 33 is always attached to the outer wall of the wafer.
Preferably, as shown in fig. 3, 7 and 10, the support rod 21 is provided with a plurality of circular partition plates 23 made of metal at intervals along the length direction, the diameter of the partition plate 23 is larger than that of the wafer, and when the wafer is placed on the material frame 20, the wafer is coaxial with the partition plate 23. The arc-shaped groove 211 and the limiting wheel 221 are positioned between the partition plates 23.
Further preferably, as shown in fig. 5 and 6, the lower sections of the outer walls on the two sides of at least two partition plates 23 are provided with sliding grooves 231 with arc structures along arc surfaces, the side blocking rods 22 penetrate through the sliding grooves 231, and the side blocking rods 22 move up and down along the track of the sliding grooves 231, so as to ensure that the limiting wheels 221 are always in contact with the outer walls of the wafers, so as to continuously fix the wafers until the wafers are taken out by the clamping component 30.
Preferably, as shown in fig. 5 and 6, spring strips 24 are disposed on the outer walls of the partition plates 23 at the two ends of the material frame 20, the middle sections of the spring strips 24 are connected to the partition plates 23, the two ends of the spring strips 24 are disposed below the side blocking rods 22 at the two sides, respectively, when the spring strips 24 are in a natural state, the side blocking rods 22 are located at the waist portions of the partition plates 23, and at this time, the side walls of the wafers are just in contact with the concave portions at the middle sections of the limiting wheels 221. The side stop lever 22 can be automatically lifted to the middle section of the wafer in the height direction through the spring piece 24, so that the limiting effect on the two sides of the wafer is realized. And the side stopper rods 22 are slowly lowered by elastic deformation under the pressure of the claws 32 so as to facilitate the wafer taking-out by the chuck assembly 31.
Preferably, as shown in fig. 2, the inner wall of the chuck 32 has a groove 321, the width of the groove 321 is larger than the thickness of the wafer, and when the clamping assembly 31 takes out the wafer and clamps the wafer, the sidewall of the wafer contacts the bottom surface of the groove 321 to prevent the wafer from falling.
Further preferably, the cross section of the groove 321 is a circular arc structure to prevent the inner wall of the groove 321 from contacting the surface of the wafer and the groove, and prevent the glass powder on the surface of the wafer from being rubbed off.
Preferably, as shown in fig. 2, the middle section of the circumference of the roller 33 is in an arc-shaped concave structure, and the width of the concave portion is greater than the thickness of the wafer. The concave structure at the middle section of the roller 33 can accurately guide the wafer into the clamping jaws 32, and prevent the wafer from deflecting in the clamping assembly 31.
Preferably, as shown in fig. 8 and 9, the outer diameter of the roller 33 is smaller than the outer diameter of the middle section of the limiting wheel 221, so that the roller 33 can smoothly enter between the limiting wheel 221 and the sidewall of the wafer, and the roller 33 can contact the outer wall of the wafer instead of the limiting wheel 221, so that the wafer can be taken out by the clamping assembly 31.
Preferably, as shown in fig. 1, 5, 8 and 10, an elastic band 36 having elasticity is disposed between the fingers 32, two ends of the elastic band 36 are connected to the middle sections of the fingers 32 at two sides, respectively, and the width of the elastic band 36 is greater than the thickness of the wafer.
As shown in fig. 8, when the wafer is in the clamping assembly 31, the middle section of the elastic belt 36 contacts with the top arc outer wall of the wafer, and the elastic belt 36 is in a tensioned state, so that the jaws 32 are closed to the middle, thereby maintaining a stable clamping state for the wafer.
More specifically, the downward force applied by the elastic band 36 to the wafer is smaller than the pulling force applied by the elastic band 36 to the claws 32, and the mounting position of the elastic band 36 on the claws 32 needs to be adjusted before each set of the gripper assemblies 31 is used. The elastic band 36 is mounted on the chuck 32 at a position higher than the radius of the wafer to be held. If the resilient strap 36 is mounted too low on the finger 32, this may result in excessive upward force being applied to the resilient strap 36 by the wafer, resulting in a corresponding increase in the downward reaction force generated by the resilient strap 36, and a greater likelihood of wafer ejection.
The elastic band 36 is not only used for folding the claws 32 to clamp the wafer, but also the elastic band 36 can enable the claws 32 to fold by itself, the structure is simple, and complicated electric control parts are avoided. But also can be used as a limit position to prevent the wafer from moving upwards, so that the wafer is more stable in the clamping assembly 31, and the wafer is prevented from shaking up and down due to the vibration of equipment or during the up-and-down conveying in the transfer process. Meanwhile, the pressure applied by the elastic belt 36 is smoother, the impact on the wafer is smaller, and the wafer can be effectively prevented from being damaged. Because the material of the wafer is brittle, the existing clamping equipment usually utilizes electrical parts to clamp the wafer, and the wafer is often broken due to deviation of the clamping position or overlarge clamping force in the using process.
Preferably, as shown in fig. 8, the clamping assembly 31 further includes a guide rail 34, the upper ends of the jaws 32 are slidably disposed on the guide rail 34, springs 35 are disposed between the two ends of the guide rail 34 and the corresponding jaws 32, and when the springs 35 are in a natural state, the jaws 32 move to the middle of the guide rail 34.
Through the action of the springs 35 on the two sides, the jaws 32 are always positioned in the middle section of the guide rail 34, namely, the jaws 32 are kept to have a relatively fixed position on the clamping assembly 31, and the jaws 32 are prevented from deviating to one side of the guide rail 34. At the same time, the spring 35 also provides an auxiliary clamping force to the chuck 32 to ensure that the clamping force applied to the chuck 32 along with the elastic band 36 is greater than the downward force applied to the wafer by the elastic band 36, further preventing the wafer from being ejected from the clamping assembly 31.
The specific implementation mode is as follows: when the clamping member 30 moves downward to move each clamping assembly 31 toward each wafer, the roller 33 will first contact the outer wall of the upper section of the wafer, then the roller 33 will contact the limiting wheel 221, and the roller 33 will be located between the limiting wheel 221 and the outer wall of the wafer; the holding member 30 moves downwards continuously, the claws 32 will move downwards along the slide grooves 231 by the rolling contact of the rollers 33 and the limiting wheels 221, and the wafers will gradually enter the claws 32 in the process until the side walls of the wafers contact the inner walls of the lower sections of the claws 32 and the top outer walls of the wafers contact the elastic belts 36, and the wafers will be completely fixed between the claws 32. The holding member 30 is then moved upward to remove the wafer from the frame 20. No part of the clamping component 30 contacts with the surface and the groove of the wafer in the whole process, so that the integrity of the glass powder coating on the surface of the wafer is ensured.
The foregoing is only a preferred embodiment of the present invention and is not intended to be exhaustive or to limit the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.
Claims (8)
1. A flourishing material transfer device for wafer coated glass powder, characterized by comprising:
the material frame (20), the material frame (20) includes support rods (21) horizontally arranged at intervals, a plurality of arc-shaped grooves (211) are formed in the top surface of each support rod (21) along the length direction, side stop rods (22) are arranged on two sides of each material frame (20), each side stop rod (22) can slide up and down along the outer side of a wafer, a limiting wheel (221) is arranged on each side stop rod (22) along the length direction, each limiting wheel (221) is rotatably arranged on each side stop rod (22), the middle sections of the circumferences of the limiting wheels (221) are in arc-shaped concave structures, and the arc-shaped grooves (211) and the limiting wheels (221) are combined for use and are all used for contacting with the circumferential side surfaces of the wafers;
the material taking component (30) is arranged above the material frame (20), a plurality of groups of clamping assemblies (31) are arranged on the material taking component (30), each clamping assembly (31) comprises a pair of clamping jaws (32), the lower sections of the clamping jaws (32) are bent towards the middle part, the lower ends of the clamping jaws (32) are provided with rollers (33) for rolling contact with the outer wall of the wafer, when the clamping jaws (32) move downwards, the side blocking rods (22) can be pushed to move downwards along the outer wall of the wafer, and the distance between the clamping jaws (32) can be automatically adjusted according to the contact part of the wafer;
elastic bands (36) are arranged between the clamping jaws (32), two ends of each elastic band (36) are connected to the middle sections of the clamping jaws (32) on two sides respectively, the width of each elastic band (36) is larger than the thickness of each wafer, when the wafers are positioned in the clamping assembly (31), the middle sections of the elastic bands (36) are in contact with the arc outer walls of the tops of the wafers, the elastic bands (36) are in a tightening state, so that the clamping jaws (32) are folded towards the middle, and the downward force applied to the wafers by the elastic bands (36) is smaller than the pulling force applied to the clamping jaws (32) by the elastic bands (36).
2. The material containing and transferring device for coating glass powder on the wafer as claimed in claim 1, wherein a plurality of circular partition plates (23) made of metal are arranged on the support rod (21) at intervals along the length direction, the diameter of each partition plate (23) is larger than that of the wafer, when the wafer is placed on the material frame (20), the wafer and the partition plates (23) are coaxial, the arc-shaped grooves (211) and the limiting wheels (221) are both positioned between the partition plates (23), the lower sections of the outer walls of the two sides of at least two partition plates (23) are provided with sliding grooves (231) with arc structures along the arc surfaces, the side blocking rods (22) penetrate through the sliding grooves (231), and the side blocking rods (22) move up and down along the tracks of the sliding grooves (231).
3. The containing and transferring device for glass powder coated on a wafer as claimed in claim 2, wherein the outer wall of the partition plate (23) positioned at the two ends of the material frame (20) is provided with a spring piece (24), the middle section of the spring piece (24) is connected to the partition plate (23), the two ends of the spring piece (24) are respectively arranged below the side stop levers (22) at the two sides, when the spring piece (24) is in a natural state, the side stop lever (22) is positioned at the waist of the partition plate (23), and at the moment, the side wall of the wafer just contacts with the concave part at the middle section of the limiting wheel (221).
4. The holding and transferring device for coating glass powder on the wafer as claimed in claim 1, wherein the inner wall of the claw (32) is provided with a groove (321), the width of the groove (321) is larger than the thickness of the wafer, and the cross section of the groove (321) is in a circular arc structure.
5. The holding and transferring device for glass powder coated on a wafer as claimed in claim 1, wherein the middle section of the circumference of the roller (33) is in a circular arc concave structure, and the width of the concave part is larger than the thickness of the wafer.
6. The filling and transferring device for glass powder coated on a wafer as claimed in claim 1, wherein the outer diameter of the roller (33) is smaller than the outer diameter of the middle section of the limiting wheel (221).
7. The containing and transferring device for glass powder coated on a wafer as claimed in claim 1, wherein the clamping assembly (31) further comprises a guide rail (34), the upper ends of the clamping jaws (32) are slidably arranged on the guide rail (34), springs (35) are arranged between the two ends of the guide rail (34) and the corresponding clamping jaws (32), and when the springs (35) are in a natural state, the clamping jaws (32) move to the middle of the guide rail (34).
8. The containing and transferring device for glass powder coated on the wafer as claimed in claim 1, wherein the material taking component (30) is arranged on a telescopic rod of a lifting device (37), the lifting device (37) is used for controlling the material taking component (30) to ascend and descend, and the lifting device (37) is arranged on a linear conveying module (38) for transferring the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210372842.4A CN114433444B (en) | 2022-04-11 | 2022-04-11 | Material containing and transferring device for coating glass powder on wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210372842.4A CN114433444B (en) | 2022-04-11 | 2022-04-11 | Material containing and transferring device for coating glass powder on wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114433444A CN114433444A (en) | 2022-05-06 |
| CN114433444B true CN114433444B (en) | 2022-07-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210372842.4A Active CN114433444B (en) | 2022-04-11 | 2022-04-11 | Material containing and transferring device for coating glass powder on wafer |
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| CN115106329A (en) * | 2022-06-17 | 2022-09-27 | 广东先导微电子科技有限公司 | Wafer processing device |
| CN115116908B (en) * | 2022-08-22 | 2023-01-10 | 四川洪芯微科技有限公司 | Wafer groove corrosion device |
| CN115424976B (en) * | 2022-11-07 | 2023-02-17 | 浙江果纳半导体技术有限公司 | Wafer clamping mechanism and wafer transmission equipment |
| CN115547915B (en) * | 2022-11-28 | 2023-02-14 | 四川上特科技有限公司 | Wafer exposure clamp and exposure device |
| CN115881596B (en) * | 2023-03-08 | 2023-05-05 | 四川上特科技有限公司 | Wafer bearing frame and wafer slicing device |
| CN115910874B (en) * | 2023-03-09 | 2023-05-23 | 四川上特科技有限公司 | Wafer storage frame |
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Denomination of invention: Material Transfer Device for Glass Powder Coating on Wafers Effective date of registration: 20230612 Granted publication date: 20220701 Pledgee: CITIC FINANCIAL LEASING Co.,Ltd. Pledgor: SICHUAN SHANGTE TECHNOLOGY Co.,Ltd. Registration number: Y2023990000291 |
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