CN114141675A

CN114141675A - Quartz boat suitable for wafers with different thicknesses

Info

Publication number: CN114141675A
Application number: CN202111479845.XA
Authority: CN
Inventors: 高博; 张雷; 乔琪琪; 忽永瑞; 孙瑞瑞; 赵恩
Original assignee: No 214 Institute of China North Industries Group Corp
Current assignee: No 214 Institute of China North Industries Group Corp
Priority date: 2021-12-07
Filing date: 2021-12-07
Publication date: 2022-03-04

Abstract

The invention relates to a quartz boat suitable for wafers with different thicknesses, which comprises a pair of upper groove rods (1) and a pair of lower groove rods (2), wherein the upper groove rods and the lower groove rods are parallel to each other, the upper groove rods are positioned on the upper sides of the lower groove rods, a group of quartz plates (3) are connected between the two lower groove rods, the outer sides of the two lower groove rods are respectively connected with the upper groove rods through the quartz plates, a group of V-shaped grooves (4) are respectively and uniformly distributed on the upper groove rods and the lower groove rods, the positions of the V-shaped grooves of the upper groove rods and the positions of the V-shaped grooves of the lower groove rods correspond to each other and are positioned on the same cross section, the bottoms of the V-shaped grooves on the upper groove rods are communicated with first I-shaped grooves (5), the bottoms of the V-shaped grooves on the lower groove rods are communicated with second I-shaped grooves (6), the widths of the first I-shaped grooves are 0.8-1.1mm, and the widths of the second I-shaped grooves are 0.4-0.7 mm. The invention is suitable for wafers with different thicknesses and the same diameter, can prevent the wafers from being too large inclined, improves the uniformity among the wafers, meets the requirements of the production process, and is convenient for automatic operation by adopting an automatic wafer guide machine.

Description

Quartz boat suitable for wafers with different thicknesses

Technical Field

The invention relates to the technical field of wafer processing devices, in particular to a quartz boat applicable to wafers with different thicknesses, which is applied to a horizontal LPCVD furnace.

Background

Quartz products are widely used in the microelectronics industry for integrated circuit chip fabrication due to their excellent physicochemical properties. Quartz boats are commonly used as wafer carriers in integrated circuit chip production lines, and are generally used for oxidation diffusion, LPCVD and other important processes. With the development of wafer processing technology, different products have different requirements on the thickness of the wafer, and wafers with the thickness of 300 microns to 800 microns are widely adopted at present.

Because the wafer thickness is inconsistent, the quartz boats with different sizes need to be customized, so that the quartz boats in the process line are too many in types, and the unified management is not facilitated. If wafers with different thicknesses and the same diameter are placed in the existing quartz boat, the problems of processing are great and mainly appear as follows:

1. when the quartz boat meeting the requirement of wafers with the thickness of 800 microns is placed on wafers with the thickness of 300-400 microns, the wafers are excessively inclined, and the relative distance between the wafers is not uniform, so that the uniformity of a film on the surface of each wafer is reduced during LPCVD (low pressure chemical vapor deposition) processing;

2. because the wafer after being placed inclines too much, the automatic wafer guide machine can not be adopted to carry out the operation of loading and unloading the wafer, and only manual operation can be carried out, thus easily causing quality problems.

Therefore, a general quartz boat capable of meeting the thickness of 300 to 800 microns and wafers with the same diameter is urgently needed to meet the requirements of the production process.

Disclosure of Invention

Aiming at the problems in the prior art, the invention provides the quartz boat suitable for wafers with different thicknesses, which can prevent the wafers from being too large in inclination, improve the uniformity among the wafers, meet the requirements of a production process and facilitate automatic operation by adopting an automatic wafer guide machine.

The invention adopts the following technical scheme:

the utility model provides a quartz boat suitable for different thickness wafers, includes a pair of groove stick and a pair of lower groove stick, and upper and lower groove stick is parallel to each other and the groove stick is located groove stick upside down, connects a set of quartz plate between the two lower groove sticks, and the two lower groove stick outsides are connected with the upper groove stick through the quartz plate respectively, and upper and lower groove stick goes up a set of V type groove of equipartition respectively, and the V type groove position of the upper groove stick corresponds each other with the V type groove position of lower groove stick, all is in same cross-section, its characterized in that: the bottom of the V-shaped groove on the upper groove rod is communicated with a first I-shaped groove, the bottom of the V-shaped groove on the lower groove rod is communicated with a second I-shaped groove, the width of the first I-shaped groove is 0.8-1.1mm, and the width of the second I-shaped groove is 0.4-0.7 mm.

Furthermore, the included angle of the notch of the V-shaped groove is 55-70 degrees.

Furthermore, the depth of the first I-shaped groove and the depth of the second I-shaped groove are both 1-5 mm.

Furthermore, the quartz plate between the two lower groove rods is horizontally arranged and used for stably supporting the quartz boat.

Furthermore, an ear plate is further connected to the outer side face of each upper groove rod and used for transferring the quartz boat.

The invention has the following beneficial effects:

set up first, second I type groove in this scheme, through the I type groove of different width, make the compatible 300 micron ~ 800 micron thickness wafer of quartz boat, guarantee that the wafer of different thickness is placed and can not produce obvious slope, do not influence the piece of LPCVD technology in, homogeneity between the piece. The automatic guide of the wafer guide machine is realized.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure in the direction A in FIG. 1;

FIG. 3 is a schematic view of the channel shape of the upper channel bar;

FIG. 4 is a schematic view of the channel shape of the lower channel bar;

FIG. 5 is a schematic view of the 300-700 μm thick wafer and the upper channel bar at B-B of FIG. 2;

FIG. 6 is a schematic view of the 300-700 μm thick wafer and the lower channel bar at C-C in FIG. 2;

FIG. 7 is a schematic view of the 700-800 μm thick wafer and the upper channel bar at B '-B' of FIG. 2;

FIG. 8 is a schematic view of the 700-800 μm thick wafer and the lower channel bar at C '-C' of FIG. 2;

in fig. 1, the wafer is omitted for clarity of the structure of the present invention.

Reference numerals: 1. an upper channel bar; 2. a lower channel bar; 3. a quartz plate; 4. a V-shaped groove; 5. a first I-shaped groove; 6. a second I-shaped groove; 7. an ear plate; 8. and (5) a wafer.

Detailed Description

In order to make the present invention more clear, the following further describes a quartz boat for wafers with different thicknesses according to the present invention with reference to the attached drawings, and the embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.

As shown in FIG. 1 and FIG. 2, a quartz boat is suitable for wafers with different thickness and the same diameter, wherein the thickness of the wafer 8 is 300-800 μm. It includes a pair of upper groove stick 1 and a pair of lower groove stick 2, and upper and lower groove stick is columniform quartz rod and parallel arrangement each other, and a pair of 1 symmetries in upper groove stick are located two 2 upsides in lower groove stick. Two quartz plates 3 which are horizontally arranged are connected between the two lower groove rods 2 and are respectively positioned at the two axial ends of the lower groove rods 2, and the bottom surfaces of the quartz plates 3 are large surfaces and are used as bearing surfaces of the quartz boats to form stable contact with the working platform. The outer sides of the two lower groove rods 2 are respectively connected with the upper groove rod 1 through a group of obliquely arranged quartz plates 3, the number of each group of quartz plates 3 is 3, the connection effect with the upper groove rod and the lower groove rod is achieved, a distance is reserved between every two quartz plates 3, and the circulation of the gas compounds in the LPCVD process of the wafer is facilitated. Still connect the otic placode 7 of a quartz material on every 1 lateral surfaces of upper groove stick, otic placode 7 horizontal arrangement for transport the quartz boat. A group of V-shaped grooves 4 are respectively and uniformly distributed on the upper groove rod and the lower groove rod along the axial direction of the rods, the notches of the V-shaped grooves face the center of a circle for placing a wafer 8, and the included angle of the notches is 55-70 degrees. The positions of the V-shaped grooves 4 of the upper groove rod 1 and the positions of the V-shaped grooves 4 of the lower groove rod 2 correspond to each other and are positioned on the same section. As shown in fig. 2, the cross section of the quartz boat presents an inverted trapezoid shape with an opening at the upper end, the wafer 8 is placed in the quartz boat, and the matching position of the wafer 8 and the notch of the lower groove rod 2 is close to the bottom end of the wafer 8 and symmetrically distributed on the edges of two sides; the matching position of the wafer 8 and the notch of the upper groove rod 1 is lower than the circle center of the wafer 8 and higher than the matching position of the lower groove rod 2, and the matching position of the wafer 8 and the notch of the upper groove rod 1 is also symmetrically distributed on the edges of two sides.

As shown in fig. 3, the bottom of the V-shaped groove 4 on the upper groove rod 1 is communicated with a first I-shaped groove 5, the center line of the V-shaped groove 4 coincides with the center line of the first I-shaped groove 5, the width of the first I-shaped groove 5 is 0.8-1.1mm, and the depth of the first I-shaped groove is 1-5 mm. As shown in fig. 4, the bottom of the V-shaped groove 4 on the lower groove rod 2 is connected with a second I-shaped groove 6, the center lines of the V-shaped groove 4 and the second I-shaped groove 6 are superposed, the width of the second I-shaped groove 6 is 0.4-0.7mm, and the depth of the second I-shaped groove is 1-5 mm.

As shown in fig. 5, when the thickness of the wafer 8 is between 300 and 700 μm, the edge of the wafer 8 is clamped into the first I-shaped groove 5 and does not contact with the V-shaped groove 4 of the upper groove rod; as shown in fig. 6, the edge of the wafer 8 snaps into the second I-groove 6 without contacting the V-groove 4 of the lower channel bar. Because the V-shaped grooves 4 corresponding to the upper and lower groove rods are in the same section, the inclination angle of the wafer can be controlled within an allowable range by setting the groove width of the first I-shaped groove and the second I-shaped groove and the distance between the first I-shaped groove and the second I-shaped groove in the vertical direction, and the requirements of the production process are met.

As shown in fig. 7, when the thickness of the wafer is between 700 and 800 microns, the edge of the wafer is clamped into the first I-shaped groove 5 and does not contact with the V-shaped groove 4 of the upper groove rod; as shown in fig. 8, the edge of the wafer is clamped into the V-shaped groove 4 of the lower groove bar, and is not in contact with the second I-shaped groove 6, so that the inclination angle of the wafer is controlled within an allowable range, and the requirements of the production process are met.

In the invention, the V-shaped groove is designed by adopting an included angle of 55-70 degrees, thereby not only playing a role in guiding the wafer placement, but also playing a role in limiting and matching; through the matching of the first I-shaped groove and the second I-shaped groove and the V-shaped groove, the quartz boat can be compatible with wafers with the thickness of 300-800 microns, the wafers with different thicknesses can be placed without obvious inclination, the uniformity in and among wafers in the LPCVD process is not influenced, the product quality is improved, and the automatic wafer guide operation of the wafer guide machine is realized.

The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner; those skilled in the art can make numerous possible variations and modifications to the present teachings, or modify equivalent embodiments to equivalent variations, without departing from the scope of the present teachings, using the methods and techniques disclosed above. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention.

Claims

1. The utility model provides a quartz boat that is suitable for different thickness wafers, including a pair of groove stick (1) and a pair of lower groove stick (2), on, down the groove stick is parallel to each other and go up groove stick (1) and be located groove stick (2) upside down, connect a set of quartz plate (3) between two lower groove stick (2), two lower groove stick (2) outsides are connected with last groove stick (1) respectively through quartz plate (3), on the lower groove stick respectively a set of V type groove (4) of equipartition, the V type groove (4) position of going up groove stick (1) corresponds with V type groove (4) position of lower groove stick (2) each other, all be in same cross-section, its characterized in that: the groove width of the first I-shaped groove (5) is 0.8-1.1mm, and the groove width of the second I-shaped groove (6) is 0.4-0.7 mm.

2. The quartz boat of claim 1, wherein the quartz boat is adapted for wafers of different thicknesses, and comprises: the included angle of the notch of the V-shaped groove (4) is 55-70 degrees.

3. The quartz boat of claim 2, wherein the quartz boat is adapted for wafers of different thicknesses, and comprises: the depth of the first I-shaped groove and the depth of the second I-shaped groove are both 1-5 mm.

4. The quartz boat of claim 3, wherein the quartz boat is adapted for wafers of different thicknesses, and comprises: the quartz plate (3) between the two lower groove rods (2) is horizontally arranged and used for stably supporting the quartz boat.

5. A quartz boat for wafers of different thickness as claimed in claim 1 or 4, wherein: and each upper groove rod (1) is also connected with an ear plate (7) on the outer side surface for transferring the quartz boat.