CN218160317U - Silicon wafer bearing support plate for plate type film coating equipment - Google Patents
Silicon wafer bearing support plate for plate type film coating equipment Download PDFInfo
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- CN218160317U CN218160317U CN202222632789.5U CN202222632789U CN218160317U CN 218160317 U CN218160317 U CN 218160317U CN 202222632789 U CN202222632789 U CN 202222632789U CN 218160317 U CN218160317 U CN 218160317U
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Abstract
The utility model relates to a photovoltaic equipment technical field, concretely relates to board-like coating equipment is with bearing support plate of silicon chip. The utility model provides a support plate that bears silicon chip that board-like coating equipment used, include: the device comprises a carrier plate body and a plurality of first grooves arranged on the carrier plate body in an array manner, wherein platforms of the first grooves are suitable for bearing workpieces; a plurality of bosses are fixed on the upper plane of the carrier plate body, the bosses are arranged along the peripheral edge of the first groove, and a slope sliding table is arranged on the side wall of each boss towards the side wall of the first groove; when the workpiece is placed into the first groove, the slope sliding table is suitable for guiding and limiting the workpiece. Through the setting of boss, can avoid the silicon chip to need the requirement of accurate positioning before placing, be unlikely to the coating film and appoint the border position at the skew on the silicon chip, reach the coating film effect that solar cell needs, reduced simultaneously and required the cost to automatic silicon chip material accuracy, reduce the required cost of automatic accurate location.
Description
Technical Field
The utility model relates to a photovoltaic equipment technical field, concretely relates to board-like coating equipment is with bearing support plate of silicon chip.
Background
In the production process of the solar cell, the silicon wafer is required to be placed on a support plate, and the silicon wafer is carried by the support plate and enters the solar cell coating equipment for carrying out the process reaction. The material and structural design of the carrier plate all have obvious influence on the quality of the coating film, such as appearance and performance.
The structure of the existing plate-type film-coating carrier plate is that a plurality of rectangular grooves are distributed on the carrier plate in an array manner, and the grooves are used for bearing silicon wafers and limiting the silicon wafers when the silicon wafers deviate. The thickness of the carrier plate is generally 3-5mm, the thickness of the silicon chip is 0.18mm, and the silicon chip is embedded in the rectangular groove because the carrier plate is far thicker than the silicon chip. During film coating, the process conditions at the edge of the silicon wafer are changed due to the blocking of the groove, so that an edge effect is generated, uneven deposition is caused, color difference occurs between a film at the edge and other areas, and finally the conversion efficiency and the yield of the battery piece are reduced.
Therefore, it is necessary to develop a silicon wafer-supporting carrier plate for a plate-type coating apparatus.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a support plate that bears silicon chip that board-like coating equipment used solves among the prior art silicon chip and changes the serious technical problem of marginal colour difference.
In order to achieve the above object, an embodiment of the present invention provides a support plate for bearing a silicon wafer for a plate-type film plating apparatus, including:
the device comprises a carrier plate body and a plurality of first grooves which are arranged on the carrier plate body in an array manner, wherein the first grooves are suitable for bearing workpieces;
a plurality of bosses are fixed at the upper end of the carrier plate body and are circumferentially arranged along the first groove;
a slope sliding table is arranged on the side wall of the boss towards the side wall of the first groove; wherein
When the silicon chip is placed into the first groove, the slope sliding table is suitable for guiding and limiting the silicon chip.
Preferably, the first groove depth is greater than the workpiece thickness.
Preferably, the inner bottom wall of the first groove is a solid plate.
Preferably, the inner bottom wall of the first groove is of a hollow structure.
Preferably, a plurality of positioning strips are arranged on the inner bottom wall of the first groove, a closed ring is formed by the plurality of positioning strips, and the distance between the two opposite positioning strips is smaller than the size of the workpiece.
Preferably, the carrier plate body is further provided with a plurality of first steps, and the first steps are circumferentially arranged along the first groove;
the distance between the two oppositely arranged first steps is larger than the slotting distance of the first groove.
Preferably, the length of the boss is 1-3mm.
Preferably, the thickness of the carrier plate body is 3-5mm.
Preferably, the carrier plate body is made of graphite, carbon fiber or carbon-carbon composite material.
Compared with the prior art, the embodiment of the utility model provides a following beneficial effect has: the utility model provides a plate-type filming equipment is with bearing support plate of silicon chip, include: the support plate comprises a support plate body and a plurality of first grooves which are arranged on the support plate body in an array manner, wherein the first grooves are rectangular and are suitable for bearing workpieces; a plurality of bosses are fixed at the upper end of the carrier plate body and are circumferentially arranged along the first groove; a slope sliding table is arranged on the side wall of the boss towards the side wall of the first groove; wherein the work piece is put into in the first recess, the slope slip table is used for the work piece to be put into when guide the work piece and falls into first recess. Through the setting of boss, can realize that the silicon chip is placed and spacing in the carrier plate body, reduce the influence that blocks at first recess to the silicon chip edge in the coating process simultaneously, can make the silicon chip air current distribution better even all around, promote the coating film effect to improve the colour difference problem at silicon chip edge, improve the rete quality. The arrangement of the first grooves can place and limit the silicon wafers in the carrier plate body. The air can be guided to uniformly flow on the surface of the silicon wafer through the arrangement of the first step.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a perspective view of a first embodiment of a silicon wafer-supporting carrier plate for a plate-type coating apparatus according to the present invention;
fig. 2 is a perspective view of a second embodiment of a silicon wafer-supporting carrier plate for a plate-type coating apparatus according to the present invention.
In the figure:
1. a carrier plate body; 2. a first groove; 20. a positioning bar; 3. a boss; 30. a slope sliding table; 4. a first step.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic drawings, which illustrate the basic structure of the present invention in a schematic manner, and thus show only the components related to the present invention.
Example one
As shown in fig. 1, the present embodiment provides a silicon wafer-supporting carrier plate for a plate-type coating apparatus, including: the carrier plate comprises a carrier plate body 1 and a plurality of first grooves 2 arranged on the carrier plate body 1 in an array mode, wherein the first grooves 2 are rectangular, and the first grooves 2 are suitable for bearing workpieces.
It should be noted that, the workpieces referred to hereinafter refer to silicon wafers that are adapted to a silicon wafer-bearing carrier plate for a plate-type coating apparatus shown in this embodiment.
In this embodiment, each of the first grooves 2 is rectangular, and the first grooves 2 are suitable for bearing a workpiece. A plurality of bosses 3 are fixed at the upper end of the carrier plate body 1, and the bosses 3 are arranged along the peripheral edge of the first groove 2; a slope sliding table 30 is arranged on the side wall of the boss 3 towards the side wall of the first groove 2; the slope sliding table 30 extends to the side wall surface of the first groove 2; the slope sliding table 30 is suitable for guiding the silicon wafer to fall into the first groove 2, and the slope sliding table 30 is arranged for guiding the silicon wafer to fall into the first groove 2 when one side of the silicon wafer deviates onto the slope sliding table 30 when the silicon wafer is placed into the first groove 2; the requirement that the silicon wafer needs to be accurately positioned before being placed into the first groove 2 is avoided, the requirement on the accuracy of an automatic silicon wafer feeding machine is reduced, and the cost required by automatic accurate positioning is reduced. In this embodiment, the number of the bosses 3 disposed around one first groove 2 is preferably four, and the length directions of the four bosses 3 point to the geometric center of the first groove 2. The boss 3 is arranged to further limit the workpiece so as to prevent the workpiece from being separated from the first groove 2, and the workpiece is put in or taken out along the direction perpendicular to the bottom wall of the first groove 2 right above the first groove 2. The depth of the first groove 2 is larger than the thickness of the workpiece. The depth of the first groove 2 is 0.2-0.6mm, a workpiece is placed in the first groove 2, and the side wall of the boss 3 can limit the workpiece.
The inner bottom wall of the first groove 2 is a solid plate or a hollow plate; when the inner bottom wall of each first groove 2 is hollow, a plurality of positioning strips 20 are further arranged on the inner wall of each first groove 2, a closed ring is formed by the plurality of positioning strips 20, and the distance between the two positioning strips 20 is smaller than the size of the workpiece; when the workpiece is placed in the first groove 2, the positioning strip 20 can support and bear the workpiece from the lower end, so that the workpiece is prevented from falling off from the first groove 2. And when the interior diapire of first recess 2 was the solid slab, the work piece was directly placed diapire in first recess 2, through the cooperation of boss 3 with 2 diapires of first recess, can play the effect of bearing and spacing work piece.
Example two
As shown in fig. 2, the present embodiment provides a silicon wafer-supporting carrier plate for a plate-type film plating apparatus, comprising: the carrier plate comprises a carrier plate body 1 and a plurality of first grooves 2 arranged on the carrier plate body 1 in an array mode, wherein the first grooves 2 are rectangular, and the first grooves 2 are suitable for bearing workpieces.
It should be noted that, the workpieces referred to hereinafter refer to silicon wafers that are adapted to a silicon wafer-bearing carrier plate for a plate-type coating apparatus shown in this embodiment.
In this embodiment, each first groove 2 is rectangular, and the first grooves 2 are suitable for bearing a workpiece. A plurality of bosses 3 are fixed at the upper end of the carrier plate body 1, and the bosses 3 are circumferentially arranged along the first groove 2; every two bosses 3 are symmetrically arranged, and a slope sliding table 30 is arranged on the side wall of each boss 3 towards the side wall of the first groove 2; the slope sliding table 30 extends to the side wall surface of the first groove 2; the slope sliding table 30 is suitable for guiding the silicon wafer to fall into the first groove 2, and the slope sliding table 30 is arranged for guiding the silicon wafer to fall into the first groove 2 when one side of the silicon wafer deviates onto the slope sliding table 30 when the silicon wafer is placed into the first groove 2; the requirement that the silicon wafer needs to be accurately positioned before being placed into the first groove 2 is avoided, and the requirement on the accuracy of an automatic silicon wafer feeding machine is reduced. In this embodiment, the number of the bosses 3 disposed around one first groove 2 is preferably four, and the length directions of the four bosses 3 point to the geometric center of the first groove 2. The boss 3 is arranged to further limit the workpiece so as to prevent the workpiece from being separated from the first groove 2, and the workpiece is put in or taken out along the direction perpendicular to the bottom wall of the first groove 2 right above the first groove 2. The depth of the first groove 2 is larger than the thickness of the workpiece. The depth of the first groove 2 is 0.2-0.6mm, a workpiece is placed in the first groove 2, and the side wall of the boss 3 can limit the workpiece.
The inner bottom wall of the first groove 2 is a solid plate or a hollow structure; when the first grooves 2 are of hollow structures, if the positioning strips 20 are arranged on the inner wall of each first groove 2, a plurality of positioning strips 20 form a closed ring, and the distance between two opposite positioning strips 20 is smaller than the size of the workpiece; when the workpiece is placed in the first groove 2, the positioning strip 20 can support and bear the workpiece from the lower end, so that the workpiece is prevented from falling off from the first groove 2. And when diapire was the solid slab in first recess 2, the work piece was directly placed diapire in first recess 2, through the cooperation of boss 3 with 2 diapires of first recess, can play the effect of bearing and spacing work piece.
A plurality of first steps 4 are further arranged at the upper end of the carrier plate body 1, and the first steps 4 are circumferentially arranged along the first groove 2; the boss 3 is arranged on the inner side wall of the first step 4; the distance between the two oppositely arranged first steps 4 is larger than the slotting distance of the first groove 2. A plurality of first steps 4 form a second groove, and the opening width of the second groove is larger than that of the first groove 2; the opening width of the second groove is 1-3mm greater than that of the first groove 2; the arrangement of the first steps 4 can enable the air flow distribution around the workpiece to be better and uniform. Through the mode, when the workpiece is placed into the first groove 2, the airflow can flow to the second groove and flows to the periphery of the workpiece from the second groove, the blocking influence of the second groove on the edge of the workpiece in the coating process can be reduced, the airflow distribution on the periphery of the workpiece is more uniform, the coating effect is improved, the problem of chromatic aberration of the edge of the workpiece is solved, and the film quality is improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A carrier plate for bearing a silicon wafer for plate-type coating equipment is characterized by comprising:
the support plate comprises a support plate body (1) and a plurality of first grooves (2) which are arranged on the support plate body (1) in an array manner, wherein the first grooves (2) are suitable for bearing workpieces;
a plurality of bosses (3) are fixed at the upper end of the carrier plate body (1), and the bosses (3) are arranged along the circumferential direction of the first groove (2);
a slope sliding table (30) is arranged on the side wall of the boss (3) towards the side wall of the first groove (2); wherein
When the silicon chip is placed into the first groove (2), the slope sliding table (30) is suitable for guiding and limiting the silicon chip.
2. The silicon wafer-supporting carrier plate for a plate-type coating apparatus according to claim 1,
the first groove (2) is rectangular, and the depth of the first groove (2) is larger than the thickness of a workpiece.
3. The silicon wafer-supporting carrier plate for a plate-type coating apparatus according to claim 2,
the inner bottom wall of the first groove (2) is a solid plate.
4. The silicon wafer-supporting carrier plate for a plate-type coating apparatus according to claim 2,
the inner bottom wall of the first groove (2) is of a hollow structure.
5. The silicon wafer-supporting carrier plate for a plate-type coating apparatus according to claim 4,
a plurality of positioning strips (20) are arranged on the bottom wall of the first groove (2), a closed ring is formed by the plurality of positioning strips (20), and the distance between every two opposite positioning strips (20) is smaller than the size of a workpiece.
6. The silicon wafer-supporting carrier plate for a plate-type coating apparatus according to claim 3 or 5,
the carrier plate body (1) is also provided with a plurality of first steps (4), and the first steps (4) are arranged along the circumferential direction of the first groove (2);
the distance between the two oppositely arranged first steps (4) is larger than the slotting distance of the first groove (2).
7. The silicon wafer-supporting carrier plate for a plate-type coating apparatus according to claim 6,
the length of the boss (3) is 1-3mm.
8. The silicon wafer-supporting carrier plate for a plate-type coating apparatus according to claim 7,
the thickness of the carrier plate body (1) is 3-5mm.
9. The silicon wafer-supporting carrier plate for a plate-type coating apparatus according to claim 8,
the carrier plate body (1) is made of graphite, carbon fiber or carbon-carbon composite material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222632789.5U CN218160317U (en) | 2022-10-08 | 2022-10-08 | Silicon wafer bearing support plate for plate type film coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222632789.5U CN218160317U (en) | 2022-10-08 | 2022-10-08 | Silicon wafer bearing support plate for plate type film coating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218160317U true CN218160317U (en) | 2022-12-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222632789.5U Active CN218160317U (en) | 2022-10-08 | 2022-10-08 | Silicon wafer bearing support plate for plate type film coating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218160317U (en) |
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2022
- 2022-10-08 CN CN202222632789.5U patent/CN218160317U/en active Active
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