Improved bearing disc and bearing device
Technical Field
The utility model relates to a battery piece processing transportation equipment, concretely relates to improved generation bears dish and bears device.
Background
The production process flow of the solar silicon wafer generally comprises silicon wafer detection, surface texture making and acid pickling, diffusion knot making, phosphorosilicate glass removal, plasma etching and acid pickling, antireflection film plating, screen printing, rapid sintering and the like. In the production and processing process, a plurality of silicon wafers to be processed are generally placed on the silicon wafer bearing frame, the whole silicon wafer bearing frame is connected and installed on the transportation rail, and the silicon wafers are driven to be transferred among the processing stations through the movement of the silicon wafer bearing frame, so that the silicon wafers are processed in batches. A plurality of bearing grooves communicated up and down are arranged on a common silicon wafer bearing frame in the market, and when a silicon wafer to be processed is placed, a hook is arranged on the bearing groove, and then the silicon wafer to be processed is placed on the hook; for example, the utility model with the publication number of CN205473976U, the hook of the graphite cabinet of the solar silicon wafer coating machine, and the utility model with the publication number of CN205792426U, the double-sided coated graphite frame suitable for PERC cell, are disclosed. In addition, for a specific silicon wafer processing technology, for example, when the film coating layer of the silicon wafer is thin, the supporting of the silicon wafer is also completed by using the supporting plate so as to ensure that the film coating of the silicon wafer is protected in the processing process and the silicon wafer can be uniformly heated, and the like, for example, the utility model patent with the publication number of CN209963035U entitled "a silicon wafer supporting plate and a silicon wafer supporting device"; however, when the loading tray is used as a loading tool, because the bottom surface of the loading tray is sealed, when a silicon wafer to be processed is placed on the storage groove of the loading tray, air leakage treatment is required, namely air between the silicon wafer and the storage groove is exhausted, so that the silicon wafer can be ensured to be attached and placed in the storage groove, the position accuracy of the silicon wafer is ensured, and the processing quality is provided; in order to solve the exhaust problem, the conventional method is to directly arrange a vent hole on the storage tank of the bearing plate, and the vent hole penetrates through the storage tank and the lower space of the bearing plate, so that the exhaust effect is achieved; however, such an exhaust method exposes the bottom of the silicon wafer corresponding to the vent hole, and is easily contaminated by dust or other impurities during the processing, thereby affecting the processing effect.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome prior art's is not enough, provides an improved generation bears the dish, should bear the dish and can ensure the smooth discharge of air between storage tank and the silicon chip to can guarantee the processingquality of silicon chip.
Another object of the present invention is to provide an improved bearing device.
The purpose of the utility model is realized through the following technical scheme:
an improved bearing plate is characterized by comprising a main body plate and a limiting piece which is used for being matched and installed with a bearing frame; the limiting piece is arranged on the bottom surface of the main body plate, and the outer contour of the limiting piece corresponds to the inner contour of the bearing groove on the bearing frame; the storage tank is arranged on the main body plate, the right-angle vent hole is formed in the storage tank and comprises a horizontal section and a vertical section, the outlet of the horizontal section is formed in the inner wall of the storage tank, and the outlet of the vertical section is formed in the bottom of the main body plate.
The working principle of the improved bearing disc is as follows:
firstly, correspondingly placing a bearing frame in each bearing groove on each bearing frame, and enabling a limiting piece on the bottom surface of a main body plate to be placed in the bearing grooves in a matching manner, so that the limiting and fixing of a bearing disc are realized, and the bearing disc is prevented from moving; then, a plurality of silicon wafers to be processed are placed in the storage grooves on the top surface of the main body plate one by one, so that the installation of the bearing plate and the placement of the silicon wafers to be processed are completed. When placing the silicon chip, the air in the storage tank passes through the horizontal segment and the vertical segment of right angle air vent in proper order, and the below of bearing the frame is discharged at last, avoids remaining the air between storage tank and silicon chip to ensure that the silicon chip laminating is placed in the storage tank, thereby ensure the position accuracy of silicon chip. In addition, because the right-angle vent hole adopts two mutually perpendicular paths (a horizontal section and a vertical section), external air and impurities cannot directly enter the storage tank through the outlet of the vertical section to contact with the silicon wafer, so that the bottom surface of the silicon wafer is prevented from being polluted and damaged, and the processing quality of the silicon wafer is improved.
The utility model discloses a preferred scheme, the corner department of storage tank all is equipped with the chamfer.
Preferably, the outlet of the horizontal section is provided at a middle position of the chamfer.
Preferably, the chamfered corners at the corners of the storage tank and the inner walls of the storage tank are rounded.
The utility model discloses a preferred scheme, the degree of depth of storing tank is less than the thickness of silicon chip.
The utility model discloses an optimal scheme, the top surface of main part board still is equipped with gets puts the groove, should get the area ratio of putting the groove the storage tank is big, and gets the degree of depth ratio of putting the groove the storage tank is shallow.
Preferably, the four corners of the taking and placing groove are provided with circular grooves arranged outwards, and the circular grooves are communicated with the taking and placing groove.
In a preferred embodiment of the present invention, the position-limiting member includes four sets of position-limiting posts, and the connecting lines of the two position-limiting posts of each set of position-limiting posts are respectively arranged in parallel with the four edges of the main body plate; the connecting lines of the four groups of limiting columns form the outer contour of the limiting part.
The utility model discloses a preferred scheme, the width of main part board corresponds the setting with the transverse dimension of bearer frame, be equipped with a plurality ofly on the main part board the storage tank and get and put the groove, a plurality of storage tanks with get and put the groove and arrange the setting along the transverse direction, all be equipped with in a plurality of storage tanks the right angle air vent.
The utility model provides an improved generation bears device, its characterized in that, including the carriage and the improved generation bears the dish, wherein, the carriage includes many supporting rods, frame and coupling assembling, wherein, many supporting rods vertically and horizontally staggered set up in the frame and the both ends of supporting rod all with frame connection, and vertically and horizontally staggered many supporting rods form a plurality of bearing grooves, bear the dish and set up in bearing groove.
Compared with the prior art, the utility model following beneficial effect has:
1. the utility model discloses in through the setting of right angle air vent for when placing the silicon chip, the air in the storage tank is discharged to the below of bearer frame behind the horizontal segment of right angle air vent and vertical section in proper order, avoids remaining the air between storage tank and silicon chip, places in the storage tank in order to ensure the silicon chip laminating, thereby ensures the position precision of silicon chip.
2. In the utility model, because the right-angle vent hole adopts two mutually perpendicular paths (horizontal and vertical), external air and impurities can not directly enter the storage tank through the outlet of the vertical section to contact with the silicon wafer, thereby avoiding the bottom surface of the silicon wafer from being polluted and damaged and being beneficial to improving the processing quality of the silicon wafer; meanwhile, the air in the storage tank can be smoothly discharged, the air leakage effect is achieved, the structure is simple, the effect is obvious, the problems of air leakage and silicon wafer pollution in actual production can be effectively solved, and the design is very ingenious.
Drawings
Fig. 1-5 are schematic structural views of a first embodiment of an improved carrier tray of the present invention, wherein fig. 1 is a top view, fig. 2 is a sectional view taken along direction a in fig. 1, fig. 3 is a bottom view, fig. 4 is a perspective view, and fig. 5 is an enlarged view of direction B in fig. 4.
Fig. 6-9 are schematic structural views of a second embodiment of the improved carrying device of the present invention, wherein fig. 6 is a perspective view of a part of a carrying tray being omitted, fig. 7 is a perspective view of the carrying tray in fig. 6, fig. 8 is an enlarged view of C in fig. 7, and fig. 9 is a bottom view of the carrying tray.
Fig. 10 to 15 are schematic structural views of a bearing frame in a second embodiment of the improved bearing device of the present invention, in which fig. 10 is a perspective view, fig. 11 is an enlarged view of D in fig. 10, fig. 12 is a partial perspective view of a guide rail set rod, fig. 13 is a front view of a horizontal bearing rod, fig. 14 is a perspective view of a supporting fixing rod, and fig. 15 is a front view of a vertical reinforcing rod.
Detailed Description
The present invention will be further described with reference to the following examples and drawings, but the embodiments of the present invention are not limited thereto.
Example 1
Referring to fig. 1 to 5, the improved carrier tray of the present embodiment includes a main body plate 1a and a limiting member for matching with a carrier frame; the limiting piece is arranged on the bottom surface of the main body plate 1a, and the outer contour of the limiting piece is arranged corresponding to the inner contour of the bearing groove 15 on the bearing frame; the main body plate 1a is provided with a storage groove 2a, the storage groove 2a is provided with a right-angle vent hole 10a, the right-angle vent hole 10a comprises a horizontal section 8a and a vertical section 9a, an outlet of the horizontal section 8a is arranged on the inner wall of the storage groove 2a, and an outlet of the vertical section 9a is arranged at the bottom of the main body plate 1 a. In this embodiment, the horizontal section 8a is rectangular, and the vertical section 9a is oblong.
Referring to fig. 4 and 5, the storage groove 2a is provided with a chamfer 5a at each corner. Through the setting of chamfer 5a, can match with the silicon chip that is equipped with chamfer 5a to the workman also can begin to take out through the chamfer 5a department of silicon chip when taking out the silicon chip, and it is more convenient to operate, and can avoid the corner of silicon chip to prick the hand.
Referring to fig. 2, 4 and 5, the outlet of the horizontal section 8a is disposed at a middle position of the chamfer 5 a.
Referring to fig. 2, 4 and 5, the corners of the chamfers 5a at the corners of the storage tub 2a and the inner walls of the storage tub 2a are rounded. Therefore, the sharp corner of the silicon wafer can be prevented from directly contacting the inner wall of the storage groove 2a, the side edge of the silicon wafer is prevented from colliding with the inner wall of the storage groove 2a, and the protection of the silicon wafer is facilitated; meanwhile, the middle part of the inner wall of the whole storage groove 2a, which is only left with the chamfer 5a, is a plane and is used for positioning and fixing the silicon wafer, the structure is simple, the area of direct contact between the silicon wafer and the inner wall of the storage groove 2a is effectively reduced, and the design is ingenious.
In this embodiment, the depth of the storage groove 2a is smaller than the thickness of the silicon wafer. Therefore, the silicon wafer can be conveniently taken out from the limiting storage groove 2a by workers through the edge of the silicon wafer protrusion, the structure is simple, and the practicability is high.
Referring to fig. 1, 2, 4 and 5, the top surface of the main body plate 1a is further provided with a pick-and-place slot 3a, the pick-and-place slot 3a has a larger area than the storage slot 2a, and the depth of the pick-and-place slot 3a is shallower than the storage slot 2 a. Therefore, on one hand, through the arrangement of the taking and placing groove 3a, when the processed silicon wafer needs to be taken out, a worker can start to take up the silicon wafer from the edge of the silicon wafer through the gap between the taking and placing groove 3a and the storage groove 2a, so that the silicon wafer is taken out, and the operation is convenient; on the other hand, the edge of the silicon wafer can be prevented from being exposed by the arrangement of the taking and placing groove 3a, and the processing precision of the silicon wafer is improved under the protection of the taking and placing groove 3 a; in addition, the taking and placing groove 3a with larger area can also be used for placing silicon wafers with larger sizes, so that the silicon wafer taking and placing device can adapt to silicon wafers with two different sizes, and is ingenious in design.
Referring to fig. 1, 4 and 5, the access slot 3a is provided with circular slots 4a at four corners, and the circular slots 4a are communicated with the access slot 3 a. When the silicon wafer needs to be stored on the taking and placing groove 3a, the round groove 4a can prevent the corners of the silicon wafer from being directly touched with the corners of the taking and placing groove 3a, and the corners of the silicon wafer can be effectively protected. In this embodiment, the top edge of the taking and placing groove 3a is provided with a chamfer, so that the edge of the silicon wafer placed in the taking and placing groove 3a can be prevented from being damaged, and the silicon wafer can be protected.
In addition, when the silicon wafers matched with the taking and placing groove 3a are processed, the air can be directly exhausted through the right-angle vent hole 10a in the storage groove 2 a; of course, the right-angle vent hole 10a may be provided in the pick-and-place slot 3a of the present embodiment to facilitate air discharge.
Referring to fig. 3, the limiting member includes four sets of limiting posts 7a, and connecting lines of two limiting posts 7a of each set of limiting posts 7a are respectively arranged in parallel with four edges of the main body plate 1 a; the connecting lines of the four groups of limiting columns 7a form the outer contour of the limiting part. The matching with the bearing groove 15 is realized through the arrangement of the limiting columns 7a, and the position of the main body plate 1a is limited; the silicon wafer bearing frame has the advantages that the limiting columns 7a are adopted, the structure is simple, the weight of the bearing plate can be reduced, the pressure on the silicon wafer bearing frame is reduced, and the silicon wafer bearing frame is prevented from deforming. The bottom of the main body plate 1a is also provided with a plurality of reinforcing ribs 6a, and the plurality of reinforcing ribs 6a are arranged in a criss-cross mode. Through the arrangement of the reinforcing ribs 6a, the bearing capacity and the deformation resistance of the main body plate 1a are improved, the main body plate 1a is ensured to keep a horizontal posture, and deformation is avoided.
In this embodiment, the main body plate 1a is made of a graphite material. The main body plate 1a made of graphite stores the silicon wafer, on one hand, the graphite main body plate 1a has a good heat conduction function and is in contact with the whole bottom surface of the silicon wafer, so that the silicon wafer can be uniformly heated, and the silicon wafer can be better subjected to film coating processing under specific conditions; on the other hand, the compactness of the graphite main body plate 1a is better than that of a C-C composite plate, the processed surface is smoother, damage to a coating layer on a silicon wafer is avoided, and the main body plate 1a with better compactness and high surface smoothness can avoid dust adsorption in the coating processing process, so that the coating processing precision of the silicon wafer is improved.
Referring to fig. 1 to 5, the working principle of the improved carrier tray of this embodiment is as follows:
firstly, a bearing frame is correspondingly placed in each bearing groove 15 on the bearing frame, and the limiting piece on the bottom surface of the main body plate 1a is placed in the bearing groove 15 in a matching manner, so that the limiting and fixing of the bearing disc are realized, and the bearing disc is prevented from moving; then, a plurality of silicon wafers to be processed are placed one by one in the plurality of storage grooves 2a on the top surface of the main body plate 1a, thereby completing the mounting of the carrier tray and the placement of the silicon wafers to be processed. When placing the silicon chip, the air in the storage tank 2a passes through the horizontal segment 8a and the vertical segment 9a of the right-angle vent hole 10a in proper order, and is discharged to the below of the bearing frame at last, so that air is prevented from remaining between the storage tank 2a and the silicon chip, the silicon chip is ensured to be attached and placed in the storage tank 2a, and the position precision of the silicon chip is ensured. In addition, because the right-angle vent hole 10a adopts two mutually perpendicular paths (the horizontal section 8a and the vertical section 9a), external air and impurities cannot directly enter the storage tank 2a through the outlet of the vertical section 9a to contact with the silicon wafer, so that the bottom surface of the silicon wafer is prevented from being polluted and damaged, and the processing quality of the silicon wafer is improved.
The improved bearing device of the embodiment comprises a bearing frame and the improved bearing disc, wherein the bearing frame comprises a plurality of bearing rods, a frame and a connecting assembly, the bearing rods are arranged in the frame in a criss-cross mode, two ends of each bearing rod are connected with the frame, the bearing rods in the criss-cross mode form a plurality of bearing grooves 15, and the bearing disc is arranged in the bearing grooves 15. The specific structure of the bearing frame of the improved bearing device of the embodiment can be referred to the graphite bearing frame in the prior art
Example 2
Referring to fig. 6 to 9, the modified carrier tray of this embodiment is different from embodiment 1 in that the width of the main body plate 1a is set corresponding to the transverse dimension of the carrier frame, the main body plate 1a is provided with a plurality of storage slots 2a and picking and placing slots 3a, the storage slots 2a and picking and placing slots 3a are arranged in a transverse direction, and the storage slots 2a are all provided with the right-angle ventilation holes 10 a. The main body plate 1a is provided with the storage grooves 2a, so that a plurality of silicon wafers can be loaded, the mounting process of the bearing plate is simplified, and the operation is convenient; meanwhile, the width of the main body plate 1a is matched with the transverse width of the bearing frame to form a rectangular or elongated bearing disc, so that the selection of the plates is facilitated during processing, the plates are not required to be cut into single independent bearing discs, and the storage grooves 2a are directly processed on the rectangular or elongated plates, so that the processing difficulty and the processing cost are effectively reduced.
The two end parts of the top surface of the main body plate 1a are left empty, so that the solid part of the main body plate 1a can be supported on the guide rail group rods on the two sides of the bearing frame, the main body plate 1a and the bearing money can be conveniently installed, and meanwhile, the silicon wafer is prevented from being placed at the position, close to the edge, of the top surface of the main body plate 1 a.
Referring to fig. 6, 10-15, the improved bearing device of the present embodiment is different from embodiment 1 in that the plurality of supporting rods includes a plurality of transversely extending transverse supporting rods 1 and a plurality of supporting and fixing rods 3, and the frame includes two sets of guide rail set rods 5; the two groups of guide rail group rods 5 extend along the longitudinal direction and are oppositely arranged, the plurality of transverse supporting rods 1 are arranged at equal intervals, two ends of each transverse supporting rod 1 are detachably arranged on the two groups of guide rail group rods 5 respectively, and a bearing groove 15 is formed by the space enclosed by each two transverse supporting rods 1 and the two groups of guide rail group rods 5; a plurality of supporting and fixing rods 3 are arranged between every two transverse supporting rods 1. And the supporting and fixing rod 3 and the transverse supporting rod 1 are arranged perpendicular to each other.
Referring to fig. 12 and 13, a plurality of limiting installation grooves 9 are formed in the inner side of the guide rail group rod 5 along the longitudinal direction, the limiting installation grooves 9 are arranged at equal intervals, and the limiting installation grooves 9 are 7-shaped; mounting hooks 11 which are matched with the limiting mounting grooves 9 and are arranged at right angles are arranged at two ends of the transverse supporting rod 1; and the mounting hooks 11 at the two ends of the transverse supporting rod 1 are correspondingly arranged on the limiting mounting grooves 9 on the two groups of guide rail group rods 5. Through the setting of spacing mounting groove 9 and installation hook 11, be convenient for horizontal supporting rod 1 and the installation and the dismantlement of guide rail group pole 5 to spacing effectual, accomplish the restriction to horizontal and longitudinal direction of horizontal supporting rod 1 simultaneously, design benefit, simple structure.
Referring to fig. 6, 10 and 11, corner connectors 7 are respectively arranged at corners between two ends of the transverse supporting rod 1 and the guide rail group rods 5, connecting holes 10 are arranged at corresponding positions of the guide rail group rods 5 and the transverse supporting rod 1, and the corner connectors 7 are connected with the transverse supporting rod 1 and the guide rail group rods 5 through bolts. Through the arrangement of the corner connecting piece 7, the stability between the transverse supporting rod 1 and the guide rail group rod 5 is further enhanced, so that the connection between the transverse supporting rod and the guide rail group rod is firmer.
Referring to fig. 6, 10, 11 and 14, a plurality of mounting holes 6 are formed in the transverse support rods 1, and the mounting holes 6 in each transverse support rod 1 are arranged in a one-to-one correspondence manner; the supporting and fixing rod 3 is composed of a round rod, and two end parts of the supporting and fixing rod 3 are matched with the mounting holes 6. The supporting and fixing rod 3 and the transverse supporting rod 1 are installed and connected in such a way, so that the assembly and disassembly are convenient, and the processing is easy. In this embodiment, the mounting holes 6 are through holes, mounting posts 13 are disposed at two ends of the supporting and fixing rod 3, the mounting posts 13 are matched with the mounting holes 6, and the diameter of the main body of the supporting and fixing rod 3 is larger than that of the mounting holes 6; thus, the mounting holes 6 are formed as through holes, which facilitates the mounting connection of the supporting and fixing rods 3 at the front and rear sides of the transverse supporting rod 1, so that the supporting and fixing rods 3 can be mounted at corresponding positions according to actual requirements.
Referring to fig. 10, the supporting fixing rods 3 between two adjacent sets of the transverse supporting rods 1 are arranged in a staggered manner. In this embodiment, the supporting fixing rods 3 between two adjacent sets of the horizontal supporting rods 1 are randomly arranged, and are arranged in a staggered manner or in a mutually corresponding manner.
Referring to fig. 10, the transverse reinforcing rods 2 are disposed in front of the foremost transverse supporting rod 1 and behind the rearmost transverse supporting rod 1, two ends of each transverse reinforcing rod 2 are connected to the two sets of guide rail group rods 5, and a plurality of supporting and fixing rods 3 are disposed between the transverse reinforcing rods 2 and the transverse supporting rods 1. In this embodiment, the transverse reinforcing rods 2 are further fixedly connected with the corners of the guide rail group rods 5 through corner connecting pieces 7 and bolts. Through the setting of horizontal stiffener 2, be favorable to improving the stability of whole bearing frame. In this embodiment, the two end portions of the horizontal reinforcing rod 2 are also provided with mounting hooks 11, and the corresponding portion of the guide rail group rod 5 is also provided with a limiting mounting groove 9, so as to limit and fix the position of the horizontal reinforcing rod 2.
Referring to fig. 10 and 11, longitudinal reinforcing rods 4 are respectively arranged on the inner sides of the two sets of guide rail group rods 5, limiting grooves 12 are respectively arranged on the transverse supporting rods 1 and the transverse reinforcing rods 2 corresponding to the longitudinal reinforcing rods 4, and connecting grooves 14 matched with the limiting grooves 12 are arranged on the longitudinal reinforcing rods 4; and the corner connecting pieces 7 are arranged between the longitudinal reinforcing rod 4 and the transverse supporting rod 1 as well as between the longitudinal reinforcing rod and the transverse reinforcing rod 2. Through indulging the setting of stiffener 4, form the cooperation with horizontal stiffener 2 for whole bearing frame is firmer all around, and stability is better, and can further carry out spacing and connection installation to all horizontal supporting rod 1, thereby improves the stability of whole bearing frame. In this embodiment, the spacing groove 12 on the horizontal supporting rod 1 is downward, the spacing groove 12 on the horizontal reinforcing rod 2 is downward, indulge the connecting groove 14 on the reinforcing rod 4 and correspond the matching setting, set up the spacing groove 12 of different orientations like this, be favorable to improving the installation back and indulge the fastening nature and the stability between reinforcing rod 4, horizontal reinforcing rod 2 and the horizontal supporting rod 1.
Referring to fig. 12, the guide rail set bar 5 includes a plurality of guide rail plates 8, the plurality of guide rail plates 8 are arranged in a horizontal direction, and a vertical height of each guide rail plate 8 is greater than a horizontal width. In this embodiment, the plurality of rail plates 8 are connected together by bolts. By arranging the guide rail group rod 5, the bending resistance of the guide rail plate 8 in the vertical direction is obviously improved, so that the deformation resistance of the whole bearing frame is improved, the top surface of a silicon wafer is ensured to be kept horizontal in the processing and transporting processes, and the processing quality of the silicon wafer is improved.
The transverse supporting rods, the supporting and fixing rods, the transverse reinforcing rods, the longitudinal reinforcing rods, the guide rail group rods and the like of the bearing frame in the embodiment are all made of graphite or C-C composite materials.
The above is the preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be equivalent replacement modes, and all are included in the scope of the present invention.