CN113097101A - Intelligent wafer splitting device for processing semiconductor integrated circuit device - Google Patents
Intelligent wafer splitting device for processing semiconductor integrated circuit device Download PDFInfo
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- CN113097101A CN113097101A CN202110306847.2A CN202110306847A CN113097101A CN 113097101 A CN113097101 A CN 113097101A CN 202110306847 A CN202110306847 A CN 202110306847A CN 113097101 A CN113097101 A CN 113097101A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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Abstract
The invention relates to the field of semiconductor processing equipment, in particular to an intelligent wafer cracking device for processing a semiconductor integrated circuit device, which comprises an equipment shell, wherein a rotating inner frame is arranged in the equipment shell, an upper cracking device and a lower cracking device are arranged in the rotating inner frame, the upper cracking device and the lower cracking device are connected with the inner side of the rotating inner frame through a first hydraulic push rod, and are connected with an attaching piece through one end of an outer sleeve rod, after the rotating inner frame drives the cracking device clamping a wafer to rotate for 90 degrees under the action of a rear side driving device, the first hydraulic push rod can further act on the two cracking devices, so that the attaching piece drives the outer sleeve rod to extrude an inner spring, the wafer further enters the cracking device to be contacted with diamond wires on a wire saw, separating channels are respectively formed on two sides of the wafer, edge cracking caused by the staggering of the separating channels is avoided, the wafer can be provided with the separation channel in a vertical state, and generated debris can fall downwards and be discharged conveniently.
Description
Technical Field
The invention relates to the field of semiconductor processing equipment, in particular to an intelligent wafer splitting device for processing a semiconductor integrated circuit device.
Background
In the manufacturing process of semiconductor chips, after a plurality of chip regions are formed on the surface of a wafer, streets need to be scribed at the intervals, and then a whole wafer is split into a plurality of individual chips.
However, the conventional wafer streets are usually cut along the cutting lines by the splitting blade, so that chips generated while the edges of the staggered areas of the wafer streets are easily cracked are not discharged well, and the conventional wafers are split by forces in different directions, so that the splitting efficiency is low, and the chips are easily displaced, thereby causing scratches and damages.
Disclosure of Invention
The utility model provides a semiconductor integrated circuit device processing is with wafer intelligence lobe of a leaf device, the device can avoid the wafer edge to burst when the cutting separates the way, can also conveniently discharge the piece, later can also improve lobe of a leaf efficiency when lobe of a leaf, avoids producing the displacement and causes the damage.
The utility model provides a semiconductor integrated circuit device processing is with wafer intelligence lobe of a leaf device, includes the equipment shell, equipment shell internally mounted has the rotation inside casing, rotate inside casing internally mounted have last lobe of a leaf device and lower lobe of a leaf device, go up lobe of a leaf device and lower lobe of a leaf device through first hydraulic catch bar with rotate the inside casing inboard and be connected, go up lobe of a leaf device and lower lobe of a leaf device corresponding one side and install the piece of laminating, go up lobe of a leaf device and lower lobe of a leaf device internally mounted have the elastic layer.
Preferably, the rotating inner frame is arranged in a circular ring shape, and the bonding pieces in the upper splitting device and the lower splitting device are symmetrically arranged.
Preferably, the upper lobe device and the lower lobe device are internally provided with a movable rod and a fixed rod, one end of the movable rod and one end of the fixed rod are sleeved with an outer sleeve rod, and one end of the outer sleeve rod is connected with the attaching piece.
Preferably, wire saws are installed on the outer sides of the upper and lower splinter devices, diamond wires penetrating through the interior of the splinter devices are arranged on the wire saws, and the wire saws on the upper and lower splinter devices are arranged in a transversely and longitudinally staggered mode.
Preferably, the elastic layer is arranged in a hollow rectangle, one side of the elastic layer is provided with a through hole communicated with the inside, and the splinter device is internally provided with a chip collecting box.
Preferably, one end of the movable rod is connected with a limiting plate, and a second hydraulic push rod connected with the limiting plate is arranged on the outer sides of the upper splitting device and the lower splitting device.
Preferably, the outer loop bar is provided with the mount pad, binding plate one side is connected with the bulb of gomphosis in the mount pad inside, the splitting sword is installed in the mount pad outside, splitting sword one side is connected with the pull rod, pull rod one end extends to the outer loop bar inside and contacts with the movable rod.
Preferably, the movable rods and the fixed rods are arranged in the splitting device at intervals.
Preferably, the mounting seat is internally provided with a limiting block, the outer side of the ball head is provided with a clamping groove attached to the cambered surface of the limiting block, one side of the limiting block is provided with a rotating rod at the same horizontal position as the circle center of the ball head, and the outer side of the rotating rod is provided with a coil spring.
Compared with the prior art, the invention has the following beneficial effects:
1. the inner frame is rotated to be in a circular ring shape, the jointing pieces in the upper splitting device and the lower splitting device are symmetrically arranged, when a wafer is placed on the lower splitting device, the first hydraulic pushing rod can drive the upper splitting device and the lower splitting device to be close to each other, finally the jointing pieces form a clamping state on two sides of the wafer, a movable rod and a fixed rod are installed in the upper splitting device and the lower splitting device, an outer sleeve rod is sleeved at one end of the movable rod and one end of the fixed rod, one end of the outer sleeve rod is connected with the jointing pieces, after the inner frame is rotated under the action of the rear side driving device to drive the splitting device with the wafer to rotate for 90 degrees, the first hydraulic pushing rod can further act on the two splitting devices, so that the jointing pieces drive the outer sleeve rod to extrude an inner spring, and the wafer further enters the interior of the splitting device to be contacted with diamond wires on a wire saw, the separating channels are respectively scribed on the two sides of the wafer, so that the separating channels can be formed on the wafer in a vertical state while the edge cracking caused by the staggered separating channels is avoided, the chips which are conveniently produced fall and are discharged downwards, and the wire saw devices on the upper splitting device and the lower splitting device are arranged in a transverse and longitudinal staggered manner, so that the separating channels generated on the two sides of the wafer by the wire saw devices are arranged in a vertically staggered manner.
2. One end of the movable rod is connected with a limiting plate, a second hydraulic pushing rod connected with the limiting plate is arranged on the outer sides of the upper lobe device and the lower lobe device, so that after the lobe device with the separation channel is continuously rotated to a horizontal state, acting force can be exerted on the limiting plate by the second hydraulic pushing rod on the lobe device on one side firstly, the limiting plate drives the movable rod to move, a mounting seat is arranged through the outer sleeve rod, one side of the attaching plate is connected with a ball head embedded in the mounting seat, a lobe knife is arranged on the outer side of the mounting seat, one side of the lobe knife is connected with a pull rod, one end of the pull rod extends into the outer sleeve rod and is contacted with the movable rod, pulling force can be generated on the pull rod after the movable rod moves, one end of the lobe knife is enabled to be tilted and the other end of the lobe knife is contacted with the back surface of one side, provided with the separation channel, so that, utilize movable rod and dead lever at the inside interval distribution setting that is of lobe of a leaf device for when a lane receives the effort to split and lets the wafer downward sloping of both sides, can utilize wafer one side downward sloping and opposite side perk upwards, thereby let stress concentration make it split on the lane of separating of adjacent one side, reach the effect of high-efficient lobe of a leaf wafer.
3. The limiting block is arranged in the mounting seat, the outside of the ball head is provided with a clamping groove attached to the cambered surface of the limiting block, the rotating rod is arranged at the position on one side of the limiting block, which is at the same level with the circle center of the ball head, and the spring is arranged on the outside of the rotating rod, so that the ball head can rotate in the mounting seat, so that the bonding sheet can be bonded to the wafer even in an inclined state, thereby preventing the wafer from being damaged due to scratches caused by displacement, thereby ensuring the high-efficiency splitting effect, avoiding the chip area from contacting with external scraps in the whole process, improving the quality of the wafer after splitting, wherein, the ball head can only rotate along four directions through the limiting block and the clamping groove, when the ball head rotates towards one side, in addition, the limiting blocks on the two sides can drive the rotating rod to rotate by overcoming the acting force of the coil spring, and the force in the opposite direction is applied to the rotating rod, so that the attaching sheet can be conveniently reset after the sheet is split.
4. Through last lobe of a leaf device and lower lobe of a leaf device internally mounted have the elastic layer, the inside hollow rectangle setting of elastic layer, elastic layer one side seted up with inside communicating through-hole, the inside bits box that receives that is provided with of lobe of a leaf device, then when first hydraulic stem promotes the lobe of a leaf device and is close to each other and offers the wafer and separate the way, can utilize the overcoat pole to exert the effort to the elastic layer, make the elastic layer compression inner space, outwards blow off inside air from the through-hole, the piece that produces when will seting up the separation way blows off, when improving the piece clearance efficiency, can utilize inside negative pressure to externally produce suction again when subsequent elastic layer resets, thereby inhale the piece inside the elastic layer, at last concentrate the piece in receiving the bits box along with the rotation of lobe of a leaf device, further improve the clearance efficiency to the piece.
Drawings
FIG. 1 is an overall perspective front view of the present invention;
FIG. 2 is a front interior perspective view of the present invention;
FIG. 3 is an internal perspective view of the lobe apparatus of the present invention;
FIG. 4 is an enlarged view taken at A of FIG. 3 according to the present invention;
FIG. 5 is a perspective view of a splitting blade of the present invention;
FIG. 6 is an interior perspective view of the mount of the present invention;
FIG. 7 is a bottom perspective view of the mount of the present invention;
FIG. 8 is a top view of the lower breaking apparatus of the present invention;
fig. 9 is an overall left perspective view of the present invention.
In FIGS. 1-9: 1-equipment shell, 2-rotating inner frame, 3-upward splitting device, 4-downward splitting device, 5-first hydraulic push rod, 6-wire saw, 7-second hydraulic push rod, 8-attaching piece, 9-wafer, 10-outer sleeve rod, 11-movable rod, 12-elastic layer, 13-limiting plate, 14-fixing rod, 15-splitting blade, 16-mounting seat, 17-pull rod, 18-diamond wire, 19-ball head and 20-limiting block.
Detailed Description
Referring to fig. 1 to 9, a schematic plan view and a schematic perspective view of an intelligent wafer breaking apparatus for semiconductor integrated circuit device processing are shown.
The utility model provides a semiconductor integrated circuit device processing is with wafer intelligence lobe of a leaf device, includes equipment shell 1, and equipment shell 1 internally mounted has rotates inside casing 2, rotates inside casing 2 internally mounted have and goes up lobe of a leaf device 3 and lower lobe of a leaf device 4, goes up lobe of a leaf device 3 and lower lobe of a leaf device 4 through first hydraulic pressure catch bar 5 with rotate the inside connection of inside casing, goes up lobe of a leaf device 3 and installs laminating piece 8 with the corresponding one side of lower lobe of a leaf device 4, goes up lobe of a leaf device 3 and lower lobe of a leaf device 4 internally mounted have elastic layer 12.
In the specific implementation, the rotating inner frame 2 is arranged in a circular ring shape, the fitting pieces 8 in the upper splitting device 3 and the lower splitting device 4 are symmetrically arranged, so that after the wafer 9 is placed on the lower splitting device 4, the first hydraulic push rod 5 can be used for driving the upper splitting device 3 and the lower splitting device 4 to be close to each other, and finally, the wafer 9 is clamped on two sides through the fitting pieces 8.
In the specific implementation, the movable rod 11 and the fixed rod 14 are installed inside the upper splitting device 3 and the lower splitting device 4, the outer sleeve rod 10 is sleeved at one end of the movable rod 11 and one end of the fixed rod 14, and one end of the outer sleeve rod 10 is connected with the attaching piece 8, so that when the inner frame 2 is rotated to drive the splitting device holding the wafer 9 to rotate 90 degrees under the action of the rear driving device, the first hydraulic push rod 5 can further exert an action on the two splitting devices, so that the attaching piece 8 drives the outer sleeve rod 10 to extrude an internal spring, so that the wafer 9 further enters the interior of the splitting device to be in contact with the diamond wires 18 on the wire saw 6, and the two sides of the wafer 9 are respectively provided with the partition lanes, so that the edge crack caused by the partition lane crossing can be avoided, the wafer 9 can be provided with the partition lanes in the vertical state, and the generated debris can fall and be discharged downwards.
In a specific implementation, a wire saw 6 is installed outside the upper and lower splinter devices 3 and 4, a diamond wire 18 penetrating through the inside of the splinter device is arranged on the wire saw 6, and the wire saw 6 on the upper and lower splinter devices 3 and 4 is arranged in a transversely and longitudinally staggered manner, so that after the splinter device provided with the separation channel continues to rotate to the horizontal state, the second hydraulic push rod 7 on one side of the splinter device can be used for exerting an acting force on the limiting plate 13, and the limiting plate 13 drives the movable rod 11 to move.
In the specific implementation, the elastic layer 12 is arranged in a hollow rectangle, a through hole communicated with the inside is formed in one side of the elastic layer 12, a chip collecting box is arranged inside the cracking device, when the first hydraulic rod 5 pushes the cracking device to approach each other to form a separation channel for the wafer 9, an acting force can be applied to the elastic layer 12 by using the outer sleeve rod 10, the elastic layer 12 compresses the inner space, the inner air is blown out from the through hole, chips generated when the separation channel is formed are blown away, the chip removing efficiency is improved, meanwhile, when the subsequent elastic layer 12 is reset, the internal negative air pressure can be used for generating a suction force outwards, the chips are sucked into the elastic layer 12, and finally the chips are concentrated in the chip collecting box along with the rotation of the cracking device, and the chip removing efficiency is further improved.
In the specific implementation, one end of the movable rod 11 is connected with the limiting plate 13, and the second hydraulic pushing rod 7 connected with the limiting plate 13 is arranged outside the upper lobe device 3 and the lower lobe device 4, so that after the movable rod 11 moves, a pulling force can be generated on the pull rod 17, the pull rod 17 enables one end of the lobe knife 15 to tilt, and the other end of the lobe knife to be in back contact with the side of the wafer 9 where the separating channel is formed, and the effect of applying an acting force at the separating channel to enable the wafer 9 to crack along the separating channel is achieved.
In a specific implementation, the outer loop bar 10 is provided with a mounting seat 16, one side of the attaching plate 8 is connected with a ball 19 embedded in the mounting seat 16, a splitting blade 15 is installed outside the mounting seat 16, one side of the splitting blade 15 is connected with a pull rod 17, and one end of the pull rod 17 extends into the outer loop bar 10 and contacts with the movable rod 11.
In specific implementation, the movable rods 11 and the fixed rods 10 are arranged inside the splitting device at intervals, so that when one of the separating channels is cracked by an acting force to enable the wafers 9 on two sides to incline downwards, one side of each wafer 9 inclines downwards and the other side of each wafer tilts upwards, stress is concentrated on the separating channel on the adjacent side to enable the wafer to crack, and the effect of efficiently splitting the wafer is achieved.
In the specific implementation, a limiting block 20 is installed inside the installation seat 16, a clamping groove attached to the cambered surface of the limiting block 20 is formed on the outer side of the ball head 19, a rotating rod is arranged at the position on one side of the limiting block 20, which is at the same horizontal position with the circle center of the ball head 19, and a coil spring is arranged outside the rotating rod, the ball head 19 can be used for rotating in the mounting seat 16, so that the bonding sheet 8 can be bonded to the wafer 9 even in an inclined state, thereby preventing the wafer 9 from being damaged due to scratches caused by displacement, thereby ensuring the high-efficiency splitting effect, avoiding the chip area from contacting with external chips in the whole process, improving the quality of the wafer 9 after splitting, wherein, the limiting block 20 and the clamping groove make the ball head 19 only rotate along four directions, and when the ball head 19 rotates towards one side, in addition, the limiting blocks 20 on the two sides drive the rotating rod to rotate against the acting force of the coil spring, and the force in the opposite direction is applied to the rotating rod, so that the attaching sheet 8 can be conveniently reset after the sheet is split.
The working principle of the intelligent wafer splitting device for processing the semiconductor integrated circuit device is as follows.
Firstly, a wafer 9 to be split is placed between an upper splitting device 3 and a lower splitting device 4, the inner frame 2 is arranged in a circular ring shape through rotation, the upper splitting device 3 and an attaching piece 8 in the lower splitting device 4 are symmetrically arranged, when the wafer 9 is placed on the lower splitting device 4, the upper splitting device 3 and the lower splitting device 4 can be driven to be close to each other by using a first hydraulic push rod 5, finally, two sides of the wafer 9 are clamped by the attaching piece 8, a movable rod 11 and a fixed rod 14 are installed inside the upper splitting device 3 and the lower splitting device 4, the movable rod 11 and one end of the fixed rod 14 are sleeved with an outer sleeve rod 10, one end of the outer sleeve rod 10 is connected with the attaching piece 8, and after the inner frame 2 is rotated under the action of a rear side driving device to drive the splitting device clamping the wafer 9 to rotate for 90 degrees, the first hydraulic push rod 5 can further act on the two splitting devices, the fitting sheet 8 drives the outer sleeve rod 10 to extrude the inner spring, so that the wafer 9 further enters the splitting device to contact with the diamond wire 18 on the wire saw 6, and separate channels are respectively scribed on two sides of the wafer 9, so that edge cracking caused by staggered channels is avoided, the wafer 9 can be provided with separate channels in a vertical state, and generated debris conveniently falls down and is discharged, wherein the wire saw 6 on the upper splitting device 3 and the lower splitting device 4 is arranged in a transversely and longitudinally staggered manner, so that the separate channels generated on two sides of the wafer 9 by the wire saw 6 are arranged in a vertically staggered manner, then one end of the movable rod 11 is connected with a limiting plate 13, a second hydraulic push rod 7 connected with the limiting plate 13 is arranged on the outer sides of the upper splitting device 3 and the lower splitting device 4, so that after the splitting device provided with separate channels continuously rotates to a horizontal state, the second hydraulic push rod 7 on one side splitting device can be firstly utilized to apply acting force to the limiting plate 13, the limiting plate 13 drives the movable rod 11 to move, the outer sleeve rod 10 is provided with the mounting seat 16, one side of the attaching plate 8 is connected with a ball head 19 embedded in the mounting seat 16, the outer side of the mounting seat 16 is provided with the splitting blade 15, one side of the splitting blade 15 is connected with the pull rod 17, one end of the pull rod 17 extends into the outer sleeve rod 10 and contacts with the movable rod 11, the pull rod 17 can generate pulling force after the movable rod 11 moves, one end of the splitting blade 15 is tilted and the other end of the splitting blade 17 contacts with the back of one side of the wafer 9 provided with the partition channel, so that the effect of applying acting force at the partition channel to crack the wafer 9 along the partition channel is achieved, the movable rod 11 and the fixed rod 10 are arranged at intervals in the splitting device, when one partition channel is cracked by acting force to lead the wafer 9 at two sides to tilt downwards, one side of the wafer 9 tilts upwards and tilts, therefore, stress is concentrated on the separating channel on one adjacent side to crack the wafer, the effect of efficiently cracking the wafer is achieved, then the limiting block 20 is installed inside the installation seat 16, the outer side of the ball head 19 is provided with a clamping groove attached to the cambered surface of the limiting block 20, the position of one side of the limiting block 20, which is at the same level with the circle center of the ball head 19, is provided with a rotating rod, the outer side of the rotating rod is provided with a coil spring, the ball head 19 can rotate in the installation seat 16, so that the attaching sheet 8 can be attached to the wafer 9 in an inclined state, the wafer 9 is prevented from being displaced to generate scratches and damage, the efficient cracking effect is guaranteed, meanwhile, the chip area can be prevented from contacting with external chips in the whole course, the quality of the wafer 9 after cracking is improved, wherein the ball head 19 can only rotate in four directions through the limiting block 20 and the clamping groove, in addition, the limiting blocks 20 at the two sides can drive the rotating rod to rotate against the acting force of the coil spring, and apply opposite force to the rotating rod to conveniently reset the attaching sheet 8 after the sheet is split, then the elastic layer 12 is installed inside the upper and lower splitting devices 3 and 4, the elastic layer 12 is arranged in a hollow rectangle, one side of the elastic layer 12 is provided with a through hole communicated with the inside, and a chip receiving box is arranged inside the splitting device, so that when the first hydraulic rod 5 pushes the splitting devices to approach each other to open a channel for the wafer 9, the outer sleeve rod 10 can apply acting force to the elastic layer 12 to enable the elastic layer 12 to compress the inner space, blow out the inner air from the through hole, blow off the chips generated when the channel is opened, improve the chip removing efficiency, and simultaneously, utilize the internal negative air pressure to generate suction force outwards when the subsequent elastic layer 12 is reset, thereby sucking the chips into the elastic layer 12, finally, the chips are concentrated in the chip collecting box along with the rotation of the chip splitting device, so that the chip removing efficiency is further improved.
Claims (8)
1. The utility model provides a semiconductor integrated circuit device processing is with wafer intelligence lobe of a leaf device, includes equipment shell (1), its characterized in that: equipment shell (1) internally mounted has rotation inside casing (2), it can follow last lobe of a leaf device (3) and lower lobe of a leaf device (4) of both sides centre gripping brilliant plectane (9) to rotate inside casing (2), go up lobe of a leaf device (3) and be provided with laminating piece (8) that can centre gripping under wafer board (9) tilt state with lower lobe of a leaf device (4) inside, go up lobe of a leaf device (3) and lower lobe of a leaf device (4) internally mounted have elastic layer (12) of cavity setting, it is provided with the coping saw ware (6) of dislocation set with lower lobe of a leaf device (4) outside to go up lobe of a leaf device (3).
2. The intelligent wafer splitting device for processing the semiconductor integrated circuit device, according to claim 1, wherein: the upper splitting device (3) and the bonding sheet (8) in the lower splitting device (4) are symmetrically arranged.
3. The intelligent wafer splitting device for processing the semiconductor integrated circuit device, according to claim 1, wherein: and a diamond wire (18) is arranged in the wire saw (6), and the diamond wires (18) in the upper splitting device (3) and the lower splitting device (4) are arranged in a transversely and longitudinally staggered manner.
4. The intelligent wafer splitting device for processing the semiconductor integrated circuit device, according to claim 1, wherein: the upper splitting device (3) and the lower splitting device (4) are internally provided with movable rods (11) and fixed rods (14) which are arranged at intervals.
5. The intelligent wafer splitting device for processing the semiconductor integrated circuit device, according to claim 1, wherein: one side of the attaching sheet (8) is connected with a mounting seat (16) and is provided with a bulb (19) embedded in the mounting seat (16).
6. The intelligent wafer splitting device for processing the semiconductor integrated circuit device, according to claim 1, wherein: the elastic layer (12) is rectangular.
7. The intelligent wafer splitting device for processing the semiconductor integrated circuit device, according to claim 5, wherein: and a limiting block (20) which is attached and contacted with the outer side of the ball head (19) is arranged in the mounting seat (16).
8. The intelligent wafer splitting device for processing the semiconductor integrated circuit device, according to claim 7, wherein: and a rotating rod which is in the same horizontal plane with the circle center of the ball head (19) is arranged on one side of the limiting block (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110306847.2A CN113097101B (en) | 2021-03-23 | 2021-03-23 | Intelligent wafer splitting device for processing semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110306847.2A CN113097101B (en) | 2021-03-23 | 2021-03-23 | Intelligent wafer splitting device for processing semiconductor integrated circuit device |
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| Publication Number | Publication Date |
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| CN113097101A true CN113097101A (en) | 2021-07-09 |
| CN113097101B CN113097101B (en) | 2022-07-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110306847.2A Active CN113097101B (en) | 2021-03-23 | 2021-03-23 | Intelligent wafer splitting device for processing semiconductor integrated circuit device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114433444A (en) * | 2022-04-11 | 2022-05-06 | 四川上特科技有限公司 | Material containing and transferring device for coating glass powder on wafer |
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| CN204516726U (en) * | 2014-10-20 | 2015-07-29 | 上海技美电子科技有限公司 | Wafer sliver apparatus |
| CN210379091U (en) * | 2019-08-27 | 2020-04-21 | 苏州辰正太阳能设备有限公司 | Splitting device for battery piece |
| CN210880354U (en) * | 2019-07-15 | 2020-06-30 | 东莞市顺烁通讯科技有限公司 | Positioning device for wafer cutting |
| CN211828807U (en) * | 2020-01-15 | 2020-10-30 | 武汉帝尔激光科技股份有限公司 | Online continuous scribing and breaking device |
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2021
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810469A (en) * | 2012-08-02 | 2012-12-05 | 华灿光电股份有限公司 | Splinter device and method of wafer |
| CN204516726U (en) * | 2014-10-20 | 2015-07-29 | 上海技美电子科技有限公司 | Wafer sliver apparatus |
| CN210880354U (en) * | 2019-07-15 | 2020-06-30 | 东莞市顺烁通讯科技有限公司 | Positioning device for wafer cutting |
| CN210379091U (en) * | 2019-08-27 | 2020-04-21 | 苏州辰正太阳能设备有限公司 | Splitting device for battery piece |
| CN211828807U (en) * | 2020-01-15 | 2020-10-30 | 武汉帝尔激光科技股份有限公司 | Online continuous scribing and breaking device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114433444A (en) * | 2022-04-11 | 2022-05-06 | 四川上特科技有限公司 | Material containing and transferring device for coating glass powder on wafer |
| CN114433444B (en) * | 2022-04-11 | 2022-07-01 | 四川上特科技有限公司 | Material containing and transferring device for coating glass powder on wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113097101B (en) | 2022-07-29 |
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